JPS5718334A - Ic chip testing apparatus - Google Patents

Ic chip testing apparatus

Info

Publication number
JPS5718334A
JPS5718334A JP9324580A JP9324580A JPS5718334A JP S5718334 A JPS5718334 A JP S5718334A JP 9324580 A JP9324580 A JP 9324580A JP 9324580 A JP9324580 A JP 9324580A JP S5718334 A JPS5718334 A JP S5718334A
Authority
JP
Japan
Prior art keywords
chip
testing apparatus
terminal
strip line
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9324580A
Other languages
Japanese (ja)
Other versions
JPS6114659B2 (en
Inventor
Isamu Odaka
Katsuhiko Aoki
Yasuo Tazo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP9324580A priority Critical patent/JPS5718334A/en
Publication of JPS5718334A publication Critical patent/JPS5718334A/en
Publication of JPS6114659B2 publication Critical patent/JPS6114659B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

PURPOSE:To achieve a high density inspection of an IC chip without damage to the terminal thereof by compressing an IC chip testing apparatus on the chip with a strip line projecting inside a hole made in the center of a testing substrate. CONSTITUTION:A window-shaped hole 10 is formed in the center of a testing substrate 8 with a compressing jig 12. A cushion material 13 is applied on a surface to be pressed by the jig inside the hole while a strip line 9 is formed on one surface of the substrate 8 extending outward radially. The IC chip testing apparatus thus formed is compressed on a chip 5 to be tested with a terminal 6 to perform inspection. This can reduce damage inflicting on the terminal of the chip while affording a high density probing with the use of the strip line.
JP9324580A 1980-07-10 1980-07-10 Ic chip testing apparatus Granted JPS5718334A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9324580A JPS5718334A (en) 1980-07-10 1980-07-10 Ic chip testing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9324580A JPS5718334A (en) 1980-07-10 1980-07-10 Ic chip testing apparatus

Publications (2)

Publication Number Publication Date
JPS5718334A true JPS5718334A (en) 1982-01-30
JPS6114659B2 JPS6114659B2 (en) 1986-04-19

Family

ID=14077117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9324580A Granted JPS5718334A (en) 1980-07-10 1980-07-10 Ic chip testing apparatus

Country Status (1)

Country Link
JP (1) JPS5718334A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260861A (en) * 1984-06-08 1985-12-24 Hitachi Ltd Probe
JPS62151772A (en) * 1985-12-20 1987-07-06 フィリップス　エレクトロニクス　ネムローゼ　フェンノートシャップ Test apparatus for high-frequency integrated circuit
JPS62163984A (en) * 1985-12-20 1987-07-20 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Inspection device
US5491891A (en) * 1993-03-25 1996-02-20 Probes Associates, Inc. Method of making a test probe ring
JP2003084010A (en) * 2001-09-13 2003-03-19 Mitsubishi Electric Corp High frequency probe

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260861A (en) * 1984-06-08 1985-12-24 Hitachi Ltd Probe
JPS62151772A (en) * 1985-12-20 1987-07-06 フィリップス　エレクトロニクス　ネムローゼ　フェンノートシャップ Test apparatus for high-frequency integrated circuit
JPS62163984A (en) * 1985-12-20 1987-07-20 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Inspection device
US5491891A (en) * 1993-03-25 1996-02-20 Probes Associates, Inc. Method of making a test probe ring
JP2003084010A (en) * 2001-09-13 2003-03-19 Mitsubishi Electric Corp High frequency probe

Also Published As

Publication number Publication date
JPS6114659B2 (en) 1986-04-19

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