KR100875412B1 - 저온 경화형 접착제 및 이것을 이용한 이방 도전성 접착필름 - Google Patents
저온 경화형 접착제 및 이것을 이용한 이방 도전성 접착필름 Download PDFInfo
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- KR100875412B1 KR100875412B1 KR1020070046159A KR20070046159A KR100875412B1 KR 100875412 B1 KR100875412 B1 KR 100875412B1 KR 1020070046159 A KR1020070046159 A KR 1020070046159A KR 20070046159 A KR20070046159 A KR 20070046159A KR 100875412 B1 KR100875412 B1 KR 100875412B1
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- resin component
- polystyrene
- double bond
- resin
- unsaturated double
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- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
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Abstract
Description
실시예 및 비교예의 조성 배합 비율 | |||||||||
에폭시 아크릴레이트 | 페녹시수지 | 인산 아크릴레이트 | 비닐실란 커플링제 | 인산계 커플링제 | 유기 과산화물 | 도전 입자 | |||
3002A | VR-60 | YP50 | PM2 | RDX63182 | A172 | KR38S | 퍼헥사3M | ||
실시예 1 | 25 | 25 | 40 | 3 | - | 1 | - | 3 | 3 |
실시예 2 | 25 | 25 | 40 | - | 3 | 1 | - | 3 | 3 |
비교예 1 | - | - | 20 | 73 | - | 1 | - | 3 | 3 |
실시예 3 | 25 | 25 | 40 | 3 | - | - | 1 | 3 | 3 |
비교예 2 | 25 | 25 | 43 | - | - | 1 | - | 3 | 3 |
실시예 및 비교예의 평가 결과 | ||||
접착 강도 (gf/㎝) | 도통 저항 (Ω) | |||
초기 | 60 ℃ 95 % 500 hr 후 | 초기 | 60 ℃ 95 % 500 hr 후 | |
실시예 1 | 865 | 780 | 9.6 | 10.3 |
실시예 2 | 680 | 630 | 9.4 | 11.1 |
비교예 1 | 330 | 280 | 9.8 | 14 |
실시예 3 | 525 | 520 | 9.5 | 11.4 |
비교예 2 | 230 | 220 | 9.8 | 12.4 |
박리 시트 종류에 의한 박리성 및 접착 강도 | ||||
박리력 (gf/5 ㎝) | 접착 강도 (gf/㎝) | |||
초기 | 23 ℃ 1 개월후 | 초기 | 23 ℃ 1 개월후 | |
PTFE | 30∼40 | 30∼40 | 865 | 855 |
PET 실리콘 박리 처리 | 20∼30 | 150∼200 | 780 | 310 |
Claims (4)
- 불포화 이중 결합을 갖는 라디칼 중합성 수지 성분, 불포화 이중 결합을 갖지 않는 수지 성분, 인산 함유 수지 성분 및 라디칼 중합 개시제를 주성분으로 하는 저온 경화형 접착제와, 상기 저온 경화형 접착제중에 분산된 도전 입자를 갖는 이방 도전성 접착제로서,상기 불포화 이중 결합을 갖는 라디칼 중합성 수지 성분이 15 ~ 69.9 중량%, 상기 불포화 이중 결합을 갖지 않는 수지 성분이 30 ~ 84.99 중량%, 상기 인산 함유 수지 성분이 0.01 ~ 20 중량% 배합되어 이루어지며,상기 불포화 이중 결합을 갖는 라디칼 중합성 수지 성분은 적어도 1 분자중에 1 개 이상의 (메타)아크릴로일기를 갖는 (메타)아크릴레이트 수지 및 이들의 변성물, 불포화 폴리에스테르디아릴프탈레이트 수지, 비닐에스테르 수지, 비스말레이미드 수지 및 이들의 변성물, 또는 점도 조정용 단량체이며,상기 불포화 이중결합을 갖지 않는 수지성분은 페녹시 수지 및 그 변성물, 우레탄 수지 및 그 변성물, 아크릴 고무 및 그 변성물, 폴리비닐부티랄, 폴리비닐아세탈 및 이들의 변성물, 셀룰로오스 유도체 및 그 변성물, 폴리올 수지 및 그 변성물, 및 폴리스티렌-폴리이소프렌-폴리스티렌 (SIS), 폴리스티렌-폴리부타디엔-폴리스티렌 (SBS), 폴리스티렌-폴리(에틸렌-부틸렌)-폴리스티렌 (SEBS), 폴리스티렌-폴리(에틸렌-프로필렌)-폴리스티렌 (SEPS) 및 이들의 변성물로 이루어진 군에서 선택되는 것이며,상기 인산함유 수지성분은 인산 함유 (메타)아크릴레이트 또는 인 함유 폴리에스테르 수지이며,상기 라디칼 중합 개시제는 하기 화학식 4로 표시되는 유기 과산화물:[화학식 4]또는 광개시제인 이방 도전성 접착제.
- 박리용 시트, 상기 시트상에 도포 건조하여 형성된, 불포화 이중 결합을 갖는 라디칼 중합성 수지 성분, 불포화 이중 결합을 갖지 않는 수지 성분, 인산 함유 수지 성분 및 라디칼 중합 개시제를 주성분으로 하는 저온 경화형 접착제, 및 상기 저온 경화형 접착제중에 분산된 도전 입자를 갖는 이방 도전성 접착 필름으로서,상기 불포화 이중 결합을 갖는 라디칼 중합성 수지 성분이 15 ~ 69.9 중량%, 상기 불포화 이중 결합을 갖지 않는 수지 성분이 30 ~ 84.99 중량%, 상기 인산 함유 수지 성분이 0.01 ~ 20 중량% 배합되어 이루어지며,상기 불포화 이중 결합을 갖는 라디칼 중합성 수지 성분은 적어도 1 분자중에 1 개 이상의 (메타)아크릴로일기를 갖는 (메타)아크릴레이트 수지 및 이들의 변성물, 불포화 폴리에스테르디아릴프탈레이트 수지, 비닐에스테르 수지, 비스말레이미드 수지 및 이들의 변성물, 또는 점도 조정용 단량체이며,상기 불포화 이중결합을 갖지 않는 수지성분은 페녹시 수지 및 그 변성물, 우레탄 수지 및 그 변성물, 아크릴 고무 및 그 변성물, 폴리비닐부티랄, 폴리비닐아세탈 및 이들의 변성물, 셀룰로오스 유도체 및 그 변성물, 폴리올 수지 및 그 변성물, 및 폴리스티렌-폴리이소프렌-폴리스티렌 (SIS), 폴리스티렌-폴리부타디엔-폴리스티렌 (SBS), 폴리스티렌-폴리(에틸렌-부틸렌)-폴리스티렌 (SEBS), 폴리스티렌-폴리(에틸렌-프로필렌)-폴리스티렌 (SEPS) 및 이들의 변성물로 이루어진 군에서 선택되는 것이며,상기 인산함유 수지성분은 인산 함유 (메타)아크릴레이트 또는 인 함유 폴리에스테르 수지이며,상기 라디칼 중합 개시제는 하기 화학식 4로 표시되는 유기 과산화물:[화학식 4]또는 광개시제인 이방 도전성 접착 필름.
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JP22810199A JP2001049228A (ja) | 1999-08-12 | 1999-08-12 | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
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KR1020070046159A KR100875412B1 (ko) | 1999-08-12 | 2007-05-11 | 저온 경화형 접착제 및 이것을 이용한 이방 도전성 접착필름 |
KR1020070046156A KR100875411B1 (ko) | 1999-08-12 | 2007-05-11 | 저온 경화형 접착제 및 이것을 이용한 이방 도전성 접착필름 |
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US5854325A (en) | 1996-05-27 | 1998-12-29 | Sumitomo Bakelite Company Limited | Photosensitive adhesive composition for additive plating |
EP0878527B1 (en) | 1997-05-16 | 2004-07-28 | Nitto Denko Corporation | Peelable heat-conductive and pressuresensitive adhesive and adhesive sheet containing the same |
EP0893484B1 (en) | 1997-07-24 | 2003-04-09 | Sony Chemicals Corporation | Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
Also Published As
Publication number | Publication date |
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US20040206943A1 (en) | 2004-10-21 |
EP1076082B1 (en) | 2004-11-03 |
JP2001049228A (ja) | 2001-02-20 |
US7754790B2 (en) | 2010-07-13 |
KR20010050058A (ko) | 2001-06-15 |
US7824754B2 (en) | 2010-11-02 |
EP1076082A1 (en) | 2001-02-14 |
DE60015456D1 (de) | 2004-12-09 |
KR20070057733A (ko) | 2007-06-07 |
DE60015456T2 (de) | 2005-06-23 |
US20080157030A1 (en) | 2008-07-03 |
KR100875411B1 (ko) | 2008-12-23 |
KR20070057734A (ko) | 2007-06-07 |
US20100227101A1 (en) | 2010-09-09 |
US20070104973A1 (en) | 2007-05-10 |
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