JPH09321402A - Printed-wiring board - Google Patents

Printed-wiring board

Info

Publication number
JPH09321402A
JPH09321402A JP3858997A JP3858997A JPH09321402A JP H09321402 A JPH09321402 A JP H09321402A JP 3858997 A JP3858997 A JP 3858997A JP 3858997 A JP3858997 A JP 3858997A JP H09321402 A JPH09321402 A JP H09321402A
Authority
JP
Japan
Prior art keywords
hole
wiring board
filler
printed wiring
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3858997A
Other languages
Japanese (ja)
Inventor
Kazumitsu Ishikawa
和充 石川
Haruo Suzuki
晴雄 鈴木
Shoji Oikawa
昇司 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP3858997A priority Critical patent/JPH09321402A/en
Publication of JPH09321402A publication Critical patent/JPH09321402A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To make it possible to mount surface-attaching components on the upper and lower surfaces of a through hole in a high integration by a method wherein a conductive filler consisting of a metallic powder-containing resin paste is filled in the through hole and a solderability is given to the surface of this filler. SOLUTION: A hole is bored by a drill in a position, wherein a through hole part is formed, on a base material 1 having copper foils 2 on both surfaces thereof and thereafter, a through hole plating 4, through which the upper and lower surfaces 4a and 4b of the through hole are electrically connected with each other, is formed using together an electroless plating and an electroplating. After that, a metallic powder-containing resin paste is filled in this through hole as a filler 5. After the surface of this filler 5 is flattened, a surface- attaching component 8 is soldered to the upper surface or lower surface of the filler 5 having a solderability in the through hole part to mount the components 8 on the upper surface or lower surface of the filler 5. Thereby, it becomes possible to obtain a printed-wiring board which can be mounted in a high density.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、面付部品を搭載す
るプリント配線基板、特に高密度実装に供する面付部品
用のプリント配線基板のスルーホール構造に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board on which surface-mounted components are mounted, and more particularly to a through-hole structure of a printed wiring board for surface-mounted components used for high-density mounting.

【０００２】[0002]

【従来の技術】従来のプリント配線基板では、スルーホ
ールは両面プリント配線基板もしくは多層プリント配線
基板の各配線層間の電気的接続を行なうことと、さらに
電子部品のリード線を挿入し部品実装することを目的と
しており、プレスやドリル等による方法で基板に穴をあ
けたところに、無電解めっきと電気めっきを併用する
か、あるいは無電解めっきのみにより貫通穴内を導体化
して電気的接続を行なう構造となっている。2. Description of the Related Art In a conventional printed wiring board, through holes are used for electrical connection between wiring layers of a double-sided printed wiring board or a multilayer printed wiring board, and further, lead wires of electronic parts are inserted to mount the parts. The purpose is to construct a hole in the substrate by a method such as pressing or drilling, and use electroless plating and electroplating together, or a structure that makes the inside of the through hole a conductor by only electroless plating for electrical connection. Has become.

【０００３】また、簡易スルーホールとして電気的な接
続を行なうため導電性を有する充填物をスルーホール内
に充填し、各配線層間を電気的に接続する銀ペースト充
填法があるがマイグレーションの危険性があることと、
スルーホール内に電子部品のリード線を挿入できなくな
るため、高密度実装には適さない構造となっていた。In addition, there is a silver paste filling method in which a conductive filling material is filled in the through hole to electrically connect as a simple through hole, and each wiring layer is electrically connected, but there is a risk of migration. That there is
Since the lead wires of electronic components cannot be inserted into the through holes, the structure is not suitable for high-density mounting.

【０００４】[0004]

【発明が解決しようとする課題】近年の小型化、高密度
化の実装技術の発展に伴ない、面付部品がリード線付挿
入型電子部品に比べ小型化と高密度化が可能となり面付
部品の適用率が高くなっている。面付部品を用いる適用
率が高くなるほど、高密度実装するには、従来のプリン
ト配線基板の上面導体回路と下面導体回路を電気的に接
続するスルーホール穴の存在は、電気的な回路接続には
必要なものの、面付部品の実装には不要となり、面付部
品等を実装する面積を減少させる要因となっている。ま
たスルーホール穴付ランド部の同一ランド内部に面付部
品用ランドを近接して設けると、リフロー半田付け工法
ではペースト半田が溶融するとき、スルーホール穴内
に、半田が流れこみ、面付部品の両端電極部の半田量が
不均一となり、はんだ付の品質が安定化しない問題があ
る。本発明は、従来のスルーホールの本来の目的である
各配線層間の電気的接続の機能を失なうことなく、スル
ーホール穴の上下表面に面付部品を高密度に実装できる
プリント配線基板を提供することを目的とするものであ
る。With the recent development of miniaturization and high-density mounting technology, surface-mounted parts can be made smaller and higher-density than lead-wired insertion type electronic parts. The application rate of parts is high. The higher the application rate of using surface-mounted parts, the higher the mounting density, the more the through-holes that electrically connect the upper surface conductor circuit and the lower surface conductor circuit of the conventional printed wiring board to the electrical circuit connection. Although it is necessary, it becomes unnecessary for mounting the surface-mounted parts, which is a factor of reducing the area for mounting the surface-mounted parts. If the land for surface-equipped parts is provided close to the same land in the land with through-holes, when the paste solder melts in the reflow soldering method, the solder will flow into the through-holes and There is a problem in that the amount of solder on the electrode portions on both ends becomes uneven, and the quality of soldering is not stabilized. The present invention provides a printed wiring board capable of densely mounting surface-mounted components on the upper and lower surfaces of a through hole without losing the function of electrical connection between wiring layers, which is the original purpose of a conventional through hole. It is intended to be provided.

【０００５】[0005]

【課題を解決するための手段】本発明は上記課題を解決
するため、プリント配線基板の製造工程中で、プリント
配線基板の両面または内層導体回路に導通するスルーホ
ールめっきを有するスルーホール内に導電性の充填物を
充填し、充填したスルーホールの表面を平坦化する。本
発明の特徴とするところは、この充填物の表面が半田付
性を有し、充填してなるスルーホール穴の上部表面また
は下部表面に面付部品を従来の部品実装や半田付け作業
の方法を変えることなく、高密度実装することが可能と
なることである。In order to solve the above-mentioned problems, according to the present invention, in the process of manufacturing a printed wiring board, conductive material is provided in both sides of the printed wiring board or in through holes having through hole plating for conducting to inner layer conductor circuits. The filling material is filled with a conductive filler, and the surface of the filled through hole is flattened. The feature of the present invention is that the surface of the filling material has solderability, and the surface mounting component is mounted on the upper surface or the lower surface of the filled through-hole hole by a conventional component mounting or soldering method. It is possible to achieve high-density mounting without changing

【０００６】上記の導電性および半田付性を有する充填
物としては、半田や半田ペーストがあるが溶融点が低
く、フロー半田付けやリフロー半田付け時に充填物が溶
解して流動し、面付部品実装の品質が不安定となる。ま
た一般的な銀スルーホール工法で用いられる銀ペースト
があるが充填してなるスルーホール穴の表面を平坦化す
ることが難しく、特にマイグンション不良の危険性が高
く高密度配線には通さない。さらに金属材、金属粉は充
填作業性やスルーホールめっきとの密着性に問題があ
る。そのため本発明では充填物として金属粉を含有する
樹脂ペーストを用い、金属粉は銅粉もしくはニッケル粉
とすることにより、これらの問題を解決することができ
た。As the filler having the above-mentioned conductivity and solderability, there are solder and solder paste, but the melting point is low, and the filler melts and flows during the flow soldering or reflow soldering, and the surface-mounted parts The quality of implementation becomes unstable. In addition, there is a silver paste used in the general silver through-hole method, but it is difficult to flatten the surface of the filled through-hole, and there is a high risk of migration failure, and it cannot pass through high-density wiring. . Furthermore, metal materials and metal powders have problems in filling workability and adhesion with through-hole plating. Therefore, in the present invention, these problems could be solved by using a resin paste containing metal powder as the filler and using copper powder or nickel powder as the metal powder.

