JPS5414674A - Lead fram an resin-sealed electronic parts using it - Google Patents

Lead fram an resin-sealed electronic parts using it

Info

Publication number
JPS5414674A
JPS5414674A JP7987477A JP7987477A JPS5414674A JP S5414674 A JPS5414674 A JP S5414674A JP 7987477 A JP7987477 A JP 7987477A JP 7987477 A JP7987477 A JP 7987477A JP S5414674 A JPS5414674 A JP S5414674A
Authority
JP
Japan
Prior art keywords
resin
electronic parts
sealed electronic
fram
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7987477A
Other languages
Japanese (ja)
Inventor
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7987477A priority Critical patent/JPS5414674A/en
Publication of JPS5414674A publication Critical patent/JPS5414674A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To improve the reliability of an electronic part by preventing moisture and impurity from affecting a pellet, by providing a through-hole at the circumference of a tub constituting a lead frame while avoiding the region of the semiconductor pellet to be fixed to the circumference.
COPYRIGHT: (C)1979,JPO&Japio
JP7987477A 1977-07-06 1977-07-06 Lead fram an resin-sealed electronic parts using it Pending JPS5414674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7987477A JPS5414674A (en) 1977-07-06 1977-07-06 Lead fram an resin-sealed electronic parts using it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7987477A JPS5414674A (en) 1977-07-06 1977-07-06 Lead fram an resin-sealed electronic parts using it

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP856884A Division JPS59155160A (en) 1984-01-23 1984-01-23 Resin seal type electronic part utilizing lead frame

Publications (1)

Publication Number Publication Date
JPS5414674A true JPS5414674A (en) 1979-02-03

Family

ID=13702360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7987477A Pending JPS5414674A (en) 1977-07-06 1977-07-06 Lead fram an resin-sealed electronic parts using it

Country Status (1)

Country Link
JP (1) JPS5414674A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676542A (en) * 1979-11-28 1981-06-24 Hitachi Ltd Resin-sealed semiconductor device
JPS58150945U (en) * 1982-04-02 1983-10-08 株式会社山本産業 pellet house

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676542A (en) * 1979-11-28 1981-06-24 Hitachi Ltd Resin-sealed semiconductor device
JPS58150945U (en) * 1982-04-02 1983-10-08 株式会社山本産業 pellet house
JPS6224449Y2 (en) * 1982-04-02 1987-06-22

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