JPS55162237A - Pellet bonding device - Google Patents

Pellet bonding device

Info

Publication number
JPS55162237A
JPS55162237A JP6894879A JP6894879A JPS55162237A JP S55162237 A JPS55162237 A JP S55162237A JP 6894879 A JP6894879 A JP 6894879A JP 6894879 A JP6894879 A JP 6894879A JP S55162237 A JPS55162237 A JP S55162237A
Authority
JP
Japan
Prior art keywords
pellet
lead frame
subsequently
pellets
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6894879A
Other languages
Japanese (ja)
Inventor
Masaru Miyashita
Osamu Yamaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6894879A priority Critical patent/JPS55162237A/en
Publication of JPS55162237A publication Critical patent/JPS55162237A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To simplify the maintenance by the method wherein an intermittently transported lead frame and pellets are sent onto an oblong table, each pellet is prefixed on the lead by using No.1 and No.2 bonding mechanisms, and subsequently this is finally fixed by detecting its position. CONSTITUTION:Lead frame 3 is transported on oblong table 4 from one side intermittently, and pellet supply table 8 provided on one side of table 4 corresponding to the stop position of lead frame 3 is also moved. On this table 8 is mounted enclosing jig 9 enclosing aligned pellets 1. By sliding collet 2 of No.1 bonding mechanism 7 provided on the upper stream side of table 4, one pellet 1 is pulled and placed on frame 3 and it is prefitted. Subsequently, the condition of the prefitting is checked by means of position detecting camera 20 of No.2 bonding mechanism 15 provided on the lower stream side, and it is finally fixed in a similar manner by using collet 2. At this time, each operation is done by pulse motors 13 and 17.
JP6894879A 1979-06-04 1979-06-04 Pellet bonding device Pending JPS55162237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6894879A JPS55162237A (en) 1979-06-04 1979-06-04 Pellet bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6894879A JPS55162237A (en) 1979-06-04 1979-06-04 Pellet bonding device

Publications (1)

Publication Number Publication Date
JPS55162237A true JPS55162237A (en) 1980-12-17

Family

ID=13388387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6894879A Pending JPS55162237A (en) 1979-06-04 1979-06-04 Pellet bonding device

Country Status (1)

Country Link
JP (1) JPS55162237A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896739A (en) * 1981-12-04 1983-06-08 Toshiba Seiki Kk Hybrid bonding method of semiconductor pellet

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