TW282557B - A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill - Google Patents

A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill

Info

Publication number
TW282557B
TW282557B TW81110475A TW81110475A TW282557B TW 282557 B TW282557 B TW 282557B TW 81110475 A TW81110475 A TW 81110475A TW 81110475 A TW81110475 A TW 81110475A TW 282557 B TW282557 B TW 282557B
Authority
TW
Taiwan
Prior art keywords
junction
lead
grain
automated bonding
destructive testing
Prior art date
Application number
TW81110475A
Other languages
Chinese (zh)
Inventor
Dyi-Chyun Hwu
Jenn-Hwang Jeng
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW81110475A priority Critical patent/TW282557B/en
Application granted granted Critical
Publication of TW282557B publication Critical patent/TW282557B/en

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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill which is used to juncture the junction of each IC grain to complete the inner lead junction, and it includes; 1. Placing the completed inner junction lead tape and the attached grain on the (X-Y) work bench. 2. Driving the (X-Y) work bench to enforce the inner junction lead to aim at the testing position by taking a certain control system. 3. Pressing the inner lead with a certain preset power which aims at the lead to drive a certain testing head to break the junction lead whose stetted power is less than the junction power . 4. Repeating step 2 & 3 on the junction lead around the IC grain.
TW81110475A 1992-12-28 1992-12-28 A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill TW282557B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW81110475A TW282557B (en) 1992-12-28 1992-12-28 A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW81110475A TW282557B (en) 1992-12-28 1992-12-28 A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill

Publications (1)

Publication Number Publication Date
TW282557B true TW282557B (en) 1996-08-01

Family

ID=51397709

Family Applications (1)

Application Number Title Priority Date Filing Date
TW81110475A TW282557B (en) 1992-12-28 1992-12-28 A non-destructive testing way and device for the junction lead of the grain tab automated bonding skill

Country Status (1)

Country Link
TW (1) TW282557B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees