JPS5596644A - Method of bonding semiconductor device - Google Patents

Method of bonding semiconductor device

Info

Publication number
JPS5596644A
JPS5596644A JP362679A JP362679A JPS5596644A JP S5596644 A JPS5596644 A JP S5596644A JP 362679 A JP362679 A JP 362679A JP 362679 A JP362679 A JP 362679A JP S5596644 A JPS5596644 A JP S5596644A
Authority
JP
Japan
Prior art keywords
tool
semiconductor device
pawls
arrow
designated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP362679A
Other languages
Japanese (ja)
Inventor
Susumu Sato
Hiroshi Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP362679A priority Critical patent/JPS5596644A/en
Publication of JPS5596644A publication Critical patent/JPS5596644A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To execute a bonding work by entirely eliminating the respective positioning works for respective lead frames regardless of the perforating pitch error and film elongation.
CONSTITUTION: Pawls 19 are initially located at the position 22, lowered to insert into an aperture 13', and moved as designated by an arrow b to the position 20 for positioning. Then, the pawls 19 are raised as designated by an arrow c from the aperture 13' to be thus returned to the position 22 as designated by an arrow d to thus wait for next lead frame feed signal. In this state the bonding tool 8, the lead frame 15, and the semiconductor device can be confirmed for positioning. When they are displaced, the pawls 19 or the tool 8 is aligned and fixed. Then, the tool 8 is lowered to bond the lead wire to the electrode terminal. The semiconductor device is separated from the adhered substrate, and the tool 8 is simultaneously raised to the original position. Then the next semiconductor device is supplied under the tool 8 in high accuracy. Thus, the lead wire can be accurately positioned at its feeding position.
COPYRIGHT: (C)1980,JPO&Japio
JP362679A 1979-01-16 1979-01-16 Method of bonding semiconductor device Pending JPS5596644A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP362679A JPS5596644A (en) 1979-01-16 1979-01-16 Method of bonding semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP362679A JPS5596644A (en) 1979-01-16 1979-01-16 Method of bonding semiconductor device

Publications (1)

Publication Number Publication Date
JPS5596644A true JPS5596644A (en) 1980-07-23

Family

ID=11562698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP362679A Pending JPS5596644A (en) 1979-01-16 1979-01-16 Method of bonding semiconductor device

Country Status (1)

Country Link
JP (1) JPS5596644A (en)

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