JPH11163412A - Led illuminator - Google Patents

Led illuminator

Info

Publication number
JPH11163412A
JPH11163412A JP32262697A JP32262697A JPH11163412A JP H11163412 A JPH11163412 A JP H11163412A JP 32262697 A JP32262697 A JP 32262697A JP 32262697 A JP32262697 A JP 32262697A JP H11163412 A JPH11163412 A JP H11163412A
Authority
JP
Japan
Prior art keywords
substrate
emitting diode
light emitting
lighting device
led lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32262697A
Other languages
Japanese (ja)
Inventor
Sakuo Kamata
策雄 鎌田
Shoichi Koyama
昇一 小山
Nobuyuki Asahi
信行 朝日
Toshiyuki Suzuki
俊之 鈴木
Eiji Shiohama
英二 塩浜
Masaru Sugimoto
勝 杉本
Shohei Yamamoto
正平 山本
Jiro Hashizume
二郎 橋爪
Yasushi Akiba
泰史 秋庭
Koji Tanaka
孝司 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP32262697A priority Critical patent/JPH11163412A/en
Priority to TW087119454A priority patent/TW408497B/en
Priority to EP98203973A priority patent/EP0921568B1/en
Priority to US09/199,893 priority patent/US6331063B1/en
Priority to DE69841798T priority patent/DE69841798D1/en
Publication of JPH11163412A publication Critical patent/JPH11163412A/en
Priority to US09/895,354 priority patent/US20020006040A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PROBLEM TO BE SOLVED: To provide a LED illuminator which can easily obtain arbitrary luminous intensity distribution characteristic, while being formed thin. SOLUTION: A large number concavities 11 are arranged vertically and horizontally on one side of a rectangular plate-type molded interconnection device(MID) substrate 1, and three LED chips are implemented on the bottom of each concavity 11. Since a plurality of LED chips 1 are implemented in each of the concavity 11 and positioned three-dimensionally on MID substrate 10, arbitrary luminous intensity distribution characteristic can be easily obtained according to the shape of the substrate 10, while forming a module thin. If the plurality of the LED chips 1 are implemented, which have one or more different luminescent colors, preferably at least three colors of red, blue and green, delicate color differences such as white light of a fluorescent lamp and daylight can be realized in the light of the overall module by mixing the luminescent colors from each of LED chips 1.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、基板に複数個の発
光ダイオード素子を配設して成るＬＥＤ照明装置に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lighting device having a plurality of light emitting diode elements arranged on a substrate.

【０００２】[0002]

【従来の技術】従来、光源に白熱灯や蛍光灯を用いた照
明装置では可視光以外に赤外線や紫外線も放射されてお
り、このような可視光以外の光が被照射物（例えば、美
術品や食品等）に良くない影響を与えていることが多か
った。また、このような照明装置では光源（ランプ）に
寿命があり、交換が必要である。2. Description of the Related Art Conventionally, in an illuminating device using an incandescent lamp or a fluorescent lamp as a light source, infrared rays and ultraviolet rays are radiated in addition to visible light. And food). In such a lighting device, the light source (lamp) has a limited life and needs to be replaced.

【０００３】一方、最近では高輝度の発光ダイオード
（以下、「ＬＥＤ」と略す。）が開発され、このような
単体のＬＥＤ（ＬＥＤディスクリート）５０を図２５及
び図２６に示すように基板５１上に複数個実装してモジ
ュール化することにより、赤外線や紫外線等の有害光線
が放射されない照明装置が使用されてきている。このよ
うなＬＥＤ照明装置では、白熱灯や蛍光灯のような光源
に比較して、寿命が長く、ランプ交換等のメンテナンス
が不要となって使い勝手が良いという利点がある。On the other hand, recently, a high-brightness light emitting diode (hereinafter abbreviated as “LED”) has been developed, and such a single LED (LED discrete) 50 is mounted on a substrate 51 as shown in FIGS. A lighting device that does not emit harmful rays such as infrared rays and ultraviolet rays by mounting a plurality of modules on a module has been used. Such an LED lighting device has an advantage that it has a longer service life than a light source such as an incandescent lamp or a fluorescent lamp, does not require maintenance such as lamp replacement, and is easy to use.

【０００４】[0004]

【発明が解決しようとする課題】ところで、上述のよう
に種々の利点を有するＬＥＤ照明装置ではあるが、以下
に述べるような問題を有している。すなわち、ＬＥＤ５
０は単波長（単色）であるために白色光が得られず、且
つ光の指向性が強いために波長（発光色）の異なるＬＥ
Ｄ５０を混在して基板５１に実装しても各色の光が完全
に混じらずに白色光源を得ることが難しく、特に被照射
物の影が虹色に見えてしまう。よって、蛍光灯を光源と
する照明装置のように昼光色と白色のような微妙な色差
を実現させることが不可能である。また、ＬＥＤ５０を
基板５１に高密度で実装すると各ＬＥＤ５０からの発熱
で温度が上昇し、発光効率及び輝度が低下してしまうと
ともに、各ＬＥＤ５０の寿命が短くなってしまう。さら
に、ＬＥＤ５０の高さ寸法が大きいために薄型化が困難
である。Although the LED lighting device has various advantages as described above, it has the following problems. That is, LED5
Since 0 is a single wavelength (monochromatic), white light cannot be obtained, and LE has a different wavelength (emission color) because the light has a high directivity.
Even if D50 is mixed and mounted on the substrate 51, it is difficult to obtain a white light source because the lights of the respective colors are not completely mixed, and particularly, the shadow of the irradiated object looks rainbow-colored. Therefore, it is impossible to realize a subtle color difference such as daylight and white as in a lighting device using a fluorescent lamp as a light source. Further, when the LEDs 50 are mounted on the substrate 51 at a high density, the temperature rises due to the heat generated from each LED 50, and the luminous efficiency and the luminance are reduced, and the life of each LED 50 is shortened. Furthermore, it is difficult to reduce the thickness of the LED 50 because the height of the LED 50 is large.

【０００５】本発明は上記問題に鑑みて為されたもので
あり、請求項１及び請求項１２〜１４の発明の目的とす
るところは、任意の配光が容易に得られるとともに薄型
化が可能なＬＥＤ照明装置を提供することにあり、ま
た、請求項２及び請求項１５，１６の発明の目的とする
ところは、白色や昼光色のような微妙な色差が実現可能
なＬＥＤ照明装置を提供することにあり、さらに、請求
項４〜１１の発明の目的とするところは、温度上昇を抑
えて発光効率及び輝度の低下を防止し発光ダイオード素
子の寿命も長くできるＬＥＤ照明装置を提供することに
ある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the inventions of claims 1 and 12 to 14 that an arbitrary light distribution can be easily obtained and the thickness can be reduced. Another object of the present invention is to provide an LED lighting device capable of realizing a subtle color difference such as white or daylight. Another object of the present invention is to provide an LED lighting device capable of suppressing a rise in temperature, preventing a decrease in luminous efficiency and luminance, and extending the life of a light emitting diode element. is there.

【０００６】[0006]

【課題を解決するための手段】請求項１の発明は、上記
目的を達成するために、基板に凹部又は凸部の少なくと
も一方を複数形成するとともに、上記各凹部又は凸部に
各々１乃至複数の発光ダイオード素子を配設したことを
特徴とし、任意の配光が容易に得られるとともに薄型化
が可能となる。According to a first aspect of the present invention, at least one of a concave portion and a convex portion is formed on a substrate, and one or more concave portions or convex portions are formed on each of the concave portions or the convex portions. The light emitting diode element of the above is disposed, and any light distribution can be easily obtained and the thickness can be reduced.

【０００７】請求項２の発明は、請求項１の発明におい
て、上記複数の発光ダイオード素子に発光色の異なる１
乃至複数種の発光ダイオード素子を含むことを特徴と
し、白色や昼光色のような微妙な色差が実現可能とな
る。請求項３の発明は、請求項１又は２の発明におい
て、上記凹部又は凸部に上記発光ダイオード素子からの
光を反射する反射手段を設けたことを特徴とし、高輝度
並びに高効率化が図れる。According to a second aspect of the present invention, in the first aspect of the present invention, the plurality of light emitting diode elements have different emission colors.
In addition, the light emitting device includes a plurality of types of light emitting diode elements, and can realize a subtle color difference such as white or daylight. According to a third aspect of the present invention, in the first or second aspect of the present invention, a reflection means for reflecting light from the light-emitting diode element is provided in the concave portion or the convex portion, so that high brightness and high efficiency can be achieved. .

【０００８】請求項４の発明は、請求項１の発明におい
て、上記基板の少なくとも一部に複数の発光ダイオード
素子のグランドとなる金属板を設け、該金属板に上記発
光ダイオード素子を接触させて成ることを特徴とし、発
光ダイオード素子が発する熱を金属板により効率良く放
熱することができ、温度上昇を抑えて発光効率や輝度の
低下が防止できるとともに発光ダイオード素子の寿命が
延ばせる。According to a fourth aspect of the present invention, in the first aspect of the present invention, a metal plate serving as a ground for a plurality of light emitting diode elements is provided on at least a part of the substrate, and the light emitting diode elements are brought into contact with the metal plate. The heat generated by the light emitting diode element can be efficiently dissipated by the metal plate, the temperature rise can be suppressed, the luminous efficiency and the luminance can be prevented from lowering, and the life of the light emitting diode element can be extended.

【０００９】請求項５の発明は、請求項１の発明におい
て、少なくとも上記基板の凹部又は凸部の発光ダイオー
ド素子の周りに当該発光ダイオード素子からの光を反射
する金属製の放熱体を配設したことを特徴とし、発光ダ
イオード素子が発する熱を金属製の放熱体により効率良
く放熱することができ、温度上昇を抑えて発光効率や輝
度の低下が防止できるとともに発光ダイオード素子の寿
命が延ばせる。According to a fifth aspect of the present invention, in the first aspect of the present invention, a metal radiator that reflects light from the light emitting diode element is disposed at least around the light emitting diode element in the concave or convex portion of the substrate. The heat generated by the light emitting diode element can be efficiently radiated by the metal radiator, the temperature rise can be suppressed, the luminous efficiency and the luminance can be prevented from lowering, and the life of the light emitting diode element can be extended.

【００１０】請求項６の発明は、請求項１の発明におい
て、上記基板に銅張金属基板を一体に形成し、該銅張金
属基板の一方の面に形成された銅張部分に上記発光ダイ
オード素子を実装してグランドとし、上記発光ダイオー
ド素子の発光を制御する制御手段を構成する回路素子を
上記銅張金属基板の他方の面に実装したことを特徴と
し、小型化が図れるとともに制御手段のノイズに対する
シールドも可能になる。According to a sixth aspect of the present invention, in the first aspect of the present invention, a copper-clad metal substrate is integrally formed on the substrate, and the light-emitting diode is provided on a copper-clad portion formed on one surface of the copper-clad metal substrate. The element is mounted as a ground, and a circuit element constituting control means for controlling light emission of the light emitting diode element is mounted on the other surface of the copper-clad metal substrate, so that miniaturization can be achieved and the control means Shielding against noise is also possible.

【００１１】請求項７の発明は、請求項１の発明におい
て、上記発光ダイオード素子から発する熱を放熱する放
熱体を備え、該放熱体に複数の凹凸部を設けたことを特
徴とし、発光ダイオード素子が発する熱を放熱体により
効率良く放熱することができ、特に凹凸部を設けること
で放熱体の表面積を増加させて効率良く放熱することが
でき、温度上昇を抑えて発光効率や輝度の低下が防止で
きるとともに発光ダイオード素子の寿命が延ばせる。According to a seventh aspect of the present invention, there is provided the light emitting diode according to the first aspect, further comprising a radiator for radiating heat generated from the light emitting diode element, wherein the radiator is provided with a plurality of uneven portions. The heat generated by the element can be efficiently dissipated by the radiator. Particularly, by providing the uneven portion, the surface area of the radiator can be increased and the heat can be dissipated more efficiently. Can be prevented and the life of the light emitting diode element can be extended.

【００１２】請求項８の発明は、請求項１の発明におい
て、上記発光ダイオード素子の少なくとも一部分に接触
する放熱フィンを備えたことを特徴とし、発光ダイオー
ド素子が発する熱を放熱フィンにより効率良く放熱する
ことができ、温度上昇を抑えて発光効率や輝度の低下が
防止できるとともに発光ダイオード素子の寿命が延ばせ
る。According to an eighth aspect of the present invention, in the first aspect of the present invention, a heat radiation fin is provided which contacts at least a part of the light emitting diode element, and the heat generated by the light emitting diode element is efficiently radiated by the heat radiation fin. In addition, the temperature rise can be suppressed, the luminous efficiency and the luminance can be prevented from lowering, and the life of the light emitting diode element can be extended.

【００１３】請求項９の発明は、請求項１の発明におい
て、上記発光ダイオード素子と少なくとも一部で接触す
る放熱ピンを上記基板内に埋設したことを特徴とし、発
光ダイオード素子が発する熱を放熱ピンにより効率良く
放熱することができ、温度上昇を抑えて発光効率や輝度
の低下が防止できるとともに発光ダイオード素子の寿命
が延ばせる。According to a ninth aspect of the present invention, in the first aspect of the present invention, a heat radiating pin at least partially in contact with the light emitting diode element is buried in the substrate to radiate heat generated by the light emitting diode element. The heat can be efficiently dissipated by the pins, and a rise in temperature can be suppressed to prevent a decrease in luminous efficiency and luminance, and a life of the light emitting diode element can be extended.

