KR100995607B1 - 도전성 페이스트 조성물 및 프린트 배선판 - Google Patents

도전성 페이스트 조성물 및 프린트 배선판 Download PDF

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Publication number
KR100995607B1
KR100995607B1 KR1020077025031A KR20077025031A KR100995607B1 KR 100995607 B1 KR100995607 B1 KR 100995607B1 KR 1020077025031 A KR1020077025031 A KR 1020077025031A KR 20077025031 A KR20077025031 A KR 20077025031A KR 100995607 B1 KR100995607 B1 KR 100995607B1
Authority
KR
South Korea
Prior art keywords
conductive paste
paste composition
ether bond
resin
wiring board
Prior art date
Application number
KR1020077025031A
Other languages
English (en)
Korean (ko)
Other versions
KR20070116673A (ko
Inventor
츠토무 우치미
마사유키 나가시마
마사루 고바야시
히로유키 시로가네
마사유키 모리
나오미 우스키
Original Assignee
가부시키가이샤 디엔피 파인 케미칼
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 디엔피 파인 케미칼, 다이니폰 인사츠 가부시키가이샤 filed Critical 가부시키가이샤 디엔피 파인 케미칼
Publication of KR20070116673A publication Critical patent/KR20070116673A/ko
Application granted granted Critical
Publication of KR100995607B1 publication Critical patent/KR100995607B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020077025031A 2005-03-31 2006-03-30 도전성 페이스트 조성물 및 프린트 배선판 KR100995607B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005103932A JP4841158B2 (ja) 2005-03-31 2005-03-31 導電性ペースト組成物およびプリント配線板
JPJP-P-2005-00103932 2005-03-31

Publications (2)

Publication Number Publication Date
KR20070116673A KR20070116673A (ko) 2007-12-10
KR100995607B1 true KR100995607B1 (ko) 2010-11-22

Family

ID=37073405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077025031A KR100995607B1 (ko) 2005-03-31 2006-03-30 도전성 페이스트 조성물 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP4841158B2 (ja)
KR (1) KR100995607B1 (ja)
CN (1) CN101156218B (ja)
TW (1) TW200701259A (ja)
WO (1) WO2006106849A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4968410B2 (ja) * 2009-10-15 2012-07-04 東洋紡績株式会社 導電性ペースト、導電性膜、タッチパネル、及び導電性薄膜の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10312712A (ja) 1997-05-14 1998-11-24 Asahi Chem Ind Co Ltd はんだ付け可能な導電性ペースト
JP2004315871A (ja) 2003-04-15 2004-11-11 Asahi Kasei Corp 金属超微粒子の製造方法およびその製造装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4572023B2 (ja) * 2000-07-11 2010-10-27 株式会社槌屋 着色導電ペーストおよびそれを用いる導電積層体とその製造方法
JP4365053B2 (ja) * 2001-09-04 2009-11-18 大日本印刷株式会社 導電性ペースト組成物及びプリント配線板
JP3659348B2 (ja) * 2002-03-05 2005-06-15 三井化学株式会社 バンプの形成方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10312712A (ja) 1997-05-14 1998-11-24 Asahi Chem Ind Co Ltd はんだ付け可能な導電性ペースト
JP2004315871A (ja) 2003-04-15 2004-11-11 Asahi Kasei Corp 金属超微粒子の製造方法およびその製造装置

Also Published As

Publication number Publication date
TW200701259A (en) 2007-01-01
CN101156218B (zh) 2010-12-08
TWI342571B (ja) 2011-05-21
JP4841158B2 (ja) 2011-12-21
CN101156218A (zh) 2008-04-02
WO2006106849A1 (ja) 2006-10-12
JP2006286367A (ja) 2006-10-19
KR20070116673A (ko) 2007-12-10

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