JPS5594145A - Method of and device for inspecting surface of article - Google Patents

Method of and device for inspecting surface of article

Info

Publication number
JPS5594145A
JPS5594145A JP135679A JP135679A JPS5594145A JP S5594145 A JPS5594145 A JP S5594145A JP 135679 A JP135679 A JP 135679A JP 135679 A JP135679 A JP 135679A JP S5594145 A JPS5594145 A JP S5594145A
Authority
JP
Japan
Prior art keywords
light
detected
article
reflected light
projected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP135679A
Other languages
Japanese (ja)
Inventor
Masakuni Akiba
Hiroto Nagatomo
Jun Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP135679A priority Critical patent/JPS5594145A/en
Priority to US06/005,924 priority patent/US4342515A/en
Priority to DE19792903072 priority patent/DE2903072A1/en
Publication of JPS5594145A publication Critical patent/JPS5594145A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To readily detect a foreign material on the surface of an article having a projected surface by illuminating light on the surface of the article to generate reflected light from the surface, polarizing the reflected light, extracting the light wave in special direction, and detecting the light intensity of the light wave. CONSTITUTION:A semiconductor wafer is contained in a cartridge 2. The wafer is placed by a feeder 3 on a table 4. This device comprises a mechanism 5 for rotating the table 4, a drive unit 6 for horizontally moving the table 4, and a light source 7 for generating parallel rays. The light is transmitted through a polarizing plate 8, objective lenses 9, 10, an illuminating light projecting mirror 11, a visually inspecting mirror 12, a relay lens 13, an aperture 14, and a photoelectric converter 15 to an electronic circuit unit 16 for processing information. Laser light is projected to the side surface of the semiconductor wafer 21 to be detected. The reflected light is detected through the converter 15 while rotating the table 4. Thus, the size and number of the foreign materials are detected by the reflected light when the plate 8 becomes the direction to detect only non-polarized light.
JP135679A 1978-01-27 1979-01-12 Method of and device for inspecting surface of article Pending JPS5594145A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP135679A JPS5594145A (en) 1979-01-12 1979-01-12 Method of and device for inspecting surface of article
US06/005,924 US4342515A (en) 1978-01-27 1979-01-23 Method of inspecting the surface of an object and apparatus therefor
DE19792903072 DE2903072A1 (en) 1978-01-27 1979-01-26 DEVICE AND METHOD FOR SURFACE INSPECTION

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP135679A JPS5594145A (en) 1979-01-12 1979-01-12 Method of and device for inspecting surface of article

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP200186A Division JPS61180128A (en) 1986-01-10 1986-01-10 Optical inspecting device

Publications (1)

Publication Number Publication Date
JPS5594145A true JPS5594145A (en) 1980-07-17

Family

ID=11499205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP135679A Pending JPS5594145A (en) 1978-01-27 1979-01-12 Method of and device for inspecting surface of article

Country Status (1)

Country Link
JP (1) JPS5594145A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780546A (en) * 1980-11-07 1982-05-20 Nippon Kogaku Kk <Nikon> Detecting device for foreign substance
JPS57128834A (en) * 1981-02-04 1982-08-10 Nippon Kogaku Kk <Nikon> Inspecting apparatus of foreign substance
JPS5833108A (en) * 1981-08-21 1983-02-26 Nec Home Electronics Ltd Method for inspecting external apperance to work
JPS58122411A (en) * 1982-01-11 1983-07-21 Japan Crown Cork Co Ltd Method and device for detecting irregularity of coating on substrate
JPS61966A (en) * 1985-06-12 1986-01-06 Hitachi Ltd Magnetic head
JPS61117433A (en) * 1984-11-14 1986-06-04 Hitachi Ltd Method and device for detecting foreign matter
JPS6211138A (en) * 1985-06-28 1987-01-20 Hitachi Electronics Eng Co Ltd Apparatus for inspecting foreign matter
JPS62134038U (en) * 1986-02-17 1987-08-24
JPH0326944A (en) * 1989-06-26 1991-02-05 Ulvac Japan Ltd Apparatus for inspecting foreign matter on substrate
JPH0339607A (en) * 1989-07-05 1991-02-20 Fujitsu Ltd Optical device for identifying semiconductor
JPH064655U (en) * 1983-04-22 1994-01-21 エルヴィーン ズイック ゲーエムベーハー オプテック−エレクトロニーク Defect detection device for flat articles
US6366690B1 (en) 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers
JP2014052217A (en) * 2012-09-05 2014-03-20 Dainippon Printing Co Ltd Foreign matter inspection device, foreign matter inspection method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999086A (en) * 1973-01-26 1974-09-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4999086A (en) * 1973-01-26 1974-09-19

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6352696B2 (en) * 1980-11-07 1988-10-19 Nippon Kogaku Kk
JPS5780546A (en) * 1980-11-07 1982-05-20 Nippon Kogaku Kk <Nikon> Detecting device for foreign substance
JPS57128834A (en) * 1981-02-04 1982-08-10 Nippon Kogaku Kk <Nikon> Inspecting apparatus of foreign substance
JPS6364738B2 (en) * 1981-02-04 1988-12-13
JPS5833108A (en) * 1981-08-21 1983-02-26 Nec Home Electronics Ltd Method for inspecting external apperance to work
JPS58122411A (en) * 1982-01-11 1983-07-21 Japan Crown Cork Co Ltd Method and device for detecting irregularity of coating on substrate
JPH0240961B2 (en) * 1982-01-11 1990-09-14 Crown Cork Japan
JPH064655U (en) * 1983-04-22 1994-01-21 エルヴィーン ズイック ゲーエムベーハー オプテック−エレクトロニーク Defect detection device for flat articles
JPS61117433A (en) * 1984-11-14 1986-06-04 Hitachi Ltd Method and device for detecting foreign matter
JPS61966A (en) * 1985-06-12 1986-01-06 Hitachi Ltd Magnetic head
JPH0373066B2 (en) * 1985-06-12 1991-11-20 Hitachi Ltd
JPH0514857B2 (en) * 1985-06-28 1993-02-26 Hitachi Electr Eng
JPS6211138A (en) * 1985-06-28 1987-01-20 Hitachi Electronics Eng Co Ltd Apparatus for inspecting foreign matter
JPS62134038U (en) * 1986-02-17 1987-08-24
JPH0326944A (en) * 1989-06-26 1991-02-05 Ulvac Japan Ltd Apparatus for inspecting foreign matter on substrate
JPH0339607A (en) * 1989-07-05 1991-02-20 Fujitsu Ltd Optical device for identifying semiconductor
US6366690B1 (en) 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers
US6810139B2 (en) 1998-07-07 2004-10-26 Applied Materials, Inc. Pixel based machine for patterned wafers
US7016526B2 (en) 1998-07-07 2006-03-21 Applied Materials, Inc. Pixel based machine for patterned wafers
US7454052B2 (en) 1998-07-07 2008-11-18 Applied Materials, Inc. Pixel based machine for patterned wafers
JP2014052217A (en) * 2012-09-05 2014-03-20 Dainippon Printing Co Ltd Foreign matter inspection device, foreign matter inspection method

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