JPH1041682A - Adhesive film having shielding effect and transparency for electromagnetic wave, and display and electromagnetic wave shielding configuration using the film - Google Patents
Adhesive film having shielding effect and transparency for electromagnetic wave, and display and electromagnetic wave shielding configuration using the filmInfo
- Publication number
- JPH1041682A JPH1041682A JP9024575A JP2457597A JPH1041682A JP H1041682 A JPH1041682 A JP H1041682A JP 9024575 A JP9024575 A JP 9024575A JP 2457597 A JP2457597 A JP 2457597A JP H1041682 A JPH1041682 A JP H1041682A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adhesive film
- electromagnetic wave
- transparency
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＣＲＴ、ＰＤＰ（プ
ラズマ）、液晶、ＥＬなどのディスプレイ前面から発生
する電磁波のシールド性と透明性を有する接着フィルム
及び該フィルムを用いたディスプレイ、電磁波遮蔽構成
体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive film for shielding and transmitting electromagnetic waves generated from the front surface of a display such as a CRT, PDP (plasma), liquid crystal, and EL, a display using the film, and an electromagnetic wave shielding structure. It is about.
【０００２】[0002]
【従来の技術】近年各種の電気設備や電子応用設備の利
用が増加するのに伴い、電磁気的なノイズ妨害（Electr
o-Magnetic Interference;EMI）も増加の一途をたどっ
ている。ノイズは大きく分けて伝導ノイズと放射ノイズ
に分けられる。伝導ノイズの対策としては、ノイズフィ
ルタなどを用いる方法がある。一方、放射ノイズの対策
としては、電磁気的に空間を絶縁する必要があるため、
筐体を金属体または高導電体にするとか、回路基板と回
路基板の間に金属板を挿入するとか、ケーブルを金属箔
で巻き付けるなどの方法が取られている。これらの方法
では、回路や電源ブロックのＥＭＩシールド効果を期待
できるが、ＣＲＴ、ＰＤＰなどのディスプレイ前面より
発生するＥＭＩシールド用途としては、不透明であるた
め適したものではなかった。2. Description of the Related Art With the recent increase in the use of various types of electrical equipment and electronic equipment, electromagnetic noise interference (Electrically
o-Magnetic Interference (EMI) is also on the rise. Noise can be roughly divided into conducted noise and radiated noise. As a measure against conduction noise, there is a method using a noise filter or the like. On the other hand, as a measure against radiation noise, it is necessary to insulate the space electromagnetically,
Methods such as making the housing a metal body or a high conductor, inserting a metal plate between circuit boards, and winding a cable with metal foil have been adopted. With these methods, an EMI shielding effect of a circuit or a power supply block can be expected, but it is not suitable as an EMI shielding application generated from the front surface of a display such as a CRT or PDP because it is opaque.
【０００３】ＥＭＩシールド性と透明性を両立させる方
法として、透明性基材上に金属または金属酸化物を蒸着
して薄膜導電層を形成する方法（特開平１−２７８８０
０号公報、特開平５−３２３１０１号公報参照）が提案
されている。一方、良導電性繊維を透明基材に埋め込ん
だＥＭＩシールド材（特開平５−３２７２７４号公報、
特開平５−２６９９１２号公報参照）や金属粉末等を含
む導電性樹脂を透明基板上に直接印刷したＥＭＩシール
ド材料（特開昭６２−５７２９７号公報、特開平２−５
２４９９号公報参照）、さらには、厚さが２ｍｍ程度の
ポリカーボネート等の透明基板上に透明樹脂層を形成
し、その上に無電解めっき法により銅のメッシュパター
ンを形成したシールド材料（特開平５−２８３８８９号
公報参照）が提案されている。As a method for achieving both EMI shielding properties and transparency, a method of forming a thin film conductive layer by depositing a metal or a metal oxide on a transparent substrate (Japanese Patent Laid-Open No. 1-278080).
No. 0, JP-A-5-323101). On the other hand, an EMI shielding material in which a good conductive fiber is embedded in a transparent base material (JP-A-5-327274,
JP-A-5-269912) or an EMI shielding material in which a conductive resin containing a metal powder or the like is directly printed on a transparent substrate (JP-A-62-57297, JP-A-2-5-5).
Further, a shield material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm and a copper mesh pattern is formed thereon by an electroless plating method (see Japanese Patent Laid-Open No. -283889).
【０００４】[0004]
【発明が解決しようとする課題】ＥＭＩシールド性と透
明性を両立させる方法として、特開平１−２７８８００
号公報、特開平５−３２３１０１号公報に示されている
透明性基材上に金属または金属酸化物を蒸着して薄膜導
電層を形成する方法は、透明性が達成できる程度の膜厚
（数１００Å〜２０００Å）にすると導電層の表面抵抗
が大きくなりすぎるため、１ＧＨｚで要求される３０ｄ
Ｂ以上のシールド効果に対して２０ｄＢ以下と不十分で
あった。良導電性繊維を透明基材に埋め込んだＥＭＩシ
ールド材（特開平５−３２７２７４号公報、特開平５−
２６９９１２号公報）では、１ＧＨｚのＥＭＩシールド
効果は４０〜５０ｄＢと十分大きいが、電磁波漏れのな
いように導電性繊維を規則配置させるために必要な繊維
径が３５μｍと太すぎるため、繊維が見えてしまい（以
後視認性という）ディスプレイ用途には適したものでは
なかった。また、特開昭６２−５７２９７号公報、特開
平２−５２４９９号公報の金属粉末等を含む導電性樹脂
を透明基板上に直接印刷したＥＭＩシールド材料の場合
も同様に、印刷精度の限界からライン幅は、１００μｍ
前後となり視認性が発現するため適したものではなかっ
た。さらに特開平５−２８３８８９号公報に記載の厚さ
が２ｍｍ程度のポリカーボネート等の透明基板上に透明
樹脂層を形成し、その上に無電解めっき法により銅のメ
ッシュパターンを形成したシールド材料では、無電解め
っきの密着力を確保するために、透明基板の表面を粗化
する必要がある。この粗化手段として、一般にクロム酸
や過マンガン酸などの毒性の高い酸化剤を使用しなけれ
ばならず、この方法は、ＡＢＳ以外の樹脂では、満足で
きる粗化を行うことは困難となる。この方法により、Ｅ
ＭＩシールド性と透明性は達成できたとしても、透明基
板の厚さを小さくすることは困難で、フィルム化には適
していない。透明基板が厚いと、ディスプレイに密着さ
せることができないため、そこからの電磁波の漏洩が大
きくなる。また製造面においては、シールド材料を巻物
等にすることができないため嵩高くなることや自動化に
適していないために製造コストがかさむという欠点もあ
る。ディスプレイ前面から発生する電磁波のシールド性
については、１ＧＨｚにおける３０ｄＢ以上のＥＭＩシ
ールド機能ばかりでなく、良好な可視光透過性、さらに
可視光透過率が大きいだけでなく、電磁波の漏れを防止
するためディスプレイ面に密着して貼付けられる接着
性、シールド材の存在を目視で確認することができない
特性である非視認性が必要とされる。また、接着性につ
いてはガラスや汎用ポリマー板に対し比較的低温で容易
に貼付き、長期間にわたって良好な密着性を有すること
が必要である。しかし、これらの特性を十分に満たすも
のは得られていなかった。本発明はかかる点に鑑み、Ｅ
ＭＩシールド性と透明性・非視認性および良好な接着特
性を有する電磁波シールド性と透明性を有する接着フィ
ルムを提供することを目的とする。As a method for achieving both EMI shielding and transparency, Japanese Patent Laid-Open No. 1-278800 has been proposed.
