JPS5810886A - Method of fomring conductor circuit on insulating board - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、絶縁基板に導体回路を作成する方法に係９％
４１に新開発された導電性及び半田付は性の良好な銅導
電ペーストを有効に利用し、プリント基板の薄形化、高
１［化、半田付は性の向上及び低コスト化を図射好適な
導体回路を作成する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for creating a conductor circuit on an insulating substrate.
The conductivity and soldering newly developed in 41 makes effective use of copper conductive paste with good properties, making printed circuit boards thinner and taller, and improving soldering properties and lowering costs. The present invention relates to a method of making a suitable conductor circuit.

従来、銅を回路に用いる方法として社、銅箔をプリント
基板全体に張り、エツチング法により、回路部分を残し
て他の箇所を溶解させてプリント回路を作成する方法が
あるが、銅張少工程及びエツチング工程には高度の技術
と大規模な設備を要するため、ａ造コストが高くなると
共にプリント基板には部品を挿入する穴が必要であるが
、これは金型を作りプレスで一度にパンチング法にょシ
打ち抜いている。そのため回路の設計変更をすると金型
から変史しなくてはならないので時間と経費がかかシ１
回路の設計変更が比較的間離であるという欠点があった
＠ また上記した従来のプリント基板においては鋼箔と反対
側に電気部品を一着し、基板に穴をあけてリード線を紋
穴に通して銅箔に半田付けしていたため、電気部品を含
むプリント基板の厚さが厚くなる欠点があった・更には
部品のリード線はハンダメッキ線、スズメッキ線、銅線
などを使っているが部品の塗装工程で必ず１００〜１５
０１１１：の焼付け工程をへて完成されるのでその時リ
ード線は全体が酸化されており、ハンダ付は性が著しく
劣化するためハンダ付は不良が多く、製品の故障のはと
んどけ半田付は不良が原因となっていた・なお厚膜回路
には銀、パラジウム導電ペースト等の金属ペーストを用
いて温［５００〜８００℃で焼成して回路を作成する方
法もるるが、銀は最近非常に高価となシ、一般電子機器
には、コストの点で使用できない状態となシつつめる。Conventionally, the method of using copper in circuits is to create a printed circuit by pasting copper foil over the entire printed circuit board and using an etching method to leave the circuit part and melt the other parts. The etching process requires advanced technology and large-scale equipment, which increases production costs and requires holes in the printed circuit board to insert the parts. It's breaking the law. Therefore, if the circuit design is changed, the mold must be changed, which takes time and money.1
There was a drawback that the circuit design changes were made relatively far apart. Also, in the conventional printed circuit board mentioned above, the electrical components were mounted on the opposite side of the steel foil, and the lead wires were inserted into the holes by drilling holes in the board. Since the printed circuit board containing the electrical components was soldered to the copper foil through the wire, the thickness of the printed circuit board containing the electrical components became thicker.Furthermore, the lead wires for the components were made of solder-plated wire, tin-plated wire, copper wire, etc. is always 100 to 15 during the parts painting process.
0111: Since it is completed after going through the baking process, the entire lead wire is oxidized at that time, and the soldering properties deteriorate significantly, so there are many defects in soldering, and the most likely cause of product failure is soldering. This was caused by a defect. ・For thick film circuits, there is a method of creating a circuit by using a metal paste such as silver or palladium conductive paste and firing it at a temperature of 500 to 800 degrees Celsius, but silver has recently become very popular. It is expensive and cannot be used in general electronic equipment due to cost.

ま九ポリマ基板に印刷抵抗体を形成する試みが従来なさ
れてきたが、従来例ではその工程及び構造が複雑である
と共に、銀の導電ペーストが必要とされ、コストも高い
ものとなりていた。その−例を第１図によ）説明すると
、これは基板１に通電用の買過大を設ける方式でありて
、スルーホニル方式又はＴＨ方式とも呼ばれるもので、
まず通常の片面鋼箔積層板をエツチングして回路パター
ン２をつく）、抵抗体３を接続すべき銅箔２ａの部分に
一対の穴４．５を基板ｌの裏面１Ｍへ貫通するようにあ
け、適尚な導電材料６，７を用いて銅箔２ａの部分から
穴４．５を通して裏面１ａへ導通する一対の電極６ａ、
７ａを裏面１ａに形成し、アンダーコート８を施された
裏面１ａに抵抗体３を印刷して硬化させ、銀ペースト９
を該抵抗体と電極６ａ、７ａとＶＣ目Ｊ刷してこれを導
通させて硬化させ、更にオーバーコート１０を印刷して
硬化させて完成する・なお１１はリードｋＡ、Ｓは半田
である。Attempts have been made to form printed resistors on polymer substrates, but the conventional methods have complicated processes and structures, require silver conductive paste, and are expensive. An example of this is shown in Fig. 1). This is a method in which an overvoltage for energization is provided on the board 1, and is also called a sulfonyl method or a TH method.
First, a normal single-sided steel foil laminate is etched to form the circuit pattern 2), and a pair of holes 4.5 are drilled through the back side 1M of the board l in the part of the copper foil 2a where the resistor 3 is to be connected. , a pair of electrodes 6a that are electrically connected from the copper foil 2a through the hole 4.5 to the back surface 1a using suitable conductive materials 6, 7;
7a is formed on the back surface 1a, a resistor 3 is printed on the back surface 1a which is coated with an undercoat 8, and the resistor 3 is cured.
The resistor and the electrodes 6a and 7a are printed with VC to make them conductive and cured, and then an overcoat 10 is printed and cured to complete the process.Note that 11 is lead kA and lead S is solder.

該従来例によると、基板−１の穴あけ加工をはじめ多く
の工数を必要とする上、鉄等延ペースト９が必要となる
ので絞逍コストー高くつくと共に銅箔２ａの部分との電
気的接続及び穴４．５まわりのエツジ部分の６通などの
信頼１１の原付に特別の起源を要する等の欠点があった
◇ そこで−上記した方法の欠点を改良するものとして、銅
粉末と合成栂月−一を７［を合１１．た銅導電ペースト
の使用が考えられ己が、これによると、ペーストを硬化
させるための加熱が必要となるが、銅はその特性から銀
とは逆に他めで酸化し易いため、この加熱によってペー
スト中の銅粉末が酸化して電気抵抗が大きくなると共に
半田付は性が悪化するという欠点がめった。According to the conventional example, a large number of man-hours are required, including drilling holes in the substrate 1, and iron-rolled paste 9 is required, which increases the drawing cost and makes it difficult to connect electrically with the copper foil 2a. There were drawbacks such as the need for a special origin in the reliability 11 moped, such as the 6 edges around the hole 4.5 ◇ Therefore, as a way to improve the drawbacks of the above method, copper powder and synthetic Togetsu were used. 1 to 7 [to 11. According to this method, heating is required to harden the paste, but due to its characteristics, copper easily oxidizes in contrast to silver, so this heating will cause the paste to harden. The problem was that the copper powder inside oxidized, increasing electrical resistance and poor soldering properties.

本発明の発明者は、上記の欠点金すべて除去し得る銅導
電ペーストの開発にだ功した・それは。The inventor of the present invention has succeeded in developing a copper conductive paste that can eliminate all of the above-mentioned drawbacks.

