JPS53105970A - Assembling method for semiconductor device - Google Patents

Assembling method for semiconductor device

Info

Publication number
JPS53105970A
JPS53105970A JP2021977A JP2021977A JPS53105970A JP S53105970 A JPS53105970 A JP S53105970A JP 2021977 A JP2021977 A JP 2021977A JP 2021977 A JP2021977 A JP 2021977A JP S53105970 A JPS53105970 A JP S53105970A
Authority
JP
Japan
Prior art keywords
pellet
semiconductor device
assembling method
frame
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021977A
Other languages
Japanese (ja)
Inventor
Keizo Otsuki
Tokuo Matsumoto
Mitsunori Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2021977A priority Critical patent/JPS53105970A/en
Publication of JPS53105970A publication Critical patent/JPS53105970A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the pellet crack and to obtain a uniform frame, by eliminating the tab of the hood frame, protruding a lead over the inner side of the pellet fixing position, and attaching the pellet to the terminal part via an insulating adhesive layer to assemble the wiring.
COPYRIGHT: (C)1978,JPO&Japio
JP2021977A 1977-02-28 1977-02-28 Assembling method for semiconductor device Pending JPS53105970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021977A JPS53105970A (en) 1977-02-28 1977-02-28 Assembling method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021977A JPS53105970A (en) 1977-02-28 1977-02-28 Assembling method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS53105970A true JPS53105970A (en) 1978-09-14

Family

ID=12021042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021977A Pending JPS53105970A (en) 1977-02-28 1977-02-28 Assembling method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS53105970A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57944U (en) * 1980-05-30 1982-01-06
JPS61218139A (en) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk Semiconductor device
JPS63222454A (en) * 1987-03-11 1988-09-16 Mitsui Haitetsuku:Kk Semiconductor device and manufacture thereof
JPS63165846U (en) * 1987-04-17 1988-10-28
JPH01114058A (en) * 1987-10-28 1989-05-02 Hitachi Ltd Resin-sealed semiconductor device
JPH01231333A (en) * 1988-03-10 1989-09-14 Hitachi Ltd Manufacture of semiconductor device
JPH01231332A (en) * 1988-03-11 1989-09-14 Hitachi Ltd Manufacture of semiconductor device
JPH01238128A (en) * 1988-03-18 1989-09-22 Nec Corp Resin seal type semiconductor device
JPH01276656A (en) * 1988-04-27 1989-11-07 Mitsubishi Electric Corp Resin sealed semiconductor
JPH02153557A (en) * 1988-12-05 1990-06-13 Nec Corp Resin sealed type semiconductor device
JPH0327562A (en) * 1989-06-23 1991-02-05 Nec Corp Semiconductor device
JPH0346358A (en) * 1989-07-14 1991-02-27 Oki Electric Ind Co Ltd Resin-sealed semiconductor device and manufacture thereof
JPH03128936U (en) * 1990-12-27 1991-12-25
JPH08227903A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Semiconductor device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57944U (en) * 1980-05-30 1982-01-06
US4943843A (en) * 1985-03-25 1990-07-24 Hitachi, Ltd. Semiconductor device
JPS61218139A (en) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk Semiconductor device
US5126821A (en) * 1985-03-25 1992-06-30 Hitachi, Ltd. Semiconductor device having inner leads extending over a surface of a semiconductor pellet
JPS63222454A (en) * 1987-03-11 1988-09-16 Mitsui Haitetsuku:Kk Semiconductor device and manufacture thereof
JPS63165846U (en) * 1987-04-17 1988-10-28
JPH01114058A (en) * 1987-10-28 1989-05-02 Hitachi Ltd Resin-sealed semiconductor device
JPH01231333A (en) * 1988-03-10 1989-09-14 Hitachi Ltd Manufacture of semiconductor device
JPH01231332A (en) * 1988-03-11 1989-09-14 Hitachi Ltd Manufacture of semiconductor device
JPH01238128A (en) * 1988-03-18 1989-09-22 Nec Corp Resin seal type semiconductor device
JPH01276656A (en) * 1988-04-27 1989-11-07 Mitsubishi Electric Corp Resin sealed semiconductor
JPH02153557A (en) * 1988-12-05 1990-06-13 Nec Corp Resin sealed type semiconductor device
JPH0327562A (en) * 1989-06-23 1991-02-05 Nec Corp Semiconductor device
JPH0346358A (en) * 1989-07-14 1991-02-27 Oki Electric Ind Co Ltd Resin-sealed semiconductor device and manufacture thereof
JPH03128936U (en) * 1990-12-27 1991-12-25
JPH08227903A (en) * 1995-12-28 1996-09-03 Hitachi Vlsi Eng Corp Semiconductor device
JP2756436B2 (en) * 1995-12-28 1998-05-25 日立超エル・エス・アイ・エンジニアリング 株式会社 Semiconductor device and manufacturing method thereof

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