JP2008091161A - Led lighting system - Google Patents

Led lighting system Download PDF

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Publication number
JP2008091161A
JP2008091161A JP2006269604A JP2006269604A JP2008091161A JP 2008091161 A JP2008091161 A JP 2008091161A JP 2006269604 A JP2006269604 A JP 2006269604A JP 2006269604 A JP2006269604 A JP 2006269604A JP 2008091161 A JP2008091161 A JP 2008091161A
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Prior art keywords
convex
circuit board
led
shape
lighting device
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Takashi Shindo
崇 進藤
Yoshiyuki Uchinono
良幸 内野々
Hiroyuki Yoshida
浩之 吉田
Masahide Muto
正英 武藤
Masahiro Sato
正博 佐藤
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres

Abstract

<P>PROBLEM TO BE SOLVED: To obtain uniform illumination by achieving a wide range of light distribution using a circuit board in a projecting shape and restraining variations in element characteristics by uniformly radiating heat generated from each LED element to be packaged. <P>SOLUTION: A heat radiation means, such as a metal block 21, is provided inside the projecting circuit board 11 where a plurality of LED elements 12 are packaged on a projecting surface 11a; and the shape of a part close to the projecting surface 11a in the projecting circuit board 11 of the heat radiation means follows that of the projecting surface 11a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、複数のＬＥＤ素子が実装された回路基板を備えるＬＥＤ照明装置に関する。   The present invention relates to an LED lighting device including a circuit board on which a plurality of LED elements are mounted.

従来、光源に高輝度のＬＥＤ（light emitting diode；発光ダイオード）素子を用いたＬＥＤ照明装置が知られている。ＬＥＤ照明装置は、光源に白熱灯や蛍光灯などを用いた照明装置と比較して、低消費電力かつ長寿命であり、さらにランプ交換等のメンテナンスが不要で使い勝手がよいといった利点を有している。   2. Description of the Related Art Conventionally, an LED lighting device using a high-luminance LED (light emitting diode) element as a light source is known. LED lighting devices have the advantages of low power consumption and long life compared to lighting devices that use incandescent lamps or fluorescent lamps as light sources, and that they do not require maintenance such as lamp replacement and are easy to use. Yes.

ＬＥＤ照明装置の光源として使用するＬＥＤ素子は、単体では照射範囲が狭いため、通常、複数個を回路基板に実装してモジュール化した状態で使用している。したがって、ＬＥＤ照明装置の配光特性は、実装される複数のＬＥＤ素子のレイアウトによって定まることになる。換言すると、ＬＥＤ照明装置は、複数のＬＥＤ素子のレイアウトを最適化することで、目的に応じた自由な配光特性が得られるといった利点も有している。   Since the LED element used as the light source of the LED lighting device has a narrow irradiation range, a plurality of LED elements are usually mounted on a circuit board and used in a modularized state. Therefore, the light distribution characteristic of the LED lighting device is determined by the layout of the plurality of LED elements to be mounted. In other words, the LED lighting device has an advantage that a free light distribution characteristic according to the purpose can be obtained by optimizing the layout of the plurality of LED elements.

また、近年では、ＭＩＤ（Molded Interconnect Devices）と呼ばれる立体回路成形品の製造技術が確立され、立体的な回路基板を比較的容易に作製できるようになってきている。そして、このような技術を用いてＬＥＤ照明装置の回路基板を凸型の立体形状に形成し、その凸面（外周面）に複数のＬＥＤ素子を実装することで、広範囲の配光を可能にする試みもなされている（例えば、特許文献１参照。）。   In recent years, a manufacturing technique of a three-dimensional circuit molded product called MID (Molded Interconnect Devices) has been established, and a three-dimensional circuit board can be manufactured relatively easily. And by using such a technique, the circuit board of the LED lighting device is formed in a convex three-dimensional shape, and a plurality of LED elements are mounted on the convex surface (outer peripheral surface), thereby enabling a wide range of light distribution. Attempts have also been made (see, for example, Patent Document 1).

特開平１１−１６３４１２号公報（〜、図１１）Japanese Patent Laid-Open No. 11-163212 (˜, FIG. 11)

ところで、この種のＬＥＤ照明装置においては、光源として用いるＬＥＤ素子の発熱によって温度が過度に上昇すると、ＬＥＤ素子の発光効率や輝度の低下を招き、また、ＬＥＤ素子の寿命低下を招く要因となることが指摘されている。このため、ＬＥＤ照明装置では、ＬＥＤ素子の発熱による温度上昇を効果的に防止できるようにすることが重要な課題とされており、例えば特許文献１に記載されているＬＥＤ照明装置では、ＬＥＤ素子の発熱により凸型の回路基板に沿った上昇気流を発生させ、凸型回路基板の下方から温度の低い空気を流れ込ませることで、ＬＥＤ素子の熱を放熱する構造としている。   By the way, in this kind of LED lighting device, if the temperature rises excessively due to the heat generated by the LED element used as the light source, the light emission efficiency and luminance of the LED element are reduced, and the life of the LED element is reduced. It has been pointed out. For this reason, in the LED lighting device, it is an important issue to be able to effectively prevent a temperature rise due to heat generation of the LED element. For example, in the LED lighting device described in Patent Document 1, the LED element Ascending airflow is generated along the convex circuit board by the heat generation, and air having a low temperature is caused to flow from below the convex circuit board, thereby radiating the heat of the LED element.

