KR100697803B1 - 복수의 발광 소자를 갖는 발광 장치 - Google Patents
복수의 발광 소자를 갖는 발광 장치 Download PDFInfo
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- KR100697803B1 KR100697803B1 KR20057002667A KR20057002667A KR100697803B1 KR 100697803 B1 KR100697803 B1 KR 100697803B1 KR 20057002667 A KR20057002667 A KR 20057002667A KR 20057002667 A KR20057002667 A KR 20057002667A KR 100697803 B1 KR100697803 B1 KR 100697803B1
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- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims description 4
- 238000003491 array Methods 0.000 abstract description 38
- 229910052594 sapphire Inorganic materials 0.000 abstract description 8
- 239000010980 sapphire Substances 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 44
- 238000005530 etching Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Illuminated Signs And Luminous Advertising (AREA)
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Abstract
Description
Claims (13)
- 절연기판 상에 복수의 GaN계 발광다이오드소자가 형성된 발광장치에 있어서,상기 복수의 발광다이오드 소자는 상기 절연기판상에 2차원적으로 배치되고, 상기 복수의 발광다이오드 소자는 동수(同數)씩 제1조와 제2조로 나뉘어, 상기 제1조와 상기 제2조는 각각 지그재그 형상으로 서로 다르게 배치되고, 상기 제1조와 상기 제2조는 2개의 교류전원용 전극에 서로 반대 극성이 되도록 병렬접속되되,상기 제1조를 구성하는 발광다이오드 소자 중에, 적어도, 말단부에 위치한 발광다이오드 소자를 제외한 어느 하나의 발광다이오드 소자의 음전극과, 상기 제2조를 구성하는 발광다이오드 소자 중에 상기 어느 하나의 발광다이오드 소자에 인접한 발광다이오드 소자의 음전극이 공유되도록 전기적으로 접속되는 것을 특징으로 하는 발광장치.
- 절연기판 상에 복수의 GaN계 발광다이오드소자가 형성된 발광장치에 있어서,상기 복수의 발광다이오드 소자는 상기 절연기판상에 2차원적으로 배치되고, 상기 복수의 발광다이오드소자는 동수(同數)씩 제1조와 제2조로 나뉘어, 상기 제1조와 상기 제2조는 2개의 교류전원용 전극에 서로 반대 극성이 되도록 병렬접속되되,상기 제1조를 구성하는 발광다이오드소자 중에 말단부에 위치한 발광다이오드 소자를 제외한 어느 하나의 발광다이오드 소자의 음전극과, 상기 제2조를 구성하는 발광다이오드 소자 중에 상기 어느 하나의 발광다이오드 소자에 인접한 발광다이오드 소자의 음전극이 공유되도록 전기적으로 접속되는 것을 특징으로 하는 발광장치.
- 제2항에 있어서, 상기 복수의 발광다이오드 소자는 동일한 형상 또는 동일한 사이즈인 것을 특징으로 하는 발광장치.
- 제2항에 있어서, 상기 복수의 발광소자는 평면형상이 정방형상인 것을 특징으로 하는 발광장치.
- 제2항에 있어서, 상기 복수의 발광소자는 평면형상이 삼각형상인 것을 특징으로 하는 발광장치.
- 제5항에 있어서,상기 제1조를 구성하는 발광다이오드 소자 중에 어느 하나의 발광다이오드 소자와, 상기 제2조를 구성하는 발광다이오드소자 중에 상기 어느 하나의 발광다이오드 소자에 인접한 발광다이오드소자는 삼각형상의 한 변을 마주함으로써, 평면형상이 정방형상이 되도록 배치되고, 상기 삼각형상의 마주보는 한 변을 통해 음전극을 공유하는 것을 특징으로 하는 발광장치.
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2002-00249957 | 2002-08-29 | ||
JP2002249957A JP3822545B2 (ja) | 2002-04-12 | 2002-08-29 | 発光装置 |
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KR20050052474A KR20050052474A (ko) | 2005-06-02 |
KR100697803B1 true KR100697803B1 (ko) | 2007-03-20 |
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KR20057002667A KR100697803B1 (ko) | 2002-08-29 | 2003-08-28 | 복수의 발광 소자를 갖는 발광 장치 |
Country Status (10)
Country | Link |
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US (17) | US7417259B2 (ko) |
EP (10) | EP3389094A1 (ko) |
KR (1) | KR100697803B1 (ko) |
CN (2) | CN100570883C (ko) |
AT (1) | ATE500616T1 (ko) |
DE (1) | DE60336252D1 (ko) |
ES (1) | ES2362407T3 (ko) |
RU (1) | RU2295174C2 (ko) |
TW (1) | TWI280672B (ko) |
WO (1) | WO2004023568A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101104767B1 (ko) * | 2011-02-09 | 2012-01-12 | (주)세미머티리얼즈 | 발광 장치 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101104767B1 (ko) * | 2011-02-09 | 2012-01-12 | (주)세미머티리얼즈 | 발광 장치 |
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