KR102024522B1 - 리드 가공 장치 및 그것을 이용하여 제조된 반도체 장치 - Google Patents
리드 가공 장치 및 그것을 이용하여 제조된 반도체 장치 Download PDFInfo
- Publication number
- KR102024522B1 KR102024522B1 KR1020170161400A KR20170161400A KR102024522B1 KR 102024522 B1 KR102024522 B1 KR 102024522B1 KR 1020170161400 A KR1020170161400 A KR 1020170161400A KR 20170161400 A KR20170161400 A KR 20170161400A KR 102024522 B1 KR102024522 B1 KR 102024522B1
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- South Korea
- Prior art keywords
- die plate
- external terminals
- punch
- stripper
- tie bar
- Prior art date
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Images
Classifications
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/123—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels for centering the inserts
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- B26D1/06—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates
- B26D1/08—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type
- B26D1/09—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member wherein the cutting member reciprocates of the guillotine type with a plurality of cutting members
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
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- H01L2224/481—Disposition
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- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H01L23/495—Lead-frames or other flat leads
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Ceramic Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Punching Or Piercing (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016236565A JP6783128B2 (ja) | 2016-12-06 | 2016-12-06 | リード加工装置 |
JPJP-P-2016-236565 | 2016-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180064981A KR20180064981A (ko) | 2018-06-15 |
KR102024522B1 true KR102024522B1 (ko) | 2019-09-24 |
Family
ID=62164254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170161400A KR102024522B1 (ko) | 2016-12-06 | 2017-11-29 | 리드 가공 장치 및 그것을 이용하여 제조된 반도체 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6783128B2 (de) |
KR (1) | KR102024522B1 (de) |
CN (1) | CN108155119B (de) |
DE (1) | DE102017221223B4 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110695184B (zh) * | 2019-10-25 | 2020-07-03 | 徐州瑞益晟机械有限公司 | 一种可减少工件形变冲裁模具设备 |
CN112802787B (zh) * | 2021-04-13 | 2021-06-22 | 四川旭茂微科技有限公司 | 一种用于引线框架组装的送料装置 |
CN115091685B (zh) * | 2022-07-21 | 2023-09-05 | 南通超达装备股份有限公司 | 一种能自动去除边料的汽车座椅发泡模具 |
CN115846477B (zh) * | 2023-03-01 | 2023-05-16 | 山西建投装备制造有限公司 | 一种钢材加工用钢材折弯设备及其操作方法 |
CN117564137B (zh) * | 2024-01-15 | 2024-04-26 | 德阳华智精密科技有限公司 | 一种灯杆燕尾槽成型模具 |
Citations (2)
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