KR0119464B1 - Semiconductor device and lead frame - Google Patents
Semiconductor device and lead frameInfo
- Publication number
- KR0119464B1 KR0119464B1 KR19940005376A KR19940005376A KR0119464B1 KR 0119464 B1 KR0119464 B1 KR 0119464B1 KR 19940005376 A KR19940005376 A KR 19940005376A KR 19940005376 A KR19940005376 A KR 19940005376A KR 0119464 B1 KR0119464 B1 KR 0119464B1
- Authority
- KR
- South Korea
- Prior art keywords
- metallic film
- semiconductor device
- lead frame
- layer
- lead
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000011521 glass Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
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- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/15165—Monolayer substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/1517—Multilayer substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5056252A JPH06268091A (ja) | 1993-03-17 | 1993-03-17 | 半導体装置 |
JP93-56252 | 1993-03-17 | ||
JP5057527A JPH06275761A (ja) | 1993-03-17 | 1993-03-17 | 半導体装置 |
JP6020642A JPH07231069A (ja) | 1994-02-17 | 1994-02-17 | 半導体装置及びその製造方法及びこれに使用されるリードフレーム |
JP94-20642 | 1994-02-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940022755A KR940022755A (ko) | 1994-10-21 |
KR0119464B1 true KR0119464B1 (en) | 1997-10-27 |
Family
ID=27283121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR19940005376A KR0119464B1 (en) | 1993-03-17 | 1994-03-17 | Semiconductor device and lead frame |
Country Status (2)
Country | Link |
---|---|
US (2) | US5497032A (ko) |
KR (1) | KR0119464B1 (ko) |
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KR0177744B1 (ko) * | 1995-08-14 | 1999-03-20 | 김광호 | 전기적 특성이 향상된 반도체 장치 |
JP2842355B2 (ja) * | 1996-02-01 | 1999-01-06 | 日本電気株式会社 | パッケージ |
US5847458A (en) * | 1996-05-21 | 1998-12-08 | Shinko Electric Industries Co., Ltd. | Semiconductor package and device having heads coupled with insulating material |
EP0844663B1 (en) * | 1996-05-27 | 2006-03-29 | Dai Nippon Printing Co., Ltd. | Method for manufacturing a circuit member for a semiconductor device |
JPH1065085A (ja) * | 1996-06-28 | 1998-03-06 | Siemens Ag | パワーパッケージ内で使用するためのリードフレーム |
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DE19703639A1 (de) * | 1997-01-31 | 1998-08-06 | Bosch Gmbh Robert | Verfahren zur Herstellung von Bonddrahtverbindungen |
KR100230515B1 (ko) * | 1997-04-04 | 1999-11-15 | 윤종용 | 요철이 형성된 리드 프레임의 제조방법 |
EP0930653B1 (en) * | 1998-01-13 | 2008-06-11 | Lucent Technologies Inc. | High frequency semiconductor device |
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JP2001358276A (ja) * | 2000-06-12 | 2001-12-26 | Mitsui High Tec Inc | 半導体装置およびリードフレーム |
JP4417541B2 (ja) * | 2000-10-23 | 2010-02-17 | ローム株式会社 | 半導体装置およびその製造方法 |
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DE10124970B4 (de) | 2001-05-21 | 2007-02-22 | Infineon Technologies Ag | Elektronisches Bauteil mit einem Halbleiterchip auf einer Halbleiterchip-Anschlußplatte, Systemträger und Verfahren zu deren Herstellung |
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DE10205563B4 (de) * | 2002-02-11 | 2009-06-10 | Advanced Micro Devices, Inc., Sunnyvale | Gehäustes Halbleiterbauelement mit zwei Die-Paddles sowie zugehöriges Herstellungsverfahren |
US6734044B1 (en) * | 2002-06-10 | 2004-05-11 | Asat Ltd. | Multiple leadframe laminated IC package |
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JP2005191147A (ja) * | 2003-12-24 | 2005-07-14 | Sanyo Electric Co Ltd | 混成集積回路装置の製造方法 |
JP2005191342A (ja) * | 2003-12-26 | 2005-07-14 | Renesas Technology Corp | 半導体装置およびその製造方法 |
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US7714453B2 (en) * | 2006-05-12 | 2010-05-11 | Broadcom Corporation | Interconnect structure and formation for package stacking of molded plastic area array package |
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TWI310979B (en) * | 2006-07-11 | 2009-06-11 | Chipmos Technologies Shanghai Ltd | Chip package and manufacturing method threrof |
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US8183687B2 (en) * | 2007-02-16 | 2012-05-22 | Broadcom Corporation | Interposer for die stacking in semiconductor packages and the method of making the same |
CN100539054C (zh) * | 2007-03-13 | 2009-09-09 | 百慕达南茂科技股份有限公司 | 芯片封装结构及其制作方法 |
US7872335B2 (en) * | 2007-06-08 | 2011-01-18 | Broadcom Corporation | Lead frame-BGA package with enhanced thermal performance and I/O counts |
