JPH0326944A - Apparatus for inspecting foreign matter on substrate - Google Patents
Apparatus for inspecting foreign matter on substrateInfo
- Publication number
- JPH0326944A JPH0326944A JP16063689A JP16063689A JPH0326944A JP H0326944 A JPH0326944 A JP H0326944A JP 16063689 A JP16063689 A JP 16063689A JP 16063689 A JP16063689 A JP 16063689A JP H0326944 A JPH0326944 A JP H0326944A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- substrate
- wafer
- foreign matter
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 12
- 230000035945 sensitivity Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000007689 inspection Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、真空雰囲気又は大気中においてウエハ等の基
板の表面上の異物を検査する異物検査装置に関するもの
である．
［従来の技術］
従来、この種の異物検査装置として、レーザ光及び検出
部を固定し、ウエハを回転させる′−φしてウエハ全面
を検査できるようにした、大気中で基板上のダストを検
出する装置は公知である．このような装置を真空雰囲気
で使用するためにはウエハを回転等させるために駆動部
を真空室内に導入する必要があり、装置が複雑となるだ
けでなく、駆動部がダスト発生源となる等の欠点があり
、この形式の装置は真空雰囲気中では使用できない．
そこで先に実開昭６３− １０６９１５号公報において
、異物検査すべき被検査物を収容する真空容器に反射Ｉ
Ｕ止膜を備えたレーザ光線導入用窓と上記真空容器内の
被検査物上で鏡面反射したレーザ光線を外部へ導出する
反射防止膜を備えたレーザ光線禅出用窓とを設け、上記
真空容器内の被検査物表面上に導入されるレーザ光線を
レーザスキャナにより上記被検査物表面上で少なくとも
一つの方向に走査させ、被検査物上の異物によって乱反
射したレーザ光線を光電子増倍管から或る検出器で検出
できるようにした真空中で使用可能な表面異物検査装置
を提案した．この検査装置では、レーザ光源及びスキャ
ナは真空容器の外に配置され、レーザ光線は真空窓を介
して真空容器内に導入される．真空容器内の被検査物に
レーザ光線が当たると、その被検査物の表面で鏡面反射
したレーザ光線はレーザ光線導入用窓と対向して設けら
れたレーザ光線導出用窓を通って真空容器の外へ出る．
被検査物上にダスト等のｎ物があると、レーザ光線はそ
の異物によって乱反射されるので、その乱反射光を光電
子増倍管で検出する．レーザ光線はスキャナにより走査
されているので、スキャナの信号及び光電子増倍管の信
号から被検査物上の異物の位置及びその大きさが検出さ
れ得る．
［発明が解決しようとする課題］
このような先に提案した真空中で使用可能な表面異物検
査装置においては、レーザ光線をＸ．Ｙ方向に走査しし
かも検出器として使用した光電子増倍管は生じる敢乱光
に対してある角度位置だけしか受光面を持たないため、
次のような問題点がある．
すなわち、光電子増信管で検出される散乱光は非常に微
弱であり、Ｓ／Ｎ比が小さく、感度が低くなりがちであ
る．また二軸走査により走査位置が二次元的に変化する
ためにバックグラウンドの変動が複雑となる．これはス
キャナ部からの迷光が主要因であると考えられる．
また、スキャン方法が原則的に点光源から発しているた
めに、被検査物上で鏡面反射したレーザ光線を真空容器
外へ出すための窓は被検査物の径の二倍程度の大きさに
しなければならない．仮に窓がなければレーザ光線は真
空容器の内壁のいたるところで散乱し、異物からの信号
か迷光かの判別ができなくなる．
更に、装置の設置されている室内の螢光灯等の光等もバ
ックグラウンドとなるため、装置は暗室で覆い、しかも
レーザ光線の散乱防止をする必要がある．
そこで、本発明は、このような従来技術の問題点を解決
して簡単かつ精度よく基板上のダスト等の異物を検出で
きる基板上の異物検査装置を提供することを目的として
いる。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a foreign matter inspection device for inspecting foreign matter on the surface of a substrate such as a wafer in a vacuum atmosphere or air. [Prior Art] Conventionally, this type of foreign matter inspection equipment has been designed to detect dust on a substrate in the atmosphere by fixing a laser beam and a detection part and rotating the wafer by '-φ' so that the entire surface of the wafer can be inspected. The detection device is publicly known. In order to use such equipment in a vacuum atmosphere, it is necessary to introduce a drive unit into the vacuum chamber to rotate the wafer, which not only complicates the equipment but also causes problems such as the drive unit becoming a source of dust. This type of device cannot be used in a vacuum atmosphere. Therefore, in Japanese Utility Model Application No. 63-106915, a reflection I
A laser beam introduction window equipped with a U stop film and a laser beam exit window equipped with an antireflection film that guides the laser beam specularly reflected on the object to be inspected in the vacuum container to the outside are provided. A laser beam introduced onto the surface of the object to be inspected in a container is scanned in at least one direction on the surface of the object to be inspected by a laser scanner, and the laser beam diffusely reflected by foreign matter on the object to be inspected is scanned from a photomultiplier tube. We proposed a surface foreign matter inspection device that can be used in vacuum and can be detected with a certain detector. In this inspection device, the laser light source and scanner are placed outside the vacuum container, and the laser beam is introduced into the vacuum container through the vacuum window. When a laser beam hits an object to be inspected inside a vacuum container, the laser beam is specularly reflected on the surface of the object and passes through a laser beam exit window provided opposite to a laser beam introduction window into the vacuum container. Go outside.
If there is an object such as dust on the object to be inspected, the laser beam is diffusely reflected by the object, so the diffusely reflected light is detected by a photomultiplier tube. Since the laser beam is scanned by a scanner, the position and size of the foreign object on the object to be inspected can be detected from the scanner signal and the photomultiplier tube signal. [Problems to be Solved by the Invention] In the above-mentioned surface foreign matter inspection device that can be used in a vacuum, a laser beam is transmitted to an X. Since the photomultiplier tube used as a detector scans in the Y direction and has a light-receiving surface only at a certain angular position relative to the generated scattered light,
There are the following problems. That is, the scattered light detected by the photomultiplier tube is very weak, has a low S/N ratio, and tends to have low sensitivity. Furthermore, because the scanning position changes two-dimensionally due to two-axis scanning, background fluctuations become complicated. This is thought to be mainly caused by stray light from the scanner section. In addition, since the scanning method basically emits light from a point source, the window that allows the laser beam specularly reflected on the object to exit the vacuum chamber must be approximately twice the diameter of the object to be inspected. There must be. If there were no window, the laser beam would be scattered all over the inner wall of the vacuum chamber, making it impossible to distinguish between signals from foreign objects and stray light. Furthermore, the light from fluorescent lights in the room where the device is installed also creates a background, so it is necessary to cover the device in a dark room and prevent the laser beam from scattering. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a foreign matter inspection device on a substrate that can easily and accurately detect foreign matter such as dust on a substrate by solving the problems of the prior art.
［課題を解決するための千段］
本発明による基板上の異物検査装置は、異物検査すべき
基板に対してレーザ光源からのレーザ光をＸ，Ｙ方向に
走査させるスキャナを設け、このスキャナがその出口部
分にレーザ光を基板表面にのみ照射させるレーザ光制限
手段を備え、また基板の真正面に、基板上の異物からの
散乱光を受けるカメラを設け、このカメラからの信号を
処理して基板上の異物の大きさや数、位置を検出する演
算処理装置を設けたことを特徴とするものである．［作
用］
本発明による基板上の異物検査装置においては、異物検
査すべき基板に対してレーザ光源からのレーザ光をＸ，
Ｙ方向に走査させるスキャナは演算処理装置により走査
速度を調節され、それによりカメラは基板全面をレーザ
光線で走査した画面を捕らえることができる．
こうして捕らえられた基板全面の画像は演算処理装置に
よりデータ処理され、その基板上のダスト等の異物の位
置や大きさを知ることかて゛きる．また基板全面の画像
を捕らえるカメラにモニタ表示装置を接続することによ
り基板表面をリアルタイムで観察することも可能となる
．
［実 施 例］
以下、添附図面を参照して本発明の実施例について説明
する．
図面には本発明による装置の一実施例を概略的に示し、
１は電源２により付勢されるレーザ光源であり、後で説
明するカメラで検出できる波長帯域のレーザ光線を発生
する．このレーザ光源１からのレーザ光線の軸線上には
スキャナ３が配置され、このスキャナ３は高速スキャナ
及び低速スキャナから成っており、実際にはポリゴンミ
ラーやメカニカルミラーが用いられ得る．またその出目
部分には光彩絞りやビーム径を一定にするレンズ系から
或り得るレーザ光制御光学系４を備えている．スキャナ
３はレーザ光源１からのレーザ光線をウエハ５上でＸ，
Ｙ方向に走査させるように機能する．またレーザ光源１
及びスキャナ３の軸線は図示したようにウエハ５の表面
に対して角度を成しており、レーザ光線をウエハ５に対
して予定の入射角で照射できるようにされている。[A Thousand Steps to Solve the Problem] The device for inspecting foreign matter on a substrate according to the present invention is provided with a scanner that scans a substrate to be inspected for foreign matter in the X and Y directions with laser light from a laser light source. The exit part is equipped with a laser beam limiting means for irradiating the laser beam only onto the substrate surface, and a camera is installed directly in front of the substrate to receive the scattered light from foreign objects on the substrate, and the signal from this camera is processed and sent to the substrate. This device is characterized by being equipped with an arithmetic processing device that detects the size, number, and position of foreign objects on the machine. [Function] In the device for inspecting foreign matter on a substrate according to the present invention, a laser beam from a laser light source is applied to the substrate to be inspected for foreign matter by
The scanning speed of the scanner, which scans in the Y direction, is adjusted by a processing unit, so that the camera can capture a screen where the entire surface of the board is scanned with a laser beam. The image of the entire surface of the board captured in this way is processed by a processing unit, making it possible to determine the location and size of foreign objects such as dust on the board. Furthermore, by connecting a monitor display device to a camera that captures images of the entire surface of the board, it is also possible to observe the board surface in real time. [Examples] Examples of the present invention will be described below with reference to the attached drawings. The drawing schematically shows an embodiment of the device according to the invention,
Reference numeral 1 denotes a laser light source energized by a power source 2, which generates a laser beam in a wavelength range that can be detected by a camera, which will be explained later. A scanner 3 is arranged on the axis of the laser beam from the laser light source 1, and this scanner 3 consists of a high-speed scanner and a low-speed scanner, and in reality, a polygon mirror or a mechanical mirror can be used. Further, the protruding part is equipped with a laser beam control optical system 4, which can be formed from an optical diaphragm or a lens system that makes the beam diameter constant. The scanner 3 sends a laser beam from the laser light source 1 onto the wafer 5 in an
It functions to scan in the Y direction. Also, laser light source 1
As shown, the axis of the scanner 3 forms an angle with respect to the surface of the wafer 5, so that the laser beam can be irradiated onto the wafer 5 at a predetermined incident angle.
また、ウエハ５の真正面にはウエハ５全体を画像として
捕らえることのできる高感度ビデオカメラ６が配置され
、この高感度ビデオカメラ６の出力側にはデータプロセ
ッサ７が接続され、このデータプロセッサ７は一方では
コンピュータ８にまた他方ではモニタ表示装置９にそれ
ぞれ接続されている．これにより、高感度ビデオカメラ
６で捕らえられたウエハ５の画像はデータプロセッサ７
でデータ処理され、モニタ表示装置９にリアルタイムで
表示され得る．データプロセッサ７及びコンピュータ８
は演算処理装置を楕或している．なお、高感度ビデオカ
メラ６には点線で示すように画像記憶装置１０を接続し
、高感度ビデオカメラ６で捕らえた画像を一旦画像記憶
装置１０に記憶し、後でこの記憶された画像データをデ
ータグロセヅサ７に入れ、データ処理するようにするこ
ともできる．
このように構或した図示装置の動作について説明する．
スキャナ３はコンピュータ８で制御された走査速度でレ
ーザ光源１からのレーザ光線によりウエハ５の面上を走
査する．その際に、レーザ光線はレーザ光制御光学系４
によりウエハ５以外には入射しないようにされている．
ウエハ５の画像は高感度ビデオカメラ６で捕らえられ、
ウエハ５の表面上にダストが存在すると、そのダストに
よる散乱光は高感度ビデオカメラ６によって捕らえられ
る．
こうして高感度ビデオカメラ６で撮像したビデオ信号は
コンピュータ８による制御のもとでデータプロセッサ７
で演算処理され、それによりウエハ５の表面上のダスト
の位置、大きさ、数を知ることができると同時に、モニ
タ表示装′ｆ１９に表示することによりウエハ５の表面
状態をリアルタイムで観察することができる．
データプロセッサ７によるビデオ信号の演算処理は画面
を固定して行われるため、スキャナ３は一画面でウエハ
全面がレーザスキャンされるようにコンピュータ８によ
って速度制御される．ところで、図示実施例において更
に高速走査を可能にするため音響光学素子をスキャナに
用いることもできる．
またスキャナの出口側に設けられるレーザ光制御光学系
４は、ウエハ５に当たるビーム径を一定にするようにレ
ンズ系を組み合わせて楕成することもできる．
ウエハの画１象を捕らえるのに高感度ビデオカメラの代
わりに高速度シャツタカメラを用いることもでき、その
場合にはウエハが移動中であってもウエハ上のダストの
数等を知ることができる．さらに、図示実施例では、測
定雰囲気を特定せずに単にウエハにおけるｎ物を検出す
るのに実施した例について説明してきたが、真空中や大
気中でウエハ以外の例えばガラス基板又は蒸着膜を施し
た基板を対象物として実施することもできる．［発明の
効果］
以上説明してきたように本発明による基板上の異物検査
装置によれば、異物検査すべき基板に対してレーザ光源
からのレーザ光をスキャナでＸ、Ｙ方向に走査させ、レ
ーザ光の照射範囲をレーザ光制限手段で基板表面にのみ
制限し、また、検出手段としてカメラを使用ししがもレ
ーザ光を高速でスキャンするため、迷光の影響がなく、
従って従来のように暗室にすることや真空室がらのレー
ザの逃げ窓を設ける必要がなく、装置全体を簡単化する
ことができる．
また、コンピュータを含む演算処理装置によりカメラで
捕らえた一画面を演算処理するようにしているので、従
来の装置に比べて極めて短時間で異物の数や大きさ、位