しかしながら、このような放熱構造では、凸型回路基板の上側ほど放熱効率が低下することになり、凸型回路基板の凸面に実装された複数のＬＥＤ素子間でその実装位置に応じた素子特性のばらつきを生じさせてしまう場合があり、均一な照明が得られなくなるといった問題があった。   However, in such a heat dissipation structure, the heat dissipation efficiency decreases toward the upper side of the convex circuit board, and the element characteristics according to the mounting position between the plurality of LED elements mounted on the convex surface of the convex circuit board. There is a problem that variation may occur, and uniform illumination cannot be obtained.

本発明は、以上のような従来の実情に鑑みて創案されたものであって、凸型形状の回路基板を用いて広範囲の配光を実現しながら、実装される各ＬＥＤ素子の発熱を均一に放熱して素子特性のばらつきを抑え、均一な照明を得られるようにしたＬＥＤ照明装置を提供することを目的としている。   The present invention was devised in view of the conventional situation as described above, and uses a convex circuit board to achieve a wide range of light distribution while uniformly generating heat from each mounted LED element. An object of the present invention is to provide an LED lighting device that can dissipate heat to suppress variation in element characteristics and obtain uniform illumination.

本発明のＬＥＤ照明装置は、凸型形状に立体成形されて回路パターンが形成された凸型回路基板と、凸型回路基板の凸面に実装された複数のＬＥＤ素子と、凸型回路基板の内部に設けられた放熱手段とを備えた構成とし、放熱手段を、凸型回路基板の凸面に近接する部分の形状が凸面に倣う形状とすることで、前記課題を解決する。このＬＥＤ照明装置では、複数のＬＥＤ素子が実装される凸型回路基板の凸面のほぼ全周に亘って凸型回路基板内部の放熱手段までの距離が略一定とされるので、この凸型回路基板の凸面に実装される複数のＬＥＤ素子の発熱は、放熱手段によって均一に放熱されることになる。   The LED lighting device according to the present invention includes a convex circuit board that is three-dimensionally formed into a convex shape to form a circuit pattern, a plurality of LED elements mounted on a convex surface of the convex circuit board, and an interior of the convex circuit board. The heat dissipating means is provided, and the heat dissipating means has a shape in which the shape of the portion adjacent to the convex surface of the convex circuit board follows the convex surface. In this LED lighting device, the distance to the heat radiation means inside the convex circuit board is substantially constant over substantially the entire circumference of the convex surface of the convex circuit board on which a plurality of LED elements are mounted. The heat generated by the plurality of LED elements mounted on the convex surface of the substrate is uniformly dissipated by the heat dissipating means.

本発明のＬＥＤ照明装置によれば、凸型回路基板の凸面に実装される複数のＬＥＤ素子の発熱が放熱手段によって均一に放熱されるので、各ＬＥＤ素子間における素子特性のばらつきを抑え、均一な照明を得ることができる。   According to the LED lighting device of the present invention, the heat generated by the plurality of LED elements mounted on the convex surface of the convex circuit board is uniformly dissipated by the heat dissipating means, so that variation in element characteristics among the LED elements is suppressed and uniform. Can be obtained.

以下、本発明の具体的な実施形態について、図面を参照しながら詳細に説明する。   Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

図１は、本発明を適用したＬＥＤ照明装置の外観を示す斜視図である。この図１に示すＬＥＤ照明装置は、スタンド型の照明装置に本発明を適用した例であり、照明用の光を発光する発光部１を基台２で支持する構造となっている。また、このＬＥＤ照明装置では、必要に応じて、ガラスなどの光透過性を有する材料で成形されたカバー３が、基台２上の発光部１を覆うように、基台２に取り付けられる。   FIG. 1 is a perspective view showing an appearance of an LED lighting device to which the present invention is applied. The LED illumination device shown in FIG. 1 is an example in which the present invention is applied to a stand-type illumination device, and has a structure in which a light emitting unit 1 that emits illumination light is supported by a base 2. Moreover, in this LED lighting device, a cover 3 formed of a light-transmitting material such as glass is attached to the base 2 so as to cover the light emitting unit 1 on the base 2 as necessary.

発光部１は、凸型回路基板１１の凸面（外周面）１１ａに複数のＬＥＤ素子１２が実装されてなるものである。凸型回路基板１１はＭＩＤ（立体回路成形品）の基板であり、基板材料が凸型形状に立体成形され、回路パターンが形成されたものである。ここで、凸型回路基板１１の基板材料としては、熱抵抗が低く放熱性の高い無機材料、例えばＡｌ２Ｏ３やＡｌＮ、Ｓｉ３Ｎ４などのセラミック材料が好適である。凸型回路基板１１は、これらの基板材料が、プレス成形やＣＩＭ（Ceramics Injection Molding；セラミックス射出成形）、鋳込み成形などの既知の成形法によって凸型形状に成形され、その成形品に回路パターンが形成されることで作製される。なお、凸型形状の成形品に回路パターンを形成する手法としては、例えば、特許第３１５３６８２号公報にて開示される手法が有効に適用できる。 The light emitting unit 1 is formed by mounting a plurality of LED elements 12 on a convex surface (outer peripheral surface) 11 a of a convex circuit board 11. The convex circuit board 11 is a MID (three-dimensional circuit molded product) board, in which a substrate material is three-dimensionally molded into a convex shape to form a circuit pattern. Here, as a substrate material of the convex circuit board 11, an inorganic material having a low thermal resistance and a high heat dissipation property, for example, a ceramic material such as Al 2 O 3 , AlN, or Si 3 N 4 is suitable. In the convex circuit board 11, these substrate materials are formed into a convex shape by a known molding method such as press molding, CIM (Ceramics Injection Molding), or casting, and a circuit pattern is formed on the molded product. It is produced by being formed. As a method for forming a circuit pattern on a convex shaped product, for example, the method disclosed in Japanese Patent No. 3153682 can be effectively applied.

