JPS53114350A - Semiconductor and its manufacture - Google Patents
Semiconductor and its manufactureInfo
- Publication number
- JPS53114350A JPS53114350A JP2801377A JP2801377A JPS53114350A JP S53114350 A JPS53114350 A JP S53114350A JP 2801377 A JP2801377 A JP 2801377A JP 2801377 A JP2801377 A JP 2801377A JP S53114350 A JPS53114350 A JP S53114350A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- manufacture
- mof
- laminate
- react
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE: To laminate an Al wiring layer, by making high-melting-point metal such as Ti or chloride such as Si react on MoF6 or WF6 so as to provide selectively an alloy layer of Mo or W only inside the connection hole of a semiconductor insulating film.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2801377A JPS53114350A (en) | 1977-03-16 | 1977-03-16 | Semiconductor and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2801377A JPS53114350A (en) | 1977-03-16 | 1977-03-16 | Semiconductor and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53114350A true JPS53114350A (en) | 1978-10-05 |
Family
ID=12236881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2801377A Pending JPS53114350A (en) | 1977-03-16 | 1977-03-16 | Semiconductor and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53114350A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5776833A (en) * | 1980-09-04 | 1982-05-14 | Applied Materials Inc | Heat resistant metal depositing method and product thereof |
JPS5818965A (en) * | 1981-07-28 | 1983-02-03 | Toshiba Corp | Manufacture of semiconductor device |
JPS6050920A (en) * | 1983-08-30 | 1985-03-22 | Toshiba Corp | Manufacture of semiconductor device |
JPS60119750A (en) * | 1983-12-02 | 1985-06-27 | Hitachi Ltd | Manufacture of semiconductor device |
JPS62204523A (en) * | 1986-03-04 | 1987-09-09 | Nec Corp | Forming method for contact electrode |
JPS6419721A (en) * | 1988-03-25 | 1989-01-23 | Seiko Epson Corp | Integrated circuit |
JPS6419720A (en) * | 1988-03-25 | 1989-01-23 | Seiko Epson Corp | Integrated circuit |
-
1977
- 1977-03-16 JP JP2801377A patent/JPS53114350A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5776833A (en) * | 1980-09-04 | 1982-05-14 | Applied Materials Inc | Heat resistant metal depositing method and product thereof |
JPS5818965A (en) * | 1981-07-28 | 1983-02-03 | Toshiba Corp | Manufacture of semiconductor device |
JPS6050920A (en) * | 1983-08-30 | 1985-03-22 | Toshiba Corp | Manufacture of semiconductor device |
JPS60119750A (en) * | 1983-12-02 | 1985-06-27 | Hitachi Ltd | Manufacture of semiconductor device |
JPH0586653B2 (en) * | 1983-12-02 | 1993-12-13 | Hitachi Ltd | |
JPS62204523A (en) * | 1986-03-04 | 1987-09-09 | Nec Corp | Forming method for contact electrode |
JPS6419721A (en) * | 1988-03-25 | 1989-01-23 | Seiko Epson Corp | Integrated circuit |
JPS6419720A (en) * | 1988-03-25 | 1989-01-23 | Seiko Epson Corp | Integrated circuit |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5348474A (en) | Electronic parts | |
JPS53114350A (en) | Semiconductor and its manufacture | |
JPS5422163A (en) | Semiconductor device | |
JPS5430787A (en) | Infrared-ray detector | |
JPS52149973A (en) | External lead of electronic parts | |
JPS5435690A (en) | Manufacture of semiconductor device of multilayer wiring type | |
JPS5428238A (en) | Watchcase | |
JPS53135266A (en) | Production of semiconductor device | |
JPS53117970A (en) | Resin seal type semiconductor device | |
JPS52155986A (en) | Semiconductor device | |
JPS53105969A (en) | Manufacture of connection structure and wiring for semiconductor device | |
JPS53117985A (en) | Semiconductor device | |
JPS542069A (en) | Semiconductor device | |
JPS52116075A (en) | Preparation of film for protecting surface of electronic parts | |
JPS5231670A (en) | Assembling method of semiconductor integrated circuit element | |
JPS5318962A (en) | Semiconductor package | |
JPS5390777A (en) | Semiconductor device and its production | |
JPS5368282A (en) | Electronic watch | |
JPS5315759A (en) | Electronic parts | |
JPS5441666A (en) | Semiconductor integrated circuit element | |
JPS5223281A (en) | Method of manufacturing semiconductor device | |
JPS5268388A (en) | Semiconductor integrated circuit | |
JPS5374362A (en) | Wiring structure for electronic parts | |
JPS53144261A (en) | Semiconductor device and its manufacture | |
JPS522171A (en) | Electronic parts |