【００１４】請求項１０の発明は、請求項１の発明にお
いて、上記基板の凸部を多層に形成したことを特徴と
し、発光ダイオード素子が発する熱を空気の対流で発散
させ、発光ダイオード素子の温度上昇を抑えて発光効率
や輝度の低下が防止できるとともに発光ダイオード素子
の寿命が延ばせる。請求項１１の発明は、請求項１の発
明において、上記発光ダイオード素子近傍の上記基板に
通風用の貫通孔を設けたことを特徴とし、貫通孔を通る
空気の対流で発光ダイオード素子からの熱を発散させ、
発光ダイオード素子の温度上昇を抑えて発光効率や輝度
の低下が防止できるとともに発光ダイオード素子の寿命
が延ばせる。According to a tenth aspect of the present invention, in the first aspect of the present invention, the convex portion of the substrate is formed in multiple layers, and the heat generated by the light emitting diode element is radiated by convection of air, and It is possible to prevent a decrease in luminous efficiency and luminance by suppressing a rise in temperature and extend the life of the light emitting diode element. According to an eleventh aspect of the present invention, in the first aspect of the invention, a through hole for ventilation is provided in the substrate near the light emitting diode element, and heat from the light emitting diode element is generated by convection of air passing through the through hole. Diverge,
The temperature rise of the light emitting diode element can be suppressed to prevent a decrease in luminous efficiency and luminance, and the life of the light emitting diode element can be extended.

【００１５】請求項１２の発明は、請求項１の発明にお
いて、上記発光ダイオード素子を、当該発光ダイオード
素子のＰ型半導体とＮ型半導体とが上記基板の実装面に
対して略平行に並ぶように配設したことを特徴とし、発
光ダイオード素子の実装にワイヤボンディングを使用せ
ずに済み、発光効率を増大できるとともにワイヤの影が
生じるのを防ぎ、配光特性の設計自由度を拡げることが
できる。According to a twelfth aspect of the present invention, in the first aspect of the present invention, the light emitting diode elements are arranged such that a P-type semiconductor and an N-type semiconductor of the light emitting diode elements are arranged substantially parallel to a mounting surface of the substrate. This feature eliminates the need for wire bonding to mount light-emitting diode elements, increases luminous efficiency, prevents shadows of wires, and increases the degree of freedom in designing light distribution characteristics. it can.

【００１６】請求項１３の発明は、請求項１の発明にお
いて、上記複数の発光ダイオード素子の発光方向に規則
性を持たせるように上記基板を形成したことを特徴と
し、基板の形状に応じて容易に配光特性を制御すること
ができる。請求項１４の発明は、請求項１の発明におい
て、上記基板の両面に凹部又は凸部の少なくとも一方を
形成するとともに、上記各凹部又は凸部に各々１乃至複
数の発光ダイオード素子を配設したことを特徴とし、光
の照射範囲を基板周囲の略全方向に拡げることができ
る。According to a thirteenth aspect of the present invention, in the first aspect of the present invention, the substrate is formed so as to have regularity in the light emitting direction of the plurality of light emitting diode elements. The light distribution characteristics can be easily controlled. According to a fourteenth aspect of the present invention, in the first aspect of the present invention, at least one of a concave portion and a convex portion is formed on both surfaces of the substrate, and one or a plurality of light emitting diode elements are disposed in each of the concave portions or the convex portions. With this feature, the light irradiation range can be extended in almost all directions around the substrate.

【００１７】請求項１５の発明は、請求項１の発明にお
いて、１乃至複数の上記凹部又は凸部を有し該凹部又は
凸部に発光色の異なる複数種の発光ダイオード素子を配
設してセルを構成し、該セルを複数個用いて形成される
ことを特徴とし、製造工程で発生した不良あるいは経年
劣化により一部の発光ダイオード素子が不点灯になった
場合、当該不点灯となった発光ダイオード素子が含まれ
るセルのみを交換することで安価に復旧させることがで
きる。また、混色あるいは配光特性の異なるセルを組み
合わせるようにすれば、装飾用のＬＥＤ照明装置が簡単
な構成で実現できる。According to a fifteenth aspect of the present invention, in the first aspect of the present invention, a plurality of types of light-emitting diode elements having one or more of the concave portions or the convex portions and having different emission colors are disposed in the concave portions or the convex portions. A cell is formed, and is formed by using a plurality of the cells, and when some of the light emitting diode elements are turned off due to a defect or aging deterioration occurring in a manufacturing process, the light is turned off. By replacing only the cell containing the light emitting diode element, it is possible to restore the cell at low cost. Also, by combining cells having different color mixing or light distribution characteristics, a decorative LED lighting device can be realized with a simple configuration.

【００１８】請求項１６の発明は、請求項１の発明にお
いて、上記発光ダイオード素子を微振動させる手段を上
記基板に設けたことを特徴とし、特定の発光ダイオード
素子を振動させることで任意の混色及び配光特性を得る
ことができ、また振動を制御することで人に不快感を与
える光のちらつき特性を改善することができる。請求項
１７の発明は、請求項１の発明において、上記基板を撓
み自在に形成したことを特徴とし、基板を自在に曲げる
ことができて配光特性を容易に変えることが可能とな
り、しかも基板の弾性を利用してねじ等を使わずにハウ
ジング等に容易に取り付けることができる。According to a sixteenth aspect of the present invention, in the first aspect of the present invention, a means for finely vibrating the light emitting diode element is provided on the substrate. In addition, light distribution characteristics can be obtained, and the flickering characteristics of light that gives a discomfort to a person can be improved by controlling the vibration. According to a seventeenth aspect of the present invention, in the first aspect of the present invention, the substrate is formed to be flexible, and the light distribution characteristic can be easily changed by freely bending the substrate. It can be easily attached to a housing or the like without using a screw or the like by utilizing the elasticity.

【００１９】請求項１８の発明は、請求項１の発明にお
いて、所定個数の上記発光ダイオード素子が含まれる寸
法単位に上記基板を切断自在としたことを特徴とし、必
要な照度が得られるような寸法に基板を切断して使用す
ることができて効率的であり、しかも基板を大きな単位
で作成することが可能でコストダウンが図れる。An eighteenth aspect of the present invention is characterized in that, in the first aspect of the present invention, the substrate can be cut in a dimensional unit including a predetermined number of the light emitting diode elements, so that a required illuminance can be obtained. Since the substrate can be cut into dimensions and used, it is efficient, and the substrate can be made in large units, thereby reducing costs.

【００２０】[0020]

【発明の実施の形態】（実施形態１）図１は本発明の実
施形態１を示す要部側面断面図、図２は同じく斜視図で
ある。図２に示すように矩形板状のＭＩＤ（立体回路成
形品）基板１０の片面に多数の凹部１１が縦横に配設さ
れ、その凹部１１の底面に３個の発光ダイオード素子
（以下、「ＬＥＤチップ」と略す。）１が実装されてい
る。(Embodiment 1) FIG. 1 is a side sectional view of a main part showing Embodiment 1 of the present invention, and FIG. 2 is a perspective view of the same. As shown in FIG. 2, a large number of recesses 11 are arranged vertically and horizontally on one side of a rectangular plate-shaped MID (three-dimensional circuit molded product) substrate 10, and three light emitting diode elements (hereinafter, referred to as “LED”) are provided on the bottom surface of the recess 11. Abbreviated as “chip”).

【００２１】次に上記ＭＩＤ基板（以下、単に「基板」
と呼ぶ。）１０の製造工程について説明する。ポリイミ
ド、ポリエーテルイミド、ポリアミド、液晶ポリマ等の
電気絶縁性材料を用い、射出成形によって絶縁性基材を
形成する。そして、ＬＥＤチップ１の実装箇所に凹部１
１を設ける等して３次元の立体形状の絶縁性基材を形成
する。Next, the MID substrate (hereinafter simply referred to as “substrate”)
Call. 10) Manufacturing steps will be described. An insulating substrate is formed by injection molding using an electrically insulating material such as polyimide, polyetherimide, polyamide, and liquid crystal polymer. Then, the concave portion 1 is provided at the mounting position of the LED chip 1.
1 to form an insulating base material having a three-dimensional three-dimensional shape.

【００２２】この絶縁性基材をアルカリ脱脂した後、そ
の表面をプラズマ処理して表面の活性化及び微細な粗面
化を行う。その後、絶縁性基材の表面にスパッタリング
や真空蒸着等により、銅、銀、金、ニッケル、白金又は
パラジウム等の金属膜（めっき下地層）を形成する。こ
の金属層の厚みは０．１〜２〔μｍ〕程度が望ましい。After the insulating base material is alkali-degreased, its surface is subjected to plasma treatment to activate the surface and finely roughen the surface. Thereafter, a metal film (plating underlayer) such as copper, silver, gold, nickel, platinum, or palladium is formed on the surface of the insulating base material by sputtering, vacuum deposition, or the like. The thickness of this metal layer is desirably about 0.1 to 2 [μm].

【００２３】そして、レーザ等の電磁波を照射して上記
金属膜を除去する。このレーザとしては第２高調波ＹＡ
Ｇレーザ、ＹＡＧレーザ、エキシマレーザ等が好まし
く、ガルバノミラーでレーザ光を走査することにより、
絶縁性基材の表面のうち回路を形成する箇所である回路
部１２以外の部分、すなわち回路部１２間の絶縁スペー
スとなる非回路部１３において照射されるものであり、
非回路部１３の少なくとも回路部１２との境界領域に非
回路部１３のパターンに沿って照射することにより、非
回路部１３の回路部１２との境界領域の金属膜を除去す
るものである。Then, the metal film is removed by irradiating an electromagnetic wave such as a laser. As this laser, the second harmonic YA
G laser, YAG laser, excimer laser, etc. are preferable, and by scanning laser light with a galvanometer mirror,
Irradiation is performed on a portion of the surface of the insulating base material other than the circuit portion 12 which is a portion where a circuit is formed, that is, on a non-circuit portion 13 serving as an insulating space between the circuit portions 12,
By irradiating at least the boundary region between the non-circuit portion 13 and the circuit portion 12 along the pattern of the non-circuit portion 13, the metal film in the boundary region between the non-circuit portion 13 and the circuit portion 12 is removed.

【００２４】次に、回路部１２に給電を行ない、例えば
硫酸銅めっき浴（硫酸銅８０ｇ／ｌ、硫酸１８０ｇ／
ｌ、塩素、光沢剤）で電気銅めっきを行ない、例えばワ
ット浴（硫酸ニッケル２７０ｇ／ｌ、塩化ニッケル５０
ｇ／ｌ、ホウ酸４０ｇ／ｌ、光沢剤）で電気ニッケルめ
っき、電気金めっき（例えば、ＥＥＪＡ社製：商品名テ
ンペレックス４０１）等を行って所定厚の金属膜を形成
した回路基板（基板１０）を得る。非回路部１３の残存
した金属膜は、必要に応じてソフトエッチング等で除去
してもよい。Next, power is supplied to the circuit section 12 and, for example, a copper sulfate plating bath (copper sulfate 80 g / l, sulfuric acid 180 g /
l, chlorine, brightener), for example, using a Watts bath (270 g / l nickel sulfate, 50% nickel chloride).
g / l, boric acid 40 g / l, brightener) by electro-nickel plating, electro-gold plating (for example, manufactured by EEJA: trade name: Temperex 401) or the like to form a circuit board (substrate) having a predetermined thickness of metal film Obtain 10). The remaining metal film of the non-circuit portion 13 may be removed by soft etching or the like as necessary.

【００２５】上記方法により得られた基板１０の凹部１
１にＬＥＤチップ１を実装し、回路部１２とＬＥＤチッ
プ１を導電性接着剤で電気的に接合する（ダイボン
ド）。その後にＬＥＤチップ１の上部電極と回路部１２
とを金線１４で接合する（ワイボンド）。なお、ＬＥＤ
チップ１が実装される凹部１１の内面１１ａを鏡面に仕
上げて反射板を兼ねる構造とすることで、高輝度及び高
効率化を図ることができる。その次に凹部１１内に透明
樹脂を充填してＬＥＤチップ１を封止する。このとき上
記透明樹脂が凹部１１の外に流れ出ないように、基板１
０に堰を設けることが望ましい。最後に基板１０の表面
（実装面）に透明樹脂等から成る拡散板１５を取り付け
て、本実施形態のＬＥＤ照明装置のモジュールが完成す
る。The concave portion 1 of the substrate 10 obtained by the above method
1, the LED chip 1 is mounted, and the circuit section 12 and the LED chip 1 are electrically bonded with a conductive adhesive (die bonding). Thereafter, the upper electrode of the LED chip 1 and the circuit portion 12
Are bonded by a gold wire 14 (Wybond). In addition, LED
By finishing the inner surface 11a of the concave portion 11 on which the chip 1 is mounted to a mirror surface and also serving as a reflecting plate, high luminance and high efficiency can be achieved. Next, the recess 11 is filled with a transparent resin to seal the LED chip 1. At this time, the substrate 1 is so protected that the transparent resin does not flow out of the recess 11.
It is desirable to provide a weir at zero. Finally, a diffusion plate 15 made of a transparent resin or the like is attached to the surface (mounting surface) of the substrate 10 to complete the module of the LED lighting device of the present embodiment.

【００２６】上述のように複数個のＬＥＤチップ１を凹
部１１内に実装してＭＩＤの基板１０に立体的に配置す
るため、基板１０の形状に応じて任意の配光特性が容易
に得られるとともに、ディスクリート型の発光ダイオー
ドを基板上に多数配設した従来例に比較してモジュール
の薄型化が可能となる。また、実装するＬＥＤチップ１
に発光色の異なる１種類以上、望ましくは赤、青、緑の
３種類を少なくとも含む複数種のＬＥＤチップ１を実装
するようにすれば、各ＬＥＤチップ１の発光色を混色さ
せて、モジュール全体の光に蛍光灯における白色や昼光
色のような微妙な色差を実現することができる。As described above, since a plurality of LED chips 1 are mounted in the recesses 11 and are three-dimensionally arranged on the MID substrate 10, an arbitrary light distribution characteristic can be easily obtained according to the shape of the substrate 10. At the same time, the thickness of the module can be reduced as compared with a conventional example in which a large number of discrete light emitting diodes are arranged on a substrate. LED chip 1 to be mounted
If a plurality of types of LED chips 1 including at least one type having different emission colors, desirably at least three types of red, blue, and green are mounted on the LED module, the emission colors of the LED chips 1 are mixed, and the entire module is mounted. A subtle color difference such as white or daylight in a fluorescent lamp can be realized for this light.

