JPH0638439Y2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0638439Y2 JPH0638439Y2 JP5037689U JP5037689U JPH0638439Y2 JP H0638439 Y2 JPH0638439 Y2 JP H0638439Y2 JP 5037689 U JP5037689 U JP 5037689U JP 5037689 U JP5037689 U JP 5037689U JP H0638439 Y2 JPH0638439 Y2 JP H0638439Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil layer
- printed wiring
- wiring board
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は金属コア型のプリント配線板に関する。TECHNICAL FIELD The present invention relates to a metal core type printed wiring board.
金属コア型のプリント配線板の代表的な特徴は、熱放散
性である。A typical characteristic of the metal core type printed wiring board is heat dissipation.
従来の技術とその問題点 従来、プリント配線板の熱放散性の良化は、アルミニウ
ム薄板コアの適用によって図っているが、ICなど発熱の
大きい部品を搭載するパッケージで要求される熱放散性
には、なお十分ではない。Conventional technology and its problems Conventionally, the improvement of heat dissipation of printed wiring boards has been achieved by the application of aluminum thin plate cores, but the heat dissipation properties required for packages that mount large heat generating parts such as ICs have been improved. Is still not enough.
本考案の目的は、優れた熱放散性を有する金属コア型の
プリント配線板を提供するにある。An object of the present invention is to provide a metal core type printed wiring board having excellent heat dissipation.
問題点を解決するための手段 本考案の上記目的は、次の構成のプリント配線板によっ
て達成される。Means for Solving the Problems The above object of the present invention is achieved by a printed wiring board having the following configuration.
銅箔層によるコアが複数層、内部に備えられ、内面に金
属被膜を施した孔が複数個、これ等銅箔層コアに亘って
延び、該金属被膜により前記複数層の銅箔層コアが接続
され、最下側の銅箔層コアの下面が露出する裏面座刳り
部に当該最下側銅箔層コアに接続する金属被膜が施され
ているプリント配線板。A plurality of cores made of copper foil layers are provided inside, a plurality of holes provided with a metal coating on the inner surface thereof extend over the copper foil layer cores, and the plurality of copper foil layer cores are provided by the metal coating. A printed wiring board which is connected and has a metal coating for connecting to the lowermost copper foil layer core in a back surface facing portion where the lower surface of the lowermost copper foil layer core is exposed.
上記孔はブラインド型の方がよい。ブラインド型の孔
は、配線パターンに制約されずに、任意の個所に穿つこ
とができる。The holes are preferably blind type. The blind type hole can be formed at any place without being restricted by the wiring pattern.
作用 本考案においては、プリント配線板上のICなど搭載部品
からの熱は、該部品側の銅箔層コアと、該コアに複数個
の孔内面の金属被膜を通じ接続している他の銅箔層コア
とが、それ等コアの、プリント配線板端面に露出してい
る端から放散すると共に、プリント配線板裏面の座刳り
部に露出している最下側銅箔層コアの下面と、更に該座
刳り部の最下側銅箔層コアと接続する金属被膜とからも
熱を放散する。Function In the present invention, heat from a mounted component such as an IC on a printed wiring board is connected to a copper foil layer core on the component side and another copper foil connected to the core through a metal coating on the inner surface of a plurality of holes. The layer core and the lower surface of the lowermost copper foil layer core, which radiates from the end of the core exposed on the end surface of the printed wiring board and is exposed on the recessed portion on the back surface of the printed wiring board, and Heat is also dissipated from the lowermost copper foil layer core of the countersink and the metal coating connected thereto.
即ち本考案によれば、複数層の銅箔層コアで熱を拡散
し、それも銅箔層コアの上記座刳り部における露出、及
び当該銅箔層コアに接続する金属被膜で以て放熱面積を
拡大した形で熱放散を行うので、熱放散効果が極めて高
い。しかも、コアが銅であり、アルミニウムコアより熱
伝導率が良いし、また複数層の銅箔層コアが金属被膜で
接続されていて、コア間の熱伝播も良好である。このた
め考案では、ICなど発熱の大きい部品を搭載したパッケ
ージで要求されるオーダにも十分満足する優れた熱放散
性が得られる。That is, according to the present invention, heat is diffused by a plurality of copper foil layer cores, and it is also exposed at the counter-sink portion of the copper foil layer core and a heat dissipation area by a metal coating connected to the copper foil layer core. Since the heat is dissipated in an expanded form, the heat dissipation effect is extremely high. Moreover, the core is made of copper and has a better thermal conductivity than the aluminum core, and the copper foil layer cores of a plurality of layers are connected by the metal coating, and the heat transfer between the cores is also good. For this reason, the device of the present invention has an excellent heat dissipation property, which is sufficiently satisfied with the order required for a package in which a heat-generating component such as an IC is mounted.
本考案で各銅箔層コアを接続するのに、それ等コア間に
亘って延びる孔の内面に施した金属被膜による構成をと
っているのは、積層板の所要個所に孔を穿ち、該孔内面
にメッキにより金属被膜を施すことにより、銅箔層コア
の接続を基板製造上、簡潔に達成するのに寄与する。In the present invention, the copper foil layer cores are connected to each other by forming a metal coating on the inner surface of the holes extending between the cores. The plating of the metal film on the inner surface of the hole contributes to the simple connection of the copper foil layer core in the manufacture of the substrate.
考案の効果 上記の如く本考案によれば、優れた熱放散性を有する金
属コア型のプリント配線板を提供することができ、しか
もそのような好ましいプリント配線板を簡潔に得ること
ができるのである。Effects of the Invention According to the present invention as described above, it is possible to provide a metal core type printed wiring board having excellent heat dissipation, and it is possible to simply obtain such a preferable printed wiring board. .
実施例 次に本考案の実施例を添付図面を参照して説明する。Embodiments Next, embodiments of the present invention will be described with reference to the accompanying drawings.
銅箔層によるコア（１）を複数層、積層板（２）の内部
に常法に従い存在させる。これ等銅箔層コア（１）は、
その端が積層板（２）の端面に露出している。各銅箔層
コア（１）は、これ等銅箔層コア（１）に亘る孔、好ま
しくはブラインド型の孔を積層板（２）の所々に穿ち、
該孔の内面にメッキにより金属被膜を施して、接続す
る。図で（３）が孔、（４）が金属被膜である。A plurality of cores (1) made of copper foil layers are made to exist inside the laminate (2) according to a conventional method. These copper foil layer cores (1) are
The end is exposed on the end face of the laminate (2). Each of the copper foil layer cores (1) has holes, preferably blind type holes, formed in the laminated plate (2) in some places over the copper foil layer cores (1),
The inner surface of the hole is plated with a metal film for connection. In the figure, (3) is a hole and (4) is a metal coating.
最下側の銅箔層コア（１）は、その下面が裏面座刳り部
（8-1）に露出している。該座刳り部（8-1）には、最下
側の銅箔層コア（１）に接続する金属被膜（９）をメッ
キにより施す。ICなど実装部品を搭載するための凹窪部
である表面座刳り部（8-2）には、最上側の銅箔層コア
（１）の上面が露出している。The lower surface of the lowermost copper foil layer core (1) is exposed at the back surface counterbore (8-1). The recessed portion (8-1) is plated with a metal coating (9) connected to the lowermost copper foil layer core (1). The upper surface of the uppermost copper foil layer core (1) is exposed in the surface recess (8-2) which is a recessed portion for mounting a mounting component such as an IC.
なお、図で（５）は樹脂層、（６）はパターン、（７）
はスルーホールを示している。In the figure, (5) is a resin layer, (6) is a pattern, and (7)
Indicates a through hole.
