TW282557B - A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill - Google Patents
A non-destructive testing way and device for the junction lead of the grain tab automated bonding skillInfo
- Publication number
- TW282557B TW282557B TW81110475A TW81110475A TW282557B TW 282557 B TW282557 B TW 282557B TW 81110475 A TW81110475 A TW 81110475A TW 81110475 A TW81110475 A TW 81110475A TW 282557 B TW282557 B TW 282557B
- Authority
- TW
- Taiwan
- Prior art keywords
- junction
- lead
- grain
- automated bonding
- destructive testing
- Prior art date
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill which is used to juncture the junction of each IC grain to complete the inner lead junction, and it includes; 1. Placing the completed inner junction lead tape and the attached grain on the (X-Y) work bench. 2. Driving the (X-Y) work bench to enforce the inner junction lead to aim at the testing position by taking a certain control system. 3. Pressing the inner lead with a certain preset power which aims at the lead to drive a certain testing head to break the junction lead whose stetted power is less than the junction power . 4. Repeating step 2 & 3 on the junction lead around the IC grain.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW81110475A TW282557B (en) | 1992-12-28 | 1992-12-28 | A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW81110475A TW282557B (en) | 1992-12-28 | 1992-12-28 | A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill |
Publications (1)
Publication Number | Publication Date |
---|---|
TW282557B true TW282557B (en) | 1996-08-01 |
Family
ID=51397709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW81110475A TW282557B (en) | 1992-12-28 | 1992-12-28 | A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW282557B (en) |
-
1992
- 1992-12-28 TW TW81110475A patent/TW282557B/en not_active IP Right Cessation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |