JPWO2021075207A1 - - Google Patents

Info

Publication number
JPWO2021075207A1
JPWO2021075207A1 JP2021552279A JP2021552279A JPWO2021075207A1 JP WO2021075207 A1 JPWO2021075207 A1 JP WO2021075207A1 JP 2021552279 A JP2021552279 A JP 2021552279A JP 2021552279 A JP2021552279 A JP 2021552279A JP WO2021075207 A1 JPWO2021075207 A1 JP WO2021075207A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021552279A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021075207A1 publication Critical patent/JPWO2021075207A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
JP2021552279A 2019-10-16 2020-09-18 Pending JPWO2021075207A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019189706 2019-10-16
JP2020020134 2020-02-07
JP2020020135 2020-02-07
PCT/JP2020/035468 WO2021075207A1 (ja) 2019-10-16 2020-09-18 エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021075207A1 true JPWO2021075207A1 (ja) 2021-04-22

Family

ID=75537571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021552279A Pending JPWO2021075207A1 (ja) 2019-10-16 2020-09-18

Country Status (5)

Country Link
JP (1) JPWO2021075207A1 (ja)
KR (1) KR20220084073A (ja)
CN (1) CN114599729A (ja)
TW (1) TW202120580A (ja)
WO (1) WO2021075207A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117858924A (zh) * 2021-08-30 2024-04-09 株式会社力森诺科 硬化性树脂组合物及电子零件装置
WO2023032971A1 (ja) * 2021-09-02 2023-03-09 株式会社レゾナック 圧縮成形用エポキシ樹脂組成物及び電子部品装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106875A (ja) * 1999-10-08 2001-04-17 Kashima Oil Co Ltd 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置
JP4639439B2 (ja) * 2000-08-04 2011-02-23 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP3944736B2 (ja) * 2003-02-06 2007-07-18 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2007153969A (ja) 2005-12-02 2007-06-21 Showa Denko Kk 高熱伝導性樹脂組成物および配線用基板
JP5189606B2 (ja) 2010-01-26 2013-04-24 パナソニック株式会社 半導体封止用エポキシ樹脂組成物、及び半導体装置
KR101735983B1 (ko) * 2013-03-07 2017-05-15 스미또모 베이크라이트 가부시키가이샤 접착 필름, 다이싱 시트 일체형 접착 필름, 백그라인드 테이프 일체형 접착 필름, 백그라인드 테이프 겸 다이싱 시트 일체형 접착 필름, 적층체, 적층체의 경화물, 및 반도체 장치, 그리고 반도체 장치의 제조 방법
JP2015074703A (ja) 2013-10-08 2015-04-20 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP6770793B2 (ja) * 2015-08-19 2020-10-21 日鉄ケミカル＆マテリアル株式会社 難燃性エポキシ樹脂組成物及びその硬化物
JP7066975B2 (ja) * 2017-03-10 2022-05-16 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
JP6859916B2 (ja) * 2017-10-13 2021-04-14 味の素株式会社 樹脂組成物層
JP7169076B2 (ja) * 2018-03-22 2022-11-10 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP2019176023A (ja) * 2018-03-28 2019-10-10 京セラ株式会社 半導体封止用樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
CN114599729A (zh) 2022-06-07
WO2021075207A1 (ja) 2021-04-22
TW202120580A (zh) 2021-06-01
KR20220084073A (ko) 2022-06-21

Similar Documents

Publication Publication Date Title
BR112019017762A2 (ja)
BR112021017339A2 (ja)
BR112021013854A2 (ja)
BR112021018450A2 (ja)
BR112019016141A2 (ja)
AU2020104490A4 (ja)
BR112019016138A2 (ja)
BR112019016142A2 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021017173A2 (ja)
BR112021017083A2 (ja)
BR112021008711A2 (ja)
JPWO2021075207A1 (ja)
BR112021018452A2 (ja)
BR112021012348A2 (ja)
BR112021018250A2 (ja)
BR112021013944A2 (ja)
BR112021013128A2 (ja)
BR112021018484A2 (ja)
BR112021015080A2 (ja)
BR112021016996A2 (ja)
BR112021017010A2 (ja)
AT524962A5 (ja)
BR112019016136A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230705