JPS5441666A - Semiconductor integrated circuit element - Google Patents

Semiconductor integrated circuit element

Info

Publication number
JPS5441666A
JPS5441666A JP10774877A JP10774877A JPS5441666A JP S5441666 A JPS5441666 A JP S5441666A JP 10774877 A JP10774877 A JP 10774877A JP 10774877 A JP10774877 A JP 10774877A JP S5441666 A JPS5441666 A JP S5441666A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit element
electrodes
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10774877A
Other languages
Japanese (ja)
Inventor
Ryosaku Kanzawa
Kiyoshi Tsukuda
Tatsuya Kamei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10774877A priority Critical patent/JPS5441666A/en
Publication of JPS5441666A publication Critical patent/JPS5441666A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Abstract

PURPOSE: To increase the circuit integration, by taking the external diameter of the electrodes of wiring smaller than that of the external electrodes, and by providing the operation region and the element wiring under or near the external electrodes via the insulation film.
COPYRIGHT: (C)1979,JPO&Japio
JP10774877A 1977-09-09 1977-09-09 Semiconductor integrated circuit element Pending JPS5441666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10774877A JPS5441666A (en) 1977-09-09 1977-09-09 Semiconductor integrated circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10774877A JPS5441666A (en) 1977-09-09 1977-09-09 Semiconductor integrated circuit element

Publications (1)

Publication Number Publication Date
JPS5441666A true JPS5441666A (en) 1979-04-03

Family

ID=14466959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10774877A Pending JPS5441666A (en) 1977-09-09 1977-09-09 Semiconductor integrated circuit element

Country Status (1)

Country Link
JP (1) JPS5441666A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196826U (en) * 1981-06-09 1982-12-14
JPS62188820A (en) * 1986-02-13 1987-08-18 Aisin Seiki Co Ltd Clutch cover
JPH01156551U (en) * 1988-04-19 1989-10-27

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196826U (en) * 1981-06-09 1982-12-14
JPS6141447Y2 (en) * 1981-06-09 1986-11-26
JPS62188820A (en) * 1986-02-13 1987-08-18 Aisin Seiki Co Ltd Clutch cover
JPH01156551U (en) * 1988-04-19 1989-10-27

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