JPS6265954A - Borosilicate glass for sealing alumina - Google Patents
Borosilicate glass for sealing aluminaInfo
- Publication number
- JPS6265954A JPS6265954A JP60205850A JP20585085A JPS6265954A JP S6265954 A JPS6265954 A JP S6265954A JP 60205850 A JP60205850 A JP 60205850A JP 20585085 A JP20585085 A JP 20585085A JP S6265954 A JPS6265954 A JP S6265954A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- alumina
- borosilicate glass
- sealing
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Glass Compositions (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ＣＣＤ等の固体＠他素子を収納するアルミナ
パッケージの窓ガラス及びアルミナ基板上に設置される
固体撮像素子ないし薄膜撮像素子のキャップガラスの用
途に特に適したアルミナ封着用硼珪酸ガラスに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to the window glass of an alumina package that houses solid-state devices such as CCDs and other devices, and the cap glass of solid-state image sensors or thin-film image sensors installed on an alumina substrate. The present invention relates to borosilicate glass for sealing alumina which is particularly suitable for applications.
カメラのオートフォーカス、ファクシミリのラインセン
ナ、テレビカメラのイメージセンナとしてＣＣＤ等の固
体撮像素子が使用されて０る。固体撮像素子は、半導体
ＩＣと同様にシリコンのチップ上に多数の素子を集積配
置したものである。シリコンのチップは、素子の安定性
を保証するため、気密封止された／＜フケージ内に収納
される。パッケージには、信頼性の高ｔＩ箋アルミナセ
ラミックが使用される。このパッケージには、光を透す
窓が必要であり、ガラス板がアルミナパッケージにガラ
スフリフトを用いて封着される。また、密着型イメージ
センサと呼ばれるものには、アルミナセラミック基板上
にアモルファスシリコン等の薄膜素子を付けたもの、あ
るいはシリコンチップを並べたものが用いられる。この
場合、薄膜素子あるいは固体素子は、キャップガラスで
カバーされ、キャップガラスはアルミナ基板とガラスフ
リットを用いて気密封止される。Solid-state image sensing devices such as CCDs are used as autofocus in cameras, line sensors in facsimiles, and image sensors in television cameras. A solid-state image sensor is a device in which a large number of elements are integrated and arranged on a silicon chip, similar to a semiconductor IC. The silicon chip is housed in a hermetically sealed cage to ensure device stability. The package uses highly reliable alumina ceramic. This package requires a window that allows light to pass through, and a glass plate is sealed to the alumina package using a glass lift. Furthermore, what is called a contact type image sensor uses a sensor in which a thin film element of amorphous silicon or the like is attached to an alumina ceramic substrate, or a sensor in which silicon chips are arranged. In this case, the thin film element or the solid element is covered with a cap glass, and the cap glass is hermetically sealed using an alumina substrate and a glass frit.
この用途に用いられるガラスは、アルミナと封着された
時に、割れやソリ、ゆがみが発生してはならない。すな
わち、ガラスの熱膨張係数がアルミナの熱膨張係数と適
合する必要がある。また、この窓ガラスやキャップガラ
スを透った光がゆがみな（撮像素子に到達しなければな
らない。そのため、ガラスには脈理と呼ばれる不均質部
や泡、ブッ、汚れ等の欠陥を全く含まない高品質が要求
される。Glass used for this purpose must not crack, warp, or warp when sealed with alumina. That is, the coefficient of thermal expansion of glass needs to match that of alumina. In addition, the light that passes through this window glass or cap glass is distorted (it has to reach the image sensor. Therefore, the glass does not contain any imperfections such as non-uniform parts called striae, bubbles, spots, dirt, etc.). No high quality is required.
従来技術
アルミナセラミックとフリットシールを行なうためには
、ガラスの熱膨張係数αがアルミナセラミックの熱膨張
係数α：約７０Ｘ１０−７／”Ｃと適合しなければなら
ない。そのため、ガラスの熱膨張係数αは６０〜７０Ｘ
１０°”７℃である必要がある。従来熱膨張係数α＝
ＧＯＸ １０−／”Ｃ程度のガラスとしては、ＩｈＯｓ
を８％未膚程度含存する硼珪酸ガラスが知られている。Prior Art In order to perform frit sealing with alumina ceramic, the thermal expansion coefficient α of the glass must match the thermal expansion coefficient α of the alumina ceramic: approximately 70×10-7/”C. Therefore, the thermal expansion coefficient α of the glass is 60~70X
It needs to be 10°”7°C.Conventional thermal expansion coefficient α=
As a glass of GOX 10-/”C, IhOs
Borosilicate glass is known that contains approximately 8% of silica.
