JPS6421936A - Inspection of semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To obtain a marking method, in which position adjustment is simple and ink is not used, by forming a heat sensitive resin layer on the surface of a semiconductor integrated circuit wafer, emitting heat rays from a heat ray emitter when the result of inspection is judged to be failure, and discoloring the heat sensitive resin layer. CONSTITUTION:A heat sensitive resin layer 8 is formed on the surface of a semiconductor integrated circuit wafer 1. A heat ray emitter 9 is provided in close proximity 5 / to the surface of the wafer 1. The electric characteristics of the semiconductor integrated circuit, which is formed on the wafer 1, are measured. When the failure is judged, heat rays are emitted from the heat ray emitter 9, and the heat sensitive resin layer 8 is discolored. The failure is recognized by the presence or absence of the discolored part. For example, an IC probe 2 of an IC tester is applied on the circuit of the semiconductor integrated circuit chip, on which the heat sensitive resin layer 8 is formed, and the electric characteristics of the circuit are measured with the IC tester. When the failure is recognized as a result of measurement, the heat rays are emitted from the heat ray emitter 9. Then, the part, on which the heat rays are projected, is discolored on the heat sensitive resin layer 8, and a mark 8a is formed. Thereafter, the wafer undergoes dicing. Then disqualified products are removed with the mark 8a as a reference.