JPH04335596A - Manufacture of through-hole printed wiring board - Google Patents
Manufacture of through-hole printed wiring boardInfo
- Publication number
- JPH04335596A JPH04335596A JP10719191A JP10719191A JPH04335596A JP H04335596 A JPH04335596 A JP H04335596A JP 10719191 A JP10719191 A JP 10719191A JP 10719191 A JP10719191 A JP 10719191A JP H04335596 A JPH04335596 A JP H04335596A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- manufacturing
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000011888 foil Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000010410 layer Substances 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ポリイミドフィルム，
ガラスエポキシ樹脂等の絶縁基板の表裏両面に設けられ
た導通パターンの所定の部署を導通させた、いわゆるス
ルーホールプリント配線基板の製造方法に関する。[Industrial Application Field] The present invention relates to polyimide films,
The present invention relates to a method for manufacturing a so-called through-hole printed wiring board in which predetermined portions of conductive patterns provided on both the front and back surfaces of an insulating substrate made of glass epoxy resin or the like are electrically connected.
【０００２】0002
【従来の技術】従来、スルーホールプリント配線基板を
製造する方法としては、スルーホールメッキを施す方法
が採られている。すなわち、図６に示すようにまずポリ
イミドフィルムまたはガラスエポキシ樹脂等の絶縁基板
３の両面にそれぞれ銅箔１を接着剤４により接合し、し
かる後に所定の場所に貫通孔５をあける。次いで、図７
に示すように無電解銅メッキ、電解銅メッキにより孔５
内に銅メッキ層７を形成し、表裏面の銅箔１同志を導通
させる。その後、銅箔１上にフォトレジスト等のレジス
トを塗布し、エッチングして所望の配線パターンを得る
。配線パターンは前記貫通孔５を含むように設けられ、
孔５内に付着した銅メッキ層７によって表裏面の配線パ
ターンが電気的に導通される。2. Description of the Related Art Conventionally, as a method of manufacturing through-hole printed wiring boards, a method of through-hole plating has been adopted. That is, as shown in FIG. 6, copper foils 1 are first bonded to both sides of an insulating substrate 3 made of polyimide film or glass epoxy resin using an adhesive 4, and then through holes 5 are formed at predetermined locations. Next, Figure 7
Hole 5 is formed by electroless copper plating and electrolytic copper plating as shown in
A copper plating layer 7 is formed inside, and the copper foils 1 on the front and back surfaces are electrically connected to each other. Thereafter, a resist such as photoresist is applied onto the copper foil 1 and etched to obtain a desired wiring pattern. The wiring pattern is provided to include the through hole 5,
The copper plating layer 7 deposited in the hole 5 provides electrical continuity between the wiring patterns on the front and back surfaces.
【０００３】0003
【発明が解決しようとする課題】しかし、上記製造方法
によれば、無電解メッキ及び電気メッキを施すためにコ
ストが高くなる欠点があり、また、銅箔上には電解メッ
キによる銅が付着するためそれだけで厚くなり、線間隔
の狭い配線パターンを形成する事ができない欠点があっ
た。[Problems to be Solved by the Invention] However, according to the above manufacturing method, there is a drawback that the cost is high because electroless plating and electroplating are applied, and copper due to electrolytic plating adheres to the copper foil. Therefore, it becomes thicker and has the disadvantage that it is not possible to form a wiring pattern with narrow line spacing.
【０００４】本発明はこれらの問題を解決し、確実な導
通が得られ、かつ、十分な信頼性を持つスルーホールプ
リント配線基板の製造方法を提供せんとするものである
。The present invention aims to solve these problems and provide a method for manufacturing a through-hole printed wiring board that provides reliable conduction and has sufficient reliability.
【０００５】[0005]
【課題を解決するための手段】本発明のスルーホールプ
リント配線基板の製造方法は、その金属箔よりも導電率
の低い第２の金属層が片面に形成された金属箔を、貫通
孔を設けた絶縁基板の両面に前記貫通孔を覆うようにラ
ミネートし、前記貫通孔の両面から金属箔を押圧、変形
せしめ、その貫通孔内で抵抗溶接法にて上下金属箔を接
続、導通させ、その後金属箔を所定の配線パターン形状
にエッチングする事を特徴としている。[Means for Solving the Problems] The method for manufacturing a through-hole printed wiring board of the present invention involves forming a metal foil on one side of which a second metal layer having a lower conductivity than the metal foil, and forming through holes therein. Laminate the insulating substrate on both sides to cover the through hole, press and deform metal foil from both sides of the through hole, connect and conduct the upper and lower metal foils within the through hole by resistance welding, and then It is characterized by etching metal foil into a predetermined wiring pattern shape.