銅粉末と合成樹脂に加えて特殊添加剤を微僅添熟したも
のであり、（？！０アサヒ化学研−りｔＷｒ裟銅尋亀ペ
ーストＡＣＰ−ｏｚｏｙｋ、びＡＣＰ−０３０として実
用化の段階に至らしめた。ＡＣＰ−０２０なる銅導電ペ
ーストけ、銅粉末８（ｌｉ＊：チ、合成ｍ脂２０重量−
を主成分とし、導電性の極めて良好なものでめるが、半
田付は性がやや劣るものである。ＡＣＰ−０３０なる銅
導電ペーストは、９ｉ４粉末８５重量％、合成樹脂１５
重量％を主成分とし、導電性はＡＣＰ−０２０よ６ｉ干
劣るが半田付は性が良好なものであるＯ 本発明は、上記し大従来技衝の欠点を除くと共に、上記
納翔発された導電性及び半田付は性の良好な２極類の銅
導電ペーストを有効に用いるためになされたもので、そ
の目的とするところは、印刷、抵抗回路を含む導体回路
の作成を極めて簡易なものとすることでＴｏｎ、また電
気的接続の信頼性の向上を図ることであるａｔ九他の目
的は、従来の銀導電ペーストの使用中鋼張り工程及びエ
ツチング工程を不要とし、プリント回路製造の容易化と
設備の簡易化を図シ、プリント回路の低コスト化を図る
ことで６る０また他の目的は、要半田付は箇所のみを半
田付は性の良好な銅導電ペーストで構成することによっ
てプリント基板の片面に電気部品を直接半田付けできる
ようにすることで回路の薄形化及び軽量化と高密度化を
図ると共に、半田付けの不良率を大幅に減少させること
でるる。In addition to copper powder and synthetic resin, special additives are slightly added to the paste. Copper conductive paste called ACP-020, copper powder 8 (li*: CH, synthetic m fat 20 weight)
It has extremely good conductivity, but its soldering properties are somewhat poor. The copper conductive paste called ACP-030 contains 85% by weight of 9i4 powder and 15% by weight of synthetic resin.
% by weight as a main component, and has good soldering properties although its electrical conductivity is 6i inferior to that of ACP-020. The conductivity and soldering was done in order to effectively use bipolar type copper conductive paste with good properties, and its purpose is to make it extremely easy to print and create conductor circuits including resistance circuits. Another purpose is to improve the reliability of electrical connections by eliminating the need for the steel plating and etching processes of conventional silver conductive pastes, and to improve the reliability of printed circuit manufacturing. Another objective is to reduce the cost of printed circuits by simplifying the design and equipment, and by using copper conductive paste, which has good soldering properties, only in the areas that require soldering. This makes it possible to directly solder electrical components to one side of a printed circuit board, thereby making the circuit thinner, lighter, and more dense, and significantly reducing the rate of soldering failures.

更に他の目的は、リード線用の穴あけ作業を不要とし、
工程の簡略化を図ることである。Another purpose is to eliminate the need for drilling holes for lead wires.
The goal is to simplify the process.

要するに本発明は、少々くとも表面が絶縁処理された基
板に下地用アンダーコートを塗布し、皺アンダーコート
の上に抵抗体を款布して加熱硬化させて抵抗体回路を形
成し、Ｈ抵抗体回路の一部に導電性の良好な銅導電ペー
ストを重ね塗布して加熱硬化させ、該銅導電ペースト上
の要半田付は箇所に半田付は性の良好な銅導電ペースト
を重ね塗布して加熱硬化させて半田付は可能な導体回路
を作成することを特徴とするものでめる〇以下本発明を
図面に示す実施例に基いて説明する。第２図において、
基板ｌはフェノール樹脂板、エボ轡シガ２ス板、セラミ
ック板等の絶縁板でもよく、また表面に絶縁処理を施し
た龜のであればアルミニウム板、鉄板等の導電材料であ
ってもよい・まず基板ｌには、第２図に示すように、ア
ンダーコート８を施してから第３図に示すようＫ。In short, in the present invention, a base undercoat is applied to a substrate whose surface has been insulated at least a little, and a resistor is placed on the wrinkled undercoat and hardened by heating to form a resistor circuit. Copper conductive paste with good conductivity is layered on a part of the body circuit and cured by heating, and the copper conductive paste with good solderability is layered on the areas where soldering is required on the copper conductive paste. The present invention is characterized by producing a conductive circuit which can be soldered by heating and curing.The present invention will be explained below based on embodiments shown in the drawings. In Figure 2,
The substrate 1 may be an insulating plate such as a phenol resin plate, an evo 2 sheet, or a ceramic plate, or may be a conductive material such as an aluminum plate or iron plate if the surface is insulated. The substrate 1 is coated with an undercoat 8 as shown in FIG. 2, and then coated with K as shown in FIG.

