JPS5877287A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS5877287A JPS5877287A JP17608981A JP17608981A JPS5877287A JP S5877287 A JPS5877287 A JP S5877287A JP 17608981 A JP17608981 A JP 17608981A JP 17608981 A JP17608981 A JP 17608981A JP S5877287 A JPS5877287 A JP S5877287A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- resin paint
- printed
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は１枚の絶縁基板の両面に所定形状の導体回路網
を有し、これらの導体回路網が上記絶縁基板に設けた透
孔のスルーホール導体路でもって電気的に接続された印
刷配線板の製造方法に関するものであり、その目的とす
るところは７［程を削減して量産性を高めることができ
る印Ｆ１１配線板の製造方法を提供することにある。
−一般に、両面印刷配線板を得るためには両面に所
定形状の導体回路網を設けたプリント基板に透孔を設け
、この透孔を介して両面の導体回路網を電気的に接続す
る、いわゆるスルーホール接続法が適用されている。そ
して、このスルーホール接続のためにはめっき金属、導
電性樹脂ペイントが用いられている。しかしながら、め
っき金属にてスルーホール接続する場合にはプリント基
板にドリリング又はパンチングによって形成した透孔に
めっき処理をしなければならない関係で、その透孔内の
壁部を活性化処理した後に化学めっきし、その後電気め
っきするなどの多くの処理工程を必要とする問題があっ
た。一方、導電性樹脂ペイントにてスルーホール接続す
る場合にはプリント基板にドリリング又はパンチングに
よって形成した透孔に印刷処理゛をしなければならない
関係で、その透孔内の壁部の機械的なみだれを除去する
だめにアンダーコート処理したのちに導電性樹脂ペイン
トを印刷するなどの多くの処理上程を必要とする問題が
あった。DETAILED DESCRIPTION OF THE INVENTION The present invention has a conductor network of a predetermined shape on both sides of a single insulating substrate, and these conductor networks conduct electricity through through-hole conductor paths provided in the insulating substrate. The purpose of this invention is to provide a method for manufacturing printed wiring boards marked F11 that can reduce the cost by 7[m] and improve mass productivity.
- Generally, in order to obtain a double-sided printed wiring board, a through hole is provided in a printed circuit board with a conductor network of a predetermined shape on both sides, and the conductor networks on both sides are electrically connected through the through hole. Through-hole connection method is applied. Plated metal and conductive resin paint are used for this through-hole connection. However, when making through-hole connections using plated metal, the holes formed in the printed circuit board by drilling or punching must be plated, so the walls inside the holes must be activated and then chemically plated. However, there was a problem in that it required many processing steps such as electroplating after that. On the other hand, when making through-hole connections using conductive resin paint, the holes formed by drilling or punching on the printed circuit board must be printed, which causes mechanical damage to the walls inside the holes. There was a problem in that many processing steps were required, such as undercoating and then printing conductive resin paint in order to remove it.
本発明はこのような従来の欠点を解消するものであり、
プリント基板として片面に所定形状の導体回路網が形成
されると共に所定箇所に透孔が設けられたものを使用し
、このプリント基板の池面への貴金属の移行抑止作用を
有する樹脂層の印刷工程において上記透孔に上記貴金属
の移行抑市作用を有する樹脂の立体的な印刷を行ない、
その後。The present invention solves these conventional drawbacks,
A process of printing a resin layer that has the effect of inhibiting the migration of precious metals to the surface of the printed circuit board, using a printed circuit board on which a conductor network of a predetermined shape is formed on one side and with through holes provided at predetermined locations. In the above-mentioned through-hole, three-dimensional printing of a resin having an effect of inhibiting migration of the above-mentioned precious metal is performed,
after that.
上記プリント基板の他面への導電性樹脂ペイントによる
所定形状の導体回路網の印刷■程において上記樹脂層が
設けられた上記プリント基板の透孔に上記導電性樹脂ペ
イントの立体的な印刷を行なうようにしだものである。Printing a conductor circuit network of a predetermined shape using conductive resin paint on the other side of the printed circuit board In step 2, three-dimensional printing of the conductive resin paint is performed in the through hole of the printed circuit board provided with the resin layer. That's how it is.
かかる製造方法によれば、上記貴金属の移行抑止作用を
有する樹脂層のプリント基板の他面への印刷工程におい
てスルーホール接続のためのアンダーコートを、そして
、上記導電性樹脂ペイントのプリント基板の他面への印
刷工程においてスルーホール接続のための導体路を形成
することができるため、両面印刷配線板の製造工程を削
減して生産性を高めることができる利点を有する。According to this manufacturing method, in the printing process of the resin layer having the effect of inhibiting migration of precious metals on the other side of the printed circuit board, an undercoat for through-hole connection is applied, and the conductive resin paint is applied to the other surface of the printed circuit board. Since conductor paths for through-hole connections can be formed in the printing process on the surface, there is an advantage that the manufacturing process of double-sided printed wiring boards can be reduced and productivity can be increased.
以下、本発明の実施例について説明する。Examples of the present invention will be described below.
実施例
まず、第１図に示すように片面に所定形状の導体回路網
としての導体層１を有し、その所定箇所に透孔２を有す
る紙基材フェノール樹脂積層板よりなるプリント基板３
を用意した。次に、第２図に示すように上記プリント基
板３の導体層のない面にメタルマスク４を配置し、その
導体層のない面および透孔２に対して貴金属の移行抑止
作用を有する樹脂ペイント６をスクリーン印刷の手法で
印刷した。この時、上記メタルマスク４として、上記プ
リント基板３の導体層のない面の所定形状の導体回路網
を形成するための予定箇所に対応してマスク孔６が設け
られ、上記プリント基板３の透孔２に対応して段付きの
マスク孔７が設けられたものを用いた。まだ、樹脂ペイ
ント６はメチルエチルケトンにより粘度１２０±１ｏＣ
ＰＳ のｉ囲に調整して用いた。そして、このスクリ
ーン印刷によって第２図に示すように上記プリント基板
３の導体層のない面に所定形状の導体回路網に対応する
貴金属の移行抑市作用を有する樹脂層６を印刷すると同
時に上記プリント基板３の透孔２に上記貴金属の移行抑
市作用を有する樹脂５の立体的な印刷を行なった。この
印１１１］の後に上記プリント基板３を電気炉中に入れ
て１６０°Ｃ２１０分の条件で上記貴金属の移行抑止作
用を有する樹脂層６を硬化さぜた。次に、第３図に示す
ように−Ｅ記プリント基板３の樹脂層５を設けた他面に
メタルマスク８を配置してスクリーン印刷の手法で導電
性樹脂ペイント９を印刷した。この時、−ｈ記メタルマ
スク８として上記プリント基・板３に設けた樹脂層６に
対応して所定形状の導体回路網のだめのマスク孔１０が
設けられ、上記プリント基板３の透孔２に対応して段付
きのマスク孔１１が設けられたものを用いた。捷た。−
導電性樹脂ペイント９として米国デーポン社製の銀粉−
樹脂系５６０４をカルピトール溶剤によって粘度１１ｏ
±１０ＣＰＳの範囲に調整して用いた。そして、このス
クリーン印刷によって第３図に示すように上記プリント
基板３に設けた樹脂層５上に所定形状の導体回路網とし
ての導電性樹脂ペイント層９を印刷すると同時に上記樹
脂層６を有する上記プリント基板３の透孔２にはとめ状
にスルーホール導体路としての導電性樹脂ペイント層９
の立体的な印刷を行なった。この印刷の後に上記プリン
ト基板３を電気へ
炉中に入れて１５００．６０分の条件で１−記導電性樹
脂ペインド層９を硬化させた。そして、上記プリント基
板３の樹脂層５および導電性樹脂ペイント層９を設けた
面側にコーティング樹脂層１２を設けた。このようにし
て第４図に示すように両面に所定形状の導体回路網を有
し、これら導体回路網がスルーホール導体路にて電気的
に接続された両面印刷配線板を得だ。Embodiment First, as shown in FIG. 1, a printed circuit board 3 is made of a paper-based phenolic resin laminate having a conductor layer 1 as a conductor circuit network of a predetermined shape on one side and having through holes 2 at predetermined locations.
prepared. Next, as shown in FIG. 2, a metal mask 4 is placed on the surface of the printed circuit board 3 that does not have a conductor layer, and a resin paint that has an effect of inhibiting noble metal migration is applied to the surface that does not have a conductor layer and the through holes 2. 6 was printed using a screen printing method. At this time, as the metal mask 4, mask holes 6 are provided corresponding to planned locations for forming a conductor network of a predetermined shape on the surface of the printed circuit board 3 without a conductor layer, and the printed circuit board 3 is transparent. A mask having a stepped mask hole 7 corresponding to the hole 2 was used. However, resin paint 6 has a viscosity of 120±1oC due to methyl ethyl ketone.