置を知ることができる。Further, a high-sensitivity video camera 6 capable of capturing an image of the entire wafer 5 is arranged directly in front of the wafer 5, and a data processor 7 is connected to the output side of this high-sensitivity video camera 6. They are connected on the one hand to a computer 8 and on the other hand to a monitor display device 9. As a result, the image of the wafer 5 captured by the high-sensitivity video camera 6 is transferred to the data processor 7.
The data can be processed and displayed on the monitor display device 9 in real time. Data processor 7 and computer 8
represents an arithmetic processing unit. An image storage device 10 is connected to the high-sensitivity video camera 6 as shown by the dotted line, and images captured by the high-sensitivity video camera 6 are temporarily stored in the image storage device 10, and the stored image data can be used later. It is also possible to input the data into the data processor 7 and process the data. The operation of the illustrated device constructed in this way will be explained. The scanner 3 scans the surface of the wafer 5 with a laser beam from a laser light source 1 at a scanning speed controlled by a computer 8. At that time, the laser beam is controlled by the laser beam control optical system 4.
This prevents the light from entering anything other than wafer 5. An image of the wafer 5 is captured by a high-sensitivity video camera 6,
When dust is present on the surface of the wafer 5, light scattered by the dust is captured by a high-sensitivity video camera 6. The video signal captured by the high-sensitivity video camera 6 is processed by the data processor 7 under the control of the computer 8.
The position, size, and number of dust on the surface of the wafer 5 can be known, and at the same time, the surface condition of the wafer 5 can be observed in real time by displaying it on the monitor display unit 'f19. Can be done. Since the arithmetic processing of the video signal by the data processor 7 is performed with the screen fixed, the speed of the scanner 3 is controlled by the computer 8 so that the entire surface of the wafer is laser scanned in one screen. Incidentally, in the illustrated embodiment, an acousto-optic element can also be used in the scanner to enable even faster scanning. Further, the laser beam control optical system 4 provided on the exit side of the scanner can be formed into an ellipse by combining lens systems so that the diameter of the beam hitting the wafer 5 is constant. A high-speed shutter camera can be used instead of a high-sensitivity video camera to capture an image of the wafer, and in that case, it is possible to know the number of dust particles on the wafer even while the wafer is moving. can. Furthermore, in the illustrated embodiment, an example has been described in which the measurement is performed simply to detect n objects on a wafer without specifying the measurement atmosphere. It is also possible to use a printed circuit board as the object. [Effects of the Invention] As described above, according to the foreign matter inspection device on a substrate according to the present invention, a laser beam from a laser light source is scanned in the X and Y directions on a substrate to be inspected for foreign matter, and the laser beam is scanned in the X and Y directions. The irradiation range of light is limited to only the substrate surface by a laser beam limiting means, and a camera is used as a detection means, but the laser beam is scanned at high speed, so there is no influence of stray light.