カーボンペースト等の抵抗体Ｒをスクリーン塗布して１
、これを１５０〜２００℃に加熱して数分から２時間位
かけて一旦焼き込んで硬化させ、抵抗体回路１２を形成
し、その後第４図に示すように該抵抗体回路１２の一部
即ち中央部を残して両端部１２ａＫ導電性の良好な銅導
電ペースト１３、例えば上記した■アサと化学研究所製
ＡＣＰ−０２０なる銅導電ペースト１３をスクリーンに
よ如重ね塗布して、これを１５０〜２００℃で２時間位
加熱して硬化させて基本回路１４を形成し、しかる後Ｋ
１８５図及び１１Ｌ６図に示すように、導電性の良好な
銅導電ペースト１３上の要半田付は箇所に半田付は性の
良好な銅導電ペースト、例えば上記した■アサと化学研
究所１１１ｊ　ＡＣＰ−０３０なる銅導電ペースト１５
をスクリーンによ如重ね塗布して、これを１５０〜２０
０℃で１時間位かけて加熱硬化させると。Screen apply resistor R such as carbon paste 1
This is heated to 150 to 200°C and once baked and cured over a period of several minutes to about 2 hours to form a resistor circuit 12, and then, as shown in FIG. A copper conductive paste 13 with good conductivity, for example, the copper conductive paste 13 ACP-020 manufactured by Asato Kagaku Kenkyusho mentioned above, is coated on both ends 12aK, leaving the center part, using a screen, The basic circuit 14 is formed by heating and curing at 200°C for about 2 hours, and then K
As shown in Figure 185 and Figure 11L6, soldering is done on the copper conductive paste 13 with good conductivity where soldering is required using a copper conductive paste with good conductivity, for example, 030 copper conductive paste 15
150 to 20
Heat and harden at 0°C for about 1 hour.

必要な箇所だけに半田付けが可能な導体回路１６が完成
する・ なお、この導体回路１６の銅導電ペースト１５の部分を
残して亀７図に示すようにオーバーコート１７を導体回
路１６全体に重ね塗布すれば完全で藝るＯ そこでディクプ式、ウェーブ式等の半田付は装置によっ
て半田付けを施せば、銅導電ペースト１５のみがオーバ
ーコート１７を塗布されないで麹出しているので、第８
図及びＭ９図に示すように、半田１８により例えは導線
１９が半田付けされる。A conductor circuit 16 that can be soldered only at the necessary points is completed.Additionally, leave the copper conductive paste 15 part of this conductor circuit 16 and overcoat 17 over the entire conductor circuit 16 as shown in Figure 7. Therefore, if soldering is done using a device such as dip type or wave type soldering, only the copper conductive paste 15 is molten without being coated with the overcoat 17.
As shown in the figure and M9, for example, a conductive wire 19 is soldered with the solder 18.

なお銅導電ペースト１３．１５は、その加熱硬化の際に
は、特殊添加剤の働きによシ、銅粉末の酸化が防止され
、半田付は性は全く損われない。In addition, when the copper conductive paste 13.15 is heat-cured, oxidation of the copper powder is prevented by the action of special additives, and the solderability is not impaired at all.

抵抗体Ｒの電気抵抗値は、その幅、長さ及び厚さによっ
て定まるもので、任意の値とすることができ、また該抵
抗体は初めに焼き込んであるのそその後の上記半田付は
工程によりて電気抵抗値が変化することはなく、また抵
抗体回路１２の両端には銅導電ペースト１３が直接重ね
塗布されるのでこれらは電気的に極めて良く接続される
。また半田１８０基板ＩＫ対する剥離強度は３〜４ｋｇ
であり、銅箔の場合の５ｋｇ１／Ｃ？’幻ぽ匹敵するも
のである。The electrical resistance value of the resistor R is determined by its width, length, and thickness, and can be set to any value. The electrical resistance value does not change due to the process, and since the copper conductive paste 13 is applied directly to both ends of the resistor circuit 12, they are electrically connected very well. Also, the peel strength for solder 180 board IK is 3 to 4 kg.
And 5kg1/C in the case of copper foil? 'It's comparable to a fantasy.

次に第１０図に示す実施例について説明すると。Next, the embodiment shown in FIG. 10 will be explained.