【０００６】[0006]
【作用】上述の本発明の製造法によれば、絶縁基板の貫
通孔に、電気メッキをする必要がないため、コストの削
減や、線間隔の狭い配線パターンを形成する事が可能に
なる。さらに第２の金属層が金属箔よりも高い抵抗値を
有しているため、接続部分では発熱量が多くなり、上下
金属箔間の溶解量が増し同一金属箔同志の場合よりもい
っそう金属箔間の接続強度が増す。[Function] According to the above-described manufacturing method of the present invention, there is no need to perform electroplating on the through holes of the insulating substrate, thereby making it possible to reduce costs and form a wiring pattern with narrow line spacing. Furthermore, since the second metal layer has a higher resistance value than the metal foil, the amount of heat generated at the connection part increases, and the amount of melting between the upper and lower metal foils increases. The strength of the connection between them increases.
【０００７】[0007]
【実施例】以下に、本発明の実施例を図１ないし図５に
示す各工程図を参照して詳述する。まず、図１に示すよ
うに３５μｍ厚みの銅箔１の片面に、前記銅箔１より導
電率の低い第２の金属層である亜鉛層２を１００Å形成
する。次ぎに図２に示されるように、両面に２０μｍ厚
の接着剤層４が形成された２５μｍ厚のポリイミドから
なるフィルム状の絶縁基板３の、スルーホールを施す位
置に３００μｍφの貫通孔５を搾設する。しかる後に、
図３に示すように絶縁基板３の表裏面に前記貫通孔５を
覆うように第２の金属層２が対向するように銅箔１を貼
り付ける。次いで図４に示されるように、先端径が１０
０μｍφの加熱ツールにより貫通孔５の部分にある銅箔
１及び第２の金属層２を押圧、折曲せしめ１．７〜１．
９ｍＶの電流を流し、上下銅箔１を抵抗加熱法により接
続する。このとき、銅箔１に比べ導電率の低い亜鉛層２
同志が接触する事になり、この導電率の低い亜鉛層２の
発熱量が高くなり、上下金属箔間の溶解量が増し、同一
金属箔同志の場合よりも良好な接続が得られる。しかる
後に図５に示すように絶縁基板３上の両面の導電層を既
知の方法でエッチングして所望の配線パターンを得る。EXAMPLES Examples of the present invention will be described in detail below with reference to process diagrams shown in FIGS. 1 to 5. First, as shown in FIG. 1, a zinc layer 2 having a thickness of 100 Å, which is a second metal layer having a lower conductivity than the copper foil 1, is formed on one side of a copper foil 1 having a thickness of 35 μm. Next, as shown in FIG. 2, a through hole 5 of 300 μm diameter is drilled at a position where a through hole is to be formed in a film-like insulating substrate 3 made of polyimide with a thickness of 25 μm and an adhesive layer 4 of a thickness of 20 μm is formed on both sides. Set up After that,
As shown in FIG. 3, copper foils 1 are pasted on the front and back surfaces of the insulating substrate 3 so that the second metal layers 2 face each other so as to cover the through holes 5. Then, as shown in Figure 4, the tip diameter is 10
The copper foil 1 and the second metal layer 2 in the through hole 5 are pressed and bent using a heating tool with a diameter of 0 μm.1.7 to 1.
A current of 9 mV is applied to connect the upper and lower copper foils 1 by resistance heating. At this time, the zinc layer 2 has lower conductivity than the copper foil 1.
Since the two metal foils come into contact with each other, the amount of heat generated by the zinc layer 2 with low conductivity increases, the amount of melting between the upper and lower metal foils increases, and a better connection can be obtained than in the case of the same metal foils. Thereafter, as shown in FIG. 5, the conductive layers on both sides of the insulating substrate 3 are etched by a known method to obtain a desired wiring pattern.
【０００８】[0008]
【発明の効果】以上のように本発明によれば、メッキ処
理によるコストアップは低減され、また、単一金属同志
の接続よりも強い強度で接続でき、信頼性の高いスルー
ホールプリント配線基板が得られるものである。[Effects of the Invention] As described above, according to the present invention, the cost increase due to plating treatment is reduced, and a through-hole printed wiring board that can connect with stronger strength than the connection between single metals and has high reliability is produced. That's what you get.
【図１】本発明のスルーホールプリント配線基板の製造
方法の一実施例に使用される金属箔の断面図FIG. 1 is a cross-sectional view of a metal foil used in an embodiment of the method for manufacturing a through-hole printed wiring board of the present invention.
【図２】本
発明のスルーホールプリント配線基板の製造方法の一実
施例に使用される絶縁基板の断面図FIG. 2 is a cross-sectional view of an insulating substrate used in an embodiment of the method for manufacturing a through-hole printed wiring board of the present invention.
【図３】本発明のス
ルーホールプリント配線基板の製造方法の一実施例に使
用される一工程における配線基板の断面図FIG. 3 is a cross-sectional view of a wiring board in one step used in an embodiment of the method for manufacturing a through-hole printed wiring board of the present invention.
【図４】本発明のスルーホールプリント配線基板の製造
方法の一実施例の一工程における配線基板の断面図FIG. 4 is a cross-sectional view of a wiring board in one step of an embodiment of the method for manufacturing a through-hole printed wiring board of the present invention.
【図
５】本発明のスルーホールプリント配線基板の製造方法
の一実施例の他の一工程における配線基板の断面図FIG. 5 is a cross-sectional view of a wiring board in another step of an embodiment of the method for manufacturing a through-hole printed wiring board of the present invention.
【図
６】従来のスルーホールプリント配線基板の製造方法の
一工程における配線基板の断面図[Fig. 6] A cross-sectional view of a wiring board in one step of a conventional through-hole printed wiring board manufacturing method.
【図７】従来のスルーホールプリント配線基板の製造方
法の他の工程における配線基板の断面図[Fig. 7] A cross-sectional view of a wiring board in another step of the conventional through-hole printed wiring board manufacturing method.
【符号の説明】 １ 金属箔 ２ 第２の金属層 ３ 絶縁基板 ４ 接着剤 ５ 貫通孔 ６ ツール ７ メッキ層[Explanation of symbols] 1 Metal foil 2 Second metal layer 3 Insulating board 4 Adhesive 5 Through hole 6 Tools 7 Plating layer
Claims (2)
２の金属層が形成された金属箔を、貫通孔の形成された
絶縁基板の両面に前記第２の金属層が対向するようにラ
ミネートし、前記貫通孔の両面から前記金属箔を押圧、
変形せしめて前記貫通孔内で抵抗溶接法で接合し、所定
の配線パターンを形成し回路基板とすることを特徴とす
るスルーホールプリント配線基板の製造方法。Claim 1: A metal foil having a second metal layer having a lower conductivity than that of the metal foil formed on one side is arranged such that the second metal layer faces both sides of an insulating substrate in which a through hole is formed. laminating and pressing the metal foil from both sides of the through hole;
A method for manufacturing a through-hole printed wiring board, which comprises deforming the board and joining the through-hole using a resistance welding method to form a predetermined wiring pattern to form a circuit board.
らなる層である事を特徴とする請求項１記載のスルーホ
ールプリント配線基板の製造方法。2. The method for manufacturing a through-hole printed wiring board according to claim 1, wherein the second metal layer is a layer made of an alloy of a plurality of metals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3107191A JP2811995B2 (en) | 1991-05-13 | 1991-05-13 | Method of manufacturing through-hole printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3107191A JP2811995B2 (en) | 1991-05-13 | 1991-05-13 | Method of manufacturing through-hole printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04335596A true JPH04335596A (en) | 1992-11-24 |
| JP2811995B2 JP2811995B2 (en) | 1998-10-15 |
Family
ID=14452782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3107191A Expired - Lifetime JP2811995B2 (en) | 1991-05-13 | 1991-05-13 | Method of manufacturing through-hole printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2811995B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5537740A (en) * | 1992-12-28 | 1996-07-23 | International Business Machines Corporation | Method of making printed circuit board |
| JPH09283881A (en) * | 1996-04-12 | 1997-10-31 | Yamaichi Electron Co Ltd | Interlayer connecting structure in circuit board |
| US6460247B1 (en) * | 1997-10-07 | 2002-10-08 | Dimensional Circuits Corp. | Wiring board constructions and methods of making same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101119308B1 (en) * | 2009-02-03 | 2012-03-19 | 삼성전기주식회사 | A printed circuit board and a fabricating method the same |
-
1991
- 1991-05-13 JP JP3107191A patent/JP2811995B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5537740A (en) * | 1992-12-28 | 1996-07-23 | International Business Machines Corporation | Method of making printed circuit board |
| JPH09283881A (en) * | 1996-04-12 | 1997-10-31 | Yamaichi Electron Co Ltd | Interlayer connecting structure in circuit board |
| US6460247B1 (en) * | 1997-10-07 | 2002-10-08 | Dimensional Circuits Corp. | Wiring board constructions and methods of making same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2811995B2 (en) | 1998-10-15 |
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