It was adjusted to the i range of PS and used. Then, as shown in FIG. 2, by this screen printing, a resin layer 6 having a noble metal migration inhibiting effect corresponding to a conductor network of a predetermined shape is printed on the surface of the printed circuit board 3 where there is no conductor layer, and at the same time the resin layer 6 is printed. Three-dimensional printing of the resin 5 having the effect of suppressing migration of noble metals was carried out in the through holes 2 of the substrate 3. After this mark 111], the printed circuit board 3 was placed in an electric furnace, and the resin layer 6 having the effect of inhibiting noble metal migration was cured at 160° C. for 210 minutes. Next, as shown in FIG. 3, a metal mask 8 was placed on the other surface of the -E printed circuit board 3 on which the resin layer 5 was provided, and a conductive resin paint 9 was printed by screen printing. At this time, a mask hole 10 for a conductive circuit network of a predetermined shape is provided as a metal mask 8 in -h corresponding to the resin layer 6 provided on the printed circuit board/board 3, and a mask hole 10 for a conductive circuit network of a predetermined shape is provided in the through hole 2 of the printed circuit board 3. A correspondingly stepped mask hole 11 was used. I cut it. −
Silver powder manufactured by Dapon Co., USA as conductive resin paint 9
Resin system 5604 was reduced to a viscosity of 11o by carpitol solvent.
It was adjusted to a range of ±10 CPS and used. Then, as shown in FIG. 3, by this screen printing, a conductive resin paint layer 9 as a conductive circuit network of a predetermined shape is printed on the resin layer 5 provided on the printed circuit board 3, and at the same time, the conductive resin paint layer 9 is printed on the resin layer 5 provided on the printed circuit board 3. A conductive resin paint layer 9 is applied to the through hole 2 of the printed circuit board 3 in a stopper shape as a through hole conductor path.
Three-dimensional printing was performed. After this printing, the printed circuit board 3 was placed in an electric furnace and the conductive resin painted layer 9 was cured for 1500.60 minutes. Then, a coating resin layer 12 was provided on the side of the printed circuit board 3 on which the resin layer 5 and the conductive resin paint layer 9 were provided. In this way, as shown in FIG. 4, a double-sided printed wiring board was obtained, which had conductor networks of a predetermined shape on both sides, and these conductor networks were electrically connected by through-hole conductor paths.
以上のように本発明によれば、片面に所定形状の導体回
路網が設けられると共にその所定箇所に透孔が設けられ
たプリント基板を有し、このプリント基板の導体層のな
い面に貴金匡の移行抑１ヒ作用を有する樹脂ペイントを
所定形状に印ｉ１１すると同時に上記プリント基板の透
孔に上記貴金属の移行抑止作用を有する樹脂ペイントの
（１体的な印刷を行ない、上記貴金属の移行抑止作用を
有する樹脂ペイントの印刷層を乾燥したのちに上記プリ
ント基板の導体層のない而に桿電性ｖｊＩ脂ペイントを
所定形状に印刷すると同時に樹脂ベイノドの印１ｈｌＪ
層が設けられた上記プリント基板の１〜孔に１−記導電
性樹脂ペインドの）γ体内な甲１１すを行ない、【２か
る後に上記導電性樹脂ペイントの印１１１１層を硬化さ
せるようにしだので、上記資金；似の多行抽出作用を有
する樹脂ペイントのプリント基板の導体層を有しない面
への印刷工程においてスルーホール接続のためのアンダ
ーコートを、そして、上記所定形状の導体回路網のだめ
の導電性樹脂ペイントの上記プリント基板の導体層を有
しない面への印刷工程においてスルーホール接続のため
の導体路を形成することができ１両面印刷配線板の製造
工程を削減して生産性を高めることができる。しかも。As described above, according to the present invention, a printed circuit board is provided with a conductor network of a predetermined shape on one side and a through hole is provided at a predetermined location, and a precious metal is placed on the surface of the printed circuit board without a conductor layer. At the same time, a resin paint having an effect of inhibiting the migration of the metal is printed in a predetermined shape i11, and at the same time, a resin paint having an effect of inhibiting the migration of the precious metal is printed in one piece to prevent the migration of the precious metal. After drying the printing layer of the resin paint having a deterrent effect, a resin paint is printed in a predetermined shape on the printed circuit board without the conductor layer, and at the same time a resin paint mark 1hlJ is applied.
Apply the conductive resin paint to the holes 1 to 1 of the printed circuit board on which the layers are provided, and then harden the conductive resin paint layer 1. Therefore, the above funds; undercoat for through-hole connection in the printing process on the side of the printed circuit board that does not have a conductor layer with a similar multi-line extraction effect, and the reservoir of the conductor network of the above prescribed shape. In the printing process of the conductive resin paint on the side of the printed circuit board that does not have a conductive layer, a conductive path for through-hole connection can be formed, reducing the manufacturing process of double-sided printed wiring boards and increasing productivity. can be increased. Moreover.
