JP6841188B2 - 塗布処理装置及び塗布液捕集部材 - Google Patents
塗布処理装置及び塗布液捕集部材 Download PDFInfo
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Description
また特許文献2には、回転するウエハの周縁にて発生する糸状(綿状)の塗布液に向けて溶剤を吐出して除去する技術が記載されている。しかしながら糸状の塗布液は飛散しやすく、排気に捕捉された塗布液を十分に抑制できない懸念がある。またレジスト塗布処理中に溶剤の供給を継続する必要があるため、薬液の使用量が多くなるおそれがある。
前記基板保持部に保持された基板に50cP以上の粘度の塗布液を供給する塗布液供給部と、
前記基板保持部上の基板を囲むように設けられたカップ体と、
前記カップ体の内周面と、前記カップ体の内部に設けられる内側部材と、の間に前記カップ体の周方向に沿って形成された環状の排気路と、
前記環状の排気路を覆うように設けられ、回転する基板から飛散する前記の塗布液を捕集するための塗布液捕集部材であって、当該塗布液捕集部材の周方向に配列され、前記カップ体の中心部を中心とした円の径方向に向かって伸びる複数の梁部と、隣り合う前記梁部の間に形成され、塗布液捕集部材の厚さ方向に貫通する複数の開口部と、を有する塗布液捕集部材と、
前記梁部の上面に形成された、塗布液捕集部材に捕集された前記塗布液を溶解するための溶剤を貯留する複数の溝状の溶剤貯留部と、
前記溶剤貯留部に溶剤を供給する溶剤供給部と、を備えることを特徴とする。
上述の塗布液処理装置に用いられることを特徴とする。
なお図2は、実機として構成した場合に想定される例を示したものではなく、技術の理解のために示した便宜上の図である。また図2中における溶剤の貯留される領域、ここでは溶剤貯留部64、流路66及び環状流路65に、ドットを付して示した。
さらに溶剤ノズル43をカップ体2の外部に退避させ、レジスト液ノズル4をウエハWの中心部上方に位置させる。次いで既述の例と同様にウエハWを回転させると共にレジスト液ノズル4からレジスト液を吐出する。この時同様にウエハWから振り切られたレジスト液の一部が糸状の塗布液100になる。
またカップ体2内に溶剤貯留部64に向けて溶剤を供給する溶剤供給部9を設けてもよい。図11及び図12に示すように例えばカップ体2における山型ガイド部21の上面に塗布液捕集部材600に向けて溶剤を吐出する溶剤供給部601を設ける。溶剤供給部601は、例えば環状の溶剤供給管602で構成され、外周側の側面に各溶剤貯留部64に対応するように複数の溶剤吐出孔603が設けられている。
また例えば内環61を管状の溶剤供給管602で構成し、各梁部63に向けて、溶剤を吐出するように構成してもよい。このような構成の場合にも梁部63に形成した溶剤貯留部64に溶剤を貯留することができるため同様の効果を得ることができる。
また上述の実施例においては、溶剤貯留部64をカップ体2の全周に亘って等間隔に複数設けている。そのため、塗布液捕集部材6の部位に寄らず、カップ体2の全周で捕集された糸状の塗布液100を溶解除去できる。従って、塗布液捕集部材6において、局所的な糸状の塗布液100の蓄積が起こりにくく、メンテナンスの高頻度化が抑制される。
またカップ体2の径方向に伸びるように梁部63を設け、梁部63の伸びる方向に沿って溶剤貯留部64を伸びるように設けている。これにより排気路25の幅方向において広い範囲に溶剤が貯留され、塗布液捕集部材6に捕集される糸状の塗布液100が溶剤に接しやすくなる。
この溶剤貯留部64に溶剤を供給するために用いるウエハWとしては、例えば塗布処理装置が配置される液処理システム内に設けられた保持棚から、溶剤の貯留専用ウエハが搬送アームにより取り出されて、当該塗布処理装置に搬送される。あるいは洗浄専用のウエハWを用いる代わりに例えば最初のロットの先頭のウエハW(製品であるウエハW)を用いてもよい。
塗布液捕集部材を設けることによる排気圧の変動の抑制を検証するため、図1に示したレジスト塗布装置を用い、排気ダクト8に設けたダンパの開度により設定されるカップ体2の設定排気圧を50Paに設定した状態で、実施の形態に示した方法に従って、100枚のウエハWにレジスト液の塗布処理を行い、0、25、50、75、100枚のウエハWを処理したときのカップ体2内(塗布液捕集部材6よりも下流側)の排気圧を計測した。また比較例として塗布液捕集部材6を設けないことを除いて実施例と同様に処理を行った。
この結果によればウエハWの処理枚数を840枚まで増えたときにも、ダンパの開度が、低排気時の開度及び高排気時の開度のいずれの場合も排気圧の変化はほとんど見られない。従って、ウエハWの処理枚数が増えたときにも塗布液捕集部材6における糸状の塗布液の詰まりは、ほとんど起こっていないことが分かり、メンテナンスの高頻度化が抑制されていると推察される。
25 排気路
11 スピンチャック
13 回転機構
4 レジスト液ノズル
43 溶剤ノズル
6 塗布液捕集部材
7 裏面側溶剤ノズル
60 開口部
64 溶剤貯留部
65 環状流路
100 糸状の塗布液
W ウエハ
Claims (8)
- 基板を水平に保持して鉛直軸周りに回転する基板保持部と、
前記基板保持部に保持された基板に50cP以上の粘度の塗布液を供給する塗布液供給部と、
前記基板保持部上の基板を囲むように設けられたカップ体と、
前記カップ体の内周面と、前記カップ体の内部に設けられる内側部材と、の間に前記カップ体の周方向に沿って形成された環状の排気路と、
前記環状の排気路を覆うように設けられ、回転する基板から飛散する前記の塗布液を捕集するための塗布液捕集部材であって、当該塗布液捕集部材の周方向に配列され、前記カップ体の中心部を中心とした円の径方向に向かって伸びる複数の梁部と、隣り合う前記梁部の間に形成され、塗布液捕集部材の厚さ方向に貫通する複数の開口部と、を有する塗布液捕集部材と、
前記梁部の上面に形成された、塗布液捕集部材に捕集された前記塗布液を溶解するための溶剤を貯留する複数の溝状の溶剤貯留部と、
前記溶剤貯留部に溶剤を供給する溶剤供給部と、を備えることを特徴とする塗布処理装置。 - 前記溝状の溶剤貯留部は、前記環状の排気路の周方向に複数設けられたことを特徴とする請求項1に記載の塗布処理装置。
- 前記溝状の溶剤貯留部は、前記環状の排気路の周方向に伸びる連通路により互いに連通されたことを特徴とする請求項2に記載の塗布処理装置