In the method of forming a thin film conductive layer by depositing a metal or metal oxide on a transparent substrate disclosed in Japanese Patent Application Laid-Open No. When the angle is set to 100 ° to 2000 °), the surface resistance of the conductive layer becomes too large.
The shielding effect of B or more was insufficient at 20 dB or less. An EMI shielding material in which a good conductive fiber is embedded in a transparent base material (JP-A-5-327274, JP-A-5-327274).
No. 269912), the EMI shielding effect at 1 GHz is sufficiently large as 40 to 50 dB, but the fiber diameter required for regularly arranging the conductive fibers so as to prevent electromagnetic wave leakage is too large at 35 μm. It was not suitable for display use (hereinafter referred to as visibility). Similarly, in the case of an EMI shielding material in which a conductive resin containing a metal powder or the like described in JP-A-62-57297 and JP-A-2-52499 is directly printed on a transparent substrate, the line width is similarly limited due to the limitation of printing accuracy. The width is 100 μm
It was not suitable because it was before and after and visibility was developed. Further, in a shielding material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm described in JP-A-5-283889 and a copper mesh pattern is formed thereon by electroless plating, In order to secure the adhesion of electroless plating, it is necessary to roughen the surface of the transparent substrate. Generally, a highly toxic oxidizing agent such as chromic acid or permanganic acid must be used as the roughening means. With this method, it is difficult to perform satisfactory roughening with a resin other than ABS. By this method, E
Even if MI shielding properties and transparency can be achieved, it is difficult to reduce the thickness of the transparent substrate, and it is not suitable for film formation. If the transparent substrate is thick, it cannot be brought into close contact with the display, so that leakage of electromagnetic waves therefrom increases. Further, in terms of manufacturing, there is also a drawback that the shield material cannot be made into a scroll or the like, so that it becomes bulky, and is not suitable for automation, so that the manufacturing cost increases. Regarding the shielding property of the electromagnetic wave generated from the front of the display, not only the EMI shielding function of 30 dB or more at 1 GHz, but also the good visible light transmittance, the visible light transmittance is large, and the display for preventing the leakage of the electromagnetic wave. Adhesiveness which is stuck to the surface and non-visibility, which is a characteristic in which the presence of the shield material cannot be visually confirmed, are required. As for the adhesiveness, it is necessary to easily adhere to glass or a general-purpose polymer plate at a relatively low temperature and have good adhesiveness over a long period of time. However, those which sufficiently satisfy these characteristics have not been obtained. In view of this, the present invention has
An object of the present invention is to provide an adhesive film having an electromagnetic wave shielding property and transparency having MI shielding properties, transparency and invisibility, and good adhesive properties.
【０００５】[0005]
【課題を解決するための手段】本発明の請求項１に記載
の発明は、ＥＭＩシールド性と透明性・非視認性および
良好な接着特性を有する電磁波シールド性と透明性を有
する接着フィルムを提供するため、（１）透明プラスチ
ック基材の表面に導電性材料で描かれた幾何学図形を設
けた構成材料において、幾何学図形を構成するライン幅
が４０μｍ以下、ライン間隔が２００μｍ以上、ライン
厚みが４０μｍ以下で、その幾何学図形を含む基材の一
部または全面を接着剤で被覆し、（２）幾何学図形を被
覆する接着剤と透明プラスチック基材、または透明プラ
スチック基材が接着層を介して導電性材料と積層されて
いる場合においては接着層と幾何学図形を被覆する接着
剤との屈折率の差を０．１４以下とするものである。請
求項２に記載の発明は、透明性、安価、耐熱性良好で取
扱性に優れたな電磁波シールド性と透明性を有する接着
フィルムを提供するため、透明プラスチック基材をポリ
エチレンテレフタレートフィルムとするものである。請
求項３に記載の発明は、加工性に優れ、安価でＥＭＩシ
ールド性に優れた電磁波シールド性と透明性を有する接
着フィルムを提供するため、導電性材料の厚みが３〜４
０μｍの銅、アルミニウムまたはニッケルの金属箔を使
用し、透明プラスチック基材への接着面を粗面とするも
のである。請求項４に記載の発明は、退色性が小さく、
コントラストの大きい電磁波シールド性と透明性を有す
る接着フィルムを提供するため、導電性材料を銅とし
て、少なくともその表面が黒化処理されていることを特
徴とするものである。請求項５に記載の発明は、加工性
に優れた電磁波シールド性と透明性を有する接着フィル
ムを提供するため、透明プラスチック基材上の幾何学図
形がケミカルエッチングプロセスにより描画されたもの
であることを特徴とするものである。請求項６に記載の
発明は、磁場シールド性に優れた電磁波シールド性と透
明性を有する接着フィルムを提供するため、導電性材料
を常磁性金属とするものである。請求項７に記載の発明
は、上記の電磁波シ−ルド性と透明性を有する接着フィ
ルムをディスプレイに用いたものである。請求項８に記
載の発明は、電磁波を発生する測定装置、測定機器や製
造装置の内部をのぞく窓や筐体に設けて電磁波をシ−ル
ドすることや電磁波から装置、機器を守るため筐体特に
透明性を要求される窓のような部位に設けた電磁波遮蔽
構成体である。According to the first aspect of the present invention, there is provided an adhesive film having an EMI shielding property, an electromagnetic wave shielding property and a transparency having good transparency and invisibility and good adhesive properties. (1) In a constituent material in which a geometrical figure drawn with a conductive material is provided on the surface of a transparent plastic substrate, the line width constituting the geometrical figure is 40 μm or less, the line interval is 200 μm or more, and the line thickness Is 40 μm or less, and a part or the whole of the substrate including the geometrical figure is coated with an adhesive, and (2) the adhesive covering the geometrical figure and the transparent plastic substrate, or the transparent plastic substrate is an adhesive layer. In this case, the difference in the refractive index between the adhesive layer and the adhesive covering the geometric figure is 0.14 or less. The invention according to claim 2 is to use a transparent plastic substrate as a polyethylene terephthalate film in order to provide an adhesive film having transparency, inexpensiveness, good heat resistance and excellent electromagnetic shielding properties and excellent handleability, and transparency. It is. The third aspect of the present invention provides an adhesive film having excellent processability, inexpensiveness, excellent electromagnetic shielding properties and excellent EMI shielding properties, and transparency.
