JPS626687Y2 - - Google Patents
Info
- Publication number
- JPS626687Y2 JPS626687Y2 JP1981072922U JP7292281U JPS626687Y2 JP S626687 Y2 JPS626687 Y2 JP S626687Y2 JP 1981072922 U JP1981072922 U JP 1981072922U JP 7292281 U JP7292281 U JP 7292281U JP S626687 Y2 JPS626687 Y2 JP S626687Y2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- positioning
- carrier
- claw
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000000078 claw Anatomy 0.000 claims description 17
- 238000010586 diagram Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Description
【考案の詳細な説明】
本考案はキヤリアに載置された試料をワイヤボ
ンデイング位置へキヤリア毎に間欠的に移送位置
決めしてワイヤボンデイングを行う試料位置決め
機構の改良に関するものである。[Detailed Description of the Invention] The present invention relates to an improvement in a sample positioning mechanism that performs wire bonding by intermittently transferring and positioning a sample placed on a carrier to a wire bonding position for each carrier.
一般に、キヤリアに載置された試料は第１図に
示すマガジンに収納されている。マガジン１０に
は等間隔に相対向して長手方向にコ字状の横溝１
０ａが設けられており、この横溝１０ａに試料１
１が載置されたキヤリア１２が挿入される。そし
て、キヤリア１２は送り手段によりローダ部のマ
ガジン１０よりボンデイング位置に送られ、試料
１１にワイヤボンデイングが行われた後にアンロ
ーダ部のマガジンに収納される。 Generally, a sample placed on a carrier is stored in a magazine shown in FIG. The magazine 10 has U-shaped horizontal grooves 1 in the longitudinal direction facing each other at equal intervals.
0a is provided, and the sample 1 is placed in this horizontal groove 10a.
1 is placed on the carrier 12 is inserted. Then, the carrier 12 is sent from the magazine 10 of the loader section to the bonding position by the feeding means, and after wire bonding is performed on the sample 11, it is stored in the magazine of the unloader section.
ところで、試料にワイヤボンデイングを施すた
めには、その試料の位置決めをするために高い精
度を必要とする。しかるに、従来はキヤリア１２
を位置決めし、しかる後にキヤリア１２に載置し
た状態で試料１１の位置決めを行つているので、
キヤリア１２をボンデイング位置に移送する送り
機構の誤差等によつて停止位置が悪かつたり、位
置決め精度が悪いという欠点があつた。またキヤ
リア１２を製造する加工精度を超精密に加工しな
ければならないので、試料１１が高精度に位置決
めできないという欠点があつた。 By the way, in order to perform wire bonding on a sample, high accuracy is required for positioning the sample. However, previously, Carrier 12
, and then positioning the sample 11 while it is placed on the carrier 12.
There have been disadvantages in that the carrier 12 may be stopped at an incorrect position due to errors in the feeding mechanism that transports it to the bonding position, and the positioning accuracy is poor. Furthermore, since the carrier 12 must be manufactured with ultra-precise processing, there is a drawback that the sample 11 cannot be positioned with high precision.
本考案は上記従来技術の欠点に鑑みなされたも
ので、高精度に位置決めできる試料位置決め機構
を提供することを目的とする。 The present invention was devised in view of the drawbacks of the prior art described above, and an object of the present invention is to provide a sample positioning mechanism capable of positioning with high precision.
以下、本考案を図示の実施例により説明する。 Hereinafter, the present invention will be explained with reference to illustrated embodiments.
第２図は本考案になる試料位置決め機構の一実
施例を示す平面図、第３図は第２図の３−３線断
面図である。２０は試料１１を載置したキヤリア
１２を供給するローダー部で、第１図に示すよう
に試料１１を載置したキヤリア１２を収納したマ
ガジン１０が載置される。２１は試料１１を載置
したキヤリア１２をボンデイング位置２２に図示
しない送り手段によつて間欠的に送るキヤリアガ
イドで、相対向する内側面にキヤリア１２をガイ
ドするガイド溝２１ａが形成されている。２３は
ボンデイング装置のホーンで、先端にはワイヤ
（図示せず）を保持するボンデイングツール２４
が取付けられている。２５はボンデイングが終了
した試料を収納するアンローダー部で、第１図に
示す空のマガジン１０が載置されている。 FIG. 2 is a plan view showing an embodiment of the sample positioning mechanism according to the present invention, and FIG. 3 is a sectional view taken along the line 3--3 in FIG. Reference numeral 20 denotes a loader section that supplies a carrier 12 on which the sample 11 is placed, and as shown in FIG. 1, a magazine 10 containing the carrier 12 on which the sample 11 is placed is placed. Reference numeral 21 denotes a carrier guide for intermittently feeding the carrier 12 carrying the sample 11 to the bonding position 22 by a feeding means (not shown). Guide grooves 21a for guiding the carrier 12 are formed on opposing inner surfaces. 23 is a horn of a bonding device, and a bonding tool 24 that holds a wire (not shown) at the tip
is installed. Reference numeral 25 denotes an unloader section for storing the sample after bonding, on which the empty magazine 10 shown in FIG. 1 is placed.