- 前記溝状の溶剤貯留部は、カップ体の径方向に伸びるように設けられたことを特徴とする請求項1ないし3のいずれか一項に記載の塗布処理装置。
- 前記溶剤供給部は、前記基板保持部に保持された基板の裏面に向けて溶剤を供給する裏面側溶剤供給部であり、
裏面側溶剤供給部から供給され基板の回転により振り切られた溶剤が少なくとも一つの前記溝状の溶剤貯留部に補充されることを特徴とする請求項1ないし4のいずれか一項に記載の塗布処理装置。 - 前記溶剤供給部は、前記基板保持部に保持された基板の表面に向けて溶剤を供給する溶剤ノズルであり、
溶剤ノズルから供給され、基板の回転により振り切られた溶剤が前記溝状の溶剤貯留部に補充されることを特徴とする請求項1ないし4のいずれか一項に記載の塗布処理装置。 - 前記溶剤供給部は、カップ体の内部に、カップ体の周方向に沿って溶剤吐出孔を備えた環状に構成されることを特徴とする請求項1ないし4のいずれか一項に記載の塗布処理装置。
- カップ体内に設けられた基板保持部に水平に保持した基板に塗布液を供給し、基板の回転により振り切られた塗布液を、カップ体の内周面と内側部材との間にカップ体の周方向に沿って形成された環状の排気路を介して排出するように構成された塗布装置に用いられ、前記排気路を覆うように設けられる塗布液捕集部材であって、
請求項1ないし7のいずれか一項に記載された塗布処理装置に用いられることを特徴とする塗布液捕集部材。
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Application Number | Priority Date | Filing Date | Title |
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JP2017164762A JP6841188B2 (ja) | 2017-08-29 | 2017-08-29 | 塗布処理装置及び塗布液捕集部材 |
TW107129045A TWI791039B (zh) | 2017-08-29 | 2018-08-21 | 塗布處理裝置及塗布液捕集構件 |
KR1020180098351A KR102195652B1 (ko) | 2017-08-29 | 2018-08-23 | 도포 처리 장치 및 도포액 포집 부재 |
US16/111,510 US10699919B2 (en) | 2017-08-29 | 2018-08-24 | Coating processing apparatus and coating liquid collecting member |
CN201821405221.7U CN209020671U (zh) | 2017-08-29 | 2018-08-29 | 涂敷处理装置和涂敷液捕集构件 |
CN201810998096.3A CN109420590B (zh) | 2017-08-29 | 2018-08-29 | 涂敷处理装置和涂敷液捕集构件 |
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JP7462503B2 (ja) | 2019-08-30 | 2024-04-05 | 株式会社Screenホールディングス | 塗布装置 |
JP7426808B2 (ja) * | 2019-11-27 | 2024-02-02 | 株式会社Screenホールディングス | 基板処理装置 |
JP7339150B2 (ja) * | 2019-12-20 | 2023-09-05 | ラピスセミコンダクタ株式会社 | 基板処理装置、基板処理方法 |
US11868057B2 (en) | 2020-10-08 | 2024-01-09 | Tokyo Electron Limited | Solution treatment apparatus and cleaning method |
CN113058791B (zh) * | 2021-04-06 | 2022-04-19 | 黄河科技学院 | 一种汽车喷漆装置 |
CN115662937B (zh) * | 2022-12-29 | 2023-03-17 | 四川晶辉半导体有限公司 | 一种芯片安装设备 |
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US5705223A (en) * | 1994-07-26 | 1998-01-06 | International Business Machine Corp. | Method and apparatus for coating a semiconductor wafer |
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JP2001176767A (ja) * | 1999-12-08 | 2001-06-29 | Lsi Logic Corp | フォトレジスト塗布装置 |
JP3616748B2 (ja) * | 2000-11-07 | 2005-02-02 | 東京エレクトロン株式会社 | 現像処理方法,現像処理装置及び処理装置 |
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JP2006086204A (ja) * | 2004-09-14 | 2006-03-30 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
US20110117283A1 (en) * | 2009-11-13 | 2011-05-19 | Hsueh Chia-Hao | Spray coating system |
JP3175893U (ja) * | 2012-03-15 | 2012-06-07 | 東京エレクトロン株式会社 | 液処理装置 |
JP6045357B2 (ja) | 2013-01-16 | 2016-12-14 | キヤノン株式会社 | 薬液層の形成方法 |
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KR20190024725A (ko) | 2019-03-08 |
TWI791039B (zh) | 2023-02-01 |
CN209020671U (zh) | 2019-06-25 |
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