しかし、これらのガラスは、いずれも溶融粘度が比較的
高（、泡や脈理のないガラスを得ることが難しい。溶融
性を向上するには、［１ｚＯｓあるいは、ＮａｚＯ、に
２ｏ を増すことが考えられる。ただし、Ｂ＊Ｏｓを
増加させると溶融粘度は低下するが、それとともに、ガ
ラス表面からの８２０３あるいはＮａｚＢ◆０？等の蒸
発が著しくなる。蒸発が激しくなると、ガラス表面に成
分の異なるガラス層あるいはスカムと呼ばれる失透物が
生じ、これらが脈理あるいはブッになる。また、蒸発物
がガラス溶融炉の天井耐火物を侵食するため、溶融炉の
寿命を縮めるばかりか、反応物がガラス中に落下し、プ
ツ等の欠陥を生じる原因となる。一方、ＮＩＬ２０ 、
ＫｚＯ等のアルカリ成分を増すと、溶融粘度は低下す
るが、熱膨張係数が増加するとともに化学的耐久性、す
なわち耐風化性が劣化する。すなわち、大気中の水分等
とガラス中のアルカリ成分が反応し、ガラス表面に炭酸
ナトリウム等の結晶を析出させ、いわゆるソーダ吹きと
いう現象をおこす。ソーダ吹きがおこると、ガラス表面
に汚れが生じるとともに透過率が低下する。However, all of these glasses have relatively high melt viscosities (and it is difficult to obtain glass without bubbles or striae. To improve the meltability, it is necessary to increase 2o to [1zOs or NazO). However, increasing B*Os lowers the melt viscosity, but at the same time, the evaporation of 8203 or NazB◆0? from the glass surface becomes significant.As the evaporation becomes more intense, different components may appear on the glass surface. A glass layer or devitrification material called scum is formed, which becomes striae or scum.In addition, the vaporized material corrodes the ceiling refractory of the glass melting furnace, which not only shortens the life of the melting furnace, but also causes the reactants to It falls into the glass and causes defects such as spots.On the other hand, NIL20,
When the alkali component such as KzO is increased, the melt viscosity decreases, but the thermal expansion coefficient increases and the chemical durability, that is, weathering resistance deteriorates. That is, moisture in the atmosphere reacts with alkaline components in the glass, causing crystals such as sodium carbonate to precipitate on the glass surface, resulting in a phenomenon called soda blowing. When soda blowing occurs, stains occur on the glass surface and the transmittance decreases.
発明の目的
そこで、本発明者らは、溶融が容易で均質な欠陥のない
ガラスが得られ、かつ化学的耐久性に優れたアルミナ封
行用ガラスを得ることを目的として鋭意研究を重ねた。Purpose of the Invention Therefore, the present inventors have conducted extensive research with the aim of obtaining an alumina sealing glass that is easy to melt, homogeneous, defect-free, and has excellent chemical durability.
上記したように、アルミナ封着用として、まず、熱膨張
係数をアルミナセラミックと適合させなければならない
ため、ガラスの熱膨張係数は６０〜７０Ｘ １０−７／
”Ｃでなければならない。また、イメージセンナの窓ガ
ラスあるいはキャップガラスとしては、均質で、泡、ブ
ハ脈皿などの欠陥を含まない耐風化性に優れたガラスが
必要である。均質で欠陥のないガラスを得るためには、
溶融が容易であること、すなわち、溶融時のガラス粘度
が低いことが必要である。粘度が低いと、ガラスからの
脱泡が容易で、ガラスの均質化が促進される。さらに、
ガラス溶融炉の温度を下げることができ、これにより槽
壁耐火物の侵食が抑制され、侵食耐火物によるガラスの
汚染を防ぐことができる。As mentioned above, for alumina sealing, the thermal expansion coefficient of glass must first be matched with that of alumina ceramic, so the thermal expansion coefficient of glass is 60 to 70X 10-7/
In addition, the window glass or cap glass for the image sensor must be a glass that is homogeneous and has excellent weathering resistance and does not contain defects such as bubbles and vein plates. To get no glass,
It is necessary that the glass be easily melted, that is, the glass viscosity at the time of melting must be low. When the viscosity is low, defoaming from the glass is easy and homogenization of the glass is promoted. moreover,
The temperature of the glass melting furnace can be lowered, thereby suppressing erosion of the tank wall refractories and preventing contamination of the glass by the eroded refractories.
