KR100920535B1 - 수지 조성물, 프리프레그, 적층판 및 반도체 패키지 - Google Patents
수지 조성물, 프리프레그, 적층판 및 반도체 패키지 Download PDFInfo
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- KR100920535B1 KR100920535B1 KR1020047002910A KR20047002910A KR100920535B1 KR 100920535 B1 KR100920535 B1 KR 100920535B1 KR 1020047002910 A KR1020047002910 A KR 1020047002910A KR 20047002910 A KR20047002910 A KR 20047002910A KR 100920535 B1 KR100920535 B1 KR 100920535B1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (19)
- 기재 (base material) 내부에 함침시켜 시트상의 프리프레그를 제조하는데 사용되는 수지 조성물로서:중량평균 분자량을 갖는 제1 시아네이트 수지;제1 시아네이트 수지보다 낮은 중량평균 분자량을 갖는 제2 시아네이트 수지;제1 시아네이트 수지 및 제2 시아네이트 수지보다 흡습성이 낮은 수지로서 비페닐디메틸렌형 에폭시 수지;경화제; 및충전제를 포함하는 것을 특징으로 하는 수지 조성물.
- 삭제
- 삭제
- 제 1 항에 있어서,상기 제1 시아네이트 수지의 중량평균 분자량은 2,000 이상인 것을 특징으로 하는 수지 조성물.
- 제 1 항에 있어서,상기 제2 시아네이트 수지의 중량평균 분자량은 1,500 이하인 것을 특징으로 하는 수지 조성물.
- 삭제
- 제 1 항에 있어서,상기 제1 시아네이트 수지 및 제2 시아네이트 수지 중 적어도 하나는 노볼락형 시아네이트 수지인 것을 특징으로 하는 수지 조성물.
- 제 1 항에 있어서,상기 제2 시아네이트 수지 및 경화제 중 적어도 하나는 실온 (room temperature)에서 액체 상태 (liquid state)인 것을 특징으로 하는 수지 조성물.
- 제 1 항에 있어서,상기 충전제는 분말 상태의 무기 충전제인 것을 특징으로 하는 수지 조성물.
- 제 1 항에 있어서,상기 충전제는 실리카인 것을 특징으로 하는 수지 조성물.
- 제 1 항에 있어서,상기 충전제는 분말 상태이고 평균 입경이 2㎛ 이하인 것을 특징으로 하는 수지 조성물.
- 제 1 항에 있어서,상기 충전제의 함량은 수지 조성물 전체의 40∼80 중량%인 것을 특징으로 하는 수지 조성물.
- 제 1 항 기재의 수지 조성물을 기재에 함침하여 형성되는 것을 특징으로 하는 프리프레그.
- 제 13 항에 있어서,상기 프리프레그 내의 상기 수지 조성물의 반응율은 30% 이하인 것을 특징으로 하는 프리프레그.
- 제 13 항에 있어서,상기 기재는 개섬 (開纖, spread-out)된 유리 섬유 기재인 것을 특징으로 하 는 프리프레그.
- 제 13 항에 있어서,상기 기재는 유기 섬유로 구성된 부직포인 것을 특징으로 하는 프리프레그.
- 제 13 항 기재의 프리프레그의 적어도 한쪽 표면에 금속박을 적층하여 형성되는 것을 특징으로 하는 프리프레그.
- 제 13 항 기재의 프리프레그의 적어도 한쪽 표면에 금속박을 적층하고, 이를 가열 가압 성형하여 형성되는 적층판.
- 제 17 항 기재의 프리프레그에 적어도 하나의 IC 칩을 탑재하여 제조되는 반도체 패키지.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2001-00264385 | 2001-08-31 | ||
JP2001264385 | 2001-08-31 | ||
PCT/JP2002/008845 WO2003018675A1 (fr) | 2001-08-31 | 2002-08-30 | Composition de resine, preimpregne, feuille laminee, et boitier de semi-conducteur |
Publications (2)
Publication Number | Publication Date |
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KR20040029080A KR20040029080A (ko) | 2004-04-03 |
KR100920535B1 true KR100920535B1 (ko) | 2009-10-08 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020047002910A KR100920535B1 (ko) | 2001-08-31 | 2002-08-30 | 수지 조성물, 프리프레그, 적층판 및 반도체 패키지 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7368497B2 (ko) |
EP (1) | EP1457515A4 (ko) |
JP (3) | JP4133817B2 (ko) |
KR (1) | KR100920535B1 (ko) |
CN (1) | CN100422244C (ko) |
HK (1) | HK1077313A1 (ko) |
TW (1) | TWI290942B (ko) |
WO (1) | WO2003018675A1 (ko) |
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-
2002
- 2002-08-30 EP EP02772828A patent/EP1457515A4/en not_active Withdrawn
- 2002-08-30 KR KR1020047002910A patent/KR100920535B1/ko not_active IP Right Cessation
- 2002-08-30 JP JP2003523530A patent/JP4133817B2/ja not_active Expired - Fee Related
- 2002-08-30 CN CNB028212975A patent/CN100422244C/zh not_active Expired - Fee Related
- 2002-08-30 WO PCT/JP2002/008845 patent/WO2003018675A1/ja not_active Application Discontinuation
- 2002-09-02 TW TW091119921A patent/TWI290942B/zh not_active IP Right Cessation
-
2004
- 2004-02-27 US US10/789,914 patent/US7368497B2/en not_active Expired - Fee Related
-
2005
- 2005-10-20 HK HK05109244.0A patent/HK1077313A1/xx not_active IP Right Cessation
-
2010
- 2010-04-23 JP JP2010099840A patent/JP5573331B2/ja not_active Expired - Fee Related
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2011
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US4309473A (en) * | 1978-12-08 | 1982-01-05 | Toho Beslon Co., Ltd. | Non-tacky strand prepreg comprising a resin composition containing a combination of (1) a thermosetting resin and (2) a high molecular weight epoxy resin and a process for forming an article from the same |
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JP2001156461A (ja) | 1999-11-30 | 2001-06-08 | Mitsubishi Gas Chem Co Inc | ビルドアップ多層プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2003018675A1 (ja) | 2004-12-09 |
EP1457515A4 (en) | 2004-11-24 |
HK1077313A1 (en) | 2006-02-10 |
JP4133817B2 (ja) | 2008-08-13 |
TWI290942B (en) | 2007-12-11 |
KR20040029080A (ko) | 2004-04-03 |
JP2012031428A (ja) | 2012-02-16 |
CN100422244C (zh) | 2008-10-01 |
EP1457515A1 (en) | 2004-09-15 |
JP2010215911A (ja) | 2010-09-30 |
JP5573331B2 (ja) | 2014-08-20 |
US7368497B2 (en) | 2008-05-06 |
WO2003018675A1 (fr) | 2003-03-06 |
US20040234741A1 (en) | 2004-11-25 |
CN1608100A (zh) | 2005-04-20 |
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