皺実施例は上記のようＫｆ４成された導体回路１６をオ
ーバーコート１７で被覆し、史にその上に同様の導体回
路１６を作成し、以下これを繰シ返して多層式の導体回
路１６を基板ｌの片面又は両面にアンダーコート８を施
して作成する方法である。In the wrinkled embodiment, a conductor circuit 16 made of Kf4 as described above is covered with an overcoat 17, a similar conductor circuit 16 is created on top of the overcoat 17, and the process is repeated to form a multilayer conductor circuit 16. In this method, an undercoat 8 is applied to one or both sides of the substrate 1.

この場合上下に一級する導体回路１６を部分的に導通さ
せるために蝶、導電性の良好な銅導電ペースト１３がオ
ーバーコート１７を貫通して導体回路１６ｉ１１Ｊ士を
Ｗｃ絖するようにすればよい０このように導体回路１６
を多層式にすることによって。In this case, in order to partially conduct the upper and lower first class conductor circuits 16, the copper conductive paste 13 with good conductivity may be passed through the overcoat 17 to connect the conductor circuits 16i11J. In this way, the conductor circuit 16
By making it multi-layered.

極めて薄形でしかも非常に多くの゛４電子路を含むプリ
ント回路を得ることが可能となる＠なお第７図に示すよ
うに完成された導体回路１６には、チップ形式の電子部
品（図示せず）等を直接半田付けすることができ、１枚
の基板ｌの片面のみで電子回路を構成することが可能と
なシ、両面に異なる電子回路を作成すれば一層式であっ
てもリード線を用いた従来例に比べてＨ杉で少なくとも
２倍の効率で基板ｌに電４１ｇ１路を作成することがで
きる。It is possible to obtain a printed circuit that is extremely thin and includes a large number of 4 electronic paths.As shown in FIG. 7, the completed conductor circuit 16 includes chip-type electronic components ( ) etc. can be directly soldered, and it is possible to configure an electronic circuit on only one side of a single board, and if different electronic circuits are created on both sides, even if it is a single-layer type, lead wires can be soldered. Compared to the conventional example using H cedar, it is possible to create one path on the substrate l with at least twice the efficiency.

本発明は、上記のように構成されるものでわるかも、印
刷抵抗囲路の作成を極めて簡易なものとすることができ
、また電気的接にの信頼性の向上を図ることかでさる９
ＪＪ来が伯られる。また従来の銀導電ペーストの使用や
銅張り工程及びエツチング工程を不要とすることができ
、プリンｌ−ｉ■：路製造の容易化、１軸の簡易化及び
プリント回路の低コスト化を一挙に図ることができると
いう画期的な効果が得られる１、またプリント基板の片
面に電子部品を直接半田付けできるので、回路の薄形化
と１ｉｉｌｌｆｉ度化を図ることができると共に、半田
付は性が極めて良くなるので半田付けの不良率を大幅に
減少させることができる効果が得ら牡る０？！には、電
気部品が基板の片面配置となるのでリード線用の穴あけ
〃ロ工作菓も不要となシ、１観の簡略化を図ることがで
き、半田付は箇所が導体回路の一部分にのみ形成される
ので＠量化も可能であり、産業上その効果の極めて大な
・る発明である。Although the present invention may be configured as described above, it is possible to extremely simplify the production of a printed resistor enclosure, and improve the reliability of electrical connection.
JJ is defeated. In addition, the use of conventional silver conductive paste, copper plating process, and etching process can be eliminated, making it possible to simplify circuit manufacturing, simplify single-axis operation, and reduce the cost of printed circuits all at once. In addition, since electronic components can be soldered directly to one side of a printed circuit board, it is possible to make the circuit thinner and more flexible. Since the soldering quality is extremely improved, the soldering defect rate can be significantly reduced. ! Since the electrical components are placed on one side of the board, there is no need to drill holes for the lead wires, and the view can be simplified, and soldering is only done on a part of the conductor circuit. Since it is formed, it can also be quantified, making it an invention with extremely great industrial effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例の印ｆＩｉ！Ｊ抵抗回路の一例としてス
ルーホール方式を示す縦断面図、第２図から第１０図は
本発明の冥施例に係り、絹２図は基板にアンターコート
を塗布した状態を示−を縦断面図、第３図はアンダーコ
ートの上に抵抗体を印刷艙布した状態を示す縦断面図、
第４図ね抵抗体に導電性の良好な銅導電ペーストを重ね
塗布した状態を示す縦断面図、第５図は導電性の良好な
銅導電ペーストの上に半田付は性の良好な銅導電ペース
トを重ねｍ布した状態を示す縦断面内、第６図は第５図
に示すものの斜初１図、第７図Ｆｉ導体回路にオーバー
コートを施した状態を示す縦断面図、第８凶は第７図に
示すものに半田付けをした状態を示す縦断葡図、第９図
はｍ８図に示すものの斜視図、第１０図は導体回路を多
Ｉ一式に作成した状態を示す縦断面図である。 １は基板、８は下地用のアンダーコート、１２は抵抗体
回路、１３ｔｊ：導゛１性の良好な銅導電ペース）、１
５は早出１−ｔけ性の長好な銅導電ペースト。 １６は導体回路、Ｒは抵抗体である。 特許出願人　　株式会社アプヒ化学研究所代理人　升地
士　　　内　ｔｏ　、ＦＬＩ　　男第１図 第２図 第５図 第１０図FIG. 1 shows a conventional example of the mark fIi! A vertical cross-sectional view showing a through-hole system as an example of a J resistance circuit. Figures 2 to 10 relate to the embodiments of the present invention, and Figure 2 is a vertical cross-sectional view showing a state in which an undercoat is applied to a substrate. Figure 3 is a longitudinal sectional view showing the state in which the resistor is printed on the undercoat.
Figure 4 is a vertical cross-sectional view showing the state in which a copper conductive paste with good conductivity is overlaid on a resistor, and Figure 5 is a longitudinal cross-sectional view showing the state in which a copper conductive paste with good conductivity is coated on top of the copper conductive paste with good conductivity. Figure 6 is a vertical cross-sectional view showing the state in which the paste is layered, Figure 6 is a diagonal first view of the one shown in Figure 5, Figure 7 is a vertical cross-sectional view showing the state in which an overcoat is applied to the Fi conductor circuit, and Figure 8 is a vertical cross-sectional view showing the state in which the overcoat is applied to the Fi conductor circuit. is a vertical cross-sectional view showing the soldered state of the thing shown in Figure 7, Figure 9 is a perspective view of the thing shown in Figure M8, and Figure 10 is a vertical cross-sectional view showing the state where the conductor circuit is made into a multi-I set. It is. 1 is a substrate, 8 is an undercoat for the base, 12 is a resistor circuit, 13tj: copper conductive paste with good conductivity), 1
5 is a copper conductive paste with excellent quick release and 1-t dissolution properties. 16 is a conductor circuit, and R is a resistor. Patent Applicant Aphi Chemical Research Institute Co., Ltd. Agent Masuji To, FLI Figure 1 Figure 2 Figure 5 Figure 10

Claims (1)

【特許請求の範囲】[Claims] 少なくとも表面が絶縁処理された基板に下地用アンダー
コートを塗布し、該アンダーコートの上に抵抗体を塗布
して加熱硬化させて抵抗体回路を形成し、該抵抗体回路
の−１１に導電性の良好な銅導電ペーストを重ね塗布し
て加熱硬化させ、皺銅導電ペースト上の要半田付は箇所
に半田付は性の良好な銅導電ペーストを重ね塗布して加
熱硬化させて半田付は可能な導体回路を作成することを
特徴とする絶縁基板に導体回路を作成する方法＠A base undercoat is applied to a substrate whose surface has been insulated at least, a resistor is applied on the undercoat and cured by heating to form a resistor circuit, and -11 of the resistor circuit is conductive. Copper conductive paste with good soldering properties is overcoated and heat cured, and soldering is possible by overcoating copper conductive paste with good soldering properties on the areas where soldering is required on the wrinkled copper conductive paste and curing with heat. A method for creating a conductor circuit on an insulated substrate, which is characterized by creating a conductor circuit.