JPWO2009028365A1 - ダイシング装置 - Google Patents
ダイシング装置 Download PDFInfo
- Publication number
- JPWO2009028365A1 JPWO2009028365A1 JP2009530059A JP2009530059A JPWO2009028365A1 JP WO2009028365 A1 JPWO2009028365 A1 JP WO2009028365A1 JP 2009530059 A JP2009530059 A JP 2009530059A JP 2009530059 A JP2009530059 A JP 2009530059A JP WO2009028365 A1 JPWO2009028365 A1 JP WO2009028365A1
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- JP
- Japan
- Prior art keywords
- workpiece
- work
- microscope
- alignment
- tables
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 claims abstract description 43
- 238000003754 machining Methods 0.000 claims description 17
- 238000003384 imaging method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0608—Grinders for cutting-off using a saw movable on slideways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
5…顕微鏡
9…回転ブレード
10…スピンドル
12、14…ワークテーブル
16、18…Xテーブル
20…オイルパン
22…ガイドレール
24…ボールねじ
26…サーボモータ
28…ボールナット
30…スライダ
32…θテーブル
34…蛇腹
36…ガイドレール
38…ボールねじ
40…サーボモータ
44…θテーブル
46…蛇腹
48…ガイドベース
50…スピンドルYガイド
52…スピンドルYテーブル
54…スピンドルZテーブル
56…ホルダ
58、60…顕微鏡駆動装置
62…顕微鏡Yガイド
64…顕微鏡Yテーブル
66…顕微鏡Zテーブル
70、74…ボールねじ
72、76…サーボモータ
Claims (3)
- ワークが載置される複数のワークテーブルと、
前記複数のワークテーブルに載置されたワークを撮像し加工領域を検出する複数のアライメント装置と、
前記複数のワークテーブルに載置されたワークを回転刃によって加工する複数の加工装置と、を備え、
前記複数のアライメント装置は、前記複数のワークテーブルに載置されたワークを各々撮像するように単独で移動自在に設けられている、
ダイシング装置。 - 前記複数のアライメント装置は、1つのワークテーブルに載置された1枚のワークを協働して撮像し加工領域を検出する、
請求項1に記載のダイシング装置。 - 前記複数のアライメント装置は、ワークの加工領域を検出する他、加工途中のワークの加工品質確認を、前記複数のワークテーブル上の複数のワークに対して、又は1つのワークテーブル上の1枚のワークに対して協働して実施する、
請求項1、又は2に記載のダイシング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009530059A JP5464421B2 (ja) | 2007-08-31 | 2008-08-20 | ダイシング装置及びダイシング方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007226273 | 2007-08-31 | ||
JP2007226273 | 2007-08-31 | ||
JP2009530059A JP5464421B2 (ja) | 2007-08-31 | 2008-08-20 | ダイシング装置及びダイシング方法 |
PCT/JP2008/064800 WO2009028365A1 (ja) | 2007-08-31 | 2008-08-20 | ダイシング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009028365A1 true JPWO2009028365A1 (ja) | 2010-12-02 |
JP5464421B2 JP5464421B2 (ja) | 2014-04-09 |
Family
ID=40387088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009530059A Active JP5464421B2 (ja) | 2007-08-31 | 2008-08-20 | ダイシング装置及びダイシング方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5464421B2 (ja) |
TW (1) | TW200913043A (ja) |
WO (1) | WO2009028365A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200472836Y1 (ko) * | 2012-07-06 | 2014-05-27 | 프로브 테크놀로지 코포레이션 | 절삭 유닛 및 그 응용설비 |
JP6205446B2 (ja) * | 2016-03-16 | 2017-09-27 | リンテック株式会社 | 光照射装置および光照射方法 |
CN112372463A (zh) * | 2020-11-23 | 2021-02-19 | 湖南邦普汽车循环有限公司 | 多片式模组电极连接切断装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02290040A (ja) * | 1989-04-28 | 1990-11-29 | Disco Abrasive Syst Ltd | アライメントシステム |
JP3765265B2 (ja) * | 2001-11-28 | 2006-04-12 | 株式会社東京精密 | ダイシング装置 |
JP4436641B2 (ja) * | 2003-09-09 | 2010-03-24 | 株式会社ディスコ | 切削装置におけるアライメント方法 |
JP4571851B2 (ja) * | 2004-11-30 | 2010-10-27 | 株式会社ディスコ | 切削装置 |
JP4527559B2 (ja) * | 2005-01-31 | 2010-08-18 | 株式会社ディスコ | 露光装置 |
JP2006222181A (ja) * | 2005-02-09 | 2006-08-24 | Matsushita Electric Ind Co Ltd | チップ搭載装置およびチップ搭載方法 |
-
2008
- 2008-08-20 WO PCT/JP2008/064800 patent/WO2009028365A1/ja active Application Filing
- 2008-08-20 JP JP2009530059A patent/JP5464421B2/ja active Active
- 2008-08-27 TW TW97132627A patent/TW200913043A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP5464421B2 (ja) | 2014-04-09 |
WO2009028365A1 (ja) | 2009-03-05 |
TW200913043A (en) | 2009-03-16 |
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