JPS5390777A - Semiconductor device and its production - Google Patents
Semiconductor device and its productionInfo
- Publication number
- JPS5390777A JPS5390777A JP512177A JP512177A JPS5390777A JP S5390777 A JPS5390777 A JP S5390777A JP 512177 A JP512177 A JP 512177A JP 512177 A JP512177 A JP 512177A JP S5390777 A JPS5390777 A JP S5390777A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- wiring layers
- rest
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Conductive Materials (AREA)
Abstract
PURPOSE: To form wiring layers free from step cutting through vapor deposition by using an Al alloy composed of less than 50 wt.% of a high melting point metal and the rest of A for the wiring layers.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP512177A JPS5390777A (en) | 1977-01-20 | 1977-01-20 | Semiconductor device and its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP512177A JPS5390777A (en) | 1977-01-20 | 1977-01-20 | Semiconductor device and its production |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5390777A true JPS5390777A (en) | 1978-08-09 |
Family
ID=11602474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP512177A Pending JPS5390777A (en) | 1977-01-20 | 1977-01-20 | Semiconductor device and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5390777A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5566609A (en) * | 1978-11-13 | 1980-05-20 | Acf Ind Inc | Improved bypass valve |
JPS58170059A (en) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
JPS63263744A (en) * | 1987-04-22 | 1988-10-31 | Nec Corp | Aluminum alloy thin film wiring |
-
1977
- 1977-01-20 JP JP512177A patent/JPS5390777A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5566609A (en) * | 1978-11-13 | 1980-05-20 | Acf Ind Inc | Improved bypass valve |
JPS58170059A (en) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
JPS63263744A (en) * | 1987-04-22 | 1988-10-31 | Nec Corp | Aluminum alloy thin film wiring |
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