【００２７】なお、本実施形態では基板１０に凹部１１
を設けて３次元形状を形成したが、これに限定する主旨
ではなく、例えば基板１０に凸部を設けて該凸部にＬＥ
Ｄチップ１を実装したり、その他の種々の３次元形状に
基板１０を形成することでＬＥＤチップ１を立体的に配
置するようにすればよい。 （実施形態２）図３は本発明の実施形態２を示す側面断
面図である。本実施形態は、基板１０の裏面（反実装
面）にＬＥＤチップ１を含む回路のグランドとなる金属
板１６を設け、凹部１１の底面に露出させた金属板１６
上にＬＥＤチップ１を実装して、ＬＥＤチップ１が発す
る熱を金属板１６により効率良く放熱させるようにした
点に特徴がある。なお、その他の構成については実施形
態１と共通であるから、共通する部分に同一の符号を付
して説明を省略する。In this embodiment, the concave portion 11 is formed on the substrate 10.
Is formed to form a three-dimensional shape. However, the present invention is not limited to this. For example, a protrusion may be provided on the substrate 10 and LE may be provided on the protrusion.
The LED chip 1 may be arranged three-dimensionally by mounting the D chip 1 or forming the substrate 10 in various other three-dimensional shapes. (Embodiment 2) FIG. 3 is a side sectional view showing Embodiment 2 of the present invention. In this embodiment, a metal plate 16 serving as a ground of a circuit including the LED chip 1 is provided on the back surface (anti-mounting surface) of the substrate 10, and the metal plate 16 exposed on the bottom surface of the concave portion 11 is provided.
It is characterized in that the LED chip 1 is mounted thereon, and the heat generated by the LED chip 1 is efficiently radiated by the metal plate 16. Since other configurations are the same as those of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted.

【００２８】次に本実施形態の基板１０の製造工程につ
いて、実施形態１と異なる点のみを説明する。適当な大
きさ、形状の金属板（例えば、銅板）１６を金型の中に
入れてインサート射出成形によって絶縁性基材を形成す
る。電気絶縁性材料には実施形態１と同様にポリイミ
ド、ポリエーテルイミド、ポリアミド、液晶ポリマ等を
用いる。金属板１６は予め板金加工、機械加工、科学的
なエッチング等によって立体形状に形成してもよい。Next, with respect to the manufacturing process of the substrate 10 of the present embodiment, only differences from the first embodiment will be described. A metal plate (for example, a copper plate) 16 having an appropriate size and shape is placed in a mold, and an insulating base material is formed by insert injection molding. As in the first embodiment, polyimide, polyetherimide, polyamide, liquid crystal polymer, or the like is used as the electrically insulating material. The metal plate 16 may be previously formed into a three-dimensional shape by sheet metal processing, machining, scientific etching, or the like.

【００２９】ここで、成形と同時にＬＥＤチップ１が実
装される凹部１１の底面から金属板１６を露出させる
か、あるいは成形後にレーザ又はホーニングにより成形
樹脂を取り除くことで上記底面から金属板１６を露出さ
せる。その絶縁性基材をアルカリ脱脂した後、金属板１
６を活性化するために表面を化学エッチングする。その
次に絶縁性基材の表面をプラズマ処理して表面の活性化
及び微細な粗面化を行う。以下実施形態１と同様に、金
属層を形成し回路部１２並びに非回路部１３を形成し
て、最終的に凹部１１内にＬＥＤチップ１を実装し且つ
透明樹脂で封止して、基板１０の実装面に拡散板１５を
取り付けることでＬＥＤ照明装置のモジュールが完成す
る。Here, the metal plate 16 is exposed from the bottom surface of the concave portion 11 in which the LED chip 1 is mounted at the same time as molding, or the molding plate is removed by laser or honing after molding to expose the metal plate 16 from the bottom surface. Let it. After the insulating substrate is alkali-degreased, the metal plate 1
The surface is chemically etched to activate 6. Then, the surface of the insulating base material is plasma-treated to activate the surface and to make the surface rough. Hereinafter, in the same manner as in the first embodiment, a metal layer is formed, a circuit portion 12 and a non-circuit portion 13 are formed, and finally, the LED chip 1 is mounted in the concave portion 11 and sealed with a transparent resin. The module of the LED lighting device is completed by attaching the diffusion plate 15 to the mounting surface of the LED lighting device.

【００３０】上述のように本実施形態によれば、金属板
１６を回路の共通のグランドとすることで金属板１６に
ＬＥＤチップ１を実装して金属板１６とＬＥＤチップ１
とを直接接触させ、ＬＥＤチップ１から発生する熱を金
属板１６によって効率良く放熱し取り除くことができ
る。そのため、ＬＥＤチップ１の温度上昇が防げ、発光
効率や輝度の低下を抑えることができ、また、ＬＥＤチ
ップ１の寿命も延ばすことができる。As described above, according to the present embodiment, the LED chip 1 is mounted on the metal plate 16 by using the metal plate 16 as a common ground of the circuit, and the metal plate 16 and the LED chip 1
And the heat generated from the LED chip 1 can be efficiently radiated and removed by the metal plate 16. Therefore, a rise in the temperature of the LED chip 1 can be prevented, a decrease in luminous efficiency and luminance can be suppressed, and the life of the LED chip 1 can be extended.

【００３１】（実施形態３）図４は本発明の実施形態３
を示す要部側面断面図、図５は同じく平面図である。本
実施形態は、基板１０に実装されたＬＥＤチップ１の周
囲に金属等から成り光を反射する放熱体１７を配設し、
ＬＥＤチップ１の放熱用の放熱板１７を反射板に兼用し
た点に特徴がある。なお、その他の構成については実施
形態１と共通であるから、共通する部分に同一の符号を
付して説明を省略する。(Embodiment 3) FIG. 4 shows Embodiment 3 of the present invention.
And FIG. 5 is a plan view of the same. In the present embodiment, a radiator 17 made of metal or the like and reflecting light is disposed around the LED chip 1 mounted on the substrate 10,
It is characterized in that the heat radiating plate 17 for radiating the LED chip 1 is also used as a reflecting plate. Since other configurations are the same as those of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted.

【００３２】次に本実施形態の基板１０の製造工程につ
いて、実施形態１と異なる点のみを説明する。適当な大
きさ、形状の放熱板（例えば、銅板）１７を金型の中に
入れてインサート射出成形によって絶縁性基材を形成す
る。電気絶縁性材料には実施形態１と同様にポリイミ
ド、ポリエーテルイミド、ポリアミド、液晶ポリマ等を
用いる。放熱板１７は予め板金加工、機械加工、科学的
なエッチング等によって反射板と成るような立体形状
（具体的にはＬＥＤチップ１が実装される凹部１７ａが
多数配設された形状）に形成してある。Next, with respect to the manufacturing process of the substrate 10 of the present embodiment, only differences from the first embodiment will be described. A heat sink (for example, a copper plate) 17 having an appropriate size and shape is placed in a mold, and an insulating base material is formed by insert injection molding. As in the first embodiment, polyimide, polyetherimide, polyamide, liquid crystal polymer, or the like is used as the electrically insulating material. The heat radiating plate 17 is formed in advance into a three-dimensional shape (specifically, a shape in which a large number of concave portions 17a on which the LED chips 1 are mounted) by using sheet metal processing, machining, scientific etching, or the like. It is.

【００３３】その絶縁性基材をアルカリ脱脂した後、放
熱板１７を活性化するために表面を化学エッチングす
る。その次に絶縁性基材の表面をプラズマ処理して表面
の活性化及び微細な粗面化を行う。以下、金属層を形成
し回路部１２並びに非回路部１３を形成して、最終的に
放熱板１７の凹部１７ａ内にＬＥＤチップ１を実装し且
つ透明樹脂で封止して、基板１０の実装面に拡散板１５
を取り付けることでＬＥＤ照明装置のモジュールが完成
する。After the insulating base material is alkali-degreased, the surface thereof is chemically etched to activate the heat radiating plate 17. Then, the surface of the insulating base material is plasma-treated to activate the surface and to make the surface rough. Hereinafter, the metal layer is formed, the circuit portion 12 and the non-circuit portion 13 are formed, and finally, the LED chip 1 is mounted in the concave portion 17a of the heat sink 17 and sealed with a transparent resin to mount the substrate 10. Diffuser 15 on the surface
The module of the LED lighting device is completed by attaching the.

【００３４】上述のように本実施形態によれば、反射板
を兼ねる放熱板１７をＬＥＤチップ１の周りに配設した
ことにより、放熱板１７とＬＥＤチップ１とを直接接触
させ、ＬＥＤチップ１から発生する熱を放熱板１７によ
って効率良く放熱し取り除くことができる。そのため、
ＬＥＤチップ１の温度上昇が防げ、発光効率や輝度の低
下を抑えることができ、また、ＬＥＤチップ１の寿命も
延ばすことができる。As described above, according to the present embodiment, since the heat radiating plate 17 also serving as the reflecting plate is disposed around the LED chip 1, the heat radiating plate 17 and the LED chip 1 are brought into direct contact with each other, Can be efficiently radiated and removed by the heat radiating plate 17. for that reason,
A rise in the temperature of the LED chip 1 can be prevented, a decrease in luminous efficiency and luminance can be suppressed, and the life of the LED chip 1 can be extended.

【００３５】（実施形態４）図６は本発明の実施形態３
を示す要部側面断面図である。本実施形態は、基板１０
の凹部１１内面に光を反射する金属膜（例えば、銅膜）
を形成し、この金属膜をＬＥＤチップ１の放熱を行う放
熱体１８と反射板とに兼用した点に特徴がある。なお、
その他の構成については実施形態１と共通であるから、
共通する部分に同一の符号を付して説明を省略する。(Embodiment 4) FIG. 6 shows Embodiment 3 of the present invention.
FIG. In the present embodiment, the substrate 10
Metal film (for example, copper film) reflecting light on the inner surface of the concave portion 11
This is characterized in that this metal film is used also as a radiator 18 for radiating heat of the LED chip 1 and a reflector. In addition,
Since other configurations are common to the first embodiment,
Common parts are denoted by the same reference numerals, and description thereof is omitted.

【００３６】次に本実施形態の基板１０の製造工程につ
いて、実施形態１と異なる点のみを説明する。ポリイミ
ド、ポリエーテルイミド、ポリアミド、液晶ポリマ等の
電気絶縁性材料を用い、射出成形によって絶縁性基材を
形成する。そして、ＬＥＤチップ１の実装箇所に凹部１
１を設ける等して３次元の立体形状の絶縁性基材を形成
する。この絶縁性基材をアルカリ脱脂した後、その表面
をプラズマ処理して表面の活性化及び微細な粗面化を行
う。その後、絶縁性基材の表面にスパッタリングや真空
蒸着等により、銅、銀、金、ニッケル、白金又はパラジ
ウム等の金属膜（めっき下地層）を形成する。Next, with respect to the manufacturing process of the substrate 10 of the present embodiment, only differences from the first embodiment will be described. An insulating substrate is formed by injection molding using an electrically insulating material such as polyimide, polyetherimide, polyamide, and liquid crystal polymer. Then, the concave portion 1 is provided at the mounting position of the LED chip 1.
1 to form an insulating base material having a three-dimensional three-dimensional shape. After alkali-degreasing the insulating base material, the surface is subjected to plasma treatment to activate the surface and finely roughen the surface. Thereafter, a metal film (plating underlayer) such as copper, silver, gold, nickel, platinum, or palladium is formed on the surface of the insulating base material by sputtering, vacuum deposition, or the like.

【００３７】そして、レーザ等の電磁波を照射して上記
金属膜を除去して配線パターンを形成する（レーザパタ
ーニング）のであるが、この時凹部１１の内面に形成さ
れている金属膜（放熱体１８）の全体が回路部１２を構
成するように金属膜を除去する。以下、放熱体１８が形
成された凹部１１の底面にＬＥＤチップ１を実装し且つ
透明樹脂で封止して、基板１０の実装面に拡散板１５を
取り付けることでＬＥＤ照明装置のモジュールが完成す
る。Then, the metal film is removed by irradiating an electromagnetic wave such as a laser to form a wiring pattern (laser patterning). At this time, the metal film (radiator 18) formed on the inner surface of the concave portion 11 is formed. The metal film is removed so that the whole of () constitutes the circuit section 12. Hereinafter, the LED chip 1 is mounted on the bottom surface of the recess 11 in which the heat radiator 18 is formed, sealed with a transparent resin, and the diffusion plate 15 is mounted on the mounting surface of the substrate 10 to complete the module of the LED lighting device. .

【００３８】上述のように本実施形態においても、金属
膜（金属めっき）を放熱体１８と反射板とに兼用してＬ
ＥＤチップ１の周りに配設したことにより、放熱体１８
とＬＥＤチップ１とを直接接触させ、ＬＥＤチップ１か
ら発生する熱を放熱体１８によって効率良く放熱し取り
除くことができる。そのため、ＬＥＤチップ１の温度上
昇が防げ、発光効率や輝度の低下を抑えることができ、
また、ＬＥＤチップ１の寿命も延ばすことができる。As described above, also in this embodiment, the metal film (metal plating) is used as the heat radiator 18 and the reflection plate, and
The arrangement around the ED chip 1 allows the heat radiator 18
And the LED chip 1 are brought into direct contact with each other, and the heat generated from the LED chip 1 can be efficiently radiated and removed by the radiator 18. Therefore, a rise in the temperature of the LED chip 1 can be prevented, and a decrease in luminous efficiency and luminance can be suppressed.
In addition, the life of the LED chip 1 can be extended.