３０は試料１１の下面を真空吸着する試料吸着
具で、上下動可能にボンデイング位置２２の下方
に配設されている。３１，３２はボンデイング位
置２２に位置する試料１１を挟持するようにして
位置決めする２個１対の第１及び第２位置決め爪
で、相対向する挟持面はＶ字状に形成されてい
る。３３，３４はそれぞれ案内棒で、一方の案内
棒３３は前記一方の位置決め爪３１にピン３５で
固定されると共に、前記他方の位置決め爪３２に
スライド可能に嵌挿され、他方の案内棒３４は前
記他方の位置決め爪３２にピン３６で固定される
と共に、前記一方の位置決め爪３１にスライド可
能に嵌挿されている。３７は前記案内棒３３，３
４の一端にそれぞれ植設されたピン３８，３９が
それぞれ摺動自在に嵌挿されるＵ字状溝３７ａが
形成されたＴ字状リンクで、ホルダー４０に固定
した支点軸４１に回動自在に取付けられている。
４２はＴ字状リンク３７に回動自在に取付けられ
たユニボールで、ジヨイント４３を介して図示し
ないカム駆動装置に接続されている。 Reference numeral 30 denotes a sample suction tool for vacuum suctioning the lower surface of the sample 11, and is disposed below the bonding position 22 so as to be movable up and down. Reference numerals 31 and 32 denote a pair of first and second positioning claws that sandwich and position the sample 11 located at the bonding position 22, and the opposing clamping surfaces are formed in a V-shape. Reference numerals 33 and 34 each indicate guide rods, one guide rod 33 is fixed to the one positioning claw 31 with a pin 35, and is slidably inserted into the other positioning claw 32, and the other guide rod 34 is It is fixed to the other positioning claw 32 with a pin 36, and is slidably fitted into the one positioning claw 31. 37 is the guide rod 33, 3
It is a T-shaped link in which a U-shaped groove 37a is formed into which pins 38 and 39 implanted at one end of the holder 40 are slidably inserted, and the link is rotatable about a fulcrum shaft 41 fixed to a holder 40. installed.
A uniball 42 is rotatably attached to the T-shaped link 37, and is connected to a cam drive device (not shown) via a joint 43.
次に本機構の作動を第４図を参照して説明す
る。始動前は、第４図ａに示すように試料吸着具
３０は下降した位置に、また２個の位置決め爪３
１，３２は互いに広く離れた状態にある。キヤリ
ア１２に載置された試料１１がボンデイング位置
２２へ送られてくると、第４図ａの状態より第４
図ｂに示すように試料吸着具３０が上昇して試料
１１を吸着し、試料１１をキヤリア１２よりボン
デイングする高さまで持ち上げて停止する。次に
ジヨイント４３が矢印Ａ方向に移動し、Ｔ字状リ
ンク３７のが支点軸４１を支点として矢印Ｂ方向
に回動する。これにより、案内棒３３，３４がそ
れぞれ逆のＣ，Ｄ方向に移動し、位置決め爪３
１，３２が相対向する方向に移動して試料１０を
挟持し、試料１１を位置決めする。 Next, the operation of this mechanism will be explained with reference to FIG. Before starting, the sample suction tool 30 is in the lowered position as shown in FIG. 4a, and the two positioning claws 3
1 and 32 are widely separated from each other. When the sample 11 placed on the carrier 12 is sent to the bonding position 22, it changes from the state shown in FIG.
As shown in FIG. b, the sample suction tool 30 rises to suction the sample 11, lifts the sample 11 from the carrier 12 to a height for bonding, and then stops. Next, the joint 43 moves in the direction of arrow A, and the T-shaped link 37 rotates in the direction of arrow B about the fulcrum shaft 41. As a result, the guide rods 33 and 34 move in the opposite directions C and D, respectively, and the positioning claw 3
1 and 32 move in opposite directions to sandwich the sample 10 and position the sample 11.
ジヨイント４３は前記と逆方向に移動し、位置
決め爪３１，３２は試料１１より離れる。その
後、この状態でツール２４が図示しない駆動機構
で移動して試料１１にワイヤボンデイングを行
う。ボンデイング終了後、試料吸着具３０は第４
図ｃに示すように下降するが、下降途中に真空が
切れて試料１１をキヤリア１２に残して下降す
る。そして、キヤリア１２は第４図ｄに示すよう
に１ピツチ送られ、次の試料１１がボンデイング
位置２２に送られてくる。このような動作を順次
繰返してキヤリア１２上の全ての試料１１のボン
デイングが完了すると、キヤリア１２はアンロー
ダー部２４に収納される。 The joint 43 moves in the opposite direction, and the positioning claws 31 and 32 move away from the sample 11. Thereafter, in this state, the tool 24 is moved by a drive mechanism (not shown) to perform wire bonding on the sample 11. After the bonding is completed, the sample suction tool 30
It descends as shown in Figure c, but the vacuum breaks during the descent, leaving the sample 11 in the carrier 12 and descending. Then, the carrier 12 is fed one pitch as shown in FIG. 4d, and the next sample 11 is fed to the bonding position 22. When bonding of all the samples 11 on the carrier 12 is completed by sequentially repeating such operations, the carrier 12 is stored in the unloader section 24.
