JPS5394874A - Connecting method for semiconductor device - Google Patents

Connecting method for semiconductor device

Info

Publication number
JPS5394874A
JPS5394874A JP1007877A JP1007877A JPS5394874A JP S5394874 A JPS5394874 A JP S5394874A JP 1007877 A JP1007877 A JP 1007877A JP 1007877 A JP1007877 A JP 1007877A JP S5394874 A JPS5394874 A JP S5394874A
Authority
JP
Japan
Prior art keywords
semiconductor device
connecting method
fitting
secure
easy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1007877A
Other languages
Japanese (ja)
Other versions
JPS5751935B2 (en
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1007877A priority Critical patent/JPS5394874A/en
Publication of JPS5394874A publication Critical patent/JPS5394874A/en
Publication of JPS5751935B2 publication Critical patent/JPS5751935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To secure an easy and high-intensity connection, by fitting the convex part of the external lead terminal to the concave part of the substrate connection terminal.
COPYRIGHT: (C)1978,JPO&Japio
JP1007877A 1977-01-31 1977-01-31 Connecting method for semiconductor device Granted JPS5394874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1007877A JPS5394874A (en) 1977-01-31 1977-01-31 Connecting method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1007877A JPS5394874A (en) 1977-01-31 1977-01-31 Connecting method for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5394874A true JPS5394874A (en) 1978-08-19
JPS5751935B2 JPS5751935B2 (en) 1982-11-05

Family

ID=11740311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1007877A Granted JPS5394874A (en) 1977-01-31 1977-01-31 Connecting method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5394874A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
JPH03123046A (en) * 1981-07-17 1991-05-24 British Telecommun Plc <Bt> Method of manufacturing tape for automatic bonding

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152147A (en) * 1981-03-16 1982-09-20 Matsushita Electric Ind Co Ltd Formation of metal projection on metal lead
JPH03123046A (en) * 1981-07-17 1991-05-24 British Telecommun Plc <Bt> Method of manufacturing tape for automatic bonding
JPH0371778B2 (en) * 1981-07-17 1991-11-14 Buriteitsushu Terekomyunikeeshonzu Plc

Also Published As

Publication number Publication date
JPS5751935B2 (en) 1982-11-05

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