JPS56169322A - Selective diffusion of boron into silicon - Google Patents

Selective diffusion of boron into silicon

Info

Publication number
JPS56169322A
JPS56169322A JP7219180A JP7219180A JPS56169322A JP S56169322 A JPS56169322 A JP S56169322A JP 7219180 A JP7219180 A JP 7219180A JP 7219180 A JP7219180 A JP 7219180A JP S56169322 A JPS56169322 A JP S56169322A
Authority
JP
Japan
Prior art keywords
diffusion
film
hbo2
substrate
selective diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7219180A
Other languages
Japanese (ja)
Inventor
Hirokazu Hashimoto
Toru Shinmen
Mitsuhiko Asano
Hideaki Goshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP7219180A priority Critical patent/JPS56169322A/en
Publication of JPS56169322A publication Critical patent/JPS56169322A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251Diffusion into or out of group IV semiconductors
    • H01L21/2254Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H01L21/2255Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)

Abstract

PURPOSE:To enable to perform a stabilized selective diffusion of B on an Si substrate using an HBO2 by a method wherein the diffusion mask of two-layer construction consisting of an SiO2 film and an Si3N4 film against HBO2 is used. CONSTITUTION:An SiO2 film 2 is formed on an N type radical Si substrate 1. Then, on this film 2, an Si3N4 film 3 is formed. After a photolithography process has been finished, a diffusion aperture 4 is formed by performing a plasma etching on the films 2 and 3. Then, N2, H2 and O2 are feeded in the heating up process of the substrate 1. Then the HBO2 film 5 is adhered by feeding N2, H2, O2 and BCl3. Then, N2 is feeded, B is diffused and a P<+> diffusion layer 6 is formed. Through these procedures, a stabilized selective diffusion of B can be performed by making use of the diffusion mask having an excellent masking effect for the HBO2.
JP7219180A 1980-05-30 1980-05-30 Selective diffusion of boron into silicon Pending JPS56169322A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7219180A JPS56169322A (en) 1980-05-30 1980-05-30 Selective diffusion of boron into silicon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7219180A JPS56169322A (en) 1980-05-30 1980-05-30 Selective diffusion of boron into silicon

Publications (1)

Publication Number Publication Date
JPS56169322A true JPS56169322A (en) 1981-12-26

Family

ID=13482069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7219180A Pending JPS56169322A (en) 1980-05-30 1980-05-30 Selective diffusion of boron into silicon

Country Status (1)

Country Link
JP (1) JPS56169322A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59177923A (en) * 1983-03-28 1984-10-08 Matsushita Electronics Corp Boron diffusion to semiconductor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869478A (en) * 1971-12-22 1973-09-20
JPS5377465A (en) * 1976-12-20 1978-07-08 Sanyo Electric Co Ltd Boron deposition method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4869478A (en) * 1971-12-22 1973-09-20
JPS5377465A (en) * 1976-12-20 1978-07-08 Sanyo Electric Co Ltd Boron deposition method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59177923A (en) * 1983-03-28 1984-10-08 Matsushita Electronics Corp Boron diffusion to semiconductor
JPH0586650B2 (en) * 1983-03-28 1993-12-13 Matsushita Electronics Corp

Similar Documents

Publication Publication Date Title
JPS51121263A (en) Method of manufacturing a semiconductor divice
JPS559414A (en) Manufacturing method of semiconductor device
JPS56169322A (en) Selective diffusion of boron into silicon
JPS56124270A (en) Manufacture of semiconductor device
JPS5494869A (en) Production of semiconductor device
JPS5643756A (en) Manufacture of semiconductor device
JPS5726467A (en) Manufacture of semiconductor device
JPS5779642A (en) Manufacture of semiconductor device
JPS56111265A (en) Manufacture of semiconductor device
JPS5710949A (en) Manufacture of semiconductor device
JPS56148825A (en) Manufacture of semiconductor device
JPS5736879A (en) Manufacture of semiconductor device
JPS5687342A (en) Manufacture of semiconductor device
JPS5762538A (en) Manufacture of semiconductor device
JPS54121684A (en) Manufacture of semkconductor device
JPS5513953A (en) Complementary integrated circuit
JPS57106145A (en) Manufacture of semiconductor device
JPS57206071A (en) Semiconductor device and manufacture thereof
JPS55156327A (en) Manufacture for semiconductor
JPS54109385A (en) Field effect semiconductor device of high dielectric strength
JPS5673440A (en) Manufacture of semiconductor device
JPS54126482A (en) Non-volatile semiconductor device
JPS5272162A (en) Production of semiconductor device
JPS647566A (en) Manufacture of thin film transistor
JPS5715425A (en) Method for forming semiconductor nitride layer