JPS5628637A - Film making method - Google Patents

Film making method

Info

Publication number
JPS5628637A
JPS5628637A JP10445279A JP10445279A JPS5628637A JP S5628637 A JPS5628637 A JP S5628637A JP 10445279 A JP10445279 A JP 10445279A JP 10445279 A JP10445279 A JP 10445279A JP S5628637 A JPS5628637 A JP S5628637A
Authority
JP
Japan
Prior art keywords
substrates
gas
semiconductor
plasma
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10445279A
Other languages
Japanese (ja)
Other versions
JPS6029295B2 (en
Inventor
Shunpei Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP54104452A priority Critical patent/JPS6029295B2/en
Publication of JPS5628637A publication Critical patent/JPS5628637A/en
Priority to US06/377,314 priority patent/US4492716A/en
Priority to US06/429,255 priority patent/US4543267A/en
Priority to US06/429,257 priority patent/US4505950A/en
Priority to US06/428,737 priority patent/US4461783A/en
Priority to US06/619,834 priority patent/US4615298A/en
Publication of JPS6029295B2 publication Critical patent/JPS6029295B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02425—Conductive materials, e.g. metallic silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02579—P-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
    • H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System
    • H01L31/204—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System including AIVBIV alloys, e.g. SiGe, SiC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/206—Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00—Coating apparatus
    • Y10S118/90—Semiconductor vapor doping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y10S438/908—Utilizing cluster apparatus

Abstract

PURPOSE: To form good quality and uniform amorphous semiconductor films on substrates in a short time, in a vacuum vapor phase method, by providing a gas plasma converting region and a semiconductor deposition region, and using at least He and Ne gases as carrier gas.
CONSTITUTION: Mixed gases F of semiconductor compound A (SiH4, SiF4, etc.) are converted to plasma by using the reaction pipe 1 consisting of a gas lead-in part 2, a plasma converting region 3 provided with a high frequency source 6, a semiconductor deposition region 4 provided with a high frequency source 9 for orientation and a heating source 10 and erected with substrates 7, and a gas lead-out part 5 and using at least He, Ne as a carrier gas E, whereby homogeneous amorphous silicon semiconductor films are formed in a short time on the substrates 7 of a low pressure normal state and ≤700°C temperature. It is also possible to contain respective impurity compounds B, C of n type and p type and successively laminate and form these layers on the substrates. This method makes possible volume production with multiple substrates.
COPYRIGHT: (C)1981,JPO&Japio
JP54104452A 1979-08-16 1979-08-16 Non-single crystal film formation method Expired JPS6029295B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP54104452A JPS6029295B2 (en) 1979-08-16 1979-08-16 Non-single crystal film formation method
US06/377,314 US4492716A (en) 1979-08-16 1982-05-12 Method of making non-crystalline semiconductor layer
US06/429,255 US4543267A (en) 1979-08-16 1982-09-30 Method of making a non-single-crystalline semi-conductor layer on a substrate
US06/429,257 US4505950A (en) 1979-08-16 1982-09-30 Method of manufacturing a multiple-layer, non-single-crystalline semiconductor on a substrate
US06/428,737 US4461783A (en) 1979-08-16 1982-09-30 Non-single-crystalline semiconductor layer on a substrate and method of making same
US06/619,834 US4615298A (en) 1979-08-16 1984-06-12 Method of making non-crystalline semiconductor layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54104452A JPS6029295B2 (en) 1979-08-16 1979-08-16 Non-single crystal film formation method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57192055A Division JPS5895550A (en) 1982-11-01 1982-11-01 Device for forming non-single crystal semiconductor layer

Publications (2)

Publication Number Publication Date
JPS5628637A true JPS5628637A (en) 1981-03-20
JPS6029295B2 JPS6029295B2 (en) 1985-07-10

Family

ID=14381007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54104452A Expired JPS6029295B2 (en) 1979-08-16 1979-08-16 Non-single crystal film formation method

Country Status (2)

Country Link
US (5) US4492716A (en)
JP (1) JPS6029295B2 (en)

Cited By (15)

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JPS56166935A (en) * 1980-05-23 1981-12-22 Mitsubishi Electric Corp Apparatus for vapor growth under reduced pressure
JPS5838783U (en) * 1981-09-09 1983-03-14 株式会社富士電機総合研究所 Mass production thin film manufacturing equipment
JPS5895550A (en) * 1982-11-01 1983-06-07 Shunpei Yamazaki Device for forming non-single crystal semiconductor layer
JPS58174570A (en) * 1982-03-29 1983-10-13 エナージー・コンバーション・デバイセス・インコーポレーテッド Glow discharge deposition device containing non-horizontally placed cathode
JPS5916329A (en) * 1982-07-19 1984-01-27 Semiconductor Energy Lab Co Ltd Plasma vapor reaction device
JPS5958820A (en) * 1982-09-28 1984-04-04 Matsushita Electronics Corp Equipment for vapor phase epitaxial growth
JPS59195531A (en) * 1983-04-19 1984-11-06 Agency Of Ind Science & Technol Apparatus for continuously growing sno2 film
JPS6010620A (en) * 1983-06-29 1985-01-19 Fuji Electric Corp Res & Dev Ltd Plasma cvd method
JPS6027143A (en) * 1983-07-25 1985-02-12 Mitsubishi Electric Corp Device for continuous heat treatment
JPS60111418A (en) * 1983-10-26 1985-06-17 ア−ルシ−エ−　コ−ポレ−ション Coating method and device
JPS60149119A (en) * 1984-01-13 1985-08-06 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS6139586A (en) * 1984-07-31 1986-02-25 Canon Inc Manufacture of amorphous semiconductor
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JPS62122123A (en) * 1985-11-21 1987-06-03 Toshiba Corp Vertical type thermal treatment equipment
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US4543267A (en) 1985-09-24
US4492716A (en) 1985-01-08
US4461783A (en) 1984-07-24
US4615298A (en) 1986-10-07
US4505950A (en) 1985-03-19
JPS6029295B2 (en) 1985-07-10

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