Therefore, there is no need to create a dark room or provide a laser escape window like in a vacuum chamber, as in the past, and the entire device can be simplified. In addition, since a processing unit including a computer processes one screen captured by a camera, it is possible to determine the number, size, and position of foreign objects in an extremely short time compared to conventional devices.
更に、検出手段としてのカメラに高速度シャッタ型のも
のを使用することにより動いている基板でも検出するこ
とができ、より広範囲の応用が可能となる．Furthermore, by using a high-speed shutter type camera as a detection means, it is possible to detect even moving boards, making a wider range of applications possible.
図面は本発明の一実施例を示す概略線図である．図
中
１：レーザ光源
２：電源
３：スキャナ
４：レーザ光制御光学系
５：ウエハ
６：カメラ
７：データプロセッサ
８：コンピュータ
９：モニタ表示装置
１０：画像記憶装置The drawing is a schematic diagram showing an embodiment of the present invention. figure
Middle 1: Laser light source 2: Power supply 3: Scanner 4: Laser light control optical system 5: Wafer 6: Camera 7: Data processor 8: Computer 9: Monitor display device 10: Image storage device
Claims (1)
をＸ、Ｙ方向に走査させるスキャナを設け、このスキャ
ナがその出口部分にレーザ光を基板表面にのみ照射させ
るレーザ光制限手段を備え、また基板の真正面に、基板
上の異物からの散乱光を受けるカメラを設け、このカメ
ラからの信号を処理して基板上の異物の大きさや数、位
置を検出する演算処理装置を設けたことを特徴とする基
板上の異物検査装置。A scanner is provided to scan a substrate to be inspected for foreign matter in the X and Y directions with laser light from a laser light source, and this scanner is provided with a laser beam limiting means at its exit portion to irradiate the laser beam only onto the surface of the substrate, and A feature is that a camera is installed directly in front of the board to receive scattered light from foreign objects on the board, and a processing unit is installed that processes the signals from this camera to detect the size, number, and position of the foreign objects on the board. A device for inspecting foreign substances on substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16063689A JPH0326944A (en) | 1989-06-26 | 1989-06-26 | Apparatus for inspecting foreign matter on substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16063689A JPH0326944A (en) | 1989-06-26 | 1989-06-26 | Apparatus for inspecting foreign matter on substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0326944A true JPH0326944A (en) | 1991-02-05 |
Family
ID=15719215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16063689A Pending JPH0326944A (en) | 1989-06-26 | 1989-06-26 | Apparatus for inspecting foreign matter on substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0326944A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009222532A (en) * | 2008-03-14 | 2009-10-01 | Kanto Auto Works Ltd | Adherend detector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5594145A (en) * | 1979-01-12 | 1980-07-17 | Hitachi Ltd | Method of and device for inspecting surface of article |
| JPS6015939A (en) * | 1983-07-08 | 1985-01-26 | Hitachi Ltd | Inspecting device for foreign matter |
| JPS61292931A (en) * | 1985-06-21 | 1986-12-23 | Hitachi Ltd | Method and apparatus for inspecting defect |
| JPS62159029A (en) * | 1986-01-08 | 1987-07-15 | Canon Inc | Inspecting device for defect of reticle mask |
| JPS62179641A (en) * | 1986-02-03 | 1987-08-06 | Canon Inc | Foreign matter inspector |
-
1989
- 1989-06-26 JP JP16063689A patent/JPH0326944A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5594145A (en) * | 1979-01-12 | 1980-07-17 | Hitachi Ltd | Method of and device for inspecting surface of article |
| JPS6015939A (en) * | 1983-07-08 | 1985-01-26 | Hitachi Ltd | Inspecting device for foreign matter |
| JPS61292931A (en) * | 1985-06-21 | 1986-12-23 | Hitachi Ltd | Method and apparatus for inspecting defect |
| JPS62159029A (en) * | 1986-01-08 | 1987-07-15 | Canon Inc | Inspecting device for defect of reticle mask |
| JPS62179641A (en) * | 1986-02-03 | 1987-08-06 | Canon Inc | Foreign matter inspector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009222532A (en) * | 2008-03-14 | 2009-10-01 | Kanto Auto Works Ltd | Adherend detector |
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