本発明は、イメージセンサの窓ガラスあるいはキャップ
ガラスとして用いられるガラスとして、アルミナとの封
着性がよく（熱膨張係数６０〜７０×１０−１７１℃）
、溶融が容易で（１０”’ｐｏｉｓｅ温度、１４００°
Ｃ以下）、溶融時にガラス表面からの蒸発が少なく（蒸
発率２％未清）、かつ耐風化性に優れた（アルカリ溶出
ｆｆ１０．１ｑ以下）ガラスを得ることを目的とするも
のである。The present invention has good sealing properties with alumina (thermal expansion coefficient 60 to 70 x 10-171°C) as a glass used as a window glass or cap glass of an image sensor.
, easy to melt (10'''poise temperature, 1400°
The purpose of the present invention is to obtain a glass with low evaporation from the glass surface during melting (evaporation rate of 2% unfinished) and excellent weathering resistance (alkali elution ff10.1q or less).
発明の措成
本発明者らは、以下に示すガラス組成物が、アルミナ封
着に適し、かつ均質で欠陥のない高品質が得られ、特に
イメージセンサの窓ガラスあるいはキャップガラスに適
していることを見出した。Establishment of the Invention The present inventors have found that the glass composition shown below is suitable for alumina sealing and can provide a uniform and defect-free high quality, and is particularly suitable for window glass or cap glass of image sensors. I found it.
すなわち本発明のアルミナ封着用−硼珪酸ガラスは、重
量百分率で５ｉＯｚ ６５〜７５％、＾１．ＬＯｓ４〜
８％、Ｂｔｕｓ ８〜１５％、ＢａＯ０．５〜５％、Ｚ
ｎＯ０，５〜５％。That is, the borosilicate glass for sealing alumina of the present invention has a weight percentage of 5iOz 65 to 75%,^1. LOs4～
8%, Btus 8-15%, BaO 0.5-5%, Z
nO0.5-5%.
ＮａｚＯ＋ ＫｉＯ７〜１４％、ＬｉｚＯ０〜３％、Ｍ
ｇ０Ｏ〜３％、ＣａＯ０〜３％からなり、より好ましく
は、ＳｉＯ＊１３５〜７５％、八１ｚＯｉ４〜７％、８
２０ｇ １０〜１４％、ＢａＯ１〜５％、ＺｎＯ１〜
５％、 ＮａｚＯ＋ ＫｚＯ８〜１４％、Ｌ １ｇ００
〜３％、Ｍｇ０Ｏ〜３％、Ｃａ００〜３％からなる基本
組成を存し、熱膨張係数が６０〜７０Ｘ １０−７／”
Ｃであることを特徴とする。NazO+ KiO7-14%, LizO0-3%, M
g0~3%, CaO0~3%, more preferably SiO*135~75%, 81zOi4~7%, 8
20g 10-14%, BaO1-5%, ZnO1-
5%, NazO+ KzO8-14%, L 1g00
~3%, Mg0O~3%, Ca00~3%, and has a thermal expansion coefficient of 60~70X 10-7/''
It is characterized by being C.
本発明においては、従来より知られている熱膨張係数６
０〜７０Ｘ １０ ／’Ｃの硼珪酸ガラスに比較して
ＢｔＯＳを８〜１５％、好ましくは１０〜１４％と多く
することで粘度を下げることができた。１３ｚＯｓを多
くするとガラス表面からの蒸発が増加することになるが
、これに対しては５％以下のＺｎＯを導入することによ
って抑制した。In the present invention, the conventionally known coefficient of thermal expansion is 6.
The viscosity could be lowered by increasing BtOS by 8 to 15%, preferably 10 to 14%, compared to borosilicate glass of 0 to 70X 10 /'C. If 13zOs is increased, evaporation from the glass surface increases, but this was suppressed by introducing 5% or less of ZnO.
以下に、本発明のアルミナ封着用硼珪酸ガラスの各成分
の作用及びそれの含量範囲を上記のように限定した理由
について説明する。Below, the effect of each component of the borosilicate glass for sealing alumina of the present invention and the reason why the content range thereof is limited as described above will be explained.
５ｉＯｚは、ガラス構造の骨格をなす基本成分であり、
その含量は、６５〜７５％である。６５％より少ない場
合は、熱膨張係数が大きくなると共に、耐風化性も悪く
なり、７５％よりも多い場合は、粘度が高（なるため溶
融が難しくなる。5iOz is a basic component that forms the skeleton of the glass structure,
Its content is 65-75%. When it is less than 65%, the coefficient of thermal expansion becomes large and the weathering resistance becomes poor, and when it is more than 75%, the viscosity becomes high (so that melting becomes difficult).
ＡＩｚＯｓは、耐風化性を向上させ、ガラスの失透を抑
制する成分であり、その含量は４〜８％、好ましくは４
〜７％である。４％より少ない場合は、上記の効果が得
られず、８％より多い場合は、粘度が高くなり溶融が困
難となる。AIzOs is a component that improves weathering resistance and suppresses devitrification of glass, and its content is 4 to 8%, preferably 4%.
~7%. If it is less than 4%, the above effects cannot be obtained, and if it is more than 8%, the viscosity becomes high and melting becomes difficult.
［＋２０５は、融剤として作用するもので、粘度を下げ
、溶融を容易にする成分であり、その含量は８〜１５％
、好ましくは１０〜１４％である。８％より少ない場合
は、上記の効果が得られず、１５％より多い場合は、ガ
ラス表面からの蒸発が著しく多くなり、ガラスの欠陥を
生む原因となる。[+205 is a component that acts as a flux and lowers viscosity and facilitates melting, and its content is 8 to 15%
, preferably 10 to 14%. When it is less than 8%, the above effects cannot be obtained, and when it is more than 15%, evaporation from the glass surface increases significantly, causing defects in the glass.
［１ａＯは、ガラスの分相を抑え、化学的耐久性を向上
させる成分であり、その含量は、０．５〜５％、好まし
くは１〜５％である。０．５％より少ない場合は、上記
の効果が得られず、５％より多い場合は、粘度が高くな
り溶融が難しくなる。[1aO is a component that suppresses phase separation of glass and improves chemical durability, and its content is 0.5 to 5%, preferably 1 to 5%. If it is less than 0.5%, the above effects cannot be obtained, and if it is more than 5%, the viscosity becomes high and melting becomes difficult.
ＺｎＯは、Ｂｔｕｓやアルカリ成分の蒸発を抑制する成
分であり、その含量は、０．５〜５％、好ましくは１〜
５％である。０．５％より少ない場合はζ上記の効果が
得られず、５％より多い場合は、ガラスの失透性が増す
。ZnO is a component that suppresses the evaporation of Btus and alkaline components, and its content is 0.5 to 5%, preferably 1 to 5%.
It is 5%. When it is less than 0.5%, the above effects cannot be obtained, and when it is more than 5%, the devitrification of the glass increases.
Ｎａ１Ｏ及びＫｚＯは、融剤として作用し、また熱膨張
係数を制御する成分であり、その含量は台皿で７〜１４
％、好ましくは８〜１４％である。７％より少ない場合
は、粘度が高くなり、溶融が難しくなるとともに熱膨張
係数が低くなりすぎ、１４％より多い場合は耐風化性が
悪くなると共に熱膨張係数が大きくなる。Na1O and KzO are components that act as fluxing agents and control the coefficient of thermal expansion, and their contents range from 7 to 14 in the base plate.
%, preferably 8-14%. If it is less than 7%, the viscosity becomes high, making it difficult to melt, and the coefficient of thermal expansion becomes too low. If it is more than 14%, the weathering resistance becomes poor and the coefficient of thermal expansion becomes large.
Ｌ１２０は、粘度を下げ、溶融を容易にする成分であり
、その含量は０〜３％である。３％より多い場合は、熱
膨張係数が大きくなる。L120 is a component that lowers viscosity and facilitates melting, and its content is 0 to 3%. When it is more than 3%, the coefficient of thermal expansion becomes large.
ＭｇＯとＣａＯは、化学的耐久性を増大させるため各々
３％まで含量させることができる。MgO and CaO can each be contained up to 3% to increase chemical durability.
また、本発明においては、上記成分に加え清澄剤として
＾５ｔｙｓ、 ５ｂｚＯｓ、 ＮａＣｌ、ＮａｚＳＯ＋
及びＣａＦｚ等の弗化物の中から少なくとも１種の成分
を２％まで含量することが可能である。Furthermore, in the present invention, in addition to the above components, clarifiers such as ^5tys, 5bzOs, NaCl, NazSO+
It is possible to contain up to 2% of at least one component selected from fluorides such as and CaFz.
実施例 以下に本発明の実施例を示す。Example Examples of the present invention are shown below.
以 下 余 白 表のＮα１〜８のガラス試料は次のように調製した。Below, remaining white Glass samples of Nα1 to Nα8 in the table were prepared as follows.
表に示された組成に調合したガラス原料を白金ルツボに
入れ、電気炉で１５００℃４時間加熱した後、グラフ１
イト板上に流し出し、板状に成型した。その後、冷却炉
で除歪して試料を作成し、特性測定を行なった。The glass raw materials prepared according to the composition shown in the table were placed in a platinum crucible and heated at 1500°C for 4 hours in an electric furnace.
The mixture was poured onto a light plate and formed into a plate shape. Thereafter, the strain was removed in a cooling furnace to prepare a sample, and the characteristics were measured.
熱膨張係数は、石英管式膨張計で測定した。粘度は、白
金法引き上げ法で測定した。耐風化性の判定には、ＪＩ
Ｓ Ｒ３５０２に記載されているアルカリ溶出量を測定
した。アルカリ溶出量が少ないほど耐風化性に優れたガ
ラスである。The thermal expansion coefficient was measured using a quartz tube dilatometer. The viscosity was measured by the platinum pulling method. For weathering resistance determination, JI
The alkali elution amount described in SR3502 was measured. The smaller the amount of alkali elution, the better the weathering resistance of the glass.
溶融時の蒸発率の測定は、次の方法で行なった。The evaporation rate during melting was measured by the following method.
試料を粉砕し、１０００μ■から１４１０μＩの大きさ
にふるった後、粉砕したガラス約５ｇを精秤し、あらか
じめｆｆｆｆｆｌを測定した白金ルツボに入れ、１０ｐ
。After crushing the sample and sieving it to a size of 1,000 μι to 1,410 μι, approximately 5 g of the crushed glass was accurately weighed, placed in a platinum crucible in which fffffl had been measured in advance, and 10 p.
.
ｉｓｅに相当する温度に保持した電気炉に３時間入れた
。炉から取り出した後、室温で放冷し、ガラスと白金ル
ツボの合計重量を精秤した。熱処理面発明の効果
本発明のアルミナ封着用硼珪酸ガラスは、アルミリ−と
の封着性、耐風化性に優れ、粘度が小さく溶融が容易で
あるとともに、ガラスからの蒸発が少なく、これに寄囚
するガラス欠陥が生じにくいため、イメージセンナ用ア
ルミナパッケージの窓ガラスあるいはアルミナ基板用キ
ャップガラスとしてｍｉｓである。The sample was placed in an electric furnace maintained at a temperature corresponding to ISE for 3 hours. After taking it out from the furnace, it was allowed to cool at room temperature, and the total weight of the glass and platinum crucible was precisely weighed. Effects of the invention on heat-treated surface The borosilicate glass for sealing alumina of the present invention has excellent sealing properties with aluminum and weathering resistance, has a low viscosity and is easy to melt, and has little evaporation from the glass, which contributes to this. Because it is difficult to cause glass defects, it is a mis-use as a window glass for an alumina package for an image sensor or as a cap glass for an alumina substrate.
特許出願人 日本電気硝子株式会社 代表者 岸田清作 手続補正書 昭和６１年 ６月１２日Patent applicant: Nippon Electric Glass Co., Ltd. Representative: Kiyosaku Kishida Procedural amendment June 12, 1986
Claims (3)
２Ｏ＿３４〜８％、Ｂ＿２Ｏ＿３８〜１５％、ＢａＯ０
．５〜５％、ＺｎＯ０．５〜５％、Ｎａ＿２Ｏ＋Ｋ＿２
Ｏ７〜１４％、Ｌｉ＿２Ｏ０〜３％、ＭｇＯ０〜３％、
ＣａＯ０〜３％、からなる基本組成を有し、熱膨張係数
が６０〜７０×１０＾−＾７／℃であるアルミナ封着用
硼珪酸ガラス。(1) In weight percentage, SiO_265-75%, Al_
2O_34-8%, B_2O_38-15%, BaO0
．． 5-5%, ZnO0.5-5%, Na_2O+K_2
O7-14%, Li_2O0-3%, MgO0-3%,
A borosilicate glass for alumina sealing having a basic composition of 0 to 3% CaO and a thermal expansion coefficient of 60 to 70 x 10^-^7/°C.
２＿３４〜７％、Ｂ＿２Ｏ＿３１０〜１４％、ＢａＯ１
〜５％、ＺｎＯ１〜５％、Ｎａ＿２Ｏ＋Ｋ＿２Ｏ８〜１
４％、Ｌｉ＿２Ｏ０〜３％、ＭｇＯ０〜３％ＣａＯ０〜
３％、からなる基本組成を有し、熱膨張係数が６０〜７
０×１０＾−＾７／℃である特許請求の範囲第１項記載
のアルミナ封着用硼珪酸ガラス。(2) In weight percentage, SiO_265-75%, Al_
2_34~7%, B_2O_310~14%, BaO1
~5%, ZnO1~5%, Na_2O+K_2O8~1
4%, Li_2O0~3%, MgO0~3%CaO0~
3%, with a thermal expansion coefficient of 60 to 7.
The borosilicate glass for sealing alumina according to claim 1, which has a temperature of 0x10^-^7/°C.
２Ｏ＿３、ＮａＣｌ、Ｎａ＿２ＳＯ＿４及び弗化物の中
から少なくとも１種の成分を２％まで含有してなる特許
請求の範囲第１項および第２項記載のアルミナ封着用硼
珪酸ガラス。(3) As_2O_3 and Sb_ as clarifiers in the basic composition
The borosilicate glass for sealing alumina according to claims 1 and 2, which contains up to 2% of at least one component selected from 2O_3, NaCl, Na_2SO_4 and fluoride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60205850A JPS6265954A (en) | 1985-09-18 | 1985-09-18 | Borosilicate glass for sealing alumina |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60205850A JPS6265954A (en) | 1985-09-18 | 1985-09-18 | Borosilicate glass for sealing alumina |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6265954A true JPS6265954A (en) | 1987-03-25 |
| JPH0210099B2 JPH0210099B2 (en) | 1990-03-06 |
Family
ID=16513742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60205850A Granted JPS6265954A (en) | 1985-09-18 | 1985-09-18 | Borosilicate glass for sealing alumina |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6265954A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01239036A (en) * | 1988-03-16 | 1989-09-25 | F G K:Kk | High-strength glass |
| JPH01320236A (en) * | 1988-06-22 | 1989-12-26 | Toshiba Glass Co Ltd | Cover glass for solid-state image pickup element |
| JPH03167863A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167861A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167865A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167846A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167847A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167845A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167862A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167859A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167858A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03173157A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173156A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173160A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173161A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| US5277946A (en) * | 1989-08-24 | 1994-01-11 | Nippon Electric Glass Co., Ltd. | Alumina package for hermetically containing an electronic device therein |
| JP2005162600A (en) * | 2003-11-11 | 2005-06-23 | Nippon Electric Glass Co Ltd | Cover glass plate for semiconductor package |
| CN113735438A (en) * | 2021-09-23 | 2021-12-03 | 成都光明光电股份有限公司 | Glass composition |
-
1985
- 1985-09-18 JP JP60205850A patent/JPS6265954A/en active Granted
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01239036A (en) * | 1988-03-16 | 1989-09-25 | F G K:Kk | High-strength glass |
| JPH0470262B2 (en) * | 1988-03-16 | 1992-11-10 | Efu Jii Kee Kk | |
| JPH01320236A (en) * | 1988-06-22 | 1989-12-26 | Toshiba Glass Co Ltd | Cover glass for solid-state image pickup element |
| US5277946A (en) * | 1989-08-24 | 1994-01-11 | Nippon Electric Glass Co., Ltd. | Alumina package for hermetically containing an electronic device therein |
| JPH03167862A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167861A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167847A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167845A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167865A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167859A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167858A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167846A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03167863A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03173157A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173161A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173160A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173156A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JP2005162600A (en) * | 2003-11-11 | 2005-06-23 | Nippon Electric Glass Co Ltd | Cover glass plate for semiconductor package |
| CN113735438A (en) * | 2021-09-23 | 2021-12-03 | 成都光明光电股份有限公司 | Glass composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0210099B2 (en) | 1990-03-06 |
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