本発明を適用したＬＥＤ照明装置では、以上のような凸型回路基板１１の凸面１１ａに複数のＬＥＤ素子１２を実装して、図１に示すような発光部１とすることで、全周囲に亘る広い範囲への配光を可能としている。また、このＬＥＤ照明装置では、発光部１の複数のＬＥＤ素子１２の点灯／消灯を個別に、或いは実装位置に応じてグループ分けしたグループごとに切り替え可能にし、点灯させるＬＥＤ素子１２を選択的に切り替えるようにすれば、配光を任意に変更することができ、自由な配光を得ることができる。   In the LED lighting device to which the present invention is applied, a plurality of LED elements 12 are mounted on the convex surface 11a of the convex circuit board 11 as described above to form the light emitting unit 1 as shown in FIG. Light distribution over a wide range is possible. Further, in this LED lighting device, the plurality of LED elements 12 of the light emitting unit 1 can be switched on / off individually or grouped according to the mounting position, and the LED elements 12 to be lit are selectively selected. If switching is performed, the light distribution can be arbitrarily changed, and a free light distribution can be obtained.

ＬＥＤ照明装置は、ＬＥＤ素子１２の発熱による温度上昇に起因してＬＥＤ素子１２に発光効率や輝度の低下、寿命低下などの問題を生じさせないようにするために、ＬＥＤ素子１２の発熱を効率よく放熱するための放熱機構を設けることが望まれる。そこで、本発明を適用したＬＥＤ照明装置では、凸型形状に立体成形された凸型回路基板１１の内部に放熱手段を設けるようにしており、特に、この凸型回路基板１１の内部に設ける放熱手段を、その凸型回路基板１１の凸面１１ａに近接する部分の形状が凸面１１ａに倣う形状となるようにすることで、凸型回路基板１１の凸面１１ａに実装された複数のＬＥＤ素子１２の発熱を均一に放熱できるようにしている。以下、本発明を適用したＬＥＤ照明装置における発光部１の例として、凸型回路基板１１の内部に放熱手段を設けた２つの具体例（実施例１，２）を例示して説明する。   The LED illumination device efficiently generates heat from the LED element 12 in order to prevent the LED element 12 from causing problems such as a decrease in light emission efficiency, luminance, and life due to a temperature increase due to heat generation of the LED element 12. It is desirable to provide a heat dissipation mechanism for radiating heat. Therefore, in the LED lighting device to which the present invention is applied, heat radiating means is provided inside the convex circuit board 11 that is three-dimensionally formed into a convex shape, and in particular, heat dissipation provided inside the convex circuit board 11. The means of the plurality of LED elements 12 mounted on the convex surface 11a of the convex circuit board 11 is configured such that the shape of the portion adjacent to the convex surface 11a of the convex circuit board 11 is a shape that follows the convex surface 11a. Heat generation can be dissipated uniformly. Hereinafter, two specific examples (Examples 1 and 2) in which a heat dissipation unit is provided inside the convex circuit board 11 will be described as examples of the light emitting unit 1 in the LED lighting device to which the present invention is applied.

［実施例１］
実施例１は、金属材料が凸型のブロック状に成形された金属ブロックを凸型回路基板１１の内部に埋設して放熱手段とした例である。 [Example 1]
Example 1 is an example in which a metal block in which a metal material is formed in a convex block shape is embedded in the convex circuit board 11 to serve as heat dissipation means.

図２は、本実施例における発光部１の縦断面図である。本実施例では、図２に示すように、凸型回路基板１１が半球体の内部を凸面（外周面）１１ａに沿うようにくり抜いたカップ型の凸型形状に成形され、この凸型回路基板１１の内部に、例えばＣｕやＡｌなどの金属材料が凸型に成形されてなる金属ブロック２１が埋め込まれている。凸型回路基板１１の内部に埋設された金属ブロック２１は、その外周面、すなわち凸型回路基板１１の凸面１１ａに近接する面が、凸型回路基板１１の凸面１１ａに倣う形状とされ、複数のＬＥＤ素子１２が実装される凸型回路基板１１の凸面１１ａと、放熱手段としての金属ブロック２１外周面との間の距離Ｌ１が、凸面１１ａのほぼ全周に亘って略一定とされている。したがって、本実施例の発光部１では、凸型回路基板１１の凸面１１ａに実装された複数のＬＥＤ素子１２の発熱が、金属ブロック２１によって均一に放熱されることになり、実装位置に応じた放熱効率の差に起因する複数のＬＥＤ素子１２間における素子特性のばらつきを有効に抑え、均一な照明を得ることが可能となる。   FIG. 2 is a longitudinal sectional view of the light emitting unit 1 in the present embodiment. In this embodiment, as shown in FIG. 2, the convex circuit board 11 is formed into a cup-shaped convex shape by hollowing out the inside of the hemisphere along the convex surface (outer peripheral surface) 11a. 11 is embedded with a metal block 21 made of a metal material such as Cu or Al formed into a convex shape. The metal block 21 embedded in the convex circuit board 11 has an outer peripheral surface, that is, a surface close to the convex surface 11 a of the convex circuit board 11, which is shaped to follow the convex surface 11 a of the convex circuit board 11. The distance L1 between the convex surface 11a of the convex circuit board 11 on which the LED element 12 is mounted and the outer peripheral surface of the metal block 21 as the heat radiating means is substantially constant over the entire circumference of the convex surface 11a. . Therefore, in the light emitting unit 1 of the present embodiment, the heat generated by the plurality of LED elements 12 mounted on the convex surface 11a of the convex circuit board 11 is uniformly dissipated by the metal block 21, and according to the mounting position. It is possible to effectively suppress variations in element characteristics among the plurality of LED elements 12 due to the difference in heat dissipation efficiency and obtain uniform illumination.

ここで、本実施例における発光部１の作製工程の一例について、簡単に説明する。   Here, an example of a manufacturing process of the light emitting unit 1 in this embodiment will be briefly described.

まず、図３に示すように、凸型回路基板１１を、均一の厚みを有するカップ型の凸型形状に成形する。ここで、基板材料にはＡｌ２Ｏ３やＡｌＮ、Ｓｉ３Ｎ４などのセラミック材料を用い、例えば、粉末状のセラミック材料にポリスチレン、パラフィンワックス、ステアリン酸の混合物などをバインダーとして混合し、ＣＩＭ成形機などの成形機に投入してカップ型の形状の凸型回路基板１１に成形する。また、凸型回路基板１１は、ＣＩＭの他にもプレス成形、鋳込み成形などの成形法によって成形することも可能である。鋳込み成形により凸型回路基板１１を成形する場合には、水溶性の樹脂と水とがバインダーとして用いられる。 First, as shown in FIG. 3, the convex circuit board 11 is formed into a cup-shaped convex shape having a uniform thickness. Here, a ceramic material such as Al 2 O 3 , AlN, or Si 3 N 4 is used as the substrate material. For example, a mixture of polystyrene, paraffin wax, stearic acid, or the like is mixed with a powdered ceramic material as a binder, and CIM It is put into a molding machine such as a molding machine and molded into a convex circuit board 11 having a cup shape. In addition to the CIM, the convex circuit board 11 can be molded by a molding method such as press molding or casting. In the case where the convex circuit board 11 is formed by casting, water-soluble resin and water are used as a binder.

次に、図４に示すように、金属ブロック２１を、凸型回路基板１１の内部の空間に合わせた凸型のブロック状に成形する。ここで、金属ブロック２１の材料には例えばＣｕやＡｌなどを用い、これらの金属材料を、例えば鋳型を用いた鋳造やＭＩＭ（Metal Injection Molding；金属射出成形）などの成形法によって、凸型回路基板１１内部の空間に合致する凸型のブロック状に成形して、金属ブロック２１を作製する。なお、このとき、金属ブロック２１の外周面に例えば図５に示すような溝２１ａを形成しておくようにすれば、この溝２１ａを冷媒流路として活用して凸型回路基板１１の内部に冷媒を流すことも可能となり、放熱特性を更に良好なものとすることができる。   Next, as shown in FIG. 4, the metal block 21 is formed into a convex block shape that matches the space inside the convex circuit board 11. Here, for example, Cu or Al is used as the material of the metal block 21, and these metal materials are formed into a convex circuit by a molding method such as casting using a mold or MIM (Metal Injection Molding). The metal block 21 is manufactured by forming into a convex block shape that matches the space inside the substrate 11. At this time, if a groove 21a as shown in FIG. 5 is formed on the outer peripheral surface of the metal block 21, for example, the groove 21a is used as a refrigerant flow path inside the convex circuit board 11. It is also possible to flow a refrigerant, and the heat dissipation characteristics can be further improved.

次に、図６に示すように、凸型回路基板１１の内部に金属ブロック２１を嵌め込み、例えば、ろう付けや固体接合などの接合方法により、これら凸型回路基板１１と金属ブロック２１とを接合する。これにより、図７に示すように、凸型回路基板１１の内部に放熱手段としての金属ブロック２１が埋め込まれて一体化された状態となる。なお、凸型回路基板１１の回路パターンは、凸型回路基板１１と金属ブロック２１とを一体化する前に形成してもよいし、凸型回路基板１１と金属ブロック２１とを一体化した後に形成するようにしてもよい。ただし、凸型回路基板１１の凸面１１ａへのＬＥＤ素子１２の実装は、ＬＥＤ素子１２の破損を防止するために、凸型回路基板１１と金属ブロック２１とを一体化した後の最終工程で行うことが望ましい。   Next, as shown in FIG. 6, the metal block 21 is fitted into the convex circuit board 11, and the convex circuit board 11 and the metal block 21 are joined by a joining method such as brazing or solid joining, for example. To do. As a result, as shown in FIG. 7, the metal block 21 as the heat dissipation means is embedded in the convex circuit board 11 and integrated. The circuit pattern of the convex circuit board 11 may be formed before the convex circuit board 11 and the metal block 21 are integrated, or after the convex circuit board 11 and the metal block 21 are integrated. You may make it form. However, the LED element 12 is mounted on the convex surface 11a of the convex circuit board 11 in the final step after the convex circuit board 11 and the metal block 21 are integrated in order to prevent the LED element 12 from being damaged. It is desirable.

［実施例２］
実施例２は、凸型回路基板１１の凸面１１ａに沿うように凸型回路基板１１の内部に冷媒が流される冷媒流路を貫通形成し、この冷媒流路を放熱手段とした例である。 [Example 2]
Example 2 is an example in which a refrigerant flow path through which a refrigerant flows is formed inside the convex circuit board 11 so as to extend along the convex surface 11a of the convex circuit board 11, and this refrigerant flow path is used as a heat dissipation means.

図８は、本実施例における発光部１の縦断面図である。本実施例では、図８に示すように、凸型回路基板１１は半球体の凸型形状に成形され、この半球体形状の凸型回路基板１１の内部に、例えば冷却水などの冷媒が流れる冷媒流路２２が、凸型回路基板１１の凸面１１ａに沿うようなかたちで貫通形成されている。この冷媒流路２２は、例えば、頂点部から放射状に分岐する複数の分岐流路の集合として構成される。そして、各分岐流路の壁面のうち凸型回路基板１１の凸面１１ａに近接する部分が、凸型回路基板１１の凸面１１ａに倣う形状とされ、複数のＬＥＤ素子１２が実装される凸型回路基板１１の凸面１１ａと、放熱手段としての冷媒流路２２との間の距離Ｌ２が、凸面１１ａのほぼ全周に亘って略一定とされている。したがって、本実施例の発光部１では、凸型回路基板１１の凸面１１ａに実装された複数のＬＥＤ素子１２の発熱が、冷媒流路２２を流れる冷媒によって均一に放熱されることになり、上述した実施例１と同様に、実装位置に応じた放熱効率の差に起因する複数のＬＥＤ素子１２間における素子特性のばらつきを有効に抑え、均一な照明を得ることが可能となる。   FIG. 8 is a longitudinal sectional view of the light emitting unit 1 in this embodiment. In this embodiment, as shown in FIG. 8, the convex circuit board 11 is formed into a hemispherical convex shape, and a coolant such as cooling water flows inside the hemispherical convex circuit board 11. The coolant channel 22 is formed so as to penetrate the convex surface 11 a of the convex circuit board 11. The refrigerant flow path 22 is configured as a set of a plurality of branch flow paths that diverge radially from the apex portion, for example. A portion of the wall surface of each branch channel that is close to the convex surface 11a of the convex circuit board 11 is shaped to follow the convex surface 11a of the convex circuit board 11, and the convex circuit on which the plurality of LED elements 12 are mounted. A distance L2 between the convex surface 11a of the substrate 11 and the refrigerant flow path 22 as a heat radiating means is substantially constant over substantially the entire circumference of the convex surface 11a. Therefore, in the light emitting unit 1 of the present embodiment, the heat generated by the plurality of LED elements 12 mounted on the convex surface 11a of the convex circuit board 11 is uniformly dissipated by the refrigerant flowing through the refrigerant flow path 22, and is described above. As in the first embodiment, it is possible to effectively suppress variation in element characteristics among the plurality of LED elements 12 due to the difference in heat dissipation efficiency depending on the mounting position, and to obtain uniform illumination.

ここで、本実施例における発光部１の作製工程の一例について、簡単に説明する。   Here, an example of a manufacturing process of the light emitting unit 1 in this embodiment will be briefly described.

まず、図９に示すように、凸型回路基板１１の内部に冷媒流路２２を貫通形成するための型となる流路形成用部材２４を作製する。ここで、流路形成用部材２４の材料としては例えばパラフィンワックスなどを用い、この材料を例えば射出成形や押出成形などの成形法によって冷媒流路２２に対応した放射状に成形して、流路形成用部材２４を作製する。   First, as shown in FIG. 9, a flow path forming member 24 serving as a mold for penetrating and forming the coolant flow path 22 inside the convex circuit board 11 is produced. Here, as the material of the flow path forming member 24, for example, paraffin wax or the like is used, and this material is formed into a radial shape corresponding to the refrigerant flow path 22 by a molding method such as injection molding or extrusion molding to form the flow path. A member 24 is prepared.

次に、図１０に示すように、凸型回路基板１１を、流路形成用部材２４が内部に埋め込まれた状態の半球体の形状に成形する。ここで、基板材料にはＡｌ２Ｏ３やＡｌＮ、Ｓｉ３Ｎ４などのセラミック材料を用い、例えば、粉末状にしたセラミック材料にポリスチレン、パラフィンワックス、ステアリン酸の混合物などをバインダーとして混合し、これを予め流路形成用部材２４がセットされたＣＩＭ成形機などの成形機に投入して、半球体形状の凸型回路基板１１に成形する。このとき、成形機における基板成形型の成形面から均一に浮かした状態で、流路形成用部材２４を基板成形型の内部に配置しておくことにより、凸面１１ａからの距離が均一となる位置に流路形成用部材２４が埋め込まれた状態の凸型回路基板１１を得る。また、凸型回路基板１１は、ＣＩＭの他にも鋳込み成形によって成形することも可能である。鋳込み成形により凸型回路基板１１を成形する場合には、水溶性の樹脂と水がバインダーとして用いられる。 Next, as shown in FIG. 10, the convex circuit board 11 is formed into a hemispherical shape in which the flow path forming member 24 is embedded. Here, a ceramic material such as Al 2 O 3 , AlN, or Si 3 N 4 is used as the substrate material. For example, a powdered ceramic material is mixed with a mixture of polystyrene, paraffin wax, stearic acid, and the like as a binder, This is put into a molding machine such as a CIM molding machine in which the flow path forming member 24 is set in advance, and molded into the hemispherical convex circuit board 11. At this time, a position where the distance from the convex surface 11a becomes uniform by disposing the flow path forming member 24 inside the substrate molding die in a state of floating uniformly from the molding surface of the substrate molding die in the molding machine. Thus, the convex circuit board 11 in which the flow path forming member 24 is embedded is obtained. Further, the convex circuit board 11 can be formed by casting other than CIM. When the convex circuit board 11 is formed by casting, water-soluble resin and water are used as a binder.

次に、図１１に示すように、流路形成用部材２４が内部に埋め込まれた状態の半球体形状の凸型回路基板１１を高温炉２６内に収容し、ヒータ２６ａの加熱によって、凸型回路基板１１内部に埋め込まれた流路形成用部材２４と基板材料に混合したバインダーを熱分解させる。ここで、ヒータ２６ａによる加熱条件は、例えば最高温度が５００℃〜６００℃程度となるように設定される。この加熱処理により凸型回路基板１１内部の流路形成用部材２４が分解除去されることで、凸型回路基板１１内部に冷媒流路２２が形成されることになる。なお、図１１においては、高温炉２６内に１つの凸型回路基板１１を収容した様子を図示しているが、実際には、複数個の凸型回路基板１１をまとめて高温炉２６内に収容して加熱処理を行う。   Next, as shown in FIG. 11, the hemispherical convex circuit board 11 with the flow path forming member 24 embedded therein is accommodated in a high temperature furnace 26, and the convex shape is obtained by heating the heater 26a. The flow path forming member 24 embedded in the circuit board 11 and the binder mixed in the board material are thermally decomposed. Here, the heating conditions by the heater 26a are set such that the maximum temperature is about 500 ° C. to 600 ° C., for example. By this heat treatment, the flow path forming member 24 inside the convex circuit board 11 is disassembled and removed, whereby the refrigerant flow path 22 is formed inside the convex circuit board 11. In FIG. 11, a state in which one convex circuit board 11 is accommodated in the high-temperature furnace 26 is illustrated, but actually, a plurality of convex circuit boards 11 are collectively put in the high-temperature furnace 26. House and heat-treat.

次に、図１２に示すように、流路形成用部材２４が分解除去されて冷媒流路２２が形成された凸型回路基板１１を、高温炉２６内のヒータ２６ａの加熱によって商品形状に焼き固める。ここで、焼結の条件は、例えば、基板材料にＡｌ２Ｏ３を用いた場合は高温炉２６内を大気雰囲気として、ヒータ２６ａによる加熱条件を、例えば最高温度が１５００℃〜１６００℃程度となるように設定する。また、基板材料にＡｌＮを用いた場合は高温炉２６内を窒素雰囲気として、ヒータ２６ａによる加熱条件を、例えば最高温度が１８００℃〜１９００℃程度となるように設定する。この焼結処理によって凸型回路基板１１が商品形状に焼き固められ、図１３に示すように、内部に冷媒流路２２が凸面１１ａに沿って貫通形成された凸型回路基板１１が作製される。その後、凸型回路基板１１に回路パターンが形成され、凸面１１ａに複数のＬＥＤ素子１２が実装されることで、発光部１が完成する。 Next, as shown in FIG. 12, the convex circuit board 11 on which the flow path forming member 24 is disassembled and removed to form the refrigerant flow path 22 is baked into a product shape by heating a heater 26a in the high temperature furnace 26. Solidify. Here, the sintering conditions are, for example, when Al 2 O 3 is used as a substrate material, the inside of the high-temperature furnace 26 is an air atmosphere, and the heating condition by the heater 26a is, for example, a maximum temperature of about 1500 ° C. to 1600 ° C. Set as follows. When AlN is used as the substrate material, the inside of the high temperature furnace 26 is set to a nitrogen atmosphere, and the heating conditions by the heater 26a are set so that the maximum temperature is about 1800 ° C. to 1900 ° C., for example. By this sintering process, the convex circuit board 11 is baked into a product shape, and as shown in FIG. 13, the convex circuit board 11 in which the refrigerant flow path 22 is formed through the convex surface 11a is produced. . Thereafter, a circuit pattern is formed on the convex circuit board 11, and a plurality of LED elements 12 are mounted on the convex surface 11a, whereby the light emitting unit 1 is completed.

以上、具体的な例を挙げながら詳細に説明したように、本発明を適用したＬＥＤ照明装置は、凸型回路基板１１の内部に金属ブロック２１や冷媒流路２２などの放熱手段を設け、その放熱手段の凸型回路基板１１の凸面１１ａに近接する部分の形状を凸面１１ａに倣う形状としているので、凸型回路基板１１の凸面１１ａに実装された複数のＬＥＤ素子１２の発熱を放熱手段によって均一に放熱することができる。したがって、このＬＥＤ照明装置によれば、凸型回路基板１１の凸面１１ａに実装された複数のＬＥＤ素子１２間における素子特性のばらつきを抑え、均一な照明を得ることができる。   As described above in detail with specific examples, the LED lighting device to which the present invention is applied is provided with heat dissipating means such as the metal block 21 and the refrigerant flow path 22 inside the convex circuit board 11, Since the shape of the portion adjacent to the convex surface 11a of the convex circuit board 11 of the heat dissipation means is made to follow the convex surface 11a, the heat generation of the plurality of LED elements 12 mounted on the convex surface 11a of the convex circuit board 11 is caused by the heat dissipation means. Heat can be evenly dissipated. Therefore, according to this LED illumination device, variation in element characteristics among the plurality of LED elements 12 mounted on the convex surface 11a of the convex circuit board 11 can be suppressed, and uniform illumination can be obtained.

また、本発明を適用したＬＥＤ照明装置は、凸型回路基板１１の凸面１１ａに複数のＬＥＤ素子１２を実装しているので、全周囲に亘る広い範囲への配光が可能であり、さらに、複数のＬＥＤ素子１２の点灯／消灯を個別に或いはグループごとに選択的に切り替えることにより、自由な配光を得ることができる。   In addition, since the LED lighting device to which the present invention is applied has a plurality of LED elements 12 mounted on the convex surface 11a of the convex circuit board 11, light distribution over a wide range over the entire circumference is possible. By selectively switching on / off the plurality of LED elements 12 individually or for each group, free light distribution can be obtained.

なお、以上説明した実施形態は本発明の一適用例を例示したものであり、本発明が以上の実施形態で説明した内容に限定されることを意図するものではなく、本発明の趣旨を逸脱しない範囲で様々な変形が可能である。例えば、ＬＥＤ照明装置の配光特性を向上させるといった観点からは、凸型回路基板１１の凸面１１ａに、光源として用いる複数のＬＥＤ素子１２からの光を反射して前方に配光するための反射部を各ＬＥＤ素子１２ごとに設けることも有効である。具体的には、例えば図１４に示すように、凸型回路基板１１の凸面１１ａに、複数のＬＥＤ素子１２に対応させて複数の凹部２８を設け、各凹部２８内にＬＥＤ素子１８を実装する。そして、各凹部２８の壁面を加工して、ＬＥＤ素子１２からの横方向への光を凹部２８の壁面にて反射させ、前方に配光できるようにする。凸型回路基板１１の凸面１１ａ上に複数のＬＥＤ素子１２をそのまま実装した場合には、隣接するＬＥＤ素子１２の横方向の光が干渉して、照明のむらを発生させる要因となることも懸念されるが、以上のような反射部を設けて各ＬＥＤ素子１２からの光を前方に配光するようにすれば、照明むらの発生を有効に抑制することができる。   The embodiment described above is an example of application of the present invention, and the present invention is not intended to be limited to the contents described in the above embodiment, and departs from the spirit of the present invention. Various modifications can be made without departing from the scope. For example, from the viewpoint of improving the light distribution characteristics of the LED lighting device, the reflection for distributing light forward by reflecting light from the plurality of LED elements 12 used as the light source on the convex surface 11a of the convex circuit board 11. It is also effective to provide a portion for each LED element 12. Specifically, for example, as shown in FIG. 14, a plurality of concave portions 28 are provided on the convex surface 11 a of the convex circuit board 11 so as to correspond to the plurality of LED elements 12, and the LED elements 18 are mounted in the respective concave portions 28. . And the wall surface of each recessed part 28 is processed, the light to the horizontal direction from the LED element 12 is reflected in the wall surface of the recessed part 28, and light distribution can be carried out ahead. When a plurality of LED elements 12 are mounted on the convex surface 11a of the convex circuit board 11 as they are, there is a concern that the light in the lateral direction of the adjacent LED elements 12 may interfere to cause uneven illumination. However, if the reflection part as described above is provided to distribute the light from each LED element 12 forward, it is possible to effectively suppress the occurrence of illumination unevenness.

また、上述した実施形態では、スタンド型の照明装置に本発明を適用した例を説明したが、本発明は、例えば図１５に示すように、吊り下げタイプの照明装置に対しても有効に適用可能である。この図１５に示すような吊り下げタイプの照明装置は、例えば室内の天井などから吊り下げられて室内を照明するものであり、発光部１が下側を向くように基体５に取り付けられ、発光部１を覆うようにフード６が装着される。このような吊り下げタイプの照明装置に本発明を適用した場合、発光部１を覆うフード６の内面を反射面とし、一部のＬＥＤ素子１２からの光を下方に反射させることで、吊り下げタイプの照明装置として理想的な配光特性を得ることができる。   In the embodiment described above, an example in which the present invention is applied to a stand-type lighting device has been described. However, the present invention is also effectively applied to a hanging type lighting device, for example, as shown in FIG. Is possible. The hanging type lighting device as shown in FIG. 15 illuminates the interior of a room by being suspended from, for example, an indoor ceiling, and is attached to the base 5 so that the light emitting unit 1 faces downward. A hood 6 is attached so as to cover the portion 1. When the present invention is applied to such a hanging type lighting device, the inner surface of the hood 6 covering the light emitting unit 1 is used as a reflecting surface, and the light from a part of the LED elements 12 is reflected downward to suspend the lighting device. Ideal light distribution characteristics can be obtained as a type of lighting device.