第１図は本考案の一実施例を示す表面図、第２図はその
裏面図、第３図は第１、２図のプリント配線板の縦断面
図である。 （１）……銅箔層によるコア （２）……積層板 （３）……孔 （４），（９）……金属被膜 （５）……樹脂層 （６）パターン （７）……スルーホール （8-1）……裏面座刳り部 （8-2）……表面座刳り部FIG. 1 is a front view showing an embodiment of the present invention, FIG. 2 is a back view thereof, and FIG. 3 is a vertical sectional view of the printed wiring board of FIGS. (1) …… Core with copper foil layer (2) …… Laminate (3) …… Hole (4), (9) …… Metal coating (5) …… Resin layer (6) Pattern (7) …… Through hole (8-1) …… Back surface recessed part (8-2) …… Surface recessed part
Claims (2)
れ、内面に金属被膜を施した孔が複数個、これ等銅箔層
コアに亘って延び、該金属被膜により前記複数層の銅箔
層コアが接続され、最下側の銅箔層コアの下面が露出す
る裏面座刳り部に当該最下側銅箔層コアに接続する金属
被膜が施されているプリント配線板。1. A plurality of cores made of a copper foil layer are provided inside, a plurality of holes having a metal coating on the inner surface thereof extend over the copper foil layer core, and the plurality of layers are provided by the metal coating. A printed wiring board to which a copper foil layer core is connected, and a metal coating for connecting to the lowermost copper foil layer core is applied to a back face recessed portion where the lower surface of the lowermost copper foil layer core is exposed.
リント配線板。2. The printed wiring board according to claim 1, wherein the holes are blind type.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5037689U JPH0638439Y2 (en) | 1989-04-28 | 1989-04-28 | Printed wiring board |
| US07/509,833 US5045642A (en) | 1989-04-20 | 1990-04-17 | Printed wiring boards with superposed copper foils cores |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5037689U JPH0638439Y2 (en) | 1989-04-28 | 1989-04-28 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0356169U JPH0356169U (en) | 1991-05-30 |
| JPH0638439Y2 true JPH0638439Y2 (en) | 1994-10-05 |
Family
ID=31568869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5037689U Expired - Lifetime JPH0638439Y2 (en) | 1989-04-20 | 1989-04-28 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638439Y2 (en) |
-
1989
- 1989-04-28 JP JP5037689U patent/JPH0638439Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356169U (en) | 1991-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0638439Y2 (en) | Printed wiring board | |
| JPH0499051A (en) | Film carrier mounting structure | |
| JPS5932191A (en) | Printed circuit board and method of producing same | |
| JPH0750816B2 (en) | Printed wiring board and manufacturing method thereof | |
| JPS6239039A (en) | Chip carrier for electronic device | |
| JPH07321471A (en) | Multilayer board | |
| JPH065994A (en) | Multilayer printed wiring board | |
| JPH02278894A (en) | Printed circuit board | |
| JPS6022889U (en) | multilayer printed wiring board | |
| JPS5843596A (en) | Printed circuit board | |
| CN217088245U (en) | Heat radiation substrate | |
| JPS63292660A (en) | Multilayered printed wiring substrate | |
| JPS624877B2 (en) | ||
| JPH01290279A (en) | Wiring board and manufacture thereof | |
| JPH06120628A (en) | Metallic base board | |
| JPH03204996A (en) | Metal base multilayer circuit board | |
| JPH0494193A (en) | Hybrid integrated circuit device | |
| JPH04133394A (en) | Multilayer printed circuit board | |
| JP2524733Y2 (en) | Semiconductor device | |
| JPS6265395A (en) | Printed circuit board | |
| JPS6218075Y2 (en) | ||
| JPH0651009Y2 (en) | Multi-layer wiring device | |
| JPH08775Y2 (en) | Printed wiring board with heat sink | |
| JPS62114251A (en) | Manufacture of chip carrier for electronic element | |
| JPH0722727A (en) | Substrate for mounting electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |