JPS57944U - - Google Patents
Info
- Publication number
- JPS57944U JPS57944U JP7469580U JP7469580U JPS57944U JP S57944 U JPS57944 U JP S57944U JP 7469580 U JP7469580 U JP 7469580U JP 7469580 U JP7469580 U JP 7469580U JP S57944 U JPS57944 U JP S57944U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7469580U JPS57944U (en) | 1980-05-30 | 1980-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7469580U JPS57944U (en) | 1980-05-30 | 1980-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57944U true JPS57944U (en) | 1982-01-06 |
Family
ID=29437394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7469580U Pending JPS57944U (en) | 1980-05-30 | 1980-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57944U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111373A (en) * | 1974-07-19 | 1976-01-29 | Hitachi Ltd | DOBEESURIIDOFUREEMU |
| JPS52143764A (en) * | 1976-05-26 | 1977-11-30 | Hitachi Ltd | Metal connecting method |
| JPS53105970A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Assembling method for semiconductor device |
-
1980
- 1980-05-30 JP JP7469580U patent/JPS57944U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111373A (en) * | 1974-07-19 | 1976-01-29 | Hitachi Ltd | DOBEESURIIDOFUREEMU |
| JPS52143764A (en) * | 1976-05-26 | 1977-11-30 | Hitachi Ltd | Metal connecting method |
| JPS53105970A (en) * | 1977-02-28 | 1978-09-14 | Hitachi Ltd | Assembling method for semiconductor device |