【００３９】（実施形態５）図７は本発明の実施形態５
を示す要部側面断面図である。本実施形態では、多数の
凹部１１が片面に形成されたＭＩＤ基板１０の反対側の
面に銅張金属基板（以下、単に「金属基板」と呼ぶ。）
１９を設け、この金属基板１９の導電層１９ａをＬＥＤ
チップ１のグランドとするとともに、ＬＥＤチップ１の
発光を制御する制御回路を構成するＩＣ、抵抗、コンデ
ンサ等の回路素子（チップ部品）２０を金属基板１９の
絶縁層１９ｂに実装した点に特徴がある。なお、その他
の構成については実施形態１と共通であるから、共通す
る部分に同一の符号を付して説明を省略する。(Embodiment 5) FIG. 7 shows Embodiment 5 of the present invention.
FIG. In the present embodiment, a copper-clad metal substrate (hereinafter simply referred to as a “metal substrate”) is provided on a surface on the opposite side of the MID substrate 10 in which a large number of concave portions 11 are formed on one surface.
The conductive layer 19a of the metal substrate 19 is
A feature is that a circuit element (chip component) 20 such as an IC, a resistor, and a capacitor, which constitutes a control circuit for controlling light emission of the LED chip 1, is mounted on an insulating layer 19 b of a metal substrate 19 while being used as a ground for the chip 1. is there. Since other configurations are the same as those of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted.

【００４０】次に本実施形態の基板１０の製造工程につ
いて簡単に説明する。まず金属基板１９を金型の中に入
れてインサート射出成形によって絶縁性基材を形成す
る。電気絶縁性材料には実施形態１と同様にポリイミ
ド、ポリエーテルイミド、ポリアミド、液晶ポリマ等を
用いる。その絶縁性基材をアルカリ脱脂した後、絶縁性
基材の表面をプラズマ処理して表面の活性化及び微細な
粗面化を行う。その後は、金属層を形成し回路部１２並
びに非回路部１３を形成した後、基板１０の凹部１１底
面に露出した金属基板１９の導電層１９ａ上にＬＥＤチ
ップ１を実装し且つ透明樹脂で封止する。Next, a brief description will be given of a manufacturing process of the substrate 10 of the present embodiment. First, the metal substrate 19 is placed in a mold and an insulating base material is formed by insert injection molding. As in the first embodiment, polyimide, polyetherimide, polyamide, liquid crystal polymer, or the like is used as the electrically insulating material. After the insulating base material is alkali-degreased, the surface of the insulating base material is plasma-treated to activate the surface and finely roughen the surface. Thereafter, after forming a metal layer to form the circuit portion 12 and the non-circuit portion 13, the LED chip 1 is mounted on the conductive layer 19a of the metal substrate 19 exposed on the bottom surface of the concave portion 11 of the substrate 10, and sealed with a transparent resin. Stop.

【００４１】ここで、本実施形態では凹部１１に実装さ
れたＬＥＤチップ１を透明樹脂で封止した後に、金属基
板１９の絶縁層１９ｂに制御回路を形成するための回路
（配線）パターンを形成する。このパターン形成方法
は、プリント基板の一般的な形成方法である露光・エッ
チング法でもレーザパターニング法の何れでもよい。そ
して、上記回路パターン形成後にＩＣ、抵抗、コンデン
サ等の回路素子（チップ部品）２０を半田実装すること
でＬＥＤ照明装置のモジュールが完成する。Here, in this embodiment, after sealing the LED chip 1 mounted in the concave portion 11 with a transparent resin, a circuit (wiring) pattern for forming a control circuit is formed on the insulating layer 19 b of the metal substrate 19. I do. This pattern forming method may be any of a general method of forming a printed circuit board, such as an exposure / etching method or a laser patterning method. Then, after the circuit pattern is formed, a circuit element (chip component) 20 such as an IC, a resistor, or a capacitor is mounted by soldering to complete the module of the LED lighting device.

【００４２】上述のように本実施形態によれば、基板１
０にインサート成形された銅張金属板１９の導電層１９
ａにＬＥＤチップ１を実装してグランドとすることによ
り、金属基板１９とＬＥＤチップ１とを直接接触させて
ＬＥＤチップ１から発する熱を金属基板１９により効率
良く放熱し取り除くことができる。そのため、ＬＥＤチ
ップ１の温度上昇が防げ、発光効率や輝度の低下を抑え
ることができ、また、ＬＥＤチップ１の寿命も延ばすこ
とができる。しかも、金属基板１９の絶縁層１９ｂにＬ
ＥＤチップ１の発光を制御する制御回路等の回路素子２
０を実装するようにしたため、モジュールの小型化が可
能になるとともにノイズに対する回路素子２０のシール
ドも図れるという利点がある。According to the present embodiment as described above, the substrate 1
Conductive layer 19 of copper-clad metal plate 19 insert-molded
By mounting the LED chip 1 on a and making it ground, the metal substrate 19 and the LED chip 1 are brought into direct contact, and the heat generated from the LED chip 1 can be efficiently radiated and removed by the metal substrate 19. Therefore, a rise in the temperature of the LED chip 1 can be prevented, a decrease in luminous efficiency and luminance can be suppressed, and the life of the LED chip 1 can be extended. In addition, the insulating layer 19b of the metal substrate 19 has L
Circuit element 2 such as a control circuit for controlling light emission of ED chip 1
0 is mounted, so that the module can be reduced in size and the circuit element 20 can be shielded against noise.

【００４３】（実施形態６）図８は本発明の実施形態６
を示す要部側面断面図である。本実施形態は、表面に凹
凸を設けた放熱体（金属板）２１の片面にＭＩＤ基板１
０を形成し、この基板１０の表面に形成された凹部１１
内の底面及び側面にＬＥＤチップ１を実装した点に特徴
がある。(Embodiment 6) FIG. 8 shows Embodiment 6 of the present invention.
FIG. In the present embodiment, the MID substrate 1 is provided on one surface of a heat radiator (metal plate) 21 having irregularities on the surface.
0, and a concave portion 11 formed on the surface of the substrate 10
It is characterized in that the LED chip 1 is mounted on the bottom and side surfaces inside.

【００４４】次に本実施形態の基板１０の製造工程につ
いて簡単に説明する。表面に凹凸を形成した金属板（例
えば、銅板）２１を金型の中に入れてインサート射出成
形によって基板１０を形成する。電気絶縁性材料には実
施形態１と同様にポリイミド、ポリエーテルイミド、ポ
リアミド、液晶ポリマ等を用いる。金属板２１は予め板
金加工、機械加工、科学的なエッチング等によって凹凸
を有する立体形成（具体的にはＬＥＤチップ１が実装さ
れる凹部１１に対応した凹部２１ａが多数形成してあ
る。Next, the manufacturing process of the substrate 10 of the present embodiment will be briefly described. A metal plate (for example, a copper plate) 21 having an uneven surface is placed in a mold and the substrate 10 is formed by insert injection molding. As in the first embodiment, polyimide, polyetherimide, polyamide, liquid crystal polymer, or the like is used as the electrically insulating material. The metal plate 21 is formed in advance into a three-dimensional structure having irregularities by sheet metal processing, machining, scientific etching, or the like (specifically, a large number of concave portions 21a corresponding to the concave portions 11 on which the LED chips 1 are mounted).

【００４５】その成形基板をアルカリ脱脂した後、金属
板２１を活性化するために表面を化学エッチングする。
その次に絶縁性基材の表面をプラズマ処理して表面の活
性化及び微細な粗面化を行う。以下、金属層を形成し回
路部１２並びに非回路部１３を形成する。そして、最終
的には基板１０の凹部１１内にＬＥＤチップ１を実装し
且つ透明樹脂で封止して、基板１０の実装面に拡散板１
５を取り付けることでＬＥＤ照明装置のモジュールが完
成する。After the molded substrate is degreased with an alkali, the surface is chemically etched to activate the metal plate 21.
Then, the surface of the insulating base material is plasma-treated to activate the surface and to make the surface rough. Hereinafter, a circuit layer 12 and a non-circuit section 13 are formed by forming a metal layer. Finally, the LED chip 1 is mounted in the concave portion 11 of the substrate 10 and sealed with a transparent resin, and the diffusion plate 1 is mounted on the mounting surface of the substrate 10.
By attaching 5, the module of the LED lighting device is completed.

【００４６】上述のように本実施形態によれば、表面に
凹凸を設けることで金属板２１の表面積を増やしたこと
により、ＬＥＤチップ１から発生する熱を効率良く放熱
し取り除くことができる。そのため、ＬＥＤチップ１の
温度上昇が防げ、発光効率や輝度の低下を抑えることが
でき、また、ＬＥＤチップ１の寿命も延ばすことができ
る。As described above, according to the present embodiment, since the surface area of the metal plate 21 is increased by providing irregularities on the surface, the heat generated from the LED chip 1 can be efficiently radiated and removed. Therefore, a rise in the temperature of the LED chip 1 can be prevented, a decrease in luminous efficiency and luminance can be suppressed, and the life of the LED chip 1 can be extended.

【００４７】（実施形態７）図９は本発明の実施形態７
を示す要部側面断面図である。本実施形態は、ＬＥＤチ
ップ１の少なくとも一部分に接触する放熱フィン２２を
備えた点に特徴がある。放熱フィン２２はアルミダイカ
スト製であって、金型の中に入れてインサート射出成形
により基板１０と一体に形成される。電気絶縁性材料に
は実施形態１と同様にポリイミド、ポリエーテルイミ
ド、ポリアミド、液晶ポリマ等を用いる。その成形基板
をアルカリ脱脂した後、放熱フィン２２を活性化するた
めに表面を化学エッチングする。その次に絶縁性基材の
表面をプラズマ処理して表面の活性化及び微細な粗面化
を行う。以下、金属層を形成し回路部１２並びに非回路
部１３を形成する。そして、最終的に基板１０の凹部１
１内にＬＥＤチップ１を実装し且つ透明樹脂で封止し
て、基板１０の実装面に拡散板１５を取り付けることで
ＬＥＤ照明装置のモジュールが完成する。ここで、凹部
１１内に実装したＬＥＤチップ１の一部が放熱フィン２
２と接触させてある。(Embodiment 7) FIG. 9 shows Embodiment 7 of the present invention.
FIG. The present embodiment is characterized in that a radiation fin 22 that contacts at least a part of the LED chip 1 is provided. The radiating fins 22 are made of aluminum die-cast, and are formed integrally with the substrate 10 by insert injection molding in a mold. As in the first embodiment, polyimide, polyetherimide, polyamide, liquid crystal polymer, or the like is used as the electrically insulating material. After the molded substrate is degreased with an alkali, the surface is chemically etched to activate the radiation fins 22. Then, the surface of the insulating base material is plasma-treated to activate the surface and to make the surface rough. Hereinafter, a circuit layer 12 and a non-circuit section 13 are formed by forming a metal layer. And finally, the concave portion 1 of the substrate 10
1, the LED chip 1 is mounted therein, sealed with a transparent resin, and a diffusion plate 15 is attached to the mounting surface of the substrate 10, thereby completing the module of the LED lighting device. Here, a part of the LED chip 1 mounted in the recess 11 is
2 contacted.

【００４８】上述のように本実施形態によれば、ＬＥＤ
チップ１の少なくとも一部に接触する放熱フィン２２を
基板１０と一体成形したことにより、ＬＥＤチップ１か
ら発生する熱を放熱フィン２２により効率良く放熱し取
り除くことができる。そのため、ＬＥＤチップ１の温度
上昇が防げ、発光効率や輝度の低下を抑えることがで
き、また、ＬＥＤチップ１の寿命も延ばすことができ
る。As described above, according to the present embodiment, the LED
Since the heat radiation fins 22 that contact at least a part of the chip 1 are formed integrally with the substrate 10, the heat generated from the LED chip 1 can be efficiently radiated and removed by the heat radiation fins 22. Therefore, a rise in the temperature of the LED chip 1 can be prevented, a decrease in luminous efficiency and luminance can be suppressed, and the life of the LED chip 1 can be extended.

【００４９】（実施形態８）図１０は本発明の実施形態
８を示す要部側面断面図である。ＭＩＤの基板２３の片
面に多数の凸部２４が縦横に配設され、その凸部２４の
頂点にＬＥＤチップ１が実装してある。上記基板２３の
製造工程について簡単に説明する。ポリイミド、ポリエ
ーテルイミド、ポリアミド、液晶ポリマ等の電気絶縁性
材料を用い、射出成形によって絶縁性基材を形成する。
そして、ＬＥＤチップ１の実装箇所に凸部２４を形成す
るとともに凸部２４内にスルーホール２５を形成する。(Eighth Embodiment) FIG. 10 is a side sectional view showing a main part of an eighth embodiment of the present invention. A large number of protrusions 24 are arranged vertically and horizontally on one side of a substrate 23 of the MID, and the LED chip 1 is mounted on the top of the protrusions 24. The manufacturing process of the substrate 23 will be briefly described. An insulating substrate is formed by injection molding using an electrically insulating material such as polyimide, polyetherimide, polyamide, and liquid crystal polymer.
Then, the protrusion 24 is formed at the mounting position of the LED chip 1 and the through hole 25 is formed in the protrusion 24.

【００５０】この絶縁性基材をアルカリ脱脂した後、そ
の表面をプラズマ処理して表面の活性化及び微細な粗面
化を行う。その後、絶縁性基材の表面にスパッタリング
や真空蒸着等により、銅、銀、金、ニッケル、白金又は
パラジウム等の金属膜（めっき下地層）を形成する。そ
して、レーザ等の電磁波を照射して非回路部の回路部と
の境界領域の金属膜を除去する。次に、回路部に給電を
行ない、例えば硫酸銅めっき浴で電気銅めっきを行なて
所定厚の金属膜を形成した回路基板（基板２３）を得
る。そして、凸部２４に形成したスルーホール２５内に
放熱ピン２６を圧入する。After the insulating base material is alkali-degreased, its surface is subjected to plasma treatment to activate the surface and to make it finely roughened. Thereafter, a metal film (plating underlayer) such as copper, silver, gold, nickel, platinum, or palladium is formed on the surface of the insulating base material by sputtering, vacuum deposition, or the like. Then, the metal film in the boundary region between the non-circuit portion and the circuit portion is removed by irradiating an electromagnetic wave such as a laser. Next, power is supplied to the circuit portion, and for example, electrolytic copper plating is performed in a copper sulfate plating bath to obtain a circuit board (substrate 23) on which a metal film having a predetermined thickness is formed. Then, the heat radiating pins 26 are press-fitted into the through holes 25 formed in the convex portions 24.

【００５１】上記方法により得られた基板２３の凸部２
４にＬＥＤチップ１を実装し、回路部（放熱ピン２６を
含む）とＬＥＤチップ１を導電性接着剤で電気的に接合
する（ダイボンド）。その後にＬＥＤチップ１の上部電
極と回路部とを金線で接合する（ワイボンド）。なお、
ＬＥＤチップ１が実装される凸部２４の周囲斜面２４ａ
を鏡面に仕上げて反射板を兼ねる構造とすることで、高
輝度及び高効率化を図ることができる。その次に透明樹
脂によりＬＥＤチップ１を封止する。最後に基板１０の
表面（実装面）に透明樹脂等から成る拡散板を取り付け
て、本実施形態のＬＥＤ照明装置のモジュールが完成す
る。The convex portion 2 of the substrate 23 obtained by the above method
4, the LED chip 1 is mounted, and the circuit portion (including the heat radiation pins 26) and the LED chip 1 are electrically bonded with a conductive adhesive (die bonding). Thereafter, the upper electrode of the LED chip 1 and the circuit portion are joined by a gold wire (Wybond). In addition,
Slope 24a around convex portion 24 on which LED chip 1 is mounted
By finishing the mirror as a mirror and having a structure that also serves as a reflector, high brightness and high efficiency can be achieved. Next, the LED chip 1 is sealed with a transparent resin. Finally, a diffusion plate made of a transparent resin or the like is attached to the surface (mounting surface) of the substrate 10 to complete the module of the LED lighting device of the present embodiment.

【００５２】上述のように本実施形態によれば、ＬＥＤ
チップ１の下の基板２４内に少なくともＬＥＤチップ１
の一部に接触する放熱ピン２６を設けたことにより、Ｌ
ＥＤチップ１から発生する熱を放熱ピン２６により効率
良く放熱し取り除くことができる。そのため、ＬＥＤチ
ップ１の温度上昇が防げ、発光効率や輝度の低下を抑え
ることができ、また、ＬＥＤチップ１の寿命も延ばすこ
とができる。As described above, according to the present embodiment, the LED
At least the LED chip 1 in the substrate 24 under the chip 1
The heat radiation pin 26 that contacts a part of the
The heat generated from the ED chip 1 can be efficiently radiated by the heat radiation pins 26 and removed. Therefore, a rise in the temperature of the LED chip 1 can be prevented, a decrease in luminous efficiency and luminance can be suppressed, and the life of the LED chip 1 can be extended.

【００５３】（実施形態９）図１１は本発明の実施形態
９を示す要部側面図である。本実施形態は、ＭＩＤの基
板２７に多層の凸部２８を形成して基板２７全体を所謂
タワー形状（螺旋形状）とし、この凸部２８の各層に各
々複数個のＬＥＤチップ１を配設するようにした点に特
徴がある。(Embodiment 9) FIG. 11 is a side view of a main part showing Embodiment 9 of the present invention. In the present embodiment, a multilayer convex portion 28 is formed on an MID substrate 27 so that the entire substrate 27 has a so-called tower shape (spiral shape), and a plurality of LED chips 1 are arranged on each layer of the convex portion 28. There is a characteristic in the point that it did.

【００５４】基板２７はタワー形状に形成された金型を
用いて射出成形される。なお、以降の工程については実
施形態１と共通するので説明を省略する。但し、基板２
７にＬＥＤチップ１を実装した後で合成樹脂による封止
は行わない。ところで、通電によりＬＥＤチップ１の温
度が上昇するとＬＥＤチップ１の近傍の空気が温められ
て上昇気流が発生し、基板２７の凸部２８に沿って空気
が上昇するとともに、基板２７の下方からは温度の低い
空気が流れ込むことでＬＥＤチップ１の熱が奪われて冷
却される。The substrate 27 is injection molded using a mold formed in a tower shape. Note that the subsequent steps are the same as in the first embodiment, and a description thereof will be omitted. However, substrate 2
After the LED chip 1 is mounted on 7, sealing with a synthetic resin is not performed. By the way, when the temperature of the LED chip 1 rises due to energization, the air near the LED chip 1 is warmed and an ascending airflow is generated, so that the air rises along the convex portion 28 of the board 27 and the air from below the board 27 When the low-temperature air flows in, the LED chip 1 is deprived of heat and cooled.

【００５５】上述のように本実施形態では、ＭＩＤの基
板２７に多層の凸部２８を形成して基板２７全体を所謂
タワー形状（螺旋形状）とし、この凸部２８の各層に各
々複数個のＬＥＤチップ１を配設するようにしたことに
より、ＬＥＤチップ１から発する熱を空気の気流（対
流）で発散させてＬＥＤチップ１の温度上昇を防ぐこと
ができる。そのため、ＬＥＤチップ１の発光効率や輝度
の低下を抑えることができ、また、寿命も延ばすことが
できる。As described above, in the present embodiment, the MID substrate 27 is formed with a multi-layered convex portion 28 to make the entire substrate 27 a so-called tower shape (spiral shape). By arranging the LED chip 1, the heat generated from the LED chip 1 can be radiated by the airflow (convection) of the air to prevent the temperature of the LED chip 1 from rising. Therefore, it is possible to suppress a decrease in the luminous efficiency and luminance of the LED chip 1, and to prolong the life.

【００５６】（実施形態１０）図１２は本発明の実施形
態１０を示す要部側面図である。本実施形態は、片面に
多数の凹部３０が形成された基板２９に対し、ＬＥＤチ
ップ１が実装される上記凹部３０と基板２９の裏面側と
を貫通する通風用の貫通孔（スルーホール）３１を設け
た点に特徴がある。(Embodiment 10) FIG. 12 is a side view of a main part showing Embodiment 10 of the present invention. In the present embodiment, a through hole (through hole) 31 for ventilation that penetrates through the concave portion 30 on which the LED chip 1 is mounted and the back surface side of the substrate 29 with respect to the substrate 29 having a large number of concave portions 30 formed on one surface. The feature is that it is provided.

【００５７】ＭＩＤの基板２９の成形時に貫通孔３１を
形成する。なお、以降の工程については実施形態１と共
通するので説明を省略する。但し、基板２９の凹部３０
にＬＥＤチップ１を実装した後で合成樹脂による封止は
行わない。而して、通電によりＬＥＤチップ１の温度が
上昇するとＬＥＤチップ１の近傍の空気が温められて上
昇気流が発生する。そのため、貫通孔３１を通して基板
２９の反対側から温度の低い空気が流れ込み、ＬＥＤチ
ップ１の熱が奪われて冷却される。A through hole 31 is formed when the MID substrate 29 is formed. Note that the subsequent steps are the same as in the first embodiment, and a description thereof will be omitted. However, the concave portion 30 of the substrate 29
After the LED chip 1 is mounted on the substrate, sealing with a synthetic resin is not performed. Thus, when the temperature of the LED chip 1 rises due to energization, the air near the LED chip 1 is heated, and an ascending airflow is generated. Therefore, low-temperature air flows from the opposite side of the substrate 29 through the through hole 31, and the heat of the LED chip 1 is taken away and cooled.

【００５８】上述のように本実施形態では、ＬＥＤチッ
プ１が実装される凹部３０と基板２９の裏面側とを貫通
する通風用の貫通孔３１を設けたことにより、ＬＥＤチ
ップ１から発する熱を空気の気流（対流）で発散させて
ＬＥＤチップ１の温度上昇を防ぐことができる。そのた
め、ＬＥＤチップ１の発光効率や輝度の低下を抑えるこ
とができ、また、寿命も延ばすことができる。As described above, in this embodiment, the heat generated from the LED chip 1 is provided by providing the ventilation through-hole 31 penetrating the recess 30 in which the LED chip 1 is mounted and the back surface of the substrate 29. The LED chip 1 can be prevented from rising in temperature by diverging by air current (convection). Therefore, it is possible to suppress a decrease in the luminous efficiency and luminance of the LED chip 1, and to prolong the life.

【００５９】（実施形態１１）ところで、図１５に示す
ようにＬＥＤチップ１はＰ型半導体１ａとＮ型半導体１
ｂとの接合界面における電子の移動時に発光し、接合界
面を含む平面内で全方向に光が照射されるが、基板１０
へのＬＥＤチップ１の実装方向や金線（ワイヤ）１４に
光が遮られて光の照射方向が制約を受けたり、影ができ
てしまう。(Embodiment 11) As shown in FIG. 15, the LED chip 1 has a P-type semiconductor 1a and an N-type semiconductor 1a.
b, light is emitted when electrons move at the bonding interface, and light is emitted in all directions within a plane including the bonding interface.
The light is blocked by the mounting direction of the LED chip 1 and the gold wire (wire) 14 so that the light irradiation direction is restricted or a shadow is formed.

【００６０】そこで、本実施形態では、図１３に示すよ
うにＬＥＤチップ１をＰ型半導体１ａとＮ型半導体１ｂ
とが基板１０の実装面に対して略平行に並ぶように配設
した点に特徴があり、その他の構成は実施形態１と共通
であるので説明は省略する。図１３に示すようにＬＥＤ
チップ１が実装される部分は周囲より一段高く形成され
ており、その両側にパッド３２が形成してあって、これ
らパッド３２とＬＥＤチップ１のＰ型半導体１ａ及びＮ
型半導体１ｂとの接続は半田や導電性接着剤３３により
行われる。ここでＬＥＤチップ１を１段高く形成された
部分に実装しているため、上記接続時の短絡事故が防止
できる。なお、ＬＥＤチップ１は例えば０．３〔ｍｍ〕
の立方体のものが望ましい。Therefore, in this embodiment, as shown in FIG. 13, the LED chip 1 is made up of a P-type semiconductor 1a and an N-type semiconductor 1b.
Are arranged so as to be substantially parallel to the mounting surface of the substrate 10, and the other configuration is the same as that of the first embodiment. LED as shown in FIG.
The portion on which the chip 1 is mounted is formed one step higher than the surroundings, and pads 32 are formed on both sides thereof. These pads 32 and the P-type semiconductors 1a and N of the LED chip 1 are formed.
The connection with the mold semiconductor 1b is made by solder or a conductive adhesive 33. Here, since the LED chip 1 is mounted on a portion formed one step higher, a short circuit accident at the time of the connection can be prevented. The LED chip 1 has, for example, 0.3 [mm].
Cubes are desirable.

【００６１】上述のように本実施形態によれば、ＬＥＤ
チップ１をＰ型半導体１ａとＮ型半導体１ｂとが基板１
０の実装面に対して略平行に並ぶように配設したことに
より、両者の接合面が基板１０の表面と略直交すること
になり、ＬＥＤチップ１から発する光を基板１０に対し
て垂直な方向に照射するため、金線（ワイヤ）１４で光
が遮られて影ができることもなく、ＬＥＤチップ１の発
光効率を高めることができる。According to the present embodiment as described above, the LED
The chip 1 is composed of a P-type semiconductor 1a and an N-type semiconductor 1b.
By arranging them so as to be substantially parallel to the mounting surface of the substrate 10, the joint surface between them is substantially orthogonal to the surface of the substrate 10, and the light emitted from the LED chip 1 is perpendicular to the substrate 10. Since the light is radiated in the direction, the light is not blocked by the gold wire (wire) 14 and a shadow is not formed, and the luminous efficiency of the LED chip 1 can be increased.

【００６２】なお、図１４に示すようにフィレット部分
に凹所３３を設け、この凹所３３内で導電性接着剤等に
よりＬＥＤチップ１を接合するようにしても、電気的な
接続時における上記短絡の発生が防止できる。上述のよ
うに本実施形態によれば、ＬＥＤチップ１をＰ型半導体
１ａとＮ型半導体１ｂとが基板１０の実装面に対して略
平行に並ぶように配設したことにより、ＬＥＤチップ１
の発光方向が基板１０に対して略平行とすることがで
き、ワイヤ（金線）１４の影がなくなってＬＥＤチップ
１の発光効率を増大させることができる。As shown in FIG. 14, a concave portion 33 is provided in the fillet portion, and the LED chip 1 is joined in the concave portion 33 by a conductive adhesive or the like. The occurrence of a short circuit can be prevented. As described above, according to the present embodiment, the LED chip 1 is arranged such that the P-type semiconductor 1a and the N-type semiconductor 1b are arranged substantially in parallel to the mounting surface of the substrate 10, so that the LED chip 1
Can be made substantially parallel to the substrate 10, and the shadow of the wire (gold wire) 14 is eliminated, so that the luminous efficiency of the LED chip 1 can be increased.

【００６３】（実施形態１２）図１６は本発明の実施形
態１２を示す要部側面断面図である。本実施形態では、
複数のＬＥＤチップ１のの発光方向に規則性を持たせる
ように基板を形成した点に特徴があり、図１６に示すよ
うに基板３４の片面（実装面）を断面鋸歯状に形成し、
各々の斜面３４ａにＬＥＤチップ１が実装してある。(Twelfth Embodiment) FIG. 16 is a side sectional view showing a main part of a twelfth embodiment of the present invention. In this embodiment,
It is characterized in that the substrate is formed so as to have regularity in the light emitting direction of the plurality of LED chips 1, and as shown in FIG. 16, one surface (mounting surface) of the substrate 34 is formed in a saw-tooth cross section.
The LED chip 1 is mounted on each slope 34a.

【００６４】一般にＬＥＤチップ１の基板３４に対する
実装向きと発光方向とには規則性があるが、ＭＩＤの基
板３４を任意の立体形状に形成することにより、所望の
配光や集光特性を得ることができる。そして、完成した
モジュールを、実装されたＬＥＤチップ１の方向が規則
正しく一方向を向くように形成してあるので、光が一方
向の配光になり発光効率がよくなるという利点がある。Generally, the mounting direction of the LED chip 1 with respect to the substrate 34 and the light emitting direction have regularity. However, by forming the MID substrate 34 into an arbitrary three-dimensional shape, desired light distribution and light collecting characteristics are obtained. be able to. Since the completed module is formed so that the direction of the mounted LED chip 1 is regularly directed in one direction, there is an advantage that light is distributed in one direction and light emission efficiency is improved.

【００６５】上述のように本実施形態によれば、複数の
ＬＥＤチップ１の発光方向に規則性を持たせるように基
板３４を形成したので、基板３４の形状に応じて容易に
配光特性を制御することができ、しかもモジュール全体
を考慮した集配光で利用率がよいという利点がある。さ
らに、基板３４の形状によって配光制御が可能であるた
め、別途レンズ等の光学手段を設ける必要がないという
利点がある。As described above, according to the present embodiment, since the substrate 34 is formed so as to have regularity in the light emitting direction of the plurality of LED chips 1, the light distribution characteristics can be easily adjusted according to the shape of the substrate 34. There is an advantage that the light can be controlled, and the light collection and distribution considering the entire module has a high utilization factor. Further, since the light distribution can be controlled depending on the shape of the substrate 34, there is an advantage that it is not necessary to separately provide an optical unit such as a lens.

【００６６】（実施形態１３）ところで、従来からある
ディスクリート型の発光ダイオードでは、例えばＬＥＤ
チップを封止するエポキシ樹脂を砲弾形に形成すること
でレンズの役割を担っており、ほぼ３６０度の全方向に
光を照射することができるが、基板に複数の発光ダイオ
ードを実装する場合には基板に遮られて全周囲方向に光
を照射することが困難になる。(Embodiment 13) By the way, in a conventional discrete light emitting diode, for example, an LED
The epoxy resin that seals the chip has a shell shape and plays the role of a lens, and can irradiate light in almost all directions of 360 degrees. However, when mounting a plurality of light emitting diodes on a substrate, Is blocked by the substrate, making it difficult to irradiate light in all directions.

【００６７】そこで、本実施形態では、図１７に示すよ
うにＭＩＤの基板３５の表裏両面に各々凹部３６を複数
形成し、各凹部３６の底面にＬＥＤチップ１を実装した
点に特徴があり、これにより基板３５の周囲のほぼ全方
向に光を照射することができる。なお、基板３５の製造
方法は実施形態１と共通であるから説明は省略する。上
述のように本実施形態によれば、基板３５の表裏両面に
各々凹部３６を複数形成し、各凹部３６の底面にＬＥＤ
チップ１を実装したことにより、略全方向に光を照射す
ることができ、従来の蛍光灯や白熱灯と同じように使用
することができる。また、基板３５に対するＬＥＤチッ
プ１の実装密度を増大させて全体の輝度を向上させるこ
とができ、さらには配光設計の自由度が大きくなるとい
う利点がある。Therefore, the present embodiment is characterized in that a plurality of recesses 36 are formed on both the front and back surfaces of the MID substrate 35 as shown in FIG. 17, and the LED chip 1 is mounted on the bottom surface of each recess 36. Thus, light can be irradiated to almost all directions around the substrate 35. Note that the method of manufacturing the substrate 35 is the same as that of the first embodiment, and a description thereof will be omitted. As described above, according to the present embodiment, a plurality of recesses 36 are formed on each of the front and back surfaces of the substrate 35, and the LED is provided on the bottom surface of each recess 36.
By mounting the chip 1, light can be emitted in almost all directions, and it can be used in the same manner as a conventional fluorescent lamp or incandescent lamp. Further, there is an advantage that the mounting density of the LED chips 1 on the substrate 35 can be increased to improve the overall luminance, and that the degree of freedom in the light distribution design is increased.

【００６８】（実施形態１４）ところで上記実施形態１
〜１３においては、１枚の基板１０に多数のＬＥＤチッ
プ１が実装されており、例えば製造工程上で発生する不
良や経年劣化によって一部のＬＥＤチップ１が点灯しな
くなった場合でも、当該不点灯のＬＥＤチップ１が含ま
れる基板１０全体を交換する必要があり、不便である。(Embodiment 14) Incidentally, Embodiment 1
13 to 13, a large number of LED chips 1 are mounted on a single substrate 10. For example, even if some of the LED chips 1 do not turn on due to a defect occurring in the manufacturing process or deterioration over time, the LED chip 1 is not affected. It is necessary to replace the entire board 10 including the lit LED chip 1, which is inconvenient.

【００６９】そこで、本実施形態では、数色の単色ＬＥ
Ｄチップ（例えば、赤・緑・青・黄）１ａ〜１ｄの組み
合わせを１つの単位とするモジュールを１セルＳとし、
このセルＳを複数個組み合わせることでＬＥＤ照明装置
を構成するようにした点に特徴がある。図１８に示すよ
うに実施形態１と同様の方法で形成されたシート状の基
板１０の凹部１１には、上記４色のＬＥＤチップ１ａ〜
１ｄをマトリクス状に配置して実装してある（図１９
（ａ）参照）。このように４色のＬＥＤチップ１ａ〜１
ｄが実装された１つの凹部１１を１セルＳとし、図１８
における破線部分で各セル毎にダイシングソーで切断す
る。そして、切断された１セルＳを再度プリント基板等
に実装することで新たにモジュールが構成される（図１
９（ｂ）参照）。上述のように本実施形態によれば、同
一の凹部１１内に実装された４個のＬＥＤチップ１を含
む１セルＳを１つの単位とし、このセルＳを複数個組み
合わせることでＬＥＤ照明装置を構成するようにしたこ
とにより、製造工程で発生した不良あるいは経年劣化に
より一部のＬＥＤチップ１が不点灯になった場合、当該
不点灯となったＬＥＤチップ１が含まれるセルＳのみを
良品と交換することでＬＥＤ照明装置を安価に復旧させ
ることができる。また、混色あるいは配光特性の異なる
セルＳを組み合わせるようにすれば、装飾用のＬＥＤ照
明装置が簡単な構成で実現できるという利点もある。Therefore, in this embodiment, several single-color LEs are used.
A module having a combination of D chips (for example, red / green / blue / yellow) 1a to 1d as one unit is defined as one cell S,
A feature is that an LED lighting device is configured by combining a plurality of the cells S. As shown in FIG. 18, the recesses 11 of the sheet-like substrate 10 formed by the same method as in the first embodiment have LED chips 1 a to
1d are arranged in a matrix and mounted (FIG. 19).
(A)). Thus, the four-color LED chips 1a to 1
One recess 11 in which “d” is mounted is defined as one cell S, and FIG.
Is cut by a dicing saw for each cell at the broken line portion in FIG. Then, by mounting the cut one cell S again on a printed circuit board or the like, a new module is configured.
9 (b)). As described above, according to the present embodiment, one cell S including four LED chips 1 mounted in the same recess 11 is defined as one unit, and an LED lighting device is manufactured by combining a plurality of the cells S. With this configuration, when some of the LED chips 1 become unlit due to a defect or aging deterioration occurring in the manufacturing process, only the cells S including the unlit LED chips 1 are regarded as good products. By replacing the LED lighting device, the LED lighting device can be restored at a low cost. Further, by combining cells S having different color mixing or light distribution characteristics, there is an advantage that an LED lighting device for decoration can be realized with a simple configuration.

【００７０】（実施形態１５）図２０は本発明の実施形
態１５を示す要部斜視図である。本実施形態は、ＭＩＤ
の基板３７にＬＥＤチップ１を微振動させる手段（マイ
クロマシン部３８）を設けた点に特徴がある。マイクロ
マシン部３８は一端が片持ち支持された３つの梁部３８
ａと、その梁部３８ａの上に設けられた水晶板３８ｂと
によって構成され、各梁部３８ａの自由端近傍にそれぞ
れＬＥＤチップ１が配設される。なお、ＬＥＤチップ１
の前方にはレンズ３９を設けることが望ましい。(Embodiment 15) FIG. 20 is a perspective view showing a main part of Embodiment 15 of the present invention. This embodiment uses the MID
This is characterized in that a means (micromachine section 38) for microvibrating the LED chip 1 is provided on the substrate 37 of FIG. The micromachine section 38 includes three beam sections 38 each having one end supported at one end.
a, and a crystal plate 38b provided on the beam portion 38a, and the LED chips 1 are arranged near free ends of the beam portions 38a, respectively. In addition, LED chip 1
Is desirably provided with a lens 39 in front of.

【００７１】次に本実施形態の基板３７の製造工程を、
実施形態１と異なる部分についてのみ説明する。基板３
７はセラミックから成るＭＩＤ基板であり、例えばアル
ミナ粉に滑剤と樹脂を混練したものを射出成形し、所定
の形状をつくり、さらに脱脂乾燥、焼結させてセラミッ
ク成形品（成形基板）を作成する。その後、この成形基
板をアルカリ脱脂した後、セラミックの表面をプラズマ
処理して表面の活性化及び微細な粗面化を行う。次にセ
ラミックの表面にスパッタリング、真空蒸着等の適宜の
方法で銅、銀、金、ニッケル、白金、パラジウム等の金
属膜（めっき下地層）を形成する。この金属膜の厚みは
０．１〜２〔μｍ〕程度が好ましい。以下、実施形態１
と同様にしてパターニングを行って梁部３８ａの上に水
晶の薄板３８ｂを実装し、さらにその上にＬＥＤチップ
１の実装を行ってＬＥＤ照明装置のモジュールが完成す
る。Next, the manufacturing process of the substrate 37 of the present embodiment will be described.
Only parts different from the first embodiment will be described. Substrate 3
Reference numeral 7 denotes a ceramic MID substrate, for example, injection molding of a mixture of alumina powder and a lubricant and a resin to form a predetermined shape, further degrease drying, and sintering to form a ceramic molded product (molded substrate). . Then, after the molded substrate is alkali-degreased, the surface of the ceramic is plasma-treated to activate and finely roughen the surface. Next, a metal film (plating base layer) of copper, silver, gold, nickel, platinum, palladium or the like is formed on the surface of the ceramic by an appropriate method such as sputtering or vacuum evaporation. The thickness of this metal film is preferably about 0.1 to 2 [μm]. Hereinafter, the first embodiment
Patterning is performed in the same manner as described above, a thin quartz plate 38b is mounted on the beam portion 38a, and the LED chip 1 is mounted thereon, thereby completing the module of the LED lighting device.

【００７２】そして、マイクロマシン部３８に電圧を印
加することにより、水晶の逆圧電効果で梁部３８ａを揺
動させることができ、梁部３８ａの上に実装されている
ＬＥＤチップ１を微振動させることができる。而して、
特定のＬＥＤチップ１に微振動を与えることにより、任
意の混色や配光特性を得ることができ、また、印加する
電圧の周波数やレベルに応じて任意の振動をＬＥＤチッ
プ１に与えるように制御すれば、人に不快感を与えるち
らつき特性を改善することができる。Then, by applying a voltage to the micromachine portion 38, the beam portion 38a can be swung by the inverse piezoelectric effect of quartz, and the LED chip 1 mounted on the beam portion 38a is slightly vibrated. be able to. Thus,
By giving a slight vibration to a specific LED chip 1, it is possible to obtain an arbitrary color mixture or light distribution characteristics, and to control the LED chip 1 to apply an arbitrary vibration according to the frequency or level of the applied voltage. This can improve the flicker characteristic that gives a person discomfort.

【００７３】（実施形態１６）図２１は本発明の実施形
態１６を示す斜視図、図２２は側面断面図である。本実
施形態は、ＬＥＤチップ１が立体的に実装されるＭＩＤ
の基板４０とフレキシブル基板４１とを一体に形成し、
撓み（曲げ）自在の基板４２を構成した点に特徴があ
る。(Embodiment 16) FIG. 21 is a perspective view showing Embodiment 16 of the present invention, and FIG. 22 is a side sectional view. In this embodiment, the MID on which the LED chip 1 is mounted three-dimensionally
The substrate 40 and the flexible substrate 41 are integrally formed,
It is characterized in that a flexible (bendable) substrate 42 is formed.

【００７４】ここで、本実施形態の基板３７の製造工程
を、実施形態１と異なる部分についてのみ説明する。予
め回路形成したポリイミド製のフレキシブル基板４１を
金型の中に入れ射出成形によってフレキシブル基板４１
を成形品に転写する。また、ＬＥＤチップ１が実装され
る部分に成形品の厚肉部（凸部）４３を形成する。な
お、曲げを考慮して上記厚肉部４３の間はフレキシブル
基板４１のまま残す。また、樹脂の封止もＬＥＤチップ
１周辺のみで行ない、フレキシブル基板４１を曲げた際
に封止剤が直接曲がらないように考慮し、基板全体とし
て曲げ易いようにしてある。その成形基板をアルカリ脱
脂した後は実施形態１と同様の工程で基板４２を形成す
る。Here, the manufacturing process of the substrate 37 of the present embodiment will be described only for parts different from the first embodiment. A polyimide flexible substrate 41 having a circuit formed in advance is placed in a mold, and the flexible substrate 41 is formed by injection molding.
Is transferred to a molded article. Further, a thick portion (convex portion) 43 of the molded product is formed in a portion where the LED chip 1 is mounted. The flexible board 41 is left between the thick portions 43 in consideration of bending. Also, the resin is sealed only around the LED chip 1, and the flexible substrate 41 is bent so that the sealing agent does not directly bend when the flexible substrate 41 is bent. After the formed substrate is degreased with alkali, the substrate 42 is formed in the same process as in the first embodiment.

【００７５】上述のように本実施形態によれば、ＬＥＤ
チップ１が立体的に実装されるＭＩＤの基板４０とフレ
キシブル基板４１とを一体に形成し、撓み（曲げ）自在
の基板４２を構成したことにより、基板４１を自在に曲
げることができて配光特性を容易に変えることが可能と
なり、しかも基板４１の弾性を利用してねじ等を使わず
に（照明器具の）ハウジング等に容易に取り付けること
ができる。As described above, according to the present embodiment, the LED
Since the MID substrate 40 on which the chip 1 is mounted three-dimensionally and the flexible substrate 41 are integrally formed to form a flexible (bendable) substrate 42, the substrate 41 can be bent freely and light distribution is achieved. The characteristics can be easily changed, and furthermore, the elasticity of the substrate 41 can be used to easily attach to a housing or the like (of a lighting fixture) without using screws or the like.

【００７６】（実施形態１７）図２３は本発明の実施形
態１７を示す斜視図である。本実施形態は、実施形態１
のように複数の凹部１１に各々複数個のＬＥＤチップ１
が実装された基板１０を、所定個数のＬＥＤチップ１が
含まれる寸法単位で切断自在とした点に特徴がある。な
お、基板１０等の基本的な構成は実施形態１と共通であ
るので、共通する部分には同一の符号を付して説明を省
略する。(Embodiment 17) FIG. 23 is a perspective view showing Embodiment 17 of the present invention. This embodiment corresponds to the first embodiment.
As shown in FIG.
Is characterized in that the substrate 10 on which the LED chips 1 are mounted can be cut in units of dimensions including a predetermined number of LED chips 1. Since the basic configuration of the substrate 10 and the like is the same as that of the first embodiment, the common parts are denoted by the same reference numerals and the description thereof will be omitted.

【００７７】図２４に示すように本実施形態の回路は、
基板１０に実装されるＬＥＤチップ１を所定の個数ずつ
直列に接続するとともに、各直列回路を抵抗Ｒ1 …を介
して電源ラインＬ1 とスイッチング素子Ｑ1 のコレクタ
との間に接続し、このスイッチング素子Ｑ1 のエミッタ
を抵抗Ｒ2 を介してグランドラインＬ2 に接続し、さら
に電源ラインＬ1 とグランドラインＬ2 とに各々抵抗Ｒ
3 ，Ｒ4 を介してスイッチング素子Ｑ1 のベースを接続
して構成してある。なお、電源ラインＬ1 −グランドラ
インＬ2 間には直流電圧ＤＣが印加される。As shown in FIG. 24, the circuit of this embodiment
With connecting LED chip 1 to be mounted on the substrate 10 in series by a predetermined number, connected between the collector of the power supply line L 1 and the switching element Q 1 and the respective series circuit through the resistor R 1 ..., the connected to the switching element ground line L 2 through a resistor R 2 to the emitter of Q 1, further each resistor R and the power supply line L 1 and a ground line L 2
3, through R 4 are constituted by connecting the base of the switching element Q 1. Note that a DC voltage DC is applied between the power supply line L 1 and the ground line L 2 .

【００７８】そして、上記ＬＥＤチップ１の直列回路の
間の適当な切断箇所イで基板１０が切断自在となってお
り、必要な個数のＬＥＤチップ１でユニット化できるよ
うにしてある。ここで、ユニット化するＬＥＤチップ１
の個数は、蛍光灯が出力（１０、１５、２０、３０Ｗ）
に応じた管球で形成されるように、出力に対応する個数
とすれば取扱が便利になる。また、切断し易いように基
板１０に溝を設けることが望ましい。なお、基板１０の
製造方法については実施形態１と共通であるから説明は
省略する。The substrate 10 can be cut freely at an appropriate cutting position A between the series circuits of the LED chips 1 so that a required number of LED chips 1 can be unitized. Here, the LED chip 1 to be unitized
Of fluorescent lights output (10, 15, 20, 30 W)
If the number corresponds to the output so that the tube is formed by the tube according to the above, the handling becomes convenient. Further, it is desirable to provide a groove in the substrate 10 so as to be easily cut. Note that the method of manufacturing the substrate 10 is the same as that of the first embodiment, and a description thereof will be omitted.

【００７９】上述のように本実施形態によれば、所定個
数のＬＥＤチップ１が含まれる寸法単位で切断自在とし
たことにより、必要な照度が得られるような寸法に基板
１０を切断して使用することができて効率的であり、し
かも基板１０を大きな単位で作成することが可能でコス
トダウンが図れるという利点がある。As described above, according to the present embodiment, the substrate 10 can be cut to a size such that a required illuminance can be obtained by making it possible to cut the size in a unit including a predetermined number of LED chips 1. This is advantageous in that the substrate 10 can be formed in a large unit and cost can be reduced.

【００８０】[0080]

【発明の効果】請求項１の発明は、基板に凹部又は凸部
の少なくとも一方を複数形成するとともに、上記各凹部
又は凸部に各々１乃至複数の発光ダイオード素子を配設
したので、任意の配光が容易に得られるとともに薄型化
が可能となるという効果がある。According to the first aspect of the present invention, at least one of a plurality of concave portions or convex portions is formed on the substrate, and one or a plurality of light emitting diode elements are disposed in each of the concave portions or convex portions. There is an effect that the light distribution can be easily obtained and the thickness can be reduced.

【００８１】請求項２の発明は、上記複数の発光ダイオ
ード素子に発光色の異なる１乃至複数種の発光ダイオー
ド素子を含むので、白色や昼光色のような微妙な色差が
実現可能となるという効果がある。請求項３の発明は、
請求項１又は２の発明において、上記凹部又は凸部に上
記発光ダイオード素子からの光を反射する反射手段を設
けたので、高輝度並びに高効率化が図れるという効果が
ある。According to the second aspect of the present invention, since the plurality of light emitting diode elements include one or more kinds of light emitting diode elements having different emission colors, a subtle color difference such as white or daylight can be realized. is there. The invention of claim 3 is
According to the first or second aspect of the present invention, since the concave portion or the convex portion is provided with a reflecting means for reflecting light from the light emitting diode element, there is an effect that high luminance and high efficiency can be achieved.

【００８２】請求項４の発明は、上記基板の少なくとも
一部に複数の発光ダイオード素子のグランドとなる金属
板を設け、該金属板に上記発光ダイオード素子を接触さ
せて成るので、発光ダイオード素子が発する熱を金属板
により効率良く放熱することができ、温度上昇を抑えて
発光効率や輝度の低下が防止できるとともに発光ダイオ
ード素子の寿命が延ばせるという効果がある。According to a fourth aspect of the present invention, at least a portion of the substrate is provided with a metal plate serving as a ground for a plurality of light emitting diode elements, and the light emitting diode elements are brought into contact with the metal plate. The generated heat can be efficiently dissipated by the metal plate, and there is an effect that a rise in temperature can be suppressed, a decrease in luminous efficiency and luminance can be prevented, and a life of the light emitting diode element can be extended.

【００８３】請求項５の発明は、少なくとも上記基板の
凹部又は凸部の発光ダイオード素子の周りに当該発光ダ
イオード素子からの光を反射する金属製の放熱体を配設
したので、発光ダイオード素子が発する熱を金属製の放
熱体により効率良く放熱することができ、温度上昇を抑
えて発光効率や輝度の低下が防止できるとともに発光ダ
イオード素子の寿命が延ばせるという効果がある。According to a fifth aspect of the present invention, since a metal radiator for reflecting light from the light emitting diode element is disposed at least around the light emitting diode element in the concave or convex portion of the substrate, the light emitting diode element can be used. The generated heat can be efficiently radiated by the metal radiator, so that the temperature rise can be suppressed, the luminous efficiency and the luminance can be prevented from lowering, and the life of the light emitting diode element can be extended.

【００８４】請求項６の発明は、上記基板に銅張金属基
板を一体に形成し、該銅張金属基板の一方の面に形成さ
れた銅張部分に上記発光ダイオード素子を実装してグラ
ンドとし、上記発光ダイオード素子の発光を制御する制
御手段を構成する回路素子を上記銅張金属基板の他方の
面に実装したので、小型化が図れるとともに制御手段の
ノイズに対するシールドも可能になるという効果があ
る。According to a sixth aspect of the present invention, a copper-clad metal substrate is integrally formed on the substrate, and the light-emitting diode element is mounted on a copper-clad portion formed on one surface of the copper-clad metal substrate to serve as a ground. Since the circuit element constituting the control means for controlling the light emission of the light emitting diode element is mounted on the other surface of the copper-clad metal substrate, it is possible to reduce the size and to shield the control means against noise. is there.

【００８５】請求項７の発明は、上記発光ダイオード素
子から発する熱を放熱する放熱体を備え、該放熱体に複
数の凹凸部を設けたので、発光ダイオード素子が発する
熱を放熱体により効率良く放熱することができ、特に凹
凸部を設けることで放熱体の表面積を増加させて効率良
く放熱することができ、温度上昇を抑えて発光効率や輝
度の低下が防止できるとともに発光ダイオード素子の寿
命が延ばせるという効果がある。According to a seventh aspect of the present invention, a heat radiator for radiating heat generated from the light emitting diode element is provided, and the heat radiator is provided with a plurality of uneven portions. It is possible to radiate heat, especially by providing the uneven part, it is possible to increase the surface area of the radiator and to radiate heat efficiently. This has the effect of extending it.

【００８６】請求項８の発明は、上記発光ダイオード素
子の少なくとも一部分に接触する放熱フィンを備えたの
で、発光ダイオード素子が発する熱を放熱フィンにより
効率良く放熱することができ、温度上昇を抑えて発光効
率や輝度の低下が防止できるとともに発光ダイオード素
子の寿命が延ばせるという効果がある。請求項９の発明
は、上記発光ダイオード素子と少なくとも一部で接触す
る放熱ピンを上記基板内に埋設したので、発光ダイオー
ド素子が発する熱を放熱ピンにより効率良く放熱するこ
とができ、温度上昇を抑えて発光効率や輝度の低下が防
止できるとともに発光ダイオード素子の寿命が延ばせる
という効果がある。According to the eighth aspect of the present invention, since the radiating fin is provided in contact with at least a part of the light emitting diode element, the heat generated by the light emitting diode element can be efficiently radiated by the radiating fin and the temperature rise can be suppressed. This has the effect of preventing a decrease in luminous efficiency and luminance and extending the life of the light emitting diode element. According to the ninth aspect of the present invention, the heat radiating pins that are at least partially in contact with the light emitting diode elements are embedded in the substrate, so that the heat generated by the light emitting diode elements can be efficiently radiated by the heat radiating pins, and the temperature rise can be reduced. It is possible to prevent the reduction of the luminous efficiency and the luminance by suppressing the luminous efficiency and extend the life of the light emitting diode element.

【００８７】請求項１０の発明は、上記基板の凸部を多
層に形成したので、発光ダイオード素子が発する熱を空
気の対流で発散させ、発光ダイオード素子の温度上昇を
抑えて発光効率や輝度の低下が防止できるとともに発光
ダイオード素子の寿命が延ばせるという効果がある。請
求項１１の発明は、上記発光ダイオード素子近傍の上記
基板に通風用の貫通孔を設けたので、貫通孔を通る空気
の対流で発光ダイオード素子からの熱を発散させ、発光
ダイオード素子の温度上昇を抑えて発光効率や輝度の低
下が防止できるとともに発光ダイオード素子の寿命が延
ばせるという効果がある。According to the tenth aspect of the present invention, since the convex portions of the substrate are formed in multiple layers, the heat generated by the light emitting diode element is radiated by convection of air, and the temperature rise of the light emitting diode element is suppressed to reduce the luminous efficiency and luminance. There is an effect that the reduction can be prevented and the life of the light emitting diode element can be extended. According to the eleventh aspect of the present invention, since a through hole for ventilation is provided in the substrate near the light emitting diode element, heat from the light emitting diode element is dissipated by convection of air passing through the through hole, and the temperature of the light emitting diode element rises. Thus, there is an effect that a reduction in luminous efficiency and luminance can be prevented, and a life of the light emitting diode element can be extended.

【００８８】請求項１２の発明は、上記発光ダイオード
素子を、当該発光ダイオード素子のＰ型半導体とＮ型半
導体とが上記基板の実装面に対して略平行に並ぶように
配設したので、発光ダイオード素子の実装にワイヤボン
ディングを使用せずに済み、発光効率を増大できるとと
もにワイヤの影が生じるのを防ぎ、配光特性の設計自由
度を拡げることができるという効果がある。According to a twelfth aspect of the present invention, the light emitting diode element is disposed such that the P-type semiconductor and the N-type semiconductor of the light emitting diode element are arranged substantially in parallel to the mounting surface of the substrate. There is no need to use wire bonding for mounting the diode element, so that the luminous efficiency can be increased, the shadow of the wire can be prevented, and the degree of freedom in designing the light distribution characteristics can be increased.

【００８９】請求項１３の発明は、上記複数の発光ダイ
オード素子の発光方向に規則性を持たせるように上記基
板を形成したので、基板の形状に応じて容易に配光特性
を制御することができるという効果がある。請求項１４
の発明は、上記基板の両面に凹部又は凸部の少なくとも
一方を形成するとともに、上記各凹部又は凸部に各々１
乃至複数の発光ダイオード素子を配設したので、光の照
射範囲を基板周囲の略全方向に拡げることができるとい
う効果がある。According to the thirteenth aspect of the present invention, since the substrate is formed so that the light emitting directions of the plurality of light emitting diode elements have regularity, the light distribution characteristics can be easily controlled according to the shape of the substrate. There is an effect that can be. Claim 14
In the invention, at least one of a concave portion or a convex portion is formed on both surfaces of the substrate, and each of the concave portions or the convex portions is
In addition, since a plurality of light emitting diode elements are provided, there is an effect that the light irradiation range can be extended in almost all directions around the substrate.

【００９０】請求項１５の発明は、１乃至複数の上記凹
部又は凸部を有し該凹部又は凸部に発光色の異なる複数
種の発光ダイオード素子を配設してセルを構成し、該セ
ルを複数個用いて形成されるので、製造工程で発生した
不良あるいは経年劣化により一部の発光ダイオード素子
が不点灯になった場合、当該不点灯となった発光ダイオ
ード素子が含まれるセルのみを交換することで安価に復
旧させることができるという効果がある。また、混色あ
るいは配光特性の異なるセルを組み合わせるようにすれ
ば、装飾用のＬＥＤ照明装置が簡単な構成で実現できる
という効果がある。The invention according to a fifteenth aspect is directed to a cell having one or a plurality of the concave portions or the convex portions, wherein a plurality of types of light emitting diode elements having different emission colors are arranged in the concave portions or the convex portions. When a part of the light emitting diode element becomes unlit due to a defect or aging deterioration in the manufacturing process, only the cell containing the unlit LED element is replaced. By doing so, there is an effect that restoration can be performed at low cost. Further, by combining cells having different color mixing or light distribution characteristics, there is an effect that an LED lighting device for decoration can be realized with a simple configuration.