A metal foil of 0 μm copper, aluminum or nickel is used, and the surface to be adhered to the transparent plastic substrate is roughened. The invention according to claim 4 has a small fading property,
In order to provide an adhesive film having a high contrast and an electromagnetic wave shielding property and transparency, the conductive material is made of copper, and at least the surface thereof is blackened. According to a fifth aspect of the present invention, a geometric pattern on a transparent plastic substrate is drawn by a chemical etching process in order to provide an adhesive film having excellent electromagnetic wave shielding properties and transparency excellent in workability. It is characterized by the following. The invention according to claim 6 is to use a conductive material as a paramagnetic metal in order to provide an adhesive film having excellent electromagnetic field shielding properties and transparency that is excellent in magnetic field shielding properties. According to a seventh aspect of the present invention, the adhesive film having the above-mentioned electromagnetic shielding and transparency is used for a display. The invention according to claim 8 provides a measuring device for generating electromagnetic waves, a shielding device provided in a window or a casing that looks into the inside of a measuring device or a manufacturing device, or a casing for protecting the device or device from the electromagnetic waves. Particularly, it is an electromagnetic wave shielding structure provided at a site such as a window where transparency is required.
【０００６】[0006]
【発明の実施の形態】以下に本発明を詳細に説明する。
本発明でいう透明プラスチック基材とは、ポリエチレン
テレフタレート（ＰＥＴ）、ポリエチレンナフタレート
などのポリエステル類、ポリエチレン、ポリプロピレ
ン、ポリスチレン、ＥＶＡなどのポリオレフィン類、ポ
リ塩化ビニル、ポリ塩化ビニリデンなどのビニル系樹
脂、ポリサルホン、ポリエーテルサルホン、ポリカーボ
ネート、ポリアミド、ポリイミド、アクリル樹脂などの
プラスチックからなるフィルムで全可視光透過率が７０
％以上のものをいう。これらは本発明の目的を妨げない
程度に着色していても良く、さらに単層で使うこともで
きるが、２層以上を組み合わせた多層フィルムとして使
ってもよい。このうち透明性、耐熱性、取り扱いやす
さ、価格の点からポリエチレンテレフタレートフィルム
が最も適している。この透明プラスチック基材の厚み
は、薄いと取扱性が悪く、厚いと可視光の透過率が低下
するため５〜２００μｍが好ましい。さらに好ましく
は、１０〜１００μｍが、より好ましくは、２５〜５０
μｍである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
The transparent plastic substrate referred to in the present invention includes polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene, polypropylene, polystyrene and EVA; vinyl resins such as polyvinyl chloride and polyvinylidene chloride; A film made of plastic such as polysulfone, polyethersulfone, polycarbonate, polyamide, polyimide, and acrylic resin and having a total visible light transmittance of 70
% Or more. These may be colored to such an extent that the object of the present invention is not hindered, and may be used as a single layer, or may be used as a multilayer film combining two or more layers. Of these, polyethylene terephthalate film is most suitable in terms of transparency, heat resistance, ease of handling, and price. The thickness of the transparent plastic substrate is preferably from 5 to 200 μm because the handleability is poor when the thickness is thin, and the transmittance of visible light decreases when the thickness is thick. More preferably, 10 to 100 μm, more preferably 25 to 50 μm.
μm.
【０００７】本発明の導電性材料としては、銅、アルミ
ニウム、ニッケル、鉄、金、銀、ステンレス、タングス
テン、クロム、チタンなどの金属の内の１種または２種
以上を組み合わせた合金を使用することができる。導電
性、回路加工の容易さ、価格の点から銅、アルミニウム
またはニッケルが適しており、厚みが３〜４０μｍの金
属箔であることが好ましい。厚みが４０μｍ以上では、
ライン幅の形成が困難であったり、視野角が狭くなるた
めであり、厚みが３μｍ以下では、表面抵抗が大きくな
り、シールド効果に劣るためである。導電性材料が、銅
であり、少なくともその表面が黒化処理されたものであ
ると、コントラストが高くなり好ましい。また、導電性
材料が経時的に酸化され退色されることが防止できる。
黒化処理は、幾何学図形の形成前後で行えば良いが、通
常形成後において、プリント配線板分野で行われている
方法を用いて行うことができる。例えば、亜塩素酸ナト
リウム（３１ｇ／ｌ）、水酸化ナトリウム（１５ｇ／
ｌ）、燐酸三ナトリウム（１２ｇ／ｌ）の水溶液中、９
５℃で２分間処理することにより行うことができる。ま
た、導電性材料が、常磁性金属であると、磁場シールド
性に優れるために好ましい。かかる導電性材料を上記プ
ラスチック基材に密着させる方法としては、アクリルや
エポキシ系樹脂を主成分とした接着層を介して貼り合わ
せるのが最も簡便である。導電層の膜厚を小さくする必
要がある場合には、真空蒸着法、スパッタリング法、イ
オンプレート法、化学蒸着法、無電解・電気めっき法な
どの薄膜形成技術のうちの１または２個以上の方法を組
み合わせることにより達成できる。導電性材料の膜厚
は、４０μｍ以下のものが適用できるが、薄いほどディ
スプレイの視野角が広がりＥＭＩシールド材料として好
ましく、１８μｍ以下とすることがさらに好ましい。As the conductive material of the present invention, an alloy of one or more of metals such as copper, aluminum, nickel, iron, gold, silver, stainless steel, tungsten, chromium, and titanium is used. be able to. Copper, aluminum or nickel is suitable from the viewpoints of conductivity, ease of circuit processing, and price, and a metal foil having a thickness of 3 to 40 μm is preferable. When the thickness is 40 μm or more,
This is because it is difficult to form a line width or the viewing angle is narrow. When the thickness is 3 μm or less, the surface resistance increases and the shielding effect is poor. It is preferable that the conductive material be copper and at least the surface thereof has been subjected to a blackening treatment because the contrast is high. Further, it is possible to prevent the conductive material from being oxidized with time and discolored.