US8115285B2 (en) * | 2008-03-14 | 2012-02-14 | Advanced Semiconductor Engineering, Inc. | Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof |
US20100044850A1 (en) * | 2008-08-21 | 2010-02-25 | Advanced Semiconductor Engineering, Inc. | Advanced quad flat non-leaded package structure and manufacturing method thereof |
US8124447B2 (en) | 2009-04-10 | 2012-02-28 | Advanced Semiconductor Engineering, Inc. | Manufacturing method of advanced quad flat non-leaded package |
US8786063B2 (en) * | 2009-05-15 | 2014-07-22 | Stats Chippac Ltd. | Integrated circuit packaging system with leads and transposer and method of manufacture thereof |
JP5278166B2 (ja) | 2009-05-28 | 2013-09-04 | セイコーエプソン株式会社 | 電子デバイスの製造方法及び電子デバイス |
JP5574667B2 (ja) * | 2009-10-21 | 2014-08-20 | キヤノン株式会社 | パッケージ、半導体装置、それらの製造方法及び機器 |
US8203201B2 (en) * | 2010-03-26 | 2012-06-19 | Stats Chippac Ltd. | Integrated circuit packaging system with leads and method of manufacture thereof |
US8138595B2 (en) * | 2010-03-26 | 2012-03-20 | Stats Chippac Ltd. | Integrated circuit packaging system with an intermediate pad and method of manufacture thereof |
JP4929382B2 (ja) * | 2010-07-13 | 2012-05-09 | 株式会社東芝 | 電子部品構造体及び電子機器 |
TWI453831B (zh) | 2010-09-09 | 2014-09-21 | 台灣捷康綜合有限公司 | 半導體封裝結構及其製造方法 |
CA2814119C (en) | 2010-10-12 | 2017-01-17 | Alliance For Sustainable Energy, Llc | High bandgap iii-v alloys for high efficiency optoelectronics |
KR20120048875A (ko) * | 2010-11-08 | 2012-05-16 | 삼성전자주식회사 | 노출 패들을 갖는 쿼드 플랫 패키지 |
US9349628B2 (en) * | 2013-02-25 | 2016-05-24 | Advanced Micro Devices, Inc. | Method and an alignment plate for engaging a stiffener frame and a circuit board |
US9966330B2 (en) | 2013-03-14 | 2018-05-08 | Vishay-Siliconix | Stack die package |
US9589929B2 (en) | 2013-03-14 | 2017-03-07 | Vishay-Siliconix | Method for fabricating stack die package |
US9728510B2 (en) * | 2015-04-10 | 2017-08-08 | Analog Devices, Inc. | Cavity package with composite substrate |
JP6461431B2 (ja) | 2016-06-14 | 2019-01-30 | 三菱電機株式会社 | 半導体装置 |
US11145574B2 (en) * | 2018-10-30 | 2021-10-12 | Microchip Technology Incorporated | Semiconductor device packages with electrical routing improvements and related methods |
WO2024041759A1 (en) * | 2022-08-24 | 2024-02-29 | Microchip Technology Caldicot Limited | Electronic device package including a gel |
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JPS58100447A (ja) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | 樹脂封止型半導体装置およびその製造方法 |
JP2582013B2 (ja) * | 1991-02-08 | 1997-02-19 | 株式会社東芝 | 樹脂封止型半導体装置及びその製造方法 |
FR2524707B1 (fr) * | 1982-04-01 | 1985-05-31 | Cit Alcatel | Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus |
JPS62276863A (ja) * | 1986-05-26 | 1987-12-01 | Hitachi Ltd | 電子装置 |
US4884124A (en) * | 1986-08-19 | 1989-11-28 | Mitsubishi Denki Kabushiki Kaisha | Resin-encapsulated semiconductor device |
JPS6352445A (ja) * | 1986-08-22 | 1988-03-05 | Hitachi Ltd | 半導体装置 |
JPS63293931A (ja) * | 1987-05-27 | 1988-11-30 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPH01251748A (ja) * | 1988-03-31 | 1989-10-06 | Toppan Printing Co Ltd | 半導体装置用リードフレーム |
US5032543A (en) * | 1988-06-17 | 1991-07-16 | Massachusetts Institute Of Technology | Coplanar packaging techniques for multichip circuits |
JP2602076B2 (ja) * | 1988-09-08 | 1997-04-23 | 三菱電機株式会社 | 半導体装置用リードフレーム |
JPH0732215B2 (ja) * | 1988-10-25 | 1995-04-10 | 三菱電機株式会社 | 半導体装置 |
US5175060A (en) * | 1989-07-01 | 1992-12-29 | Ibiden Co., Ltd. | Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same |
US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
US5139973A (en) * | 1990-12-17 | 1992-08-18 | Allegro Microsystems, Inc. | Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet |
US5172214A (en) * | 1991-02-06 | 1992-12-15 | Motorola, Inc. | Leadless semiconductor device and method for making the same |
-
1994
- 1994-03-16 US US08/213,720 patent/US5497032A/en not_active Expired - Fee Related
- 1994-03-17 KR KR19940005376A patent/KR0119464B1/ko not_active IP Right Cessation
-
1995
- 1995-11-21 US US08/561,421 patent/US5804468A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR940022755A (ko) | 1994-10-21 |
US5804468A (en) | 1998-09-08 |
US5497032A (en) | 1996-03-05 |
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