このように、試料１１は試料吸着具３０によつ
てキヤリア１２より持ち上げられ、その後Ｖ又は
逆Ｖ字状の２個の位置決め爪３１，３２に挟持さ
れて位置決めされるので、高精度に位置決めされ
る。 In this way, the sample 11 is lifted from the carrier 12 by the sample suction tool 30, and then positioned by being held between the two positioning claws 31 and 32 in the shape of a V or inverted V, so that it can be positioned with high precision. Ru.
第５図は本考案の他の実施例を示す。本実施例
は位置決め爪３１，３２が山形（逆Ｖ）状をな
し、また試料１１の位置決め方向が異なるのみ
で、前記実施例と全く同じ構成よりなるので、特
別説明しなくても容易に理解される。 FIG. 5 shows another embodiment of the invention. This embodiment has exactly the same structure as the previous embodiment, except that the positioning claws 31 and 32 are in the shape of a chevron (inverted V), and the positioning direction of the sample 11 is different, so it can be easily understood without any special explanation. be done.
以上の説明から明らかな如く、本考案になる試
料位置決め機構によれば、高精度に位置決めされ
るので、ボンダビリテイーの向上が図れる。 As is clear from the above description, according to the sample positioning mechanism of the present invention, positioning is performed with high precision, and therefore bondability can be improved.
第１図はマガジンの斜視図、第２図は本考案に
なる試料位置決め機構の一実施例を示す平面図、
第３図は第２図の３−３線断面図、第４図ａ〜ｄ
は動作説明図、第５図は本考案になる試料位置決
め機構の他の実施例を示す平面図である。
１１……試料、１２……キヤリア、３０……試
料吸着具、３１，３２……位置決め爪。
FIG. 1 is a perspective view of the magazine, and FIG. 2 is a plan view showing an embodiment of the sample positioning mechanism according to the present invention.
Figure 3 is a sectional view taken along line 3-3 in Figure 2, Figures 4 a to d
5 is an explanatory diagram of the operation, and FIG. 5 is a plan view showing another embodiment of the sample positioning mechanism according to the present invention. 11... Sample, 12... Carrier, 30... Sample suction tool, 31, 32... Positioning claw.
Claims (1)
グ位置へキヤリア毎に間欠的に移送位置決めして
ワイヤボンデイングを行う試料位置決め機構にお
いて、試料を真空吸着して前記キヤリアより垂直
に持ち上げる上下動可能な試料吸着具と、前記キ
ヤリアより持ち上げられた試料を挟持して位置決
めする２個の第１及び第２位置決め爪と、平行に
配設され、一方が前記第１位置決め爪に固定され
ると共に、前記第２位置決め爪にスライド可能に
嵌挿され、他方が前記第２位置決め爪に固定され
ると共に、前記第１位置決め爪にスライド可能に
嵌挿された２個の案内棒と、この２個の案内棒を
同時に相反方向に駆動する駆動手段とよりなる試
料位置決め機構。 In a sample positioning mechanism that performs wire bonding by intermittently transferring and positioning a sample placed on a carrier to a wire bonding position for each carrier, a vertically movable sample suction tool that vacuum suctions a sample and lifts it vertically from the carrier. and two first and second positioning claws that sandwich and position the sample lifted from the carrier, and are arranged in parallel, one of which is fixed to the first positioning claw, and one of which is fixed to the second positioning claw. two guide rods, one of which is slidably fitted into the claw, the other of which is fixed to the second positioning claw, and which is slidably fitted into the first positioning claw; A sample positioning mechanism consisting of drive means that drive in opposite directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981072922U JPS626687Y2 (en) | 1981-05-20 | 1981-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981072922U JPS626687Y2 (en) | 1981-05-20 | 1981-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57186033U JPS57186033U (en) | 1982-11-26 |
| JPS626687Y2 true JPS626687Y2 (en) | 1987-02-16 |
Family
ID=29868708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981072922U Expired JPS626687Y2 (en) | 1981-05-20 | 1981-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS626687Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0230839Y2 (en) * | 1985-12-26 | 1990-08-20 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577135A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Wire bonding apparatus |
-
1981
- 1981-05-20 JP JP1981072922U patent/JPS626687Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577135A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57186033U (en) | 1982-11-26 |
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