本発明を適用したＬＥＤ照明装置の外観を示す斜視図である。It is a perspective view which shows the external appearance of the LED lighting apparatus to which this invention is applied. 実施例１における発光部の縦断面図である。4 is a longitudinal sectional view of a light emitting unit in Example 1. FIG. 実施例１における発光部の作製工程を説明する図であり、カップ状の凸型形状に成形された凸型回路基板を示す斜視図である。It is a figure explaining the manufacturing process of the light emission part in Example 1, and is a perspective view which shows the convex circuit board shape | molded by the cup-shaped convex shape. 実施例１における発光部の作製工程を説明する図であり、凸型のブロック状に成形された金属ブロックを示す斜視図である。It is a figure explaining the preparation process of the light emission part in Example 1, and is a perspective view which shows the metal block shape | molded by the convex block shape. 凸型のブロック状に成形された金属ブロックの他の例を示す斜視図である。It is a perspective view which shows the other example of the metal block shape | molded by the convex block shape. 実施例１における発光部の作製工程を説明する図であり、凸型回路基板の内部に金属ブロックを嵌め込む様子を示す斜視図である。It is a figure explaining the preparation process of the light emission part in Example 1, and is a perspective view which shows a mode that a metal block is engage | inserted inside a convex circuit board. 実施例１における発光部の作製工程を説明する図であり、凸型回路基板と金属ブロックとが一体化された様子を示す斜視図である。It is a figure explaining the manufacturing process of the light emission part in Example 1, and is a perspective view which shows a mode that a convex circuit board and the metal block were integrated. 実施例２における発光部の縦断面図である。6 is a longitudinal sectional view of a light emitting unit in Example 2. FIG. 実施例２における発光部の作製工程を説明する図であり、凸型回路基板の内部に冷媒流路を貫通形成するための型となる流路形成用部材を示す斜視図である。It is a figure explaining the manufacturing process of the light emission part in Example 2, and is a perspective view which shows the flow-path formation member used as the type | mold for penetratingly forming a refrigerant flow path in the inside of a convex circuit board. 実施例２における発光部の作製工程を説明する図であり、流路形成用部材が内部に埋め込まれた半球体形状の凸型回路基板を示す斜視図である。It is a figure explaining the preparation process of the light emission part in Example 2, and is a perspective view which shows the hemispherical convex circuit board by which the member for flow-path formation was embedded inside. 実施例２における発光部の作製工程を説明する図であり、凸型回路基板内部に埋め込まれた流路形成用部材と基板材料に混合したバインダーを熱分解させる様子を示す模式図である。It is a figure explaining the manufacturing process of the light emission part in Example 2, and is a schematic diagram which shows a mode that the binder mixed with the member for flow-path formation embedded in the convex circuit board and board | substrate material is thermally decomposed. 実施例２における発光部の作製工程を説明する図であり、凸型回路基板を商品形状に焼き固める様子を示す模式図である。It is a figure explaining the preparation process of the light emission part in Example 2, and is a schematic diagram which shows a mode that a convex circuit board is baked and solidified in a product shape. 実施例２における発光部の作製工程を説明する図であり、内部に冷媒流路が貫通形成された凸型回路基板を示す斜視図である。It is a figure explaining the preparation process of the light emission part in Example 2, and is a perspective view which shows the convex-type circuit board by which the refrigerant | coolant flow path was penetrated and formed inside. 凸型回路基板の凸面に設けた凹部内にＬＥＤ素子を実装した様子を示す斜視図である。It is a perspective view which shows a mode that the LED element was mounted in the recessed part provided in the convex surface of a convex circuit board. 本発明を適用した吊り下げタイプのＬＥＤ照明装置を示す側面図である。It is a side view which shows the hanging type LED lighting apparatus to which this invention is applied.

符号の説明Explanation of symbols

１ 発光部
１１ 凸型回路基板
１１ａ 凸面
１２ ＬＥＤ素子
２１ 金属ブロック
２２ 冷媒流路
２８ 凹部 DESCRIPTION OF SYMBOLS 1 Light emission part 11 Convex type circuit board 11a Convex surface 12 LED element 21 Metal block 22 Refrigerant flow path 28 Concave part

Claims (5)

凸型形状に立体成形され、回路パターンが形成された凸型回路基板と、
前記凸型回路基板の凸面に実装された複数のＬＥＤ素子と、
前記凸型回路基板の内部に設けられた放熱手段とを備え、
前記放熱手段は、前記凸型回路基板の凸面に近接する部分の形状が、当該凸面に倣う形状とされていることを特徴とするＬＥＤ照明装置。 A convex circuit board three-dimensionally formed into a convex shape and having a circuit pattern formed thereon;
A plurality of LED elements mounted on the convex surface of the convex circuit board;
Heat dissipation means provided inside the convex circuit board,
In the LED illuminating device, the heat dissipating means has a shape in which a portion of the convex circuit board adjacent to the convex surface follows the convex surface. 前記放熱手段は、金属材料が凸型のブロック状に成形された金属ブロックよりなることを特徴とする請求項１に記載のＬＥＤ照明装置。   The LED illuminating apparatus according to claim 1, wherein the heat radiating means is formed of a metal block formed of a metal material in a convex block shape. 前記放熱手段は、前記凸型回路基板の凸面に沿うように当該凸型回路基板の内部に貫通形成された、冷媒が流される冷媒流路よりなることを特徴とする請求項１に記載のＬＥＤ照明装置。   2. The LED according to claim 1, wherein the heat dissipating means includes a refrigerant flow path that is formed through the convex circuit board so as to follow the convex surface of the convex circuit board and through which the refrigerant flows. Lighting device. 前記凸型回路基板の基板材料としてセラミック材料が用いられていることを特徴とする請求項１に記載のＬＥＤ照明装置。   The LED lighting device according to claim 1, wherein a ceramic material is used as a substrate material of the convex circuit board. 前記凸型回路基板の凸面に、前記複数のＬＥＤ素子からの光を反射して前方に配光するための反射部が各ＬＥＤ素子ごとに設けられていることを特徴とする請求項１に記載のＬＥＤ照明装置。   The reflective part for reflecting the light from these LED elements and distributing light ahead is provided in the convex surface of the said convex circuit board for every LED element. LED lighting device.
JP2006269604A 2006-09-29 2006-09-29 Led lighting system Pending JP2008091161A (en)

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