JPS59186347A - 集積回路の端子構造 - Google Patents
集積回路の端子構造Info
- Publication number
- JPS59186347A JPS59186347A JP58060536A JP6053683A JPS59186347A JP S59186347 A JPS59186347 A JP S59186347A JP 58060536 A JP58060536 A JP 58060536A JP 6053683 A JP6053683 A JP 6053683A JP S59186347 A JPS59186347 A JP S59186347A
- Authority
- JP
- Japan
- Prior art keywords
- bump
- bumps
- bonding
- integrated circuit
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05556—Shape in side view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
(1)発明の属する技術分野の説明
本発明は集積回路の配線用入出力端子の物理的構造に関
するものである。
するものである。
(2)従来技術の説明
従来の集積回路(以下ICと呼ぶ)の配線用入出力端子
(以下バンプと呼ぶ)は単一バンプのため、熱圧着(以
下ボンディングと呼ぶ)によるリード線圧着後、バンプ
形状が変化し、リード線のボンディング後は同時に全バ
ンプをプロービングすることが困難であった・ (3)発明の詳細な説明 本発明の目的は、リード線ボンディング用と、ブロービ
ング用とのバンプを別個に設けることによシ前記の欠点
を除去したバンプ方式を提供することにある。
(以下バンプと呼ぶ)は単一バンプのため、熱圧着(以
下ボンディングと呼ぶ)によるリード線圧着後、バンプ
形状が変化し、リード線のボンディング後は同時に全バ
ンプをプロービングすることが困難であった・ (3)発明の詳細な説明 本発明の目的は、リード線ボンディング用と、ブロービ
ング用とのバンプを別個に設けることによシ前記の欠点
を除去したバンプ方式を提供することにある。
(4)発明の構成
すなわち、本発明は、■cのバンプ構造において、電気
的、物理的に接続されている2つ以上のバンプをIC上
の内外に設け、外側のバンプを熱圧着(ボンディング)
用として、他のバンプを別の配線接続用としたことを特
徴とする。
的、物理的に接続されている2つ以上のバンプをIC上
の内外に設け、外側のバンプを熱圧着(ボンディング)
用として、他のバンプを別の配線接続用としたことを特
徴とする。
(5)この発明の詳細な説明
次に本発明の実施例について図面を参照して詳細に説明
する。図において、ICIは基板5に固定されており、
ICIの上面には人出方信号及び電源等外部引出しのた
めのバンプ2a + 2bを設け、一方のバンプ2aを
ICIの外縁に、他方のバンプ2bを内側に形成する。
する。図において、ICIは基板5に固定されており、
ICIの上面には人出方信号及び電源等外部引出しのた
めのバンプ2a + 2bを設け、一方のバンプ2aを
ICIの外縁に、他方のバンプ2bを内側に形成する。
バンプ2aと2bとはICIを製造する段階で同一物質
の配線2cで物理的に接続されている。バンプ2aはリ
ード線3により外部端子4に接続されるものである。す
なわち、バンプ2aと外部端子4とはリード線3a、3
bの位置をボンディングすることにより接続される。こ
のとき、ボンディングされるリード線3aとバンプ2b
とはボンディングにより沈み込む。この沈み込み量6と
ボンディング位置との関係は各々の端子により異なるた
め、全バンプを同時にブロービングすることはできない
が内側のバンプ2bは何の影響も受けずブロービングが
可能となる。
の配線2cで物理的に接続されている。バンプ2aはリ
ード線3により外部端子4に接続されるものである。す
なわち、バンプ2aと外部端子4とはリード線3a、3
bの位置をボンディングすることにより接続される。こ
のとき、ボンディングされるリード線3aとバンプ2b
とはボンディングにより沈み込む。この沈み込み量6と
ボンディング位置との関係は各々の端子により異なるた
め、全バンプを同時にブロービングすることはできない
が内側のバンプ2bは何の影響も受けずブロービングが
可能となる。
(6)発明の詳細な説明
以上のようなバンプ構造にしておくことにより、直接I
CIを全バンプ同時にブロービングできる効果があり、
特にICIを外部回路から切離しくリード線を切断)し
た後でもICIをブロービングできる利点がある。
CIを全バンプ同時にブロービングできる効果があり、
特にICIを外部回路から切離しくリード線を切断)し
た後でもICIをブロービングできる利点がある。
図は本発明の一実施例を示す半導体集積回路の断面図で
ある。
ある。
Claims (1)
- (1)集積回路の配線用入出力端子、電源端子の構造に
おいて、電気的物理的に接続された2つ以上の端子を集
積回路上の内外に設け、外側の端子を熱圧着用とし、他
の内側の端子を別の配線接続用としたことを特徴とする
集積回路の端子構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58060536A JPS59186347A (ja) | 1983-04-06 | 1983-04-06 | 集積回路の端子構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58060536A JPS59186347A (ja) | 1983-04-06 | 1983-04-06 | 集積回路の端子構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59186347A true JPS59186347A (ja) | 1984-10-23 |
JPS643058B2 JPS643058B2 (ja) | 1989-01-19 |
Family
ID=13145118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58060536A Granted JPS59186347A (ja) | 1983-04-06 | 1983-04-06 | 集積回路の端子構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59186347A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57133651A (en) * | 1981-02-12 | 1982-08-18 | Nec Corp | Semiconductor integrated circuit device |
-
1983
- 1983-04-06 JP JP58060536A patent/JPS59186347A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57133651A (en) * | 1981-02-12 | 1982-08-18 | Nec Corp | Semiconductor integrated circuit device |
Also Published As
Publication number | Publication date |
---|---|
JPS643058B2 (ja) | 1989-01-19 |
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