JPWO2016174868A1 - 熱可塑性液晶ポリマーフィルム及び回路基板 - Google Patents

熱可塑性液晶ポリマーフィルム及び回路基板 Download PDF

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Publication number: JPWO2016174868A1
Authority: JP; Japan
Prior art keywords: liquid crystal; crystal polymer; polymer film; thermoplastic liquid; conductor layer
Prior art date: 2015-04-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2017515392A

Other languages

English (en)

Japanese (ja)

Inventor

砂本　辰也

辰也砂本

崇裕中島

健 ▲高▼橋

小野寺　稔

稔小野寺

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kuraray Co Ltd

Original Assignee

Kuraray Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-04-27

Filing date

2016-04-26

Publication date

2018-02-15

2016-04-26 Application filed by Kuraray Co Ltd filed Critical Kuraray Co Ltd

2018-02-15 Publication of JPWO2016174868A1 publication Critical patent/JPWO2016174868A1/ja

Status Pending legal-status Critical Current

Links

229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 240
239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 239
229920001169 thermoplastic Polymers 0.000 title claims abstract description 219
239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 218
239000004020 conductor Substances 0.000 claims abstract description 130
238000000034 method Methods 0.000 claims abstract description 44
238000002844 melting Methods 0.000 claims description 48
230000008018 melting Effects 0.000 claims description 48
239000000853 adhesive Substances 0.000 claims description 15
230000001070 adhesive effect Effects 0.000 claims description 15
230000009467 reduction Effects 0.000 claims description 10
238000010030 laminating Methods 0.000 claims description 8
239000010410 layer Substances 0.000 description 155
238000010438 heat treatment Methods 0.000 description 63
229910052751 metal Inorganic materials 0.000 description 45
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 39
239000011889 copper foil Substances 0.000 description 36
239000002184 metal Substances 0.000 description 36
230000003746 surface roughness Effects 0.000 description 33
239000011888 foil Substances 0.000 description 29
239000000463 material Substances 0.000 description 22
230000005540 biological transmission Effects 0.000 description 16
230000007423 decrease Effects 0.000 description 15
125000003118 aryl group Chemical group 0.000 description 13
FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 11
KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 11
239000000956 alloy Substances 0.000 description 11
229910045601 alloy Inorganic materials 0.000 description 11
230000000694 effects Effects 0.000 description 11
230000003647 oxidation Effects 0.000 description 10
238000007254 oxidation reaction Methods 0.000 description 10
-1 aliphatic dicarboxylic acids Chemical class 0.000 description 9
238000001125 extrusion Methods 0.000 description 9
239000004973 liquid crystal related substance Substances 0.000 description 9
229920000728 polyester Polymers 0.000 description 9
230000000052 comparative effect Effects 0.000 description 8
125000005274 4-hydroxybenzoic acid group Chemical group 0.000 description 7
238000004519 manufacturing process Methods 0.000 description 7
229920000642 polymer Polymers 0.000 description 7
229940090248 4-hydroxybenzoic acid Drugs 0.000 description 6
239000004974 Thermotropic liquid crystal Substances 0.000 description 6
239000011347 resin Substances 0.000 description 6
229920005989 resin Polymers 0.000 description 6
239000000155 melt Substances 0.000 description 5
238000012545 processing Methods 0.000 description 5
239000000758 substrate Substances 0.000 description 5
QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
150000001875 compounds Chemical class 0.000 description 4
QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
238000005065 mining Methods 0.000 description 4
239000012299 nitrogen atmosphere Substances 0.000 description 4
230000008569 process Effects 0.000 description 4
239000000523 sample Substances 0.000 description 4
239000006087 Silane Coupling Agent Substances 0.000 description 3
BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 3
230000008859 change Effects 0.000 description 3
238000007906 compression Methods 0.000 description 3
229910052802 copper Inorganic materials 0.000 description 3
239000010949 copper Substances 0.000 description 3
229920001971 elastomer Polymers 0.000 description 3
238000003475 lamination Methods 0.000 description 3
238000005259 measurement Methods 0.000 description 3
230000007246 mechanism Effects 0.000 description 3
229920006149 polyester-amide block copolymer Polymers 0.000 description 3
238000002360 preparation method Methods 0.000 description 3
238000004381 surface treatment Methods 0.000 description 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
238000004891 communication Methods 0.000 description 2
229920001577 copolymer Polymers 0.000 description 2
ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
230000002500 effect on skin Effects 0.000 description 2
230000010365 information processing Effects 0.000 description 2
RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
239000004417 polycarbonate Substances 0.000 description 2
229920000139 polyethylene terephthalate Polymers 0.000 description 2
239000005020 polyethylene terephthalate Substances 0.000 description 2
229920006254 polymer film Polymers 0.000 description 2
239000002994 raw material Substances 0.000 description 2
UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
239000004696 Poly ether ether ketone Substances 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
239000004734 Polyphenylene sulfide Substances 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
239000000654 additive Substances 0.000 description 1
125000001931 aliphatic group Chemical group 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
150000004984 aromatic diamines Chemical class 0.000 description 1
150000001565 benzotriazoles Chemical class 0.000 description 1
235000010290 biphenyl Nutrition 0.000 description 1
239000004305 biphenyl Substances 0.000 description 1
VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
230000008094 contradictory effect Effects 0.000 description 1
238000002788 crimping Methods 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
238000007772 electroless plating Methods 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000005530 etching Methods 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
239000000945 filler Substances 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
230000001788 irregular Effects 0.000 description 1
239000012948 isocyanate Substances 0.000 description 1
150000002513 isocyanates Chemical class 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000003754 machining Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
150000007522 mineralic acids Chemical class 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
229910017604 nitric acid Inorganic materials 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
238000005457 optimization Methods 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
238000007747 plating Methods 0.000 description 1
238000005498 polishing Methods 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920001230 polyarylate Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920002530 polyetherether ketone Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
238000006116 polymerization reaction Methods 0.000 description 1
229920000098 polyolefin Polymers 0.000 description 1
229920000069 polyphenylene sulfide Polymers 0.000 description 1
230000003449 preventive effect Effects 0.000 description 1
238000003672 processing method Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
239000002356 single layer Substances 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000002344 surface layer Substances 0.000 description 1
238000012360 testing method Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Materials Engineering (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Laminated Bodies (AREA)
Manufacture Of Macromolecular Shaped Articles (AREA)

