JPS577135A - Wire bonding apparatus - Google Patents
Wire bonding apparatusInfo
- Publication number
- JPS577135A JPS577135A JP8180180A JP8180180A JPS577135A JP S577135 A JPS577135 A JP S577135A JP 8180180 A JP8180180 A JP 8180180A JP 8180180 A JP8180180 A JP 8180180A JP S577135 A JPS577135 A JP S577135A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- clamping mechanism
- sample stand
- stand
- sent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
PURPOSE:To accomplish fully automatic bonding work smoothly with an easier positional detection of the reference point by placing work at a given position on a sample stand with a clamping mechanism as sent to a bonding work station. CONSTITUTION:For example, a ceramic package 1 produced by die bonding pellets 2 is sent to a bonding work station on a belt 5. A sample stand 7 is lifted slightly and, for example, a clamping mechanism 12 provided diagonally thereto is actuated to grasp it at a given position, where the package 1 is sucked by vaccum on the sample stand 7. Subsequently, after the release of the clamping mechanism, the stand 7 is lifted to the working position, where a wire bonding is performed floowing a positional correction based on the pattern information on the pad position and the like. This can keep the reference point wherein the view of the photographing system thereby assuring a smooth bonding under full automation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8180180A JPS577135A (en) | 1980-06-16 | 1980-06-16 | Wire bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8180180A JPS577135A (en) | 1980-06-16 | 1980-06-16 | Wire bonding apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS577135A true JPS577135A (en) | 1982-01-14 |
JPS6117137B2 JPS6117137B2 (en) | 1986-05-06 |
Family
ID=13756583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8180180A Granted JPS577135A (en) | 1980-06-16 | 1980-06-16 | Wire bonding apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS577135A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57186033U (en) * | 1981-05-20 | 1982-11-26 | ||
JPS62107450U (en) * | 1985-12-26 | 1987-07-09 | ||
US5504646A (en) * | 1989-10-13 | 1996-04-02 | Hitachi, Ltd. | Magnetic disk including protective layer having surface with protusions and magnetic disk apparatus including the magnetic disk |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH057459Y2 (en) * | 1986-12-15 | 1993-02-25 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924070A (en) * | 1972-06-26 | 1974-03-04 | ||
JPS5242666A (en) * | 1975-09-30 | 1977-04-02 | Matsushita Electric Works Ltd | Device for lighting discharge lamp of high frequency |
JPS5360572A (en) * | 1976-11-12 | 1978-05-31 | Shinkawa Ltd | Ultrasonic wire bonding device |
-
1980
- 1980-06-16 JP JP8180180A patent/JPS577135A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4924070A (en) * | 1972-06-26 | 1974-03-04 | ||
JPS5242666A (en) * | 1975-09-30 | 1977-04-02 | Matsushita Electric Works Ltd | Device for lighting discharge lamp of high frequency |
JPS5360572A (en) * | 1976-11-12 | 1978-05-31 | Shinkawa Ltd | Ultrasonic wire bonding device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57186033U (en) * | 1981-05-20 | 1982-11-26 | ||
JPS626687Y2 (en) * | 1981-05-20 | 1987-02-16 | ||
JPS62107450U (en) * | 1985-12-26 | 1987-07-09 | ||
JPH0230839Y2 (en) * | 1985-12-26 | 1990-08-20 | ||
US5504646A (en) * | 1989-10-13 | 1996-04-02 | Hitachi, Ltd. | Magnetic disk including protective layer having surface with protusions and magnetic disk apparatus including the magnetic disk |
US5930073A (en) * | 1989-10-13 | 1999-07-27 | Hitachi, Ltd. | Magnetic disk including protective layer having surface with magnetic disk including protrusions, and magnetic disk apparatus including the magnetic disk |
US6303205B1 (en) | 1989-10-13 | 2001-10-16 | Hitachi, Ltd. | Magnetic disk including protective layer having surface with protrusions, and substrate therefor |
Also Published As
Publication number | Publication date |
---|---|
JPS6117137B2 (en) | 1986-05-06 |
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