のための導電性樹脂ペイントの印刷層は貴金属の移行抑
止作用を有する樹脂ペイントの印刷層をアンダーコート
として形成されるために貴金属のマイグレイジョンを効
果的に抑止することができる利点を有するものである。The printed layer of conductive resin paint for this purpose has the advantage of effectively inhibiting the migration of precious metals because it is formed as an undercoat with a printed layer of resin paint that has the effect of inhibiting migration of precious metals. It is.
４、図面の簡単な説明 −図面は本発明
の印刷配線板の製造方法の一実施例を示し、第１図は出
発材としての片面プリント基板の断面図、゛第２図は樹
脂ペイントの印刷工程の説明図、第３図は導電性樹脂ペ
イント−の印刷工程の説明図、第４図はコーティング樹
脂層の塗布工程の説明！である。4. Brief description of the drawings - The drawings show an embodiment of the printed wiring board manufacturing method of the present invention, in which Fig. 1 is a cross-sectional view of a single-sided printed circuit board as a starting material, and Fig. 2 is a cross-sectional view of a single-sided printed circuit board as a starting material. An explanatory diagram of the process, Fig. 3 is an explanatory diagram of the printing process of conductive resin paint, and Fig. 4 is an explanatory diagram of the coating process of the coating resin layer! It is.
、 １・・・・・・導体層、２・・・・・・透孔、３・
・・・・・プリント基板、４．８・・・・・・メタルマ
スク、５・・・・・・樹脂ペイント％６，１０・・・・
・・マスク孔、７，１１・・・・・・段付きのマスク孔
、９・・・・・・導電性樹脂ペイント、１２・・・・・
・コーティング樹脂層。, 1... Conductor layer, 2... Through hole, 3...
...Printed circuit board, 4.8...Metal mask, 5...Resin paint%6,10...
...Mask hole, 7, 11...Stepped mask hole, 9...Conductive resin paint, 12...
・Coating resin layer.
Claims (1)
定箇所に透孔が設けられたプリント基板を有し、このプ
リント基板の導体回路網がない而に貴金属移行抑止作用
を有する樹脂ペイントを所定形状に印刷すると同時に上
記プリント基板の透孔に上記樹脂ペイントを立体的に印
刷し、」二記樹脂ペイントの印刷層を乾燥したのちに上
記プリント基板の導体回路網を有しない面に設けた上記
樹脂ペイントの印刷層上に導電性樹脂ペイントを所定形
状に印刷すると同時に上記樹脂ペイントの印刷層を有す
る上記プリント基板の透孔にＦ記導電性樹脂ペイントの
立体的な印刷を行ない、その後、上記導電性樹脂ペイン
トの印刷層を硬化させることを特徴とする印刷配線板の
製造方法。It has a printed circuit board with a conductor network of a predetermined shape on one side and through-holes at predetermined locations, and a resin paint having a precious metal migration inhibiting effect is applied in a predetermined shape without the conductor network of this printed circuit board. At the same time, the resin paint is three-dimensionally printed in the through holes of the printed circuit board, and after drying the printed layer of the resin paint, the resin is applied to the surface of the printed circuit board that does not have a conductive circuit network. Conductive resin paint is printed in a predetermined shape on the print layer of the paint, and at the same time, the conductive resin paint described in F is three-dimensionally printed in the through holes of the printed circuit board having the print layer of the resin paint, and then the conductive resin paint is 1. A method for manufacturing a printed wiring board, which comprises curing a printing layer of a polyurethane resin paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17608981A JPS5877287A (en) | 1981-11-02 | 1981-11-02 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17608981A JPS5877287A (en) | 1981-11-02 | 1981-11-02 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5877287A true JPS5877287A (en) | 1983-05-10 |
Family
ID=16007511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17608981A Pending JPS5877287A (en) | 1981-11-02 | 1981-11-02 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877287A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60208888A (en) * | 1984-04-03 | 1985-10-21 | カシオ計算機株式会社 | Method of producing flexible substrate |
| JPS6376395A (en) * | 1986-09-15 | 1988-04-06 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Method of applying solder paste |
-
1981
- 1981-11-02 JP JP17608981A patent/JPS5877287A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60208888A (en) * | 1984-04-03 | 1985-10-21 | カシオ計算機株式会社 | Method of producing flexible substrate |
| JPH0434320B2 (en) * | 1984-04-03 | 1992-06-05 | Casio Computer Co Ltd | |
| JPS6376395A (en) * | 1986-09-15 | 1988-04-06 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Method of applying solder paste |
| JPH048959B2 (en) * | 1986-09-15 | 1992-02-18 |
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