JPH07307492A - Led aggregate module and its manufacture - Google Patents

Led aggregate module and its manufacture

Info

Publication number
JPH07307492A
JPH07307492A JP6097753A JP9775394A JPH07307492A JP H07307492 A JPH07307492 A JP H07307492A JP 6097753 A JP6097753 A JP 6097753A JP 9775394 A JP9775394 A JP 9775394A JP H07307492 A JPH07307492 A JP H07307492A
Authority
JP
Japan
Prior art keywords
substrate
recess
bonding wire
led
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6097753A
Other languages
Japanese (ja)
Inventor
Shinichi Sano
真一 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP6097753A priority Critical patent/JPH07307492A/en
Publication of JPH07307492A publication Critical patent/JPH07307492A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To obtain the lens characteristic of an LED aggregate module as it has been designed and to restrain the intensity of radiated light from being dropped. CONSTITUTION:A truncated cone-shaped recessed part 2 provided with a stepped part is formed on a metal substrate 1, an LED 3 is mounted on the bottom face of the recessed part 2, the LED 3 and a land part 4 which is formed on the stepped part 2a at the recessed part 2 are connected by a bonding wire 5, a silicone resin 6 is housed in the recessed part 2 in such a way that the surface becomes flush with a pattern formation face on the metal substrate 1, and a lens plate 7 is formed integrally by an insert molding operation.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明はLED集合体モジュー
ルおよびその作製方法に関し、さらに詳細にいえば、発
光ダイオードを搭載した所定形状の基板上にレンズ板を
一体的に配置してなるLED集合体モジュールに関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED assembly module and a method of manufacturing the same, and more specifically, to an LED assembly in which a lens plate is integrally arranged on a substrate having a predetermined shape on which light emitting diodes are mounted. Regarding modules.

【0002】[0002]

【従来の技術】従来からLED集合体モジュールとし
て、例えば、多数のLED(lightemittin
g diode;発光ダイオード)を搭載した基板上に
レンズ板を接着剤等で貼り合せてなるm×nマトリック
ス型LED集合体モジュールが知られている。
2. Description of the Related Art Conventionally, as an LED assembly module, for example, a large number of light emitting diodes (LEDs) are used.
2. Description of the Related Art There is known an m × n matrix type LED assembly module in which a lens plate is attached to a substrate on which a g diode (light emitting diode) is mounted with an adhesive or the like.

【0003】[0003]

【発明が解決しようとする課題】上記の構成のLED集
合体モジュールであれば、基板に対するLEDの実装を
行なった後に、接着剤を介在させてレンズ板を貼り合せ
るので、接着剤からなる接着層に気泡が混入してしまう
可能性が高く、しかも、基板とレンズ板との貼り合せ時
に、LEDを主要部とする発光部とレンズ板のレンズ部
との光軸合せが必要になり、貼り合せ作業に手間がかか
るのみならず、十分に高精度の光軸合せができていない
可能性が高くなる。
According to the LED assembly module having the above-mentioned structure, since the lens plates are bonded together with the adhesive interposed after the LED is mounted on the substrate, the adhesive layer made of the adhesive is used. There is a high possibility that air bubbles will be mixed into the lens, and when the substrate and lens plate are bonded together, it is necessary to align the optical axes of the light emitting part, which mainly consists of LEDs, and the lens part of the lens plate. Not only does it take time and labor, but there is a high possibility that the optical axis cannot be aligned with sufficiently high accuracy.

【0004】上記の不都合を解消するために、本願発明
者らは、LEDが実装された基板に対してインサート成
形によりレンズ板を一体成形し、接着剤等による貼り合
せを不要にする方法を考えた。そして、この方法を実施
するに当って、インサート成形用の合成樹脂が固化する
場合に生じるヒケ(インサート成形用の合成樹脂が冷却
されて固化される場合に生じる合成樹脂の収縮)がボン
ディングワイヤに引張り力を与え、最悪の場合にはボン
ディングワイヤとランド部またはLEDとの接続が阻害
されてしまうので、基板に凹所を形成してLEDを凹所
内に搭載し、しかもLEDとランド部とを接続するボン
ディングワイヤの全範囲を覆うようにボンディングワイ
ヤ保護用のシリコン樹脂を凹所内に予め収容するように
している。
In order to solve the above-mentioned inconvenience, the inventors of the present application consider a method of integrally forming a lens plate by insert molding on a substrate on which LEDs are mounted and eliminating the need for bonding with an adhesive or the like. It was Then, in carrying out this method, a sink mark generated when the synthetic resin for insert molding is solidified (contraction of the synthetic resin generated when the synthetic resin for insert molding is cooled and solidified) is applied to the bonding wire. A tensile force is applied, and in the worst case, the connection between the bonding wire and the land portion or the LED is disturbed. Therefore, a recess is formed in the substrate to mount the LED in the recess, and furthermore, the LED and the land portion are mounted. The silicon resin for protecting the bonding wire is housed in the recess in advance so as to cover the entire range of the bonding wire to be connected.

【0005】しかし、上述のようにインサート成形によ
ってレンズ板を一体成形してLED集合体モジュールを
作製した場合には、図4に示すように、ボンディングワ
イヤ15の一部が基板11の表面よりも上方に突出して
いる関係上、ボンディングワイヤ保護用のシリコン樹脂
16の上面を平坦面にすることができず、シリコン樹脂
16の上面の中央部(正確には、ボンディングワイヤの
うち最も上方に位置する部分に対応する部分)が上方に
突出した状態になってしまい、シリコン樹脂16自体が
レンズ特性を持ってしまう。この結果、インサート成形
により一体成形されるレンズ板17のレンズ部17aに
所望のレンズ特性を持たせるように成形型の設計、イン
サート成形用の合成樹脂の選定等を行なっても、上記シ
リコン樹脂16のレンズ特性が重畳されるのであるか
ら、最終的に得られるLED集合体モジュールのレンズ
特性を所望のレンズ特性にすることができない。ここ
で、シリコン樹脂16によるレンズ特性は、ボンディン
グワイヤ15の湾曲の程度、基板11表面からの上方へ
の突出距離等により変動するのであるから、シリコン樹
脂16のレンズ特性を予め考慮して一体成形されるレン
ズ板17のレンズ部17aのレンズ特性を設計すること
は殆ど不可能である。したがって、上述のように、最終
的に得られるLED集合体モジュールのレンズ特性を所
望のレンズ特性にすることができない。
However, when the LED aggregate module is manufactured by integrally molding the lens plate by the insert molding as described above, as shown in FIG. 4, a part of the bonding wire 15 is more than the surface of the substrate 11. Because of the upward protrusion, the upper surface of the silicon resin 16 for protecting the bonding wire cannot be made flat, and the central portion of the upper surface of the silicon resin 16 (correctly, the uppermost position of the bonding wires is located). The portion corresponding to the portion) is projected upward, and the silicone resin 16 itself has lens characteristics. As a result, even if the molding die is designed so that the lens portion 17a of the lens plate 17 integrally molded by insert molding has desired lens characteristics, and the synthetic resin for insert molding is selected, the silicone resin 16 is not removed. Since the above lens characteristics are superimposed, the lens characteristics of the finally obtained LED assembly module cannot be made desired lens characteristics. Here, the lens characteristics of the silicon resin 16 vary depending on the degree of bending of the bonding wire 15, the upward protrusion distance from the surface of the substrate 11, and the like. It is almost impossible to design the lens characteristics of the lens portion 17a of the lens plate 17 to be cut. Therefore, as described above, the lens characteristics of the finally obtained LED assembly module cannot be set to desired lens characteristics.

【0006】また、シリコン樹脂16が局部的に上方に
突出しているのであるから、インサート成形用の合成樹
脂のヒケが、シリコン樹脂16が上方に突出している箇
所に集中し易く、ヒケが集中した箇所に光学特性上無視
し得ない空間16aが生じる(図5参照)。そして、こ
の空間16aとシリコン樹脂16との界面においては、
屈折率差が設計値からかなりずれてしまうので、LED
13から出射される光の一部が反射され、ひいては出射
光強度が低下してしまう。
Further, since the silicon resin 16 locally protrudes upward, sink marks of the synthetic resin for insert molding are likely to be concentrated on the portions where the silicon resin 16 protrudes upward, and the sink marks are concentrated. A space 16a, which cannot be ignored in terms of optical characteristics, is generated at a location (see FIG. 5). At the interface between the space 16a and the silicone resin 16,
Since the difference in refractive index deviates considerably from the design value, LED
A part of the light emitted from 13 is reflected, and the intensity of the emitted light is reduced.

【0007】[0007]

【発明の目的】この発明は上記の問題点に鑑みてなされ
たものであり、所望のレンズ特性を得ることができると
ともに、出射光強度の低下を抑制することができるLE
D集合体モジュールおよびその作製方法を提供すること
を目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is possible to obtain desired lens characteristics and to suppress a decrease in intensity of emitted light.
An object is to provide a D assembly module and a method for manufacturing the same.

【0008】[0008]

【課題を解決するための手段】上記の目的を達成するた
めの、請求項1のLED集合体モジュールは、基板の所
定位置に設けられた凹所に発光ダイオードを搭載し、発
光ダイオードと基板上のランド部との間をボンディング
ワイヤで接続し、しかも基板上にインサート成形により
レンズ板を一体成形してなるLED集合体モジュールで
あって、凹所の形状を、深さ方向の中間部に基板の配線
パターン形成面とほぼ平行な段部を有する形状に設定し
てあり、上記段部にランド部を形成してあり、凹所から
上方には突出しないように発光ダイオードとランド部と
を接続するボンディングワイヤが設けられてあり、基板
の配線パターン形成面とほぼ面一状になるボンディング
ワイヤ保護用の合成樹脂を凹所に収容してある。
In order to achieve the above object, an LED assembly module according to claim 1 mounts a light emitting diode in a recess provided in a predetermined position of a substrate, and mounts the light emitting diode on the substrate. An LED assembly module in which a lens plate is integrally formed by insert molding on the substrate by connecting a bonding wire to the land portion of the substrate, and the shape of the recess is formed in the intermediate portion in the depth direction. The wiring pattern formation surface has a step portion substantially parallel to the stepped portion, and a land portion is formed on the step portion, and the light emitting diode and the land portion are connected so as not to project upward from the recess. A bonding wire is provided, and a synthetic resin for protecting the bonding wire, which is substantially flush with the wiring pattern formation surface of the substrate, is housed in the recess.

【0009】請求項2のLED集合体モジュールは、段
部が、凹所の側面の全範囲に形成されたものである。請
求項3のLED集合体モジュールの作製方法は、基板の
所定位置に設けられた凹所に発光ダイオードを搭載し、
発光ダイオードと基板上のランド部との間をボンディン
グワイヤで接続し、しかも基板上にインサート成形によ
りレンズ板を一体成形してなるLED集合体モジュール
を作製する方法であって、基板に対して絞り加工を施す
ことにより、深さ方向の中間部に基板の配線パターン形
成面とほぼ平行な段部を有する所定形状の凹所を形成
し、上記段部にランド部を形成し、凹所から上方には突
出しないように発光ダイオードとランド部とをボンディ
ングワイヤで接続し、基板の配線パターン形成面とほぼ
面一状になるボンディングワイヤ保護用の合成樹脂を凹
所に収容し、基板上にインサート成形によりレンズ板を
形成する方法である。
According to another aspect of the LED assembly module of the present invention, the step portion is formed on the entire side surface of the recess. The method for manufacturing an LED assembly module according to claim 3, wherein the LED is mounted in a recess provided at a predetermined position of the substrate,
A method for producing an LED assembly module in which a light emitting diode and a land portion on a substrate are connected by a bonding wire, and a lens plate is integrally molded on the substrate by insert molding. By performing processing, a recess of a predetermined shape having a step substantially parallel to the wiring pattern forming surface of the substrate is formed in the intermediate portion in the depth direction, a land is formed on the step, and the land is formed above the recess. Connect the light emitting diode and the land part with a bonding wire so that they do not protrude, and house the synthetic resin for bonding wire protection that is almost flush with the wiring pattern formation surface of the board in the recess and insert it on the board This is a method of forming a lens plate by molding.

【0010】[0010]

【作用】請求項1のLED集合体モジュールであれば、
基板の所定位置に設けられた凹所に発光ダイオードを搭
載し、発光ダイオードと基板上のランド部との間をボン
ディングワイヤで接続し、しかも基板上にインサート成
形によりレンズ板を一体成形してなるLED集合体モジ
ュールであって、凹所の形状を、深さ方向の中間部に基
板の配線パターン形成面とほぼ平行な段部を有する形状
に設定してあり、上記段部にランド部を形成してあり、
凹所から上方には突出しないように発光ダイオードとラ
ンド部とを接続するボンディングワイヤが設けられてあ
り、基板の配線パターン形成面とほぼ面一状になるボン
ディングワイヤ保護用の合成樹脂を凹所に収容してある
ので、ボンディングワイヤ保護用の合成樹脂がレンズ効
果を持つことを防止でき、ひいては、インサート成形に
より一体形成されるレンズ板のレンズ特性を正確に設定
しておくことにより、LED集合体モジュールに所望の
光学特性を持たせることができる。また、インサート成
形用の合成樹脂のヒケが局部的に集中することを未然に
防止することができるので、出射光強度の低下を抑制す
ることができる。
According to the LED assembly module of claim 1,
A light emitting diode is mounted in a recess provided in a predetermined position of the substrate, the light emitting diode and the land portion on the substrate are connected by a bonding wire, and a lens plate is integrally molded on the substrate by insert molding. In the LED assembly module, the shape of the recess is set to a shape having a step portion substantially parallel to the wiring pattern formation surface of the substrate at the middle portion in the depth direction, and the land portion is formed on the step portion. Yes,
A bonding wire that connects the light emitting diode and the land is provided so as not to project upward from the recess, and a synthetic resin for bonding wire protection that is almost flush with the wiring pattern formation surface of the substrate is used as the recess. Since it is housed in the LED assembly, it is possible to prevent the synthetic resin for bonding wire protection from having a lens effect, and by accurately setting the lens characteristics of the lens plate integrally formed by insert molding, the LED assembly The body module can be provided with the desired optical properties. Further, since it is possible to prevent the sink marks of the synthetic resin for insert molding from locally concentrating in advance, it is possible to suppress a decrease in the intensity of emitted light.

【0011】請求項2のLED集合体モジュールであれ
ば、段部が、凹所の側面の全範囲に形成されているの
で、段部を形成した後に、搭載されるLEDに対して所
望の相対方向になるようにランド部を形成してボンディ
ングワイヤによりLEDとランド部とを接続することが
でき、発光ダイオードに対するランド部の配置の自由度
を高めることができる。
According to the LED assembly module of the second aspect, since the step portion is formed in the entire range of the side surface of the recess, after the step portion is formed, a desired relative position to the mounted LED is obtained. The land and the land can be connected to each other by the bonding wire by forming the land so as to be oriented, and the degree of freedom in the arrangement of the land with respect to the light emitting diode can be increased.

【0012】請求項3のLED集合体モジュールの作製
方法であれば、基板の所定位置に設けられた凹所に発光
ダイオードを搭載し、発光ダイオードと基板上のランド
部との間をボンディングワイヤで接続し、しかも基板上
にインサート成形によりレンズ板を一体成形してなるL
ED集合体モジュールを作製する方法であって、基板に
対して絞り加工を施すことにより、深さ方向の中間部に
基板の配線パターン形成面とほぼ平行な段部を有する形
状の凹所を形成し、上記段部にランド部を形成し、凹所
から上方には突出しないように発光ダイオードとランド
部とをボンディングワイヤで接続し、基板の配線パター
ン形成面とほぼ面一状になるボンディングワイヤ保護用
の合成樹脂を凹所に収容し、基板上にインサート成形に
よりレンズ板を形成するのであるから、インサート成形
時のインサート成形用の合成樹脂のヒケからボンディン
グワイヤを保護するための合成樹脂がレンズ効果を持つ
ことを防止でき、ひいては、インサート成形により一体
形成されるレンズ板のレンズ特性を正確に設定しておく
ことにより、LED集合体モジュールに所望の光学特性
を持たせることができる。また、インサート成形用の合
成樹脂のヒケが局部的に集中することを未然に防止する
ことができるので、出射光強度の低下を抑制することが
できる。
According to the LED assembly module manufacturing method of the third aspect, the light emitting diode is mounted in the recess provided at the predetermined position of the substrate, and the bonding wire is provided between the light emitting diode and the land portion on the substrate. L that is connected and has a lens plate integrally molded on the substrate by insert molding
A method of manufacturing an ED assembly module, wherein a substrate is subjected to a drawing process to form a recess having a stepped portion substantially parallel to a wiring pattern formation surface of the substrate at an intermediate portion in the depth direction. Then, a land portion is formed on the stepped portion, and the light emitting diode and the land portion are connected by a bonding wire so as not to project upward from the recess, and the bonding wire is substantially flush with the wiring pattern forming surface of the substrate. Since the synthetic resin for protection is housed in the recess and the lens plate is formed on the substrate by insert molding, the synthetic resin for protecting the bonding wire from the sink mark of the synthetic resin for insert molding during insert molding is used. It is possible to prevent the lens from having a lens effect, and by accurately setting the lens characteristics of the lens plate integrally formed by insert molding, It can have desired optical characteristics to the assembly module. Further, since it is possible to prevent the sink marks of the synthetic resin for insert molding from locally concentrating in advance, it is possible to suppress a decrease in the intensity of emitted light.

【0013】[0013]

【実施例】以下、実施例を示す添付図面によってこの発
明を詳細に説明する。図1はこの発明のLED集合体モ
ジュールの一実施例を示す平面図、図2は同上要部を示
す縦断面図である。図1に示すLED集合体モジュール
は、所定の配線パターン(図示せず)が形成された金属
基板(例えば、アルミニウム板等の表面に電気絶縁層を
形成し、電気絶縁層の表面に配線パターンを形成してな
る基板であり、高い放熱性能を達成する)1の表面に所
定間隔毎に凹所2が形成されてあり、各凹所2の底面上
に図示しないランド部を介してLED3が搭載されてあ
る。そして、上記各凹所2は、段付きの逆円錐台状に形
成されてあり、上記段部2aを金属基板1の配線パター
ン形成面と平行な面に設定してあるとともに、この段部
2aの所定位置に、ボンディングワイヤ5を介してLE
D3と接続されるランド部4が形成されてある。そし
て、ボンディングワイヤ5は、全範囲が金属基板1の配
線パターン形成面よりも下方に位置する状態でLED
3、ランド部4に対するボンディングが行なわれてい
る。ボンディングワイヤ5をこのようにボンディングす
ることは、LED3の上面、ランド部4の何れもが金属
基板1の配線パターン形成面よりも下方に位置している
ことを考慮すれば、簡単に達成できる。また、上記凹所
2に、上面が金属基板1の配線パターン形成面と面一状
になるようにボンディングワイヤ保護用のシリコン樹脂
6が収容されてある。さらに、金属基板1上にインサー
ト成形によりレンズ板7が一体形成されてある。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the accompanying drawings showing embodiments. FIG. 1 is a plan view showing an embodiment of the LED assembly module of the present invention, and FIG. 2 is a vertical sectional view showing the main part of the same. In the LED assembly module shown in FIG. 1, an electric insulating layer is formed on the surface of a metal substrate (for example, an aluminum plate) on which a predetermined wiring pattern (not shown) is formed, and the wiring pattern is formed on the surface of the electric insulating layer. It is a substrate that is formed and achieves high heat dissipation performance) 1 is formed with recesses 2 at predetermined intervals on the surface thereof, and LED 3 is mounted on the bottom surface of each recess 2 via a land portion not shown. It has been done. Each of the recesses 2 is formed in a stepped inverted truncated cone shape, the step portion 2a is set to be a surface parallel to the wiring pattern forming surface of the metal substrate 1, and the step portion 2a is formed. LE through the bonding wire 5 at a predetermined position of
A land portion 4 connected to D3 is formed. Then, the bonding wire 5 is in the state where the entire area is located below the wiring pattern formation surface of the metal substrate 1 in the LED.
3, the bonding to the land portion 4 is performed. Such bonding of the bonding wire 5 can be easily achieved in consideration of the fact that both the upper surface of the LED 3 and the land portion 4 are located below the wiring pattern forming surface of the metal substrate 1. A silicon resin 6 for protecting the bonding wire is housed in the recess 2 so that the upper surface thereof is flush with the wiring pattern forming surface of the metal substrate 1. Further, the lens plate 7 is integrally formed on the metal substrate 1 by insert molding.

【0014】上記の構成のLED集合体モジュールであ
れば、シリコン樹脂6の上面が金属基板1の配線パター
ン形成面と面一状の平面であるから、シリコン樹脂6が
レンズ特性を有することは全くない。したがって、レン
ズ特性を有する部分は、レンズ板7のレンズ部7aのみ
になる。ここで、レンズ部7aのレンズ特性は、インサ
ート成形用の合成樹脂の種類、レンズ部7aの形状によ
り定まるのであるから、設計どおりの光学特性を有する
LED集合体モジュールを簡単に得ることができる。ま
た、インサート成形用の合成樹脂のヒケの影響が局部的
に集中することは全くないのであるから、ヒケに起因す
る内部反射の影響を大幅に低減することができ、ひいて
は出射光強度の低下を大幅に抑制することができる。も
ちろん、ボンディングワイヤ5によるLED3とランド
部4との接続が損なわれるおそれは全くない。尚、上記
インサート成形用の合成樹脂としては、ポリカーボネー
ト、ポリメチルメタクリレート(PMMA)、ポリプロ
ピレン、4−メチルペンテン−1重合体等の熱可塑性樹
脂が例示できる。
In the LED assembly module having the above structure, since the upper surface of the silicon resin 6 is flush with the wiring pattern forming surface of the metal substrate 1, the silicon resin 6 does not have lens characteristics. Absent. Therefore, only the lens portion 7a of the lens plate 7 has a lens characteristic. Here, since the lens characteristics of the lens portion 7a are determined by the type of synthetic resin for insert molding and the shape of the lens portion 7a, it is possible to easily obtain an LED assembly module having optical characteristics as designed. Further, since the influence of the sink mark of the synthetic resin for insert molding is not locally concentrated at all, the influence of the internal reflection caused by the sink mark can be significantly reduced, and consequently the decrease of the emitted light intensity can be prevented. It can be suppressed significantly. Of course, there is no possibility that the connection between the LED 3 and the land portion 4 by the bonding wire 5 will be lost. Examples of the synthetic resin for insert molding include thermoplastic resins such as polycarbonate, polymethylmethacrylate (PMMA), polypropylene, and 4-methylpentene-1 polymer.

【0015】[0015]

【実施例2】図3はこの発明のLED集合体モジュール
の作製方法の一実施例を説明する図である。金属基板1
に対して絞り加工等を施すことにより、金属基板1の所
定位置に段付き逆円錐台状の凹所2を形成する(図3中
A参照)。
[Embodiment 2] FIG. 3 is a view for explaining an embodiment of a method for producing an LED assembly module of the present invention. Metal substrate 1
By subjecting the metal substrate 1 to drawing or the like, a stepped inverted truncated cone-shaped recess 2 is formed at a predetermined position of the metal substrate 1 (see A in FIG. 3).

【0016】次いで、金属基板1の表面に図示しない配
線パターンを形成すると同時に、凹所2の底面および段
部2aにランド部4を形成し、凹所2の底面に形成され
たランド部上にLED3を搭載する(図3中B参照)。
その後、LED3と、段部2aに形成されたランド部4
との間をボンディングワイヤ5で接続する(図3中C参
照)。但し、この場合において、ボンディングワイヤ5
のうち、最も上方に位置する部分が金属基板1の配線パ
ターン形成面よりも下方に位置するように、ボンディン
グワイヤ5の長さ、湾曲の程度を設定する。ここで、段
部2aが金属基板1の表面と平行な面を有し、この面上
にランド部4が形成されているのであるから、ランド部
4に対するボンディングワイヤ5のボンディングを簡単
に、かつ確実に達成することができる。
Next, at the same time as forming a wiring pattern (not shown) on the surface of the metal substrate 1, a land portion 4 is formed on the bottom surface of the recess 2 and the step portion 2a, and on the land portion formed on the bottom surface of the recess 2. The LED 3 is mounted (see B in FIG. 3).
Then, the LED 3 and the land portion 4 formed on the step portion 2a
And the bonding wire 5 are connected (see C in FIG. 3). However, in this case, the bonding wire 5
Of these, the length and the degree of bending of the bonding wire 5 are set such that the uppermost portion is located below the wiring pattern forming surface of the metal substrate 1. Here, since the step portion 2a has a surface parallel to the surface of the metal substrate 1 and the land portion 4 is formed on this surface, the bonding wire 5 can be easily bonded to the land portion 4, and It can be achieved reliably.

【0017】ボンディングワイヤ5による接続が行なわ
れた後は、上面が金属基板1の配線パターン形成面と面
一状になるように、ボンディングワイヤ保護用のシリコ
ン樹脂を凹所2に収容する(図3中D参照)。そして、
最後にインサート成形により金属基板1上にレンズ板7
を一体形成してLED集合体モジュールを得る(図3中
E参照)。
After the connection by the bonding wire 5, the silicon resin for protecting the bonding wire is housed in the recess 2 so that the upper surface is flush with the wiring pattern forming surface of the metal substrate 1 (see FIG. (See D in 3). And
Finally, the lens plate 7 is formed on the metal substrate 1 by insert molding.
Are integrally formed to obtain an LED assembly module (see E in FIG. 3).

【0018】したがって、このLED集合体モジュール
の作製方法を実施することにより、設計どおりの光学特
性を有し、出射光強度の低下を大幅に抑制できるLED
集合体モジュールを簡単に得ることができる。尚、この
発明は上記の実施例に限定されるものではなく、例え
ば、凹所2の形状として、逆円錐台形状に代えて、逆楕
円錐台形状等を採用することが可能であるほか、一局部
のみに段部2aを形成することが可能であり、その他、
この発明の要旨を変更しない範囲内において種々の設計
変更を施すことが可能である。
Therefore, by carrying out the method for manufacturing this LED assembly module, the LED has the optical characteristics as designed and the decrease in the intensity of the emitted light can be greatly suppressed.
The assembly module can be easily obtained. The present invention is not limited to the above-described embodiment, and for example, as the shape of the recess 2, it is possible to adopt an inverted elliptical truncated cone shape or the like instead of the inverted truncated cone shape. It is possible to form the stepped portion 2a only in one local portion, and in addition,
Various design changes can be made within the scope of the present invention.

【0019】[0019]

【発明の効果】以上のように請求項1の発明は、ボンデ
ィングワイヤ保護用の合成樹脂がレンズ効果を持つこと
を防止でき、ひいては、インサート成形により一体形成
されるレンズ板のレンズ特性を正確に設定しておくこと
により、LED集合体モジュールに所望の光学特性を持
たせることができ、また、インサート成形用の合成樹脂
のヒケが局部的に集中することを未然に防止して、出射
光強度の低下を抑制することができるという特有の効果
を奏する。
As described above, according to the first aspect of the present invention, the synthetic resin for protecting the bonding wire can be prevented from having a lens effect, and the lens characteristics of the lens plate integrally formed by insert molding can be accurately measured. By setting it, the LED assembly module can be given the desired optical characteristics, and the sink marks of the synthetic resin for insert molding can be prevented from locally concentrating, and the output light intensity can be reduced. Has the unique effect of suppressing the decrease of

【0020】請求項2の発明は、請求項1の効果に加
え、段部を形成した後に、搭載されるLEDに対して所
望の相対方向になるようにランド部を形成してボンディ
ングワイヤによりLEDとランド部とを接続することが
でき、LEDに対するランド部の配置の自由度を高める
ことができるという特有の効果を奏する。請求項3の発
明は、ボンディングワイヤ保護用の合成樹脂がレンズ効
果を持つことを防止でき、ひいては、インサート成形に
より一体形成されるレンズ板のレンズ特性を正確に設定
しておくことにより、LED集合体モジュールに所望の
光学特性を持たせることができまた、インサート成形用
の合成樹脂のヒケが局部的に集中することを未然に防止
して、出射光強度の低下を抑制することができるという
特有の効果を奏する。
According to the invention of claim 2, in addition to the effect of claim 1, after forming the step portion, the land portion is formed so as to be in a desired relative direction with respect to the mounted LED, and the LED is bonded by the bonding wire. And the land portion can be connected to each other, and a unique effect that the degree of freedom of arrangement of the land portion with respect to the LED can be enhanced is exhibited. According to the invention of claim 3, it is possible to prevent the synthetic resin for bonding wire protection from having a lens effect, and by accurately setting the lens characteristics of the lens plate integrally formed by insert molding, the LED assembly can be obtained. It is possible to give the body module the desired optical characteristics, and it is possible to prevent the sink marks of the synthetic resin for insert molding from locally concentrating, and to suppress the decrease in the intensity of emitted light. Produce the effect of.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明のLED集合体モジュールの一実施例
を示す平面図である。
FIG. 1 is a plan view showing an embodiment of an LED assembly module of the present invention.

【図2】同上要部を示す縦断面図である。FIG. 2 is a vertical cross-sectional view showing a main part of the same.

【図3】この発明のLED集合体モジュールの作製方法
の一実施例を説明する図である。
FIG. 3 is a diagram illustrating an example of a method for manufacturing an LED assembly module according to the present invention.

【図4】従来のLED集合体モジュールの一例を示す縦
断面図である。
FIG. 4 is a vertical sectional view showing an example of a conventional LED assembly module.

【図5】従来のLED集合体モジュールの他の例を示す
縦断面図である。
FIG. 5 is a vertical sectional view showing another example of a conventional LED assembly module.

【符号の説明】[Explanation of symbols]

1 金属基板 2 凹所 2a 段部 3 LED 4 ランド部 5 ボンディングワイヤ 6 シリコン樹脂 7 レンズ板 1 Metal Substrate 2 Recess 2a Step 3 LED 4 Land 5 Bonding Wire 6 Silicon Resin 7 Lens Plate

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基板(1)の所定位置に設けられた凹所
(2)に発光ダイオード(3)を搭載し、発光ダイオー
ド(3)と基板(1)上のランド部(4)との間をボン
ディングワイヤ(5)で接続し、しかも基板(1)上に
インサート成形によりレンズ板(7)を一体成形してな
るLED集合体モジュールであって、凹所(2)の形状
を、深さ方向の中間部に基板(1)の配線パターン形成
面とほぼ平行な段部(2a)を有する形状に設定してあ
り、上記段部(2a)にランド部(4)を形成してあ
り、凹所(2)から上方には突出しないように発光ダイ
オード(3)とランド部(4)とを接続するボンディン
グワイヤ(5)が設けられてあり、基板(1)の配線パ
ターン形成面とほぼ面一状になるボンディングワイヤ保
護用の合成樹脂(6)を凹所(2)に収容してあること
を特徴とするLED集合体モジュール。
1. A light emitting diode (3) is mounted in a recess (2) provided at a predetermined position of a substrate (1), and the light emitting diode (3) and a land portion (4) on the substrate (1) are connected. An LED assembly module, in which the lens plate (7) is integrally formed on the substrate (1) by insert molding on the substrate (1) by connecting them with a bonding wire (5), and the shape of the recess (2) is deep. It is set to have a shape having a step portion (2a) substantially parallel to the wiring pattern forming surface of the substrate (1) in the middle portion in the vertical direction, and a land portion (4) is formed on the step portion (2a). A bonding wire (5) for connecting the light emitting diode (3) and the land (4) is provided so as not to project upward from the recess (2), and the bonding wire (5) is formed on the wiring pattern forming surface of the substrate (1). Synthetic resin for bonding wire protection that is almost flush (6) Is housed in the recess (2).
【請求項2】 段部(2a)が、凹所(2)の側面の全
範囲に形成されてある請求項1に記載のLED集合体モ
ジュール。
2. The LED assembly module according to claim 1, wherein the step portion (2a) is formed on the entire side surface of the recess (2).
【請求項3】 基板(1)の所定位置に設けられた凹所
(2)に発光ダイオード(3)を搭載し、発光ダイオー
ド(3)と基板(1)上のランド部(4)との間をボン
ディングワイヤ(5)で接続し、しかも基板(1)上に
インサート成形によりレンズ板(7)を一体成形してな
るLED集合体モジュールを作製する方法であって、基
板(1)に対して絞り加工を施すことにより、深さ方向
の中間部に基板(1)の配線パターン形成面とほぼ平行
な段部(2a)を有する所定形状の凹所(2)を形成
し、上記段部(2a)にランド部(4)を形成し、凹所
(2)から上方には突出しないようにLED(3)とラ
ンド部(4)とをボンディングワイヤ(5)で接続し、
基板(1)の配線パターン形成面とほぼ面一状になるボ
ンディングワイヤ保護用の合成樹脂(6)を凹所(2)
に収容し、基板(1)上にインサート成形によりレンズ
板(7)を形成することを特徴とするLED集合体モジ
ュールの作製方法。
3. A light emitting diode (3) is mounted in a recess (2) provided at a predetermined position of the substrate (1), and the light emitting diode (3) and the land portion (4) on the substrate (1) are connected. A method for producing an LED assembly module in which the lens plates (7) are integrally formed on the substrate (1) by insert molding on the substrate (1), which are connected to each other by bonding wires (5). By performing a drawing process to form a recess (2) of a predetermined shape having a step (2a) substantially parallel to the wiring pattern forming surface of the substrate (1) in the intermediate portion in the depth direction. A land portion (4) is formed on (2a), and the LED (3) and the land portion (4) are connected by a bonding wire (5) so as not to project upward from the recess (2),
The recess (2) is provided with the synthetic resin (6) for protecting the bonding wire, which is substantially flush with the wiring pattern forming surface of the substrate (1).
And a lens plate (7) is formed on the substrate (1) by insert molding on the substrate (1).
JP6097753A 1994-05-11 1994-05-11 Led aggregate module and its manufacture Pending JPH07307492A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6097753A JPH07307492A (en) 1994-05-11 1994-05-11 Led aggregate module and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6097753A JPH07307492A (en) 1994-05-11 1994-05-11 Led aggregate module and its manufacture

Publications (1)

Publication Number Publication Date
JPH07307492A true JPH07307492A (en) 1995-11-21

Family

ID=14200650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6097753A Pending JPH07307492A (en) 1994-05-11 1994-05-11 Led aggregate module and its manufacture

Country Status (1)

Country Link
JP (1) JPH07307492A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163412A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Led illuminator
JP2001036148A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source
WO2002084750A1 (en) * 2001-04-12 2002-10-24 Matsushita Electric Works, Ltd. Light source device using led, and method of producing same
KR20050099386A (en) * 2004-04-09 2005-10-13 서울반도체 주식회사 A light emitting diode lens and light emitting diode improved a light directional angle
JP2007180069A (en) * 2005-12-26 2007-07-12 Toshiba Corp Lens-equipped light-emitting diode device and manufacturing method thereof
KR100757826B1 (en) * 2006-09-29 2007-09-11 서울반도체 주식회사 Side-view light emitting diode package
JP2007531303A (en) * 2004-03-29 2007-11-01 クリー インコーポレイテッド Semiconductor light emitting device comprising a flexible coating having optical elements therein and method of assembling the same
US7847480B2 (en) 2002-05-17 2010-12-07 Ccs, Inc. Light emitting diode unit and method for manufacturing light emitting diode unit
US8097937B2 (en) 2001-04-10 2012-01-17 Osram Ag Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
KR101147322B1 (en) * 2009-09-29 2012-05-18 산켄덴키 가부시키가이샤 Light emitting semiconductor device, light emitting semiconductor module and lighting device
JP2015099948A (en) * 2015-03-02 2015-05-28 ローム株式会社 Light emitting device, manufacturing method of light emitting device, and optical device
CN104701438A (en) * 2015-03-18 2015-06-10 青岛杰生电气有限公司 Deep-ultraviolet light source and encapsulating method thereof

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163412A (en) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Led illuminator
JP2001036148A (en) * 1999-07-23 2001-02-09 Matsushita Electric Works Ltd Light source
US8097937B2 (en) 2001-04-10 2012-01-17 Osram Ag Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component
WO2002084750A1 (en) * 2001-04-12 2002-10-24 Matsushita Electric Works, Ltd. Light source device using led, and method of producing same
US6874910B2 (en) 2001-04-12 2005-04-05 Matsushita Electric Works, Ltd. Light source device using LED, and method of producing same
US7847480B2 (en) 2002-05-17 2010-12-07 Ccs, Inc. Light emitting diode unit and method for manufacturing light emitting diode unit
JP2007531303A (en) * 2004-03-29 2007-11-01 クリー インコーポレイテッド Semiconductor light emitting device comprising a flexible coating having optical elements therein and method of assembling the same
KR20050099386A (en) * 2004-04-09 2005-10-13 서울반도체 주식회사 A light emitting diode lens and light emitting diode improved a light directional angle
JP2007180069A (en) * 2005-12-26 2007-07-12 Toshiba Corp Lens-equipped light-emitting diode device and manufacturing method thereof
WO2008038978A1 (en) * 2006-09-29 2008-04-03 Seoul Semiconductor Co., Ltd. Light emitting diode package
KR100757826B1 (en) * 2006-09-29 2007-09-11 서울반도체 주식회사 Side-view light emitting diode package
US8373180B2 (en) 2006-09-29 2013-02-12 Seoul Semiconductor Co., Ltd. Light emitting diode package
KR101147322B1 (en) * 2009-09-29 2012-05-18 산켄덴키 가부시키가이샤 Light emitting semiconductor device, light emitting semiconductor module and lighting device
JP2015099948A (en) * 2015-03-02 2015-05-28 ローム株式会社 Light emitting device, manufacturing method of light emitting device, and optical device
CN104701438A (en) * 2015-03-18 2015-06-10 青岛杰生电气有限公司 Deep-ultraviolet light source and encapsulating method thereof
WO2016146068A1 (en) * 2015-03-18 2016-09-22 青岛杰生电气有限公司 Deep ultraviolet light source and packaging method therefor

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