JPS58220496A - Method of producing ceramic circuit substrate - Google Patents
Method of producing ceramic circuit substrateInfo
- Publication number
- JPS58220496A JPS58220496A JP10349282A JP10349282A JPS58220496A JP S58220496 A JPS58220496 A JP S58220496A JP 10349282 A JP10349282 A JP 10349282A JP 10349282 A JP10349282 A JP 10349282A JP S58220496 A JPS58220496 A JP S58220496A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- paste
- adhesive strength
- electrode
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000000919 ceramic Substances 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 title description 4
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 238000001465 metallisation Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- -1 phthalate ester Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はセラミック回路基板（以下回路基板という、）
の製造法に関する。[Detailed Description of the Invention] The present invention provides a ceramic circuit board (hereinafter referred to as a circuit board).
Concerning the manufacturing method.
従来０回路基板に電解メッキ法によりメッキを施す方法
として９回路の一部を電極として使用する場合が最も多
いが、この方法では回路上にメッキ電極の治具あとが凹
凸として残る欠点があった。Conventionally, when plating a circuit board using electrolytic plating, a part of the 9 circuit is most often used as an electrode, but this method has the disadvantage that jig marks from the plating electrode remain on the circuit as uneven surfaces. .
これを解゛決する方法として回路の先端に口出部を設け
る方法があるが、この場合日出部をＡｇ （銀）、Ｐｔ
（白金）などの貴金属を含む熱硬化性樹脂で形成するた
め高価となシ、かつ日出部が樹脂を含むため導通抵抗が
高く９日出部を取りつける工程、さらにメッキ後におい
て口出部がそのまま残るため日出部を除去するためのア
ルカリ処理など複雑！多くの工程が必要となり、生産性
に劣る欠点があった。One way to solve this problem is to provide an opening at the tip of the circuit, but in this case, the sunrise part is made of Ag (silver),
It is expensive because it is made of a thermosetting resin containing precious metals such as (platinum), and because the exposed part contains resin, the conduction resistance is high. The alkali treatment to remove the sunrise part is complicated because it remains as it is! This method required many steps and had the disadvantage of low productivity.
ま九前者の方法では回路の幅が１簡以下であるとメッキ
の厚さ忙バラツキが生じ、後者の方法では日出部を除去
する時に回路を切断したり。In the former method, if the width of the circuit is less than 1 inch, there will be variations in the thickness of the plating, and in the latter method, the circuit may be cut when removing the sunrise part.
導通抵抗を低くしなければならないため回路を細線化す
ることが困難であった。このような理由により回路の幅
は、前者の方法では２１Ｎ１１１以上。It was difficult to make the circuit thinner because the conduction resistance had to be lowered. For this reason, the width of the circuit is 21N111 or more in the former method.
後者の方法では４鴫以上はしなければならなかった。The latter method required more than 4 squares.
本発明はこれらの欠点のない回路基板の製造法を提供す
ることを目的とするものである。The object of the present invention is to provide a method for manufacturing a circuit board that does not have these drawbacks.
本発明者らは上記の欠点に鑑み種々検討した結果、セラ
ミックグリーンシート（以下グリーンシートという）上
にメタライズ接着強度の弱イヘーストで電極となる部分
を、メタライズ接着強度の強いペーストで回路となる部
分を印刷形成し、その後グリーンシート、メタライズ接
着強度の弱いペースト及びメタライズ接着強度ノ強イペ
ーストを同時焼成し、ついでメッキを施して電極部及び
回路部を形成した後電極部を剥離除去すれば複雑な工程
を経ず、また回路上にメッキ電極の治具あとか残らず、
簡単に細線化することができ、安価な回路基板が製造で
きることを見い出した。As a result of various studies in view of the above-mentioned drawbacks, the inventors of the present invention found that on a ceramic green sheet (hereinafter referred to as a green sheet), the parts that will become electrodes are made of Iheaste, which has a weak metallization adhesive strength, and the parts that will become a circuit, using a paste that has a strong metallization adhesive strength. After that, a green sheet, a paste with a weak metallization adhesive strength, and a paste with a strong metallization adhesive strength are simultaneously fired, and then plating is applied to form the electrode part and the circuit part, and then the electrode part is peeled off and removed. There is no process and no plating electrode jig remains on the circuit.
It was discovered that the wires can be easily made thinner and that inexpensive circuit boards can be manufactured.
本発明はグリーンシート上にメタライズ接着強度の弱い
ペーストで電極となる部分を、メタライズ接着強度の強
い斗−ストで回路となる部分を印刷形成し、その後グリ
ーンシニト、メタライズ接着強度の弱いペースト及びメ
タライズ接着強度の強いペーストを同時焼成し、ついで
メッキを施して電極部及び回路部を形成した後電極部を
剥離除去する回路基板の製造法に関する。In the present invention, a paste with a weak metallization adhesive strength is used to form electrodes on a green sheet, and a paste with a strong metallization adhesive strength is used to form a circuit on a green sheet. The present invention relates to a method for manufacturing a circuit board, in which a paste with strong adhesive strength is simultaneously fired, then plated to form an electrode part and a circuit part, and then the electrode part is peeled off and removed.
本発明において、焼結温度がグリーンシートの焼結温度
と異なるペーストを使用すればメタライズ部分と基板と
の接着強度が小さくなり。In the present invention, if a paste whose sintering temperature is different from that of the green sheet is used, the adhesive strength between the metallized portion and the substrate will be reduced.
メツΦ終了後容易に剥すことができる。It can be easily peeled off after finishing Φ.
また焼結温度がグリーンシートの焼結温度と一致するペ
ーストを使用すれば、メタライズ部分と基板との接着強
度が大きくなり、メッキ終了倖において容易に剥すこと
ができない。Furthermore, if a paste whose sintering temperature matches that of the green sheet is used, the adhesive strength between the metallized portion and the substrate will be increased and it will not be possible to peel it off easily after plating is completed.
電極部形成用ペーストと回路部形成用ペーストには同一
の金属粉を使用することが望ましいが、特に制限はなく
Ｗ（タングステン）、Ｍ。It is desirable to use the same metal powder for the electrode part forming paste and the circuit part forming paste, but there is no particular restriction, and W (tungsten) or M may be used.
（モリブデン）、Ｍｏ−Ｍｎ（モリブデン−マンガン）
等が使用される。(molybdenum), Mo-Mn (molybdenum-manganese)
etc. are used.
メッキ後の電極部は任意の方法によシ剥離除去すればよ
くその方法については何ら制限はない。The electrode portion after plating may be peeled off and removed by any method, and there are no restrictions on the method.
本発明のセラミック回路板は０回路の一部を電極として
使用せず、また口出部をＡｇ、Ｐｔなどの貴金属を含む
熱硬化性樹脂を使用しないでメッキをすることができる
ので回路の幅をＩＷ以下に細線化することができるので
ある。The ceramic circuit board of the present invention does not use a part of the zero circuit as an electrode, and the opening part can be plated without using thermosetting resin containing precious metals such as Ag and Pt, so the width of the circuit can be increased. can be made thinner than IW.
以下実施例により本発明を説明する。The present invention will be explained below with reference to Examples.
実施例１
平均結晶粒径ｚｏμｍの高純度アルミナ（純度９９、５
１以上）を９６重量部、タルク３．５重量部。Example 1 High purity alumina (purity 99, 5
1 or more) and 3.5 parts by weight of talc.
ドロマイト０．５重量部を均一に混合したセラミック粉
にバインダーとしてポリビニルブチラール樹脂８重量部
、可塑剤としてフタル酸エステル４重量部、さらに溶剤
としてブチルアルコール２０１量部、トリクロルエチレ
ン５０ｉＪｌ１部をボールミルで均一に混合しセラミッ
クスリップとした後。Ceramic powder uniformly mixed with 0.5 parts by weight of dolomite, 8 parts by weight of polyvinyl butyral resin as a binder, 4 parts by weight of phthalate ester as a plasticizer, and 201 parts by weight of butyl alcohol and 1 part by weight of trichlorethylene 50 iJl as a solvent were uniformly mixed in a ball mill. After mixing with ceramic slip.
テープキャスティング法によジグリーンシートを得た。A digreen sheet was obtained by tape casting method.
次に上記グリーンシート上にメタライズ接着強度の強い
導体ペースト１（アサヒ化学製、商品名３ＴＷ−１００
０）で回路となる部分を印刷し９次いで第１表に示すメ
タライズ接着強度の弱い導体ペースト２で電極となる部
分を回路となる部分に導イする状態に印刷し、これを５
０℃／時間の昇温速度で３００℃まで空気中で加熱し、
さらに水素雰囲気中で３０℃／時間の昇温速度で１６０
０℃まで焼成してグリーンシート、電極となる部分及び
回路となる部分のペーストを焼結した基板を製造した。Next, conductive paste 1 (manufactured by Asahi Chemical, product name: 3TW-100, manufactured by Asahi Chemical Co., Ltd.) with strong metallization adhesive strength is placed on the green sheet.
0), print the part that will become the circuit, and then print the part that will become the electrode with conductive paste 2, which has a weak metallization adhesive strength shown in Table 1, to the part that will become the circuit.
Heating in air to 300°C at a heating rate of 0°C/hour,
Further, in a hydrogen atmosphere, the temperature was increased to 160 °C at a heating rate of 30 °C/hour.
A substrate was manufactured by firing the green sheet to 0° C. and sintering the paste of the green sheet, the electrode portion, and the circuit portion.
次に電極となる部分をメッキ治具で固定し、脱脂、酸処
理後電解メッキ法で２００μｍの厚さに銅メッキを施し
て電極部及び回路部を形成した。Next, the parts that would become electrodes were fixed with a plating jig, and after degreasing and acid treatment, copper plating was applied to a thickness of 200 μm using electrolytic plating to form electrode parts and circuit parts.
メッキ終了後電極部を剥離し回路部との境界から完全に
除去して回路部のみ鋼メッギされた回路基板を得た。After plating was completed, the electrode part was peeled off and completely removed from the boundary with the circuit part to obtain a circuit board in which only the circuit part was covered with steel.
実施例２
実施例１で得たグリーンシートに実施例１と同様な方法
および同様なペーストを使用して回路となる部分及び電
極となる部分を印刷しこれ欠ｔ５℃／時間の昇温速度で
３００℃まで空気中で加熱し、さらに水素と窒素との混
合雰囲気中〔水素：窒素＝１：１（体積比）〕で２０℃
／時間の昇温速度で１５８０℃まで焼成してグリーンシ
ート。Example 2 A circuit portion and an electrode portion were printed on the green sheet obtained in Example 1 using the same method and using the same paste as in Example 1. Heating in air to 300°C, then heating to 20°C in a mixed atmosphere of hydrogen and nitrogen [hydrogen:nitrogen = 1:1 (volume ratio)]
A green sheet is produced by firing up to 1580°C at a heating rate of /hour.
電極となる部分及び回路となる部分のペーストを焼結し
た基板を製造した。次に実施例１と同様の方法に上り銅
メツキ処理して回路部のみ鋼メッキされた回路基板を得
た。A board was manufactured by sintering the paste for the parts that would become electrodes and the parts that would become circuits. Next, copper plating was performed in the same manner as in Example 1 to obtain a circuit board in which only the circuit portion was plated with steel.
本発明の回路基板は、グリーンシート上にメタライズ接
着強度の弱いペーストで電極部を、メタライズ接着強度
の強いペーストで回路部を印刷形成し、その後を士士プ
章グリーンシート、メタライズ接着強度の弱いペースト
諷びメタライズ接着強度の強いペーストを同時焼成し、
ついでメッキを施し・た後電極部を剥離除去するので、
複雑な工種を経ず９回路上にメッキ電極の治具あとが残
できる等の効果が得られる。In the circuit board of the present invention, the electrode part is printed on a green sheet using a paste with a weak metallization adhesive strength, and the circuit part is printed on a paste with a strong metallization adhesive strength, and then the Shishipu green sheet is printed, and the circuit part is printed on a green sheet with a paste with a weak metallization adhesive strength. Co-fired paste with strong adhesive metallization strength,
Then, after plating and removing the electrode part,
Effects such as leaving jig marks of plating electrodes on 9 circuits without going through complicated work can be obtained.
Claims (1)
度の弱いペーストで電極となる部分を。 メタライズ接着強度の強いペーストで回路となる部分を
印刷形成し、その後セラミックグリーンシート、メタラ
イズ接着強度の弱いペースト及びメタライズ接着強度の
強いペーストを同時焼成し、ついでメッキを施して電極
部及び回路部を形成した後電極部を剥離除去することを
特徴とするセラミック回路基板の製造法。[Claims] 1. A portion that becomes an electrode is made of a paste with weak metallization adhesive strength on a ceramic green sheet. The part that will become the circuit is printed using a paste with strong metallization adhesive strength, then the ceramic green sheet, the paste with weak metallization adhesive strength, and the paste with strong metallization adhesive strength are simultaneously fired, and then plated to form the electrode and circuit parts. A method for manufacturing a ceramic circuit board, characterized in that the electrode portion is peeled off and removed after being formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10349282A JPS58220496A (en) | 1982-06-16 | 1982-06-16 | Method of producing ceramic circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10349282A JPS58220496A (en) | 1982-06-16 | 1982-06-16 | Method of producing ceramic circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58220496A true JPS58220496A (en) | 1983-12-22 |
Family
ID=14355494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10349282A Pending JPS58220496A (en) | 1982-06-16 | 1982-06-16 | Method of producing ceramic circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58220496A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
-
1982
- 1982-06-16 JP JP10349282A patent/JPS58220496A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
| US5383093A (en) * | 1986-05-19 | 1995-01-17 | Nippondenso Co., Ltd. | Hybrid integrated circuit apparatus |
| US5897724A (en) * | 1986-05-19 | 1999-04-27 | Nippondenso Co., Ltd. | Method of producing a hybrid integrated circuit |
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