JPS5410670A - Bonding method of semiconductor chips - Google Patents

Bonding method of semiconductor chips

Info

Publication number
JPS5410670A
JPS5410670A JP7548377A JP7548377A JPS5410670A JP S5410670 A JPS5410670 A JP S5410670A JP 7548377 A JP7548377 A JP 7548377A JP 7548377 A JP7548377 A JP 7548377A JP S5410670 A JPS5410670 A JP S5410670A
Authority
JP
Japan
Prior art keywords
semiconductor chips
bonding method
chips
table surface
intermediate table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7548377A
Other languages
Japanese (ja)
Inventor
Shiyouichi Ogata
Hiroshi Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7548377A priority Critical patent/JPS5410670A/en
Publication of JPS5410670A publication Critical patent/JPS5410670A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To advantageously perform the position-alignment operation of chips in an intermediate table in place of manual work by automatically aligning the positions of the chips on table surface after dropping the chips onto the intermediate table surface from a collet.
COPYRIGHT: (C)1979,JPO&Japio
JP7548377A 1977-06-27 1977-06-27 Bonding method of semiconductor chips Pending JPS5410670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7548377A JPS5410670A (en) 1977-06-27 1977-06-27 Bonding method of semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7548377A JPS5410670A (en) 1977-06-27 1977-06-27 Bonding method of semiconductor chips

Publications (1)

Publication Number Publication Date
JPS5410670A true JPS5410670A (en) 1979-01-26

Family

ID=13577569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7548377A Pending JPS5410670A (en) 1977-06-27 1977-06-27 Bonding method of semiconductor chips

Country Status (1)

Country Link
JP (1) JPS5410670A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02216252A (en) * 1989-02-15 1990-08-29 Yuri Roll Kk Dry-type porous nonwoven fabric, production thereof and machine therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02216252A (en) * 1989-02-15 1990-08-29 Yuri Roll Kk Dry-type porous nonwoven fabric, production thereof and machine therefor

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