KR100886021B1 - 액처리방법 및 액처리장치 - Google Patents
액처리방법 및 액처리장치 Download PDFInfo
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- KR100886021B1 KR100886021B1 KR1020010068755A KR20010068755A KR100886021B1 KR 100886021 B1 KR100886021 B1 KR 100886021B1 KR 1020010068755 A KR1020010068755 A KR 1020010068755A KR 20010068755 A KR20010068755 A KR 20010068755A KR 100886021 B1 KR100886021 B1 KR 100886021B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims (32)
- 수납용기내에 있어서 기판에 처리액을 공급하여 상기 기판을 처리하는 액처리장치에서,상기 수납용기를 탑재하는 프레임과,상기 수납용기에 접속되고 상기 수납용기 내의 분위기를 배기하는 배기관과,상기 프레임 밖으로 상기 분위기를 배기하는 배기닥트를 구비하고,상기 수납용기는 상기 프레임에서 수평방향으로 인출이 자유롭게 구성되어 있고,상기 배기닥트의 접속단부는 상기 배기관의 접속단부와 접속 및 분리가 자유롭고,상기 배기닥트의 접속단부는 상기 프레임에서 상기 수평방향에 대해서 직각방향의 측부에 설치되어 있고,상기 배기닥트의 접속단부는 상방에서 보아 상기 수평방향과 반대 방향측이 상기 배기관의 접속단부측에 돌출하도록 형성되어 있고,상기 배기관의 접속단부는 상기 배기닥트의 접속단부와 서로 맞도록 상방에서 보아 상기 수평방향측이 상기 배기닥트의 접속단부측에 돌출하도록 형성되어 있는 것을 특징으로 하는 액처리장치.
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- 청구항 1 에 있어서,상기 배기닥트의 접속단부와 상기 배기관의 접속단부는 상방에서 보아 경사지게 형성되어 있는 것을 특징으로 하는 액처리장치.
- 기판에 처리액을 공급해서 상기 기판을 처리하는 수납용기를 포함하는 처리장치에 있어서,상기 수납용기를 탑재하는 프레임과,상기 수납용기에 접속되어 상기 수납용기 내의 분위기를 배기하는 배기관과,상기 프레임 밖으로 상기 분위기를 배기하는 배기닥트를 구비하고,상기 수납용기는 상기 프레임에서 수평방향으로 인출이 자유롭게 구성되어 있고,상기 배기닥트의 접속단부는 상기 배기관의 접속단부와 접속 및 분리가 자유롭고,상기 배기닥트의 접속단부는 상기 프레임에서 상기 수평방향에 대해서 직각방향의 측부에 설치되어 있고,상기 배기닥트의 접속단부는 상방에서 보아 상기 수평방향측으로 개구된 삽입구이고,상기 배기관의 접속단부는 상기 배기닥트의 삽입구에 삽입 가능한 상방에서 보아 수평방향과는 반대측으로 돌출한 형상으로 이루어진 것을 특징으로 하는 액처리장치.
- 청구항 10 에 있어서,상기 배기관의 접속단부는 끝이 날카로운 테이퍼형태를 갖추고 있는 것을 특징으로 하는 액처리장치.
- 청구항 10 에 있어서,상기 삽입구는 그 내벽 표면에 기밀성을 확보하는 씰재를 갖추는 것을 특징으로 하는 액처리장치.
- 청구항 10 에 있어서,상기 삽입구는 그 내벽표면에 스폰지재를 갖추는 것을 특징으로 하는 액처리장치.
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Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00339163 | 2000-11-07 | ||
JP2000339163A JP3616748B2 (ja) | 2000-11-07 | 2000-11-07 | 現像処理方法,現像処理装置及び処理装置 |
JP2001004931 | 2001-01-12 | ||
JPJP-P-2001-00004931 | 2001-01-12 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080000876A Division KR100827793B1 (ko) | 2000-11-07 | 2008-01-03 | 액처리방법 및 액처리장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020035758A KR20020035758A (ko) | 2002-05-15 |
KR100886021B1 true KR100886021B1 (ko) | 2009-03-03 |
Family
ID=26603529
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Application Number | Title | Priority Date | Filing Date |
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KR1020010068755A KR100886021B1 (ko) | 2000-11-07 | 2001-11-06 | 액처리방법 및 액처리장치 |
KR1020080000876A KR100827793B1 (ko) | 2000-11-07 | 2008-01-03 | 액처리방법 및 액처리장치 |
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KR1020080000876A KR100827793B1 (ko) | 2000-11-07 | 2008-01-03 | 액처리방법 및 액처리장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6715943B2 (ko) |
JP (2) | JP3616748B2 (ko) |
KR (2) | KR100886021B1 (ko) |
Families Citing this family (44)
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US20030230323A1 (en) * | 2002-06-14 | 2003-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for improving scrubber cleaning |
US7077585B2 (en) | 2002-07-22 | 2006-07-18 | Yoshitake Ito | Developing method and apparatus for performing development processing properly and a solution processing method enabling enhanced uniformity in the processing |
JP2007036268A (ja) * | 2002-07-22 | 2007-02-08 | Yoshitake Ito | 基板処理方法及び基板処理装置 |
JP2004072120A (ja) * | 2002-07-22 | 2004-03-04 | Yoshitake Ito | 現像方法及び現像装置及び液処理方法及び液処理装置 |
TWI229367B (en) * | 2002-12-26 | 2005-03-11 | Canon Kk | Chemical treatment apparatus and chemical treatment method |
US7241342B2 (en) * | 2003-12-22 | 2007-07-10 | Asml Holding N.V. | Non-dripping nozzle apparatus |
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US7357840B2 (en) * | 2004-02-27 | 2008-04-15 | Asml Holding N.V. | Solvent bath and drain |
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US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
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US7699021B2 (en) | 2004-12-22 | 2010-04-20 | Sokudo Co., Ltd. | Cluster tool substrate throughput optimization |