【０００７】[0007]

【発明の実施の形態】本発明の実施の形態について、図
に基づいて説明する。まず、図２に示すように１８μｍ
の銅箔２を両面に有する素材１のスルーホール部３にな
る所定の位置にドリル穴あけ後、無電解めっきと電気め
っきを併用してスルーホールの上面４ａと下面４ｂが電
気的に接続されるスルーホールめっき４を形成する。そ
の後、図３に示すようにこのスルーホール内に金属粉を
含有する金属粉含有樹脂ペーストを充填物５として充填
する。素材１はフェノール材、エポキシ材、コンポジッ
ト材等が用いられる。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. First, as shown in FIG. 2, 18 μm
After drilling at a predetermined position to be the through hole portion 3 of the material 1 having the copper foil 2 on both sides, the upper surface 4a and the lower surface 4b of the through hole are electrically connected by using both electroless plating and electroplating. Through-hole plating 4 is formed. Thereafter, as shown in FIG. 3, a metal powder-containing resin paste containing metal powder is filled in the through hole as a filling 5. As the material 1, a phenol material, an epoxy material, a composite material or the like is used.

【０００８】上記スルーホールめっき４は、サブトラク
ティブ法、アディティブ法等により形成される。また、
スルーホールめっき後、前記充填物５を印刷法、ディッ
プ法、注入法等の方法によりスルーホール穴内に充填す
ればよい。上記充填物５である金属粉含有樹脂ペースト
に用いる樹脂は、エポキシ樹脂系もしくはフェノール樹
脂系とする。また、金属粉含有樹脂ペーストに含有させ
る金属粉は、銅粉もしくはニッケル粉がよく、その含有
量は５０〜９０wt％とする。金属粉の含有量が５０wt％
未満では半田ぬれ性が低下するとともに無電解めっきの
析出性が劣化し、９０wt％を越えると樹脂と金属の密着
性に悪影響を及ぼし、いずれも好ましくない。金属粉の
粒径は通常０．３〜１０μｍとする。The through hole plating 4 is formed by a subtractive method, an additive method or the like. Also,
After the through-hole plating, the filling material 5 may be filled in the through-hole holes by a printing method, a dipping method, an injection method, or the like. The resin used for the metal powder-containing resin paste that is the filler 5 is an epoxy resin type or a phenol resin type. Further, the metal powder contained in the metal powder-containing resin paste is preferably copper powder or nickel powder, and the content thereof is 50 to 90 wt%. Metal powder content is 50wt%
If it is less than 90 wt%, the solder wettability is deteriorated and the depositability of electroless plating is deteriorated. If it exceeds 90 wt%, the adhesion between the resin and the metal is adversely affected. The particle size of the metal powder is usually 0.3 to 10 μm.

【０００９】また、この充填物５の表面を平坦化するた
め、スルーホール穴の外に充填物５が突起している場合
には、プレスで平坦化したり、バフ等で研磨を行なっ
て、その充填穴の上下表面の不要な樹脂ペーストを除去
して平坦化した後、１５０℃の乾燥炉で充分樹脂ペース
トを硬化する。その後、写真法により所定のパターンの
エッチングマスクを形成し、エッチングを行なって不要
な銅箔２と銅めっきを除去した状態を図３に示す。さら
に半田付けランドを除く全面にソルダーレジスト膜を印
刷法により形成し、仕上げ処理を施し、プリフラックス
を塗布して本発明の面付部品用プリント配線基板を完成
した。Further, in order to flatten the surface of the filling material 5, when the filling material 5 is projected outside the through-hole, the filling material 5 is flattened by pressing or polished by a buff and the like. After removing unnecessary resin paste on the upper and lower surfaces of the filling hole and flattening it, the resin paste is sufficiently cured in a drying oven at 150 ° C. After that, a state in which an etching mask having a predetermined pattern is formed by a photographic method and the unnecessary copper foil 2 and copper plating are removed by etching is shown in FIG. Further, a solder resist film was formed on the entire surface excluding soldering lands by a printing method, finishing treatment was performed, and preflux was applied to complete the printed wiring board for surface-mounted parts of the present invention.

【００１０】さらに、図１に示すように上記で完成した
プリント配線基板上に半田クリームを面付ランド部のみ
に印刷塗布して、面付部品８をマウント後、赤外線リフ
ロー炉で半田付けをして、本発明の目的である高密度で
信頼性の高い面付部品用プリント配線基板が完成した。
なお、面付部品８はスルーホール下部表面にも半田付け
してマウントすることができる。つまりスルーホールめ
っきの施されたスルーホール内に充填物５を充填してな
るスルーホール部３において、半田付性を有する充填物
５の上部表面または下部表面に面付部品８を半田付けし
て実装することができる。Further, as shown in FIG. 1, solder cream is printed and applied only on the surface land portion on the printed wiring board completed as described above, and after the surface component 8 is mounted, it is soldered in an infrared reflow furnace. As a result, the printed wiring board for surface-mounted components, which is the object of the present invention and has high density and high reliability, is completed.
The surface-mounted component 8 can be mounted by soldering also on the lower surface of the through hole. That is, in the through-hole portion 3 formed by filling the filling material 5 in the through-hole plated with the through-hole, the surface-attached component 8 is soldered to the upper surface or the lower surface of the filling material 5 having solderability. Can be implemented.

【００１１】[0011]

【実施例】本発明の実施例として、図１に示すように素
材１として１８μｍの銅箔２を両面に有するガラスエポ
キシ積層板を用い、充填物５である金属粉含有樹脂ペー
ストとして、粒径が５〜１０μｍの銅粉を約８５wt％と
残部がエポキシ樹脂よりなる銅粉含有樹脂ペーストを、
スクリーン版としてメタルマスクを使用し、スルーホー
ル穴内にスキージ（スクリーン版を通してインキをこす
り出すかき取りへら）を用いて充填し、約８０℃で樹脂
ペーストの仮乾燥を行なう。その後、充填したスルーホ
ールの上下面にステンレス板にて、１０kg／cm2の加圧
を行ない樹脂ペーストの充填密度をあげた。EXAMPLE As an example of the present invention, as shown in FIG. 1, a glass epoxy laminate having a copper foil 2 of 18 μm on both sides as a raw material 1 was used, and a metal powder containing resin paste as a filler 5 had a particle size of Is a copper powder-containing resin paste comprising about 85 wt% of copper powder of 5 to 10 μm and the remainder being epoxy resin,
A metal mask is used as a screen plate, a through hole is filled with a squeegee (a scraper for scraping ink through the screen plate), and the resin paste is temporarily dried at about 80 ° C. Thereafter, a pressure of 10 kg / cm 2 was applied to the upper and lower surfaces of the filled through holes with a stainless plate to increase the packing density of the resin paste.

【００１２】[0012]

【発明の効果】従来はスルーホール穴の上部表面または
下部表面に面付部品８を実装することが不可能となって
いたが、本発明によれば、スルーホールめっき４の施さ
れたスルーホール内に金属粉を含有する樹脂ペーストを
充填し、この充填物５の表面が半田付性を有しているた
め、この充填したスルーホール穴の上部または下部表面
に面付部品８を従来の部品実装や半田付け作業の方法を
変えることなく、従来の高密度なプリント配線基板に比
べて、さらに１．５〜２．０倍程度の高密度に実装でき
るプリント配線基板を提供することが可能となる。According to the present invention, it has been impossible to mount the surface-mounted component 8 on the upper surface or the lower surface of the through hole, but according to the present invention, the through hole plated with the through hole 4 is formed. Since a resin paste containing metal powder is filled in the inside thereof, and the surface of the filling 5 has solderability, the surface-attached component 8 is provided on the upper or lower surface of the filled through-hole hole. It is possible to provide a printed wiring board that can be mounted at a high density of about 1.5 to 2.0 times higher than that of a conventional high-density printed wiring board without changing the mounting or soldering method. Become.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明による面付部品を実装したプリント配線
基板の断面図。FIG. 1 is a cross-sectional view of a printed wiring board on which an imposition component according to the present invention is mounted.

【図２】本発明の充填前の製造工程を示すプリント配線
基板の断面図。FIG. 2 is a cross-sectional view of a printed wiring board showing a manufacturing process before filling according to the present invention.

【図３】本発明の充填後の製造工程を示すプリント配線
基板の断面図。FIG. 3 is a cross-sectional view of a printed wiring board showing a manufacturing process after filling according to the present invention.

【符号の説明】[Explanation of symbols]

１…素材、 ２…銅箔、 ３…スルーホール部、 ４…
スルーホールめっき、４ａ…上面、 ４ｂ…下面、 ５
…充填物、 ７…半田、 ８…面付部品。1 ... Material, 2 ... Copper foil, 3 ... Through hole part, 4 ...
Through-hole plating, 4a ... upper surface, 4b ... lower surface, 5
… Filling material, 7… Solder, 8… Faced parts.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 スルーホールめっきを有するプリント配
線基板において、このスルーホールめっきのスルーホー
ル内に、金属粉を含有する樹脂ペーストからなる導電性
の充填物を充填し、この充填物の表面が半田付性を有し
ていることを特徴とするプリント配線基板。1. In a printed wiring board having through-hole plating, a conductive filler made of a resin paste containing metal powder is filled in the through-hole of the through-hole plating, and the surface of the filler is soldered. A printed wiring board having an adhesive property. 【請求項２】 請求項１における充填物が、銅粉もしく
はニッケル粉を５０〜９０wt％含有するエポキシ樹脂系
またはフェノール樹脂系の金属粉を含有する樹脂ペース
トからなるプリント配線基板。2. The printed wiring board according to claim 1, wherein the filler is a resin paste containing an epoxy resin-based or phenol resin-based metal powder containing 50 to 90 wt% of copper powder or nickel powder. 【請求項３】 請求項１または請求項２における充填し
てなるスルーホール穴の上部表面または下部表面に面付
部品を半田付けしてなることを特徴とするプリント配線
基板。3. A printed wiring board, characterized in that an imposition component is soldered to the upper surface or the lower surface of the filled through-hole hole according to claim 1 or 2.
JP3858997A 1997-02-07 1997-02-07 Printed-wiring board Pending JPH09321402A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3858997A JPH09321402A (en) 1997-02-07 1997-02-07 Printed-wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3858997A JPH09321402A (en) 1997-02-07 1997-02-07 Printed-wiring board

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP20504390A Division JPH0491489A (en) 1990-08-03 1990-08-03 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH09321402A true JPH09321402A (en) 1997-12-12

Family

ID=12529494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3858997A Pending JPH09321402A (en) 1997-02-07 1997-02-07 Printed-wiring board

Country Status (1)

Country Link
JP (1) JPH09321402A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1053903A2 (en) 1999-05-20 2000-11-22 Nissan Motor Company, Limited Vehicular velocity controlling apparatus and method to follow up a preceding vehicle.
EP1055542A2 (en) 1999-05-25 2000-11-29 Nissan Motor Company, Limited Preceding vehicle follow-up control system with gain adjustment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1053903A2 (en) 1999-05-20 2000-11-22 Nissan Motor Company, Limited Vehicular velocity controlling apparatus and method to follow up a preceding vehicle.
EP1055542A2 (en) 1999-05-25 2000-11-29 Nissan Motor Company, Limited Preceding vehicle follow-up control system with gain adjustment

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