【００９１】請求項１６の発明は、上記発光ダイオード
素子を微振動させる手段を上記基板に設けたので、特定
の発光ダイオード素子を振動させることで任意の混色及
び配光特性を得ることができ、また振動を制御すること
で人に不快感を与える光のちらつき特性を改善すること
ができるという効果がある。請求項１７の発明は、上記
基板を撓み自在に形成したので、基板を自在に曲げるこ
とができて配光特性を容易に変えることが可能となり、
しかも基板の弾性を利用してねじ等を使わずにハウジン
グ等に容易に取り付けることができるという効果があ
る。According to the sixteenth aspect of the present invention, the means for finely vibrating the light emitting diode element is provided on the substrate, so that an arbitrary color mixing and light distribution characteristics can be obtained by vibrating a specific light emitting diode element. In addition, there is an effect that by controlling the vibration, the flickering property of light that gives a discomfort to a person can be improved. According to the invention of claim 17, since the substrate is formed to be flexible, the substrate can be bent freely and the light distribution characteristics can be easily changed,
In addition, there is an effect that the elasticity of the substrate can be easily attached to a housing or the like without using screws or the like.

【００９２】請求項１８の発明は、所定個数の上記発光
ダイオード素子が含まれる寸法単位に上記基板を切断自
在としたので、必要な照度が得られるような寸法に基板
を切断して使用することができて効率的であり、しかも
基板を大きな単位で作成することが可能でコストダウン
が図れるという効果がある。According to the eighteenth aspect of the present invention, since the substrate can be cut into dimensional units containing a predetermined number of the light emitting diode elements, the substrate can be cut to a size that can provide a required illuminance. Therefore, there is an effect that the substrate can be formed in a large unit, and the cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図１】実施形態１の要部を示す側面断面図である。FIG. 1 is a side sectional view showing a main part of a first embodiment.

【図２】同上を示す斜視図である。FIG. 2 is a perspective view showing the same.

【図３】実施形態２の要部を示す側面断面図である。FIG. 3 is a side sectional view showing a main part of a second embodiment.

【図４】実施形態３の要部を示す側面断面図である。FIG. 4 is a side sectional view showing a main part of a third embodiment.

【図５】同上を示す平面図である。FIG. 5 is a plan view showing the same.

【図６】実施形態４の要部を示す側面断面図である。FIG. 6 is a side sectional view showing a main part of a fourth embodiment.

【図７】実施形態５の要部を示す側面断面図である。FIG. 7 is a side sectional view showing a main part of a fifth embodiment.

【図８】実施形態６の要部を示す側面断面図である。FIG. 8 is a side sectional view showing a main part of a sixth embodiment.

【図９】実施形態７の要部を示す側面断面図である。FIG. 9 is a side sectional view showing a main part of a seventh embodiment.

【図１０】実施形態８の要部を示す側面断面図である。FIG. 10 is a side sectional view showing a main part of an eighth embodiment.

【図１１】実施形態９の要部を示す側面図である。FIG. 11 is a side view showing a main part of a ninth embodiment.

【図１２】実施形態１０の要部を示す側面断面図であ
る。FIG. 12 is a side sectional view showing a main part of a tenth embodiment.

【図１３】実施形態１１を示し、（ａ）は要部側面断面
図、（ｂ）は要部斜視図である。13A and 13B show an eleventh embodiment, wherein FIG. 13A is a side sectional view of a main part, and FIG. 13B is a perspective view of a main part.

【図１４】同上の他の構成を示し、（ａ）は要部側面断
面図、（ｂ）は要部斜視図である。14A and 14B show another configuration of the above, wherein FIG. 14A is a side sectional view of a main part, and FIG. 14B is a perspective view of a main part.

【図１５】同上に対する従来の構成を示す要部側面断面
図である。FIG. 15 is a side sectional view of a main part showing a conventional configuration for the above.

【図１６】実施形態１２の要部を示す側面図である。FIG. 16 is a side view showing a main part of the twelfth embodiment.

【図１７】実施形態１３の要部を示す側面図である。FIG. 17 is a side view showing a main part of a thirteenth embodiment.

【図１８】実施形態１４の斜視図である。FIG. 18 is a perspective view of a fourteenth embodiment.

【図１９】同上を示し、（ａ）は１セルの構成図、
（ｂ）は複数セルから成るモジュールの構成図である。FIG. 19 shows the same as the above, (a) is a configuration diagram of one cell,
(B) is a configuration diagram of a module including a plurality of cells.

【図２０】実施形態１５の要部斜視図である。FIG. 20 is a perspective view of a main part of the fifteenth embodiment.

【図２１】実施形態１６の斜視図である。FIG. 21 is a perspective view of a sixteenth embodiment.

【図２２】同上の要部を示す側面図である。FIG. 22 is a side view showing a main part of the above.

【図２３】実施形態１７の斜視図である。FIG. 23 is a perspective view of a seventeenth embodiment.

【図２４】同上の要部回路構成図である。FIG. 24 is a circuit diagram of a main part of the above.

【図２５】従来例を示す側面図である。FIG. 25 is a side view showing a conventional example.

【図２６】同上の斜視図である。FIG. 26 is a perspective view of the same.

【符号の説明】[Explanation of symbols]

１ ＬＥＤチップ １０ 基板 １１ 凹部 DESCRIPTION OF SYMBOLS 1 LED chip 10 Substrate 11 Concave part

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 俊之 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 塩浜 英二 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 杉本 勝 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 山本 正平 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 橋爪 二郎 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 秋庭 泰史 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 田中 孝司 大阪府門真市大字門真1048番地松下電工株 式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiyuki Suzuki 1048 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Inventor Eiji Shiohama 1048 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Works Co., Ltd. ( 72) Inventor Masaru Sugimoto 1048, Kazuma Kadoma, Kadoma City, Osaka Prefecture, Japan (72) Inventor Shohei Yamamoto 1048, Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Works, Ltd. 1048, Kadoma, Kadoma, Matsushita Electric Works, Ltd. (72) Inventor Yasufumi Akiba, Kazuma, Kazuma, Osaka 1048, Matsushita Electric Works, Ltd. Within a stock company

Claims (18)

【特許請求の範囲】[Claims] 【請求項１】 基板に凹部又は凸部の少なくとも一方を
複数形成するとともに、上記各凹部又は凸部に各々１乃
至複数の発光ダイオード素子を配設したことを特徴とす
るＬＥＤ照明装置。1. An LED lighting device, wherein at least one of a concave portion and a convex portion is formed on a substrate, and one or a plurality of light emitting diode elements are disposed in each of the concave portions or the convex portions. 【請求項２】 上記複数の発光ダイオード素子に発光色
の異なる１乃至複数種の発光ダイオード素子を含むこと
を特徴とする請求項１記載のＬＥＤ照明装置。2. The LED lighting device according to claim 1, wherein the plurality of light emitting diode elements include one or more kinds of light emitting diode elements having different emission colors. 【請求項３】 上記凹部又は凸部に上記発光ダイオード
素子からの光を反射する反射手段を設けたことを特徴と
する請求項１又は２記載のＬＥＤ照明装置。3. The LED lighting device according to claim 1, wherein a reflection means for reflecting light from the light emitting diode element is provided in the concave portion or the convex portion. 【請求項４】 上記基板の少なくとも一部に複数の発光
ダイオード素子のグランドとなる金属板を設け、該金属
板に上記発光ダイオード素子を接触させて成ることを特
徴とする請求項１記載のＬＥＤ照明装置。4. The LED according to claim 1, wherein a metal plate serving as a ground of the plurality of light emitting diode elements is provided on at least a part of the substrate, and the light emitting diode elements are brought into contact with the metal plate. Lighting equipment. 【請求項５】 少なくとも上記基板の凹部又は凸部の発
光ダイオード素子の周りに当該発光ダイオード素子から
の光を反射する金属製の放熱体を配設したことを特徴と
する請求項１記載のＬＥＤ照明装置。5. The LED according to claim 1, wherein a metal radiator that reflects light from the light emitting diode element is disposed at least around the light emitting diode element in the concave or convex part of the substrate. Lighting equipment. 【請求項６】 上記基板に銅張金属基板を一体に形成
し、該銅張金属基板の一方の面に形成された銅張部分に
上記発光ダイオード素子を実装してグランドとし、上記
発光ダイオード素子の発光を制御する制御手段を構成す
る回路素子を上記銅張金属基板の他方の面に実装したこ
とを特徴とする請求項１記載のＬＥＤ照明装置。6. A light-emitting diode device, wherein a copper-clad metal substrate is integrally formed on the substrate, and the light-emitting diode device is mounted on a copper-clad portion formed on one surface of the copper-clad metal substrate to serve as a ground. 2. The LED lighting device according to claim 1, wherein a circuit element constituting a control unit for controlling light emission of said LED is mounted on the other surface of said copper-clad metal substrate. 【請求項７】 上記発光ダイオード素子から発する熱を
放熱する放熱体を備え、該放熱体に複数の凹凸部を設け
たことを特徴とする請求項１記載のＬＥＤ照明装置。7. The LED lighting device according to claim 1, further comprising a radiator for radiating heat generated from the light emitting diode element, wherein the radiator is provided with a plurality of uneven portions. 【請求項８】 上記発光ダイオード素子の少なくとも一
部分に接触する放熱フィンを備えたこと特徴とする請求
項１記載のＬＥＤ照明装置。8. The LED lighting device according to claim 1, further comprising a radiation fin that contacts at least a part of the light emitting diode element. 【請求項９】 上記発光ダイオード素子と少なくとも一
部で接触する放熱ピンを上記基板内に埋設したことを特
徴とする請求項１記載のＬＥＤ照明装置。9. The LED lighting device according to claim 1, wherein a heat radiating pin at least partially in contact with said light emitting diode element is embedded in said substrate. 【請求項１０】 上記基板の凸部を多層に形成したこと
を特徴とする請求項１記載のＬＥＤ照明装置。10. The LED lighting device according to claim 1, wherein the convex portions of the substrate are formed in multiple layers. 【請求項１１】 上記発光ダイオード素子近傍の上記基
板に通風用の貫通孔を設けたことを特徴とする請求項１
記載のＬＥＤ照明装置。11. A ventilation hole is provided in said substrate near said light emitting diode element for ventilation.
The LED lighting device as described in the above. 【請求項１２】 上記発光ダイオード素子を、当該発光
ダイオード素子のＰ型半導体とＮ型半導体とが上記基板
の実装面に対して略平行に並ぶように配設したことを特
徴とする請求項１記載のＬＥＤ照明装置。12. The light-emitting diode device according to claim 1, wherein the P-type semiconductor and the N-type semiconductor of the light-emitting diode device are arranged substantially in parallel to a mounting surface of the substrate. The LED lighting device as described in the above. 【請求項１３】 上記複数の発光ダイオード素子の発光
方向に規則性を持たせるように上記基板を形成したこと
を特徴とする請求項１記載のＬＥＤ照明装置。13. The LED lighting device according to claim 1, wherein the substrate is formed so that the light emitting directions of the plurality of light emitting diode elements have regularity. 【請求項１４】 上記基板の両面に凹部又は凸部の少な
くとも一方を形成するとともに、上記各凹部又は凸部に
各々１乃至複数の発光ダイオード素子を配設したことを
特徴とする請求項１記載のＬＥＤ照明装置。14. The semiconductor device according to claim 1, wherein at least one of a concave portion and a convex portion is formed on both surfaces of the substrate, and one or a plurality of light emitting diode elements are disposed in each of the concave portions or the convex portions. LED lighting device. 【請求項１５】 １乃至複数の上記凹部又は凸部を有し
該凹部又は凸部に発光色の異なる複数種の発光ダイオー
ド素子を配設してセルを構成し、該セルを複数個用いて
形成されることを特徴とする請求項１記載のＬＥＤ照明
装置。15. A cell comprising one or more concave portions or convex portions and a plurality of types of light emitting diode elements having different emission colors arranged in the concave portions or convex portions, and a plurality of the cells are used. The LED lighting device according to claim 1, wherein the LED lighting device is formed. 【請求項１６】 上記発光ダイオード素子を微振動させ
る手段を上記基板に設けたことを特徴とする請求項１記
載のＬＥＤ照明装置。16. The LED lighting device according to claim 1, wherein means for microvibrating the light emitting diode element is provided on the substrate. 【請求項１７】 上記基板を撓み自在に形成したことを
特徴とする請求項１記載のＬＥＤ照明装置。17. The LED lighting device according to claim 1, wherein said substrate is formed to be flexible. 【請求項１８】 所定個数の上記発光ダイオード素子が
含まれる寸法単位に上記基板を切断自在としたことを特
徴とする請求項１記載のＬＥＤ照明装置。18. The LED lighting device according to claim 1, wherein said substrate is cuttable in a dimensional unit including a predetermined number of said light emitting diode elements.
JP32262697A 1997-11-25 1997-11-25 Led illuminator Pending JPH11163412A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP32262697A JPH11163412A (en) 1997-11-25 1997-11-25 Led illuminator
TW087119454A TW408497B (en) 1997-11-25 1998-11-24 LED illuminating apparatus
EP98203973A EP0921568B1 (en) 1997-11-25 1998-11-25 LED Luminaire
US09/199,893 US6331063B1 (en) 1997-11-25 1998-11-25 LED luminaire with light control means
DE69841798T DE69841798D1 (en) 1997-11-25 1998-11-25 Luminaire with light emitting diodes
US09/895,354 US20020006040A1 (en) 1997-11-25 2001-06-29 Led luminaire with light control means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32262697A JPH11163412A (en) 1997-11-25 1997-11-25 Led illuminator

Publications (1)

Publication Number Publication Date
JPH11163412A true JPH11163412A (en) 1999-06-18

Family

ID=18145824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32262697A Pending JPH11163412A (en) 1997-11-25 1997-11-25 Led illuminator

Country Status (1)

Country Link
JP (1) JPH11163412A (en)

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