The blackening process may be performed before and after the formation of the geometrical figure. However, after the formation, the blackening process can be performed using a method used in the field of printed wiring boards. For example, sodium chlorite (31 g / l), sodium hydroxide (15 g /
l), in an aqueous solution of trisodium phosphate (12 g / l), 9
It can be performed by treating at 5 ° C. for 2 minutes. In addition, it is preferable that the conductive material is a paramagnetic metal because of excellent magnetic field shielding properties. The simplest method of bringing the conductive material into close contact with the plastic substrate is to attach the conductive material via an adhesive layer mainly composed of acrylic or epoxy resin. When it is necessary to reduce the thickness of the conductive layer, one or two or more of thin film forming techniques such as a vacuum deposition method, a sputtering method, an ion plate method, a chemical vapor deposition method, and an electroless / electroplating method are used. This can be achieved by a combination of methods. Although the thickness of the conductive material may be 40 μm or less, the thinner the film, the wider the viewing angle of the display is, and the more preferable it is as an EMI shielding material, more preferably, 18 μm or less.
【０００８】本発明中の幾何学図形とは正三角形、二等
辺三角形、直角三角形などの三角形、正方形、長方形、
ひし形、平行四辺形、台形などの四角形、（正）六角
形、（正）八角形、（正）十二角形、（正）二十角形な
どの（正）ｎ角形、円、だ円、星形などを組み合わせた
模様であり、これらの単位の単独の繰り返しあるいは２
種類以上の組み合わせで使うこともできる。ＥＭＩシー
ルド性の観点からは三角形が最も有効であるが、可視光
透過性からは同一のライン幅なら（正）ｎ角形のｎ数が
大きいほど開口率が上がり可視光透過性が大きくなるの
で有利である。このような幾何学図形を描く方法として
は、上記導電性材料付きの透明プラスチック基材をケミ
カルエッチングプロセスによって作製するのが、加工性
の点から効果的である。その他に、幾何学図形を描いた
マスクを用いて透明プラスチック基材上に配した感光性
樹脂層を露光、現像し無電解めっきや電気めっきを組み
合わせて幾何学図形を形成する方法などがある。The geometric figures in the present invention include triangles such as equilateral triangles, isosceles triangles and right triangles, squares, rectangles, and the like.
Rectangles such as rhombus, parallelogram, trapezoid, etc., (positive) hexagons, (positive) octagons, (positive) dodecagons, (positive) n-gons such as (positive) octagons, circles, ellipses, stars It is a pattern that combines shapes and the like.
It can also be used in combinations of more than one type. From the viewpoint of EMI shielding, a triangle is most effective. However, from the viewpoint of visible light transmission, if the number of (positive) n-sided polygons is the same, the numerical aperture increases and the visible light transmission increases as the n-number of the (positive) n-sided polygon increases. It is. As a method of drawing such a geometric figure, it is effective from the viewpoint of workability to produce the transparent plastic substrate with the conductive material by a chemical etching process. In addition, there is a method of exposing and developing a photosensitive resin layer disposed on a transparent plastic base material using a mask on which a geometric figure is drawn, and forming a geometric figure by combining electroless plating or electroplating.
【０００９】このような幾何学図形のライン幅は４０μ
ｍ以下、ライン間隔は２００μｍ以上、ライン厚みは４
０μｍ以下の範囲とされる。また幾何学図形の非視認性
の観点からライン幅は２５μｍ以下、可視光透過率の点
からライン間隔は５００μｍ以上、ライン厚み１８μｍ
以下がさらに好ましい。ライン間隔は、大きいほど可視
光透過率は向上するが、この値が大きくなり過ぎると、
ＥＭＩシールド性が低下するため、１ｍｍ以下とするの
が好ましい。なお、ライン間隔は、幾何学図形等の組合
わせ等で複雑となる場合、繰り返し単位を基準としてそ
の面積を正方形の面積に換算し、その一辺の長さをライ
ン間隔とする。The line width of such a geometric figure is 40 μm.
m or less, line spacing is 200 μm or more, line thickness is 4
The range is 0 μm or less. In addition, the line width is 25 μm or less from the viewpoint of invisibility of the geometrical figure, the line interval is 500 μm or more, and the line thickness is 18 μm in terms of visible light transmittance.
The following are more preferred. As the line spacing increases, the visible light transmittance increases, but if this value is too large,
Since the EMI shielding property is deteriorated, it is preferable to set the thickness to 1 mm or less. When the line interval becomes complicated due to a combination of geometric figures and the like, the area is converted into the area of a square based on the repeating unit, and the length of one side is set as the line interval.
【００１０】次にこの幾何学図形を被覆する接着剤は前
述した透明プラスチック基材との屈折率の差が０．１４
以下とされる。また透明プラスチック基材が接着層を介
して導電性材料と積層されている場合においては、接着
層と幾何学図形を被覆する接着剤との屈折率の差が０．
１４以下とされる。これは、透明プラスチック基材と接
着剤の屈折率、または接着剤と接着層の屈折率が異なる
と可視光透過率が低下するためであり、屈折率の差が
０．１４以下であると可視光透過率の低下が少なく良好
となる。そのような要件を満たす接着剤の材料として
は、透明プラスチック基材がポリエチレンテレフタレー
ト（ｎ=1.575；屈折率）の場合、ビスフェノールＡ型エ
ポキシ樹脂やビスフェノールＦ型エポキシ樹脂、テトラ
ヒドロキシフェニルメタン型エポキシ樹脂、ノボラック
型エポキシ樹脂、レゾルシン型エポキシ樹脂、ポリアル
コール・ポリグリコール型エポキシ樹脂、ポリオレフィ
ン型エポキシ樹脂、脂環式やハロゲン化ビスフェノール
などのエポキシ樹脂（いずれも屈折率が1.55〜1.60）を
使うことができる。エポキシ樹脂以外では天然ゴム（ｎ
=1.52）、ポリイソプレン（ｎ=1.521）、ポリ１，２−
ブタジエン（ｎ=1.50）、ポリイソブテン（ｎ=1.505〜
1.51）、ポリブテン（ｎ=1.5125）、ポリ−２−ヘプチ
ル−１，３−ブタジエン（ｎ=1.50）、ポリ−２−ｔ−
ブチル−１，３−ブタジエン（ｎ=1.506）、ポリ−１，
３−ブタジエン（ｎ=1.515）などの（ジ）エン類、ポリ
オキシエチレン（ｎ=1.4563）、ポリオキシプロピレン
（ｎ=1.4495）、ポリビニルエチルエーテル（ｎ=1.45
4）、ポリビニルヘキシルエーテル（ｎ=1.4591）、ポリ
ビニルブチルエーテル（ｎ=1.4563）などのポリエーテ
ル類、ポリビニルアセテート（ｎ=1.4665）、ポリビニ
ルプロピオネート（ｎ=1.4665）などのポリエステル
類、ポリウレタン（ｎ=1.5〜1.6）、エチルセルロース
（ｎ=1.479）、ポリ塩化ビニル（ｎ=1.54〜1.55）、ポ
リアクリロニトリル（ｎ=1.52）、ポリメタクリロニト
リル（ｎ=1.52）、ポリスルホン（ｎ=1.633）、ポリス
ルフィド（ｎ=1.6）、フェノキシ樹脂（ｎ=1.5〜1.6）
などを挙げることができる。これらは、好適な可視光透
過率を発現する。Next, the adhesive covering this geometrical figure has a difference in refractive index from the transparent plastic substrate described above of 0.14.
It is as follows. Further, when the transparent plastic substrate is laminated with the conductive material via the adhesive layer, the difference in refractive index between the adhesive layer and the adhesive covering the geometrical figure is 0.
14 or less. This is because if the refractive index of the transparent plastic substrate and the adhesive or the refractive index of the adhesive and the adhesive layer is different, the visible light transmittance is reduced, and if the refractive index difference is 0.14 or less, the visible light is reduced. The light transmittance is small and good. As a material of the adhesive satisfying such requirements, when the transparent plastic substrate is polyethylene terephthalate (n = 1.575; refractive index), bisphenol A type epoxy resin, bisphenol F type epoxy resin, tetrahydroxyphenylmethane type epoxy resin , Novolak-type epoxy resin, resorcinol-type epoxy resin, polyalcohol / polyglycol-type epoxy resin, polyolefin-type epoxy resin, epoxy resin such as alicyclic or halogenated bisphenol (all have a refractive index of 1.55-1.60) it can. Natural rubber (n
= 1.52), polyisoprene (n = 1.521), poly 1,2-
Butadiene (n = 1.50), polyisobutene (n = 1.505-
1.51), polybutene (n = 1.5125), poly-2-heptyl-1,3-butadiene (n = 1.50), poly-2-t-
Butyl-1,3-butadiene (n = 1.506), poly-1,
(Di) enes such as 3-butadiene (n = 1.515), polyoxyethylene (n = 1.4563), polyoxypropylene (n = 1.4495), polyvinyl ethyl ether (n = 1.45)
4), polyethers such as polyvinyl hexyl ether (n = 1.4591), polyvinyl butyl ether (n = 1.4563), polyesters such as polyvinyl acetate (n = 1.4665), polyvinyl propionate (n = 1.4665), polyurethane (n = 1.5 to 1.6), ethyl cellulose (n = 1.479), polyvinyl chloride (n = 1.54 to 1.55), polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.52), polysulfone (n = 1.633), polysulfide (N = 1.6), phenoxy resin (n = 1.5-1.6)
And the like. These exhibit a suitable visible light transmittance.
【００１１】一方、透明プラスチック基材がアクリル樹
脂の場合、上記の樹脂以外に、ポリエチルアクリレート
（ｎ=1.4685）、ポリブチルアクリレート（ｎ=1.46
6）、ポリ−２−エチルヘキシルアクリレート（ｎ=1.46
3）、ポリ−ｔ-ブチルアクリレート（ｎ=1.4638）、ポ
リ−３−エトキシプロピルアクリレート（ｎ=1.465）、
ポリオキシカルボニルテトラメタクリレート（ｎ=1.46
5）、ポリメチルアクリレート（ｎ=1.472〜1.480）、ポ
リイソプロピルメタクリレート（ｎ=1.4728）、ポリド
デシルメタクリレート（ｎ=1.474）、ポリテトラデシル
メタクリレート（ｎ=1.4746）、ポリ−ｎ−プロピルメ
タクリレート（ｎ=1.484）、ポリ−３，３，５−トリメ
チルシクロヘキシルメタクリレート（ｎ=1.484）、ポリ
エチルメタクリレート（ｎ=1.485）、ポリ−２−ニトロ
−２−メチルプロピルメタクリレート（ｎ=1.4868）、
ポリテトラカルバニルメタクリレート（ｎ=1.4889）、
ポリ−１，１−ジエチルプロピルメタクリレート（ｎ=
1.4889）、ポリメチルメタクリレート（ｎ=1.4893）な
どのポリ（メタ）アクリル酸エステルが使用可能であ
る。これらのアクリルポリマーは必要に応じて、２種以
上共重合してもよいし、２種類以上をブレンドして使う
こともできる。On the other hand, when the transparent plastic substrate is an acrylic resin, in addition to the above resins, polyethyl acrylate (n = 1.4685) and polybutyl acrylate (n = 1.46)
6), poly-2-ethylhexyl acrylate (n = 1.46)
3), poly-t-butyl acrylate (n = 1.4638), poly-3-ethoxypropyl acrylate (n = 1.465),
Polyoxycarbonyltetramethacrylate (n = 1.46
5), polymethyl acrylate (n = 1.472 to 1.480), polyisopropyl methacrylate (n = 1.4728), polydodecyl methacrylate (n = 1.474), polytetradecyl methacrylate (n = 1.4746), poly-n-propyl methacrylate (n = 1.484), poly-3,3,5-trimethylcyclohexyl methacrylate (n = 1.484), polyethyl methacrylate (n = 1.485), poly-2-nitro-2-methylpropyl methacrylate (n = 1.4868),
Polytetracarbanyl methacrylate (n = 1.4889),
Poly-1,1-diethylpropyl methacrylate (n =
1.4889), poly (meth) acrylates such as polymethyl methacrylate (n = 1.4893) can be used. If necessary, two or more of these acrylic polymers may be copolymerized, or two or more of them may be used as a blend.
【００１２】さらにアクリル樹脂とアクリル以外との共
重合樹脂としてはエポキシアクリレート、ウレタンアク
リレート、ポリエーテルアクリレート、ポリエステルア
クリレートなども使うこともできる。特に接着性の点か
ら、エポキシアクリレート、ポリエーテルアクリレート
が優れており、エポキシアクリレートとしては、１，６
−ヘキサンジオールジグリシジルエーテル、ネオペンチ
ルグリコールジグリシジルエーテル、アリルアルコール
ジグリシジルエーテル、レゾルシノールジグリシジルエ
ーテル、アジピン酸ジグリシジルエステル、フタル酸ジ
グリシジルエステル、ポリエチレングリコールジグリシ
ジルエーテル、トリメチロールプロパントリグリシジル
エーテル、グリセリントリグリシジルエーテル、ペンタ
エリスリトールテトラグリシジルエーテル、ソルビトー
ルテトラグリシジルエーテル等の（メタ）アクリル酸付
加物が挙げられる。エポキシアクリレートは分子内に水
酸基を有するため接着性向上に有効であり、これらの共
重合樹脂は必要に応じて、２種以上併用することができ
る。接着剤の主成分となるポリマーの重量平均分子量
は、１，０００以上のものが使われる。分子量が１，０
００以下だと組成物の凝集力が低すぎるために被着体へ
の密着性が低下する。Furthermore, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate and the like can also be used as the copolymer resin of acrylic resin and other than acrylic resin. In particular, epoxy acrylate and polyether acrylate are excellent from the viewpoint of adhesiveness.
-Hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, resorcinol diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, (Meth) acrylic acid adducts such as glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether and sorbitol tetraglycidyl ether. Epoxy acrylate has a hydroxyl group in the molecule and is therefore effective in improving the adhesiveness. These copolymer resins can be used in combination of two or more as necessary. The polymer used as the main component of the adhesive has a weight average molecular weight of 1,000 or more. Molecular weight 1,0
If it is less than 00, the cohesive strength of the composition is too low, and the adhesion to the adherend is reduced.
【００１３】接着剤の硬化剤としてはトリエチレンテト
ラミン、キシレンジアミン、ジアミノジフェニルメタン
などのアミン類、無水フタル酸、無水マレイン酸、無水
ドデシルコハク酸、無水ピロメリット酸、無水ベンゾフ
ェノンテトラカルボン酸などの酸無水物、ジアミノジフ
ェニルスルホン、トリス（ジメチルアミノメチル）フェ
ノール、ポリアミド樹脂、ジシアンジアミド、エチルメ
チルイミダゾールなどを使うことができる。 これらは
単独で用いてもよいし、２種以上混合して用いてもよ
い。これらの架橋剤の添加量は上記ポリマー１００重量
部に対して０．１〜５０重量部、好ましくは１〜３０重
量部の範囲で選択するのがよい。この添加量が、０．１
重量部未満であると硬化が不十分となり、５０重量部を
越えると過剰架橋となり、接着性に悪影響を与える場合
がある。本発明で使用する接着剤の樹脂組成物には必要
に応じて、希釈剤、可塑剤、酸化防止剤、充填剤や粘着
付与剤などの添加剤を配合してもよい。そして、この接
着剤の樹脂組成物は、透明プラスチック基材の表面に導
電性材料で描かれた幾何学図形を設けた構成材料の基材
の一部または全面を被覆するために、塗布され、溶媒乾
燥、加熱硬化工程をへたのち、本発明に係る接着フィル
ムにする。上記で得られた電磁波シ−ルド性と透明性を
有する接着フィルムは、該接着フィルムの接着剤により
ＣＲＴ、ＰＤＰ、液晶、ＥＬなどのディスプレイに直接
貼り付け使用したり、アクリル板、ガラス板等の板やシ
ートに貼り付けてディスプレイに使用する。また、この
接着フィルムは、電磁波を発生する測定装置、測定機器
や製造装置の内部をのぞくための窓や筐体に上記と同様
にして使用する。さらに、電波塔や高圧線等により電磁
波障害を受ける恐れのある建造物の窓や自動車の窓等に
設ける。そして、導電性材料で描かれた幾何学図形には
アース線を設けることが好ましい。Examples of the curing agent for the adhesive include amines such as triethylenetetramine, xylenediamine and diaminodiphenylmethane; and acids such as phthalic anhydride, maleic anhydride, dodecylsuccinic anhydride, pyromellitic anhydride and benzophenonetetracarboxylic anhydride. Anhydride, diaminodiphenyl sulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, ethylmethylimidazole, and the like can be used. These may be used alone or as a mixture of two or more. The amount of the crosslinking agent to be added is selected in the range of 0.1 to 50 parts by weight, preferably 1 to 30 parts by weight, based on 100 parts by weight of the polymer. When the amount added is 0.1
If the amount is less than 50 parts by weight, the curing will be insufficient, and if it exceeds 50 parts by weight, excessive crosslinking will occur, which may adversely affect the adhesiveness. The resin composition of the adhesive used in the present invention may optionally contain additives such as a diluent, a plasticizer, an antioxidant, a filler and a tackifier. Then, the resin composition of the adhesive is applied to cover a part or the whole of the base material of the constituent material provided with the geometrical figure drawn by the conductive material on the surface of the transparent plastic base material, After the solvent drying and heat curing steps, the adhesive film according to the present invention is obtained. The adhesive film having the electromagnetic shielding property and transparency obtained above can be directly adhered to a display such as a CRT, PDP, liquid crystal, EL, or the like using an adhesive of the adhesive film, or used as an acrylic plate, a glass plate, or the like. To be used for displays. Further, this adhesive film is used in the same manner as described above for a measuring device that generates electromagnetic waves, a window or a casing for looking inside a measuring device or a manufacturing device. Furthermore, it is provided in a window of a building, a window of a car, or the like, which is susceptible to electromagnetic interference due to a radio tower or a high-voltage line. In addition, it is preferable to provide an earth line in the geometrical figure drawn with the conductive material.
【００１４】本発明は、透明プラスチック基材上の導電
性材料が除去された部分は密着性向上のために意図的に
凹凸を有していたり、導電性材料の背面形状を転写した
りするためにその表面で光が散乱され、透明性が損なわ
れるが、その凹凸面に透明プラスチック基材と屈折率が
近い樹脂が平滑に塗布されると乱反射が最小限に押さえ
られ、透明性が発現するようになる。さらに透明プラス
チック基材上の導電性材料で描写された幾何学図形は、
ライン幅が非常に小さいため肉眼で視認されない。また
ピッチも十分に大きいため見掛け上透明性を発現すると
考えられる。一方、遮蔽すべき電磁波の波長に比べて、
幾何学図形のピッチは十分に小さいため、優れたシール
ド性を発現すると考えられる。According to the present invention, the portion of the transparent plastic substrate from which the conductive material has been removed has irregularities intentionally for the purpose of improving the adhesion, or the back surface of the conductive material is transferred. Although light is scattered on the surface and transparency is impaired, irregular reflection is suppressed to a minimum when a resin having a refractive index close to that of a transparent plastic substrate is smoothly applied to the uneven surface, and transparency is exhibited. Become like Furthermore, geometric figures drawn with conductive materials on transparent plastic substrates,
The line width is so small that it cannot be seen with the naked eye. In addition, the pitch is sufficiently large, and it is considered that apparent transparency is exhibited. On the other hand, compared to the wavelength of the electromagnetic wave to be shielded,
Since the pitch of the geometric figure is sufficiently small, it is considered that excellent shielding properties are exhibited.
【００１５】[0015]
（実施例） ＜接着フィルム１の作製例＞透明プラスチック基材とし
て厚さ５０μｍの透明ＰＥＴフィルム（屈折率ｎ＝１．
５７５）を用い、その上に接着層となるエポキシ系接着
シート（ニカフレックスＳＡＦ；ニッカン工業（株）
製、ｎ＝１．５８）を介して導電性材料である厚さ１８
μｍの電解銅箔の粗化面がエポキシ系接着シート側にな
るようにして、１８０℃、３０ｋｇｆ／ｃｍ2の条件で
加熱ラミネートして接着させた。得られた銅箔付きＰＥ
Ｔフィルムにフォトリソ工程（レジストフィルム貼付け
−露光−現像−ケミカルエッチング−レジストフィルム
剥離）を経て、ライン幅２５μｍ、ライン間隔５００μ
ｍの銅格子パターンの幾何学図形をＰＥＴフィルム上に
形成し構成材料１を得た。この構成材料１上に後述の接
着剤を乾燥塗布厚が約４０μｍになるように塗布、乾燥
して電磁波シールド性と透明性を有する接着フィルム１
を得た。そして、接着フィルム１をロールラミネータを
使用し市販のアクリル板（コモグラス；（株）クラレ
製、厚み３ｍｍ）に１１０℃、２０ｋｇｆ／ｃｍ2の条
件で加熱圧着した。(Example) <Example of preparing adhesive film 1> A transparent PET film having a thickness of 50 µm (refractive index n = 1.
575), and an epoxy-based adhesive sheet (Nikaflex SAF; Nikkan Kogyo Co., Ltd.) to be an adhesive layer thereon
, N = 1.58) through a conductive material of thickness 18
Heat lamination was performed at 180 ° C. and 30 kgf / cm 2 so that the roughened surface of the μm electrolytic copper foil was on the side of the epoxy-based adhesive sheet and bonded. The obtained PE with copper foil
The T film was subjected to a photolithography process (resist film sticking-exposure-development-chemical etching-resist film peeling), line width 25 μm, line interval 500 μ
The geometric figure of the copper lattice pattern of m was formed on the PET film, and the constituent material 1 was obtained. An adhesive described later is applied on the constituent material 1 so that the dry coating thickness is about 40 μm, and dried to form an adhesive film 1 having electromagnetic wave shielding properties and transparency.
I got Then, the adhesive film 1 was heat-pressed on a commercially available acrylic plate (como glass; manufactured by Kuraray Co., Ltd., thickness: 3 mm) at 110 ° C. and 20 kgf / cm 2 using a roll laminator.
【００１６】＜接着フィルム２の作製例＞透明プラスチ
ック基材として厚さ２５μｍの透明ＰＥＴフィルムを用
い、この上に導電性材料である厚み２５μｍのアルミニ
ウム箔を、接着層となるパイララックスＬＦ−０２００
（デュポン・ジャパンリミテッド製、アクリル系接着フ
ィルム、ｎ＝１．４７）を介して、ロールラミネータに
より１７０℃、２０ｋｇ／ｃｍ2の条件でラミネートし
た。このアルミ付きＰＥＴフィルムに接着フィルム１の
作製例と同様のフォトリソ工程を経て、ライン幅２５μ
ｍ、ライン間隔２５０μｍのアルミ格子パターンの幾何
学図形をＰＥＴフィルム上に形成し構成材料２を得た。
この構成材料２の上に後述の接着剤を乾燥塗布厚が約３
０μｍになるように塗布、乾燥して電磁波シールド性と
透明性を有する接着フィルム２を得た。そして、接着フ
ィルム２を市販のアクリル板に１１０℃、３０ｋｇｆ／
ｃｍ２、３０分の条件で熱プレス機を使って加熱圧着し
た。<Production Example of Adhesive Film 2> A 25 μm-thick transparent PET film was used as a transparent plastic substrate, and a 25 μm-thick aluminum foil as a conductive material was placed on this film, and Pyralux LF-0200 serving as an adhesive layer was formed.
(Acrylic adhesive film, manufactured by DuPont Japan Limited, n = 1.47), and laminated by a roll laminator at 170 ° C. and 20 kg / cm 2 . This aluminum-coated PET film was subjected to the same photolithography process as in the production example of the adhesive film 1 to obtain a line width of 25 μm.
A geometrical figure of an aluminum lattice pattern having a line spacing of 250 μm was formed on a PET film to obtain a constituent material 2.
An adhesive to be described later is dried on the constituent material 2 to a thickness of about 3
It was applied to a thickness of 0 μm and dried to obtain an adhesive film 2 having electromagnetic wave shielding properties and transparency. Then, the adhesive film 2 is applied to a commercially available acrylic plate at 110 ° C. and 30 kgf /
Thermocompression bonding was performed using a hot press under the conditions of cm 2 and 30 minutes.
【００１７】＜接着フィルム３の作製例＞透明プラスチ
ック基材として厚さ５０μｍの透明ＰＥＴフィルムを用
い、この上に、マスクを用いて導電性材料となる無電解
ニッケルめっきを行い、ライン幅１２μｍ、ライン間隔
５００μｍ、ライン厚み２μｍのニッケル格子パターン
の幾何学図形をＰＥＴフィルム上に作製し構成材料３を
得た。この構成材料３の上に後述の接着剤を乾燥塗布厚
が約７０μｍになるように塗布、乾燥して電磁波シール
ド性と透明性を有する接着フィルム３を得た。そして、
接着フィルム３をロールラミネータを使用して市販のア
クリル板に１１０℃、２０ｋｇｆ／ｃｍ２、３０分の条
件で加熱圧着した。<Production Example of Adhesive Film 3> A transparent PET substrate having a thickness of 50 μm was used as a transparent plastic substrate, and electroless nickel plating as a conductive material was performed thereon using a mask to form a line width of 12 μm. A geometric figure of a nickel lattice pattern having a line interval of 500 μm and a line thickness of 2 μm was produced on a PET film to obtain a constituent material 3. An adhesive described later was applied on this constituent material 3 so that the dry coating thickness was about 70 μm, and dried to obtain an adhesive film 3 having electromagnetic wave shielding properties and transparency. And
The adhesive film 3 was thermocompression-bonded to a commercially available acrylic plate at 110 ° C., 20 kgf / cm 2 for 30 minutes using a roll laminator.
