KR102502018B1 - 표면 처리 구리박 및 동장 적층판 - Google Patents

표면 처리 구리박 및 동장 적층판 Download PDF

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Publication number
KR102502018B1
KR102502018B1 KR1020207020817A KR20207020817A KR102502018B1 KR 102502018 B1 KR102502018 B1 KR 102502018B1 KR 1020207020817 A KR1020207020817 A KR 1020207020817A KR 20207020817 A KR20207020817 A KR 20207020817A KR 102502018 B1 KR102502018 B1 KR 102502018B1
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KR
South Korea
Prior art keywords
copper foil
silane compound
treated
treated copper
resin substrate
Prior art date
Application number
KR1020207020817A
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English (en)
Korean (ko)
Other versions
KR20200100138A (ko
Inventor
유키 오리
Original Assignee
제이엑스금속주식회사
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Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20200100138A publication Critical patent/KR20200100138A/ko
Application granted granted Critical
Publication of KR102502018B1 publication Critical patent/KR102502018B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemical Treatment Of Metals (AREA)
KR1020207020817A 2018-03-29 2019-03-12 표면 처리 구리박 및 동장 적층판 KR102502018B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018065668A JP6413039B1 (ja) 2018-03-29 2018-03-29 表面処理銅箔及び銅張積層板
JPJP-P-2018-065668 2018-03-29
PCT/JP2019/010096 WO2019188262A1 (ja) 2018-03-29 2019-03-12 表面処理銅箔及び銅張積層板

Publications (2)

Publication Number Publication Date
KR20200100138A KR20200100138A (ko) 2020-08-25
KR102502018B1 true KR102502018B1 (ko) 2023-02-21

Family

ID=63920543

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207020817A KR102502018B1 (ko) 2018-03-29 2019-03-12 표면 처리 구리박 및 동장 적층판

Country Status (7)

Country Link
JP (1) JP6413039B1 (zh)
KR (1) KR102502018B1 (zh)
CN (1) CN111655900B (zh)
MY (1) MY194720A (zh)
PH (1) PH12020551281A1 (zh)
TW (1) TWI687527B (zh)
WO (1) WO2019188262A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715424B (zh) * 2020-01-22 2021-01-01 長春石油化學股份有限公司 電解銅箔、電極及包含其之鋰離子電池

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016006227A (ja) 2014-05-28 2016-01-14 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板、電子機器、表面処理銅箔の製造方法及びプリント配線板の製造方法

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JP5663739B2 (ja) * 2008-04-04 2015-02-04 日本ペイント株式会社 銅の表面調整組成物および表面処理方法
CN102498600A (zh) * 2009-09-11 2012-06-13 Jx日矿日石金属株式会社 锂离子电池集电体用铜箔
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP2012112009A (ja) 2010-11-26 2012-06-14 Hitachi Cable Ltd 銅箔、及び銅箔の製造方法
WO2012132577A1 (ja) * 2011-03-30 2012-10-04 Jx日鉱日石金属株式会社 印刷回路用銅箔
MY169065A (en) * 2012-03-29 2019-02-12 Jx Nippon Mining & Metals Corp Surface-treated copper foil
CN104769165B (zh) * 2012-11-09 2017-08-25 Jx日矿日石金属株式会社 表面处理铜箔及使用其的积层板、覆铜积层板、印刷配线板以及电子机器
KR101852671B1 (ko) * 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
JP6546836B2 (ja) * 2015-11-12 2019-07-17 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6294862B2 (ja) * 2015-12-09 2018-03-14 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
JP6854114B2 (ja) * 2016-01-04 2021-04-07 Ｊｘ金属株式会社 表面処理銅箔
JP6811240B2 (ja) * 2016-07-22 2021-01-13 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
JP6334034B1 (ja) * 2017-06-09 2018-05-30 Ｊｘ金属株式会社 表面処理銅箔及びその製造方法、並びに銅張積層板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016006227A (ja) 2014-05-28 2016-01-14 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板、電子機器、表面処理銅箔の製造方法及びプリント配線板の製造方法

Also Published As

Publication number Publication date
CN111655900B (zh) 2022-05-13
WO2019188262A1 (ja) 2019-10-03
JP6413039B1 (ja) 2018-10-24
MY194720A (en) 2022-12-15
TW201942369A (zh) 2019-11-01
KR20200100138A (ko) 2020-08-25
TWI687527B (zh) 2020-03-11
CN111655900A (zh) 2020-09-11
PH12020551281A1 (en) 2021-05-31
JP2019173139A (ja) 2019-10-10

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