JP2017515392A 2015-04-27 2016-04-26 熱可塑性液晶ポリマーフィルム及び回路基板 Pending JPWO2016174868A1 (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2015090470		2015-04-27
JP2015090470		2015-04-27
PCT/JP2016/002205 WO2016174868A1 (ja)	2015-04-27	2016-04-26	熱可塑性液晶ポリマーフィルム及び回路基板

Publications (1)

Publication Number	Publication Date
JPWO2016174868A1 true JPWO2016174868A1 (ja)	2018-02-15

Family

ID=57198358

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2017515392A Pending JPWO2016174868A1 (ja)	2015-04-27	2016-04-26	熱可塑性液晶ポリマーフィルム及び回路基板

Country Status (4)

Country	Link
JP (1)	JPWO2016174868A1 (zh)
CN (1)	CN107531921A (zh)
TW (2)	TWI760302B (zh)
WO (1)	WO2016174868A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI635952B (zh) *	2017-05-10	2018-09-21	亞洲電材股份有限公司	複合式金屬基板結構
US20210400810A1 (en) *	2018-10-29	2021-12-23	Panasonic Intellectual Property Management Co., Ltd.	Metal clad laminated plate and method for manufacturing metal clad laminated plate
US20210070927A1 (en) *	2019-09-10	2021-03-11	Ticona Llc	Polymer Composition and Film for Use in 5G Applications
US11917753B2 (en)	2019-09-23	2024-02-27	Ticona Llc	Circuit board for use at 5G frequencies
TWI740515B (zh)	2019-12-23	2021-09-21	長春人造樹脂廠股份有限公司	液晶高分子膜及包含其之積層板
CN115087692B (zh) *	2020-03-06	2024-02-13	株式会社村田制作所	液晶聚合物膜及其制造方法
WO2021193385A1 (ja) *	2020-03-26	2021-09-30	株式会社クラレ	多層回路基板の製造方法
CN112566364B (zh) *	2020-11-24	2022-12-30	中国科学技术大学	无胶粘层热塑性液晶聚合物高频基板及其制备方法和应用
CN112433405B (zh) *	2020-11-24	2022-04-19	中国科学技术大学	一种液晶高分子基板及其加工方法
JP2023020093A (ja) *	2021-07-30	2023-02-09	富士フイルム株式会社	積層体
JP2023034673A (ja)	2021-08-31	2023-03-13	富士フイルム株式会社	液晶ポリマーフィルム、積層体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000044797A (ja) *	1998-04-06	2000-02-15	Kuraray Co Ltd	液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板
WO2003102277A1 (fr) *	2002-06-04	2003-12-11	Mitsui Mining & Smelting Co.,Ltd.	Feuille de cuivre traitee en surface pour substrat dielectrique faible, stratifie cuivre comportant cette feuille et carte a cablage imprime
JP2005001376A (ja) *	2003-05-21	2005-01-06	Kuraray Co Ltd	フィルムの製造方法
WO2007013330A1 (ja) *	2005-07-27	2007-02-01	Kuraray Co., Ltd.	熱可塑性液晶ポリマーフィルムで被覆した配線板の製造方法
JP2012077117A (ja) *	2010-09-30	2012-04-19	Kuraray Co Ltd	熱可塑性液晶ポリマーフィルムおよびそれを用いた伝送線路

2016
- 2016-04-26 JP JP2017515392A patent/JPWO2016174868A1/ja active Pending
- 2016-04-26 CN CN201680024465.8A patent/CN107531921A/zh active Pending
- 2016-04-26 WO PCT/JP2016/002205 patent/WO2016174868A1/ja active Application Filing
- 2016-04-27 TW TW105113024A patent/TWI760302B/zh active
- 2016-04-27 TW TW110106897A patent/TW202126480A/zh unknown

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000044797A (ja) *	1998-04-06	2000-02-15	Kuraray Co Ltd	液晶ポリマ―フィルムと積層体及びそれらの製造方法並びに多層実装回路基板
WO2003102277A1 (fr) *	2002-06-04	2003-12-11	Mitsui Mining & Smelting Co.,Ltd.	Feuille de cuivre traitee en surface pour substrat dielectrique faible, stratifie cuivre comportant cette feuille et carte a cablage imprime
JP2005001376A (ja) *	2003-05-21	2005-01-06	Kuraray Co Ltd	フィルムの製造方法
WO2007013330A1 (ja) *	2005-07-27	2007-02-01	Kuraray Co., Ltd.	熱可塑性液晶ポリマーフィルムで被覆した配線板の製造方法
JP2012077117A (ja) *	2010-09-30	2012-04-19	Kuraray Co Ltd	熱可塑性液晶ポリマーフィルムおよびそれを用いた伝送線路

Also Published As

Publication number	Publication date
TW202126480A (zh)	2021-07-16
TWI760302B (zh)	2022-04-11
TW201702067A (zh)	2017-01-16
CN107531921A (zh)	2018-01-02
WO2016174868A1 (ja)	2016-11-03

Legal Events

Date	Code	Title	Description
2017-10-23	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171023
2018-11-16	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181116
2019-08-20	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190820
2019-10-16	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191016
2020-03-31	A02	Decision of refusal	Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200331

Publication	Publication Date	Title
WO2016174868A1 (ja)	2016-11-03	熱可塑性液晶ポリマーフィルム及び回路基板
JP6632541B2 (ja)	2020-01-22	回路基板およびその製造方法
TWI616328B (zh)	2018-03-01	熱塑性液晶聚合物薄膜及使用其之積層體及電路基板、積層體之製造方法、以及熱塑性液晶聚合物薄膜之製造方法
JP6499584B2 (ja)	2019-04-10	熱可塑性液晶ポリマーフィルム、回路基板、およびそれらの製造方法
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JP4216433B2 (ja)	2009-01-28	回路基板用金属張積層板の製造方法
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