【００１８】 ＜接着剤１の組成物＞ ＴＢＡ-ＨＭＥ（日立化成工業（株）製；高分子量エポキシ樹脂、Ｍｗ=３０万） １００重量部、 ＹＤ-８１２５（東都化成（株）製；ビスフェノールＡ型エポキシ樹脂） ２５重量部、 ＩＰＤＩ（日立化成工業（株）製；マスクイソシアネート） １２．５重量部、 ２−エチル−４−メチルイミダゾール ０．３重量部、 ＭＥＫ ３３０重量部 シクロヘキサノン １５重量部 上記接着剤の成分をＭＥＫとシクロヘキサノンに溶解さ
せ、接着剤１のワニスを作製した。このワニスをガラス
板に流延し、加熱乾燥して得られるフィルムの屈折率は
１．５７であった。<Composition of Adhesive 1> 100 parts by weight of TBA-HME (manufactured by Hitachi Chemical Co., Ltd .; high molecular weight epoxy resin, Mw = 300,000), YD-8125 (manufactured by Toto Kasei Co., Ltd .; bisphenol A) Epoxy resin) 25 parts by weight, IPDI (manufactured by Hitachi Chemical Co., Ltd .; mask isocyanate) 12.5 parts by weight, 2-ethyl-4-methylimidazole 0.3 part by weight, MEK 330 parts by weight Cyclohexanone 15 parts by weight The components of the adhesive were dissolved in MEK and cyclohexanone to prepare a varnish of the adhesive 1. The varnish was cast on a glass plate and dried by heating. The film obtained had a refractive index of 1.57.
【００１９】 ＜接着剤２の組成物＞ ＹＰ−３０（東都化成（株）製；フェノキシ樹脂、Ｍｗ=６万）１００重量部、 ＹＤ−８１２５（東都化成（株）製；ビスフェノールＡ型エポキシ樹脂） １０重量部、 ＩＰＤＩ（日立化成工業（株）製；マスクイソシアネート） ５重量部、 ２−エチル−４−メチルイミダゾール ０．３重量部、 ＭＥＫ ２８５重量部、 シクロヘキサノン ５重量部、 上記接着剤の成分をＭＥＫとシクロヘキサノンに溶解さ
せ、接着剤２のワニスを作製した。このワニスをガラス
板に流延し、加熱乾燥して得られるフィルムの屈折率は
１．５５であった。<Composition of Adhesive 2> 100 parts by weight of YP-30 (manufactured by Toto Kasei Co., Ltd .; phenoxy resin, Mw = 60,000); YD-8125 (manufactured by Toto Kasei Co., Ltd .; bisphenol A type epoxy resin) 10 parts by weight, 5 parts by weight of IPDI (manufactured by Hitachi Chemical Co., Ltd .; mask isocyanate), 0.3 parts by weight of 2-ethyl-4-methylimidazole, 285 parts by weight of MEK, 5 parts by weight of cyclohexanone, The components were dissolved in MEK and cyclohexanone to prepare a varnish of the adhesive 2. The varnish was cast on a glass plate and dried by heating to obtain a film having a refractive index of 1.55.
【００２０】 ＜接着剤３の組成物＞ ＨＴＲ−６００ＬＢ（帝国化学産業（株）製；ポリアクリル酸エステル、Ｍｗ= ７０万） １００重量部、 コロネートＬ（日本ポリウレタン（株）製；３官能イソシアネート） ４．５重量部、 ジブチル錫ジラウリレート ０．４重量部、 トルエン ４５０重量部、 酢酸エチル １０重量部、 上記接着剤の成分をトルエンと酢酸エチルに溶解させ、
接着剤３のワニスを作製した。このワニスをガラス板に
流延し、加熱乾燥して得られるフィルムの屈折率は１．
４７であった。<Composition of Adhesive 3> 100 parts by weight of HTR-600LB (manufactured by Teikoku Chemical Industry Co., Ltd .; polyacrylate, Mw = 700,000), Coronate L (manufactured by Nippon Polyurethane Co., Ltd .; trifunctional isocyanate) 4.5 parts by weight, 0.4 parts by weight of dibutyltin dilaurate, 450 parts by weight of toluene, 10 parts by weight of ethyl acetate, The components of the above adhesive are dissolved in toluene and ethyl acetate,
A varnish of the adhesive 3 was prepared. The varnish was cast on a glass plate and dried by heating. The film obtained had a refractive index of 1.
47.
【００２１】（実施例１）接着剤１を使用し接着フィル
ム１の作製例の手順で得た接着フィルムを実施例１とし
た。 （実施例２）接着剤２を使用し接着フィルム２の作製例
の手順で得た接着フィルムを実施例２とした。 （実施例３）接着剤３を使用し接着フィルム３の作製例
の手順で得た接着フィルムを実施例３とした。 （実施例４）ライン幅を２５μｍから３５μｍにし、そ
れ以外の条件は全て実施例１と同様にして得た接着フィ
ルムを実施例４とした。 （実施例５）ライン幅を２５μｍから１２μｍにし、そ
れ以外の条件は全て実施例２と同様にして得た接着フィ
ルムを実施例５とした。 （実施例６）ライン間隔を５００μｍから８００μｍに
し、それ以外の条件は全て実施例３と同様にして得た接
着フィルムを実施例６とした。 （実施例７）ライン間隔を５００μｍから２５０μｍに
し、それ以外の条件は全て実施例１と同様にして得た接
着フィルムを実施例７とした。 （実施例８）ライン厚みを２５μｍから３５μｍにし、
それ以外の条件は全て実施例２と同様にして得た接着フ
ィルムを実施例８とした。 （実施例９）導電性材料として黒化処理された銅を使
い、それ以外の条件は全て実施例１と同様にして得た接
着フィルムを実施例９とした。 （実施例１０）実施例１で形成した格子パターンの代わ
りに正３角形の繰り返しパターンを作製した。 （実施例１１）実施例１で形成した格子パターンの代わ
りに正６角形の繰り返しパターンを作製した。 （実施例１２）実施例１で形成した格子パターンの代わ
りに正８角形と正方形よりなる繰り返しパターンを作製
した。(Example 1) An adhesive film obtained by using the adhesive 1 and following the procedure of the production example of the adhesive film 1 was used as Example 1. (Example 2) An adhesive film obtained by the procedure of the production example of the adhesive film 2 using the adhesive 2 was used as Example 2. (Example 3) An adhesive film obtained by the procedure of the production example of the adhesive film 3 using the adhesive 3 was used as Example 3. (Example 4) An adhesive film obtained in the same manner as in Example 1 except that the line width was changed from 25 µm to 35 µm was used as Example 4. (Example 5) An adhesive film obtained in the same manner as in Example 2 except that the line width was changed from 25 µm to 12 µm was used as Example 5. (Example 6) An adhesive film obtained in the same manner as in Example 3 except that the line interval was changed from 500 µm to 800 µm was used as Example 6. (Example 7) An adhesive film obtained in the same manner as in Example 1 except that the line interval was changed from 500 µm to 250 µm was used as Example 7. Example 8 The line thickness was changed from 25 μm to 35 μm,
An adhesive film obtained in the same manner as in Example 2 under all other conditions was used as Example 8. (Example 9) An adhesive film obtained in the same manner as in Example 1 