JP4515275B2 (ja) * | 2005-01-31 | 2010-07-28 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4471865B2 (ja) * | 2005-02-18 | 2010-06-02 | 東京エレクトロン株式会社 | 液処理装置及びその方法 |
US7770535B2 (en) * | 2005-06-10 | 2010-08-10 | Semiconductor Energy Laboratory Co., Ltd. | Chemical solution application apparatus and chemical solution application method |
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KR100712551B1 (ko) * | 2006-02-09 | 2007-05-02 | 삼성전자주식회사 | 스핀 유닛의 위치 재현성 실현이 가능한 스핀너 장비 및 그 운용 방법 |
JP4830962B2 (ja) * | 2006-10-23 | 2011-12-07 | 東京エレクトロン株式会社 | 液処理装置、カップ体の着脱方法及び記憶媒体 |
KR100839913B1 (ko) * | 2007-01-12 | 2008-06-19 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
KR100839912B1 (ko) * | 2007-01-12 | 2008-06-20 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
US20080310113A1 (en) * | 2007-06-13 | 2008-12-18 | Asml Netherlands B.V. | Electronics rack and lithographic apparatus comprising such electronics rack |
JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Sokudo | 基板処理装置 |
JP5318403B2 (ja) | 2007-11-30 | 2013-10-16 | 株式会社Sokudo | 基板処理装置 |
JP5128918B2 (ja) | 2007-11-30 | 2013-01-23 | 株式会社Sokudo | 基板処理装置 |
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WO2009079874A1 (en) * | 2007-12-10 | 2009-07-02 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
JP5001828B2 (ja) * | 2007-12-28 | 2012-08-15 | 株式会社Sokudo | 基板処理装置 |
JP5179170B2 (ja) * | 2007-12-28 | 2013-04-10 | 株式会社Sokudo | 基板処理装置 |
JP5449720B2 (ja) * | 2008-08-26 | 2014-03-19 | 株式会社Sokudo | 基板処理装置 |
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JP5133305B2 (ja) * | 2009-08-19 | 2013-01-30 | 信越化学工業株式会社 | 基板の洗浄装置及び洗浄方法 |
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JP5242632B2 (ja) * | 2010-06-03 | 2013-07-24 | 東京エレクトロン株式会社 | 基板液処理装置 |
KR102119688B1 (ko) * | 2013-09-24 | 2020-06-09 | 세메스 주식회사 | 기판처리장치 |
US9984867B2 (en) * | 2014-12-19 | 2018-05-29 | Applied Materials, Inc. | Systems and methods for rinsing and drying substrates |
US10203604B2 (en) * | 2015-11-30 | 2019-02-12 | Applied Materials, Inc. | Method and apparatus for post exposure processing of photoresist wafers |
JP7124946B2 (ja) * | 2017-08-10 | 2022-08-24 | 東京エレクトロン株式会社 | 液処理方法 |
JP6841188B2 (ja) * | 2017-08-29 | 2021-03-10 | 東京エレクトロン株式会社 | 塗布処理装置及び塗布液捕集部材 |
JP7221594B2 (ja) * | 2018-03-26 | 2023-02-14 | 株式会社Screenホールディングス | 基板処理装置 |
JP7093703B2 (ja) * | 2018-09-07 | 2022-06-30 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP7360973B2 (ja) * | 2020-02-27 | 2023-10-13 | 東京エレクトロン株式会社 | 現像処理装置及び現像処理方法 |
JP2022130880A (ja) * | 2021-02-26 | 2022-09-07 | 株式会社Screenホールディングス | 基板処理装置、および、基板処理方法 |
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2000
- 2000-11-07 JP JP2000339163A patent/JP3616748B2/ja not_active Expired - Lifetime
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2001
- 2001-10-31 US US09/999,893 patent/US6715943B2/en not_active Expired - Lifetime
- 2001-11-06 KR KR1020010068755A patent/KR100886021B1/ko active IP Right Grant
- 2001-11-13 JP JP2001347139A patent/JP3910827B2/ja not_active Expired - Lifetime
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2008
- 2008-01-03 KR KR1020080000876A patent/KR100827793B1/ko active IP Right Grant
Patent Citations (3)
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KR100267617B1 (ko) * | 1993-04-23 | 2000-10-16 | 히가시 데쓰로 | 진공처리장치 및 진공처리방법 |
US5876280A (en) * | 1996-05-30 | 1999-03-02 | Tokyo Electron Limited | Substrate treating system and substrate treating method |
KR19980042482A (ko) * | 1996-11-18 | 1998-08-17 | 조셉제이.스위니 | 웨이퍼 처리 장치 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR100827793B1 (ko) | 2008-05-07 |
KR20020035758A (ko) | 2002-05-15 |
JP2002151376A (ja) | 2002-05-24 |
JP3616748B2 (ja) | 2005-02-02 |
US6715943B2 (en) | 2004-04-06 |
US20020053319A1 (en) | 2002-05-09 |
JP3910827B2 (ja) | 2007-04-25 |
KR20080007413A (ko) | 2008-01-18 |
JP2002280296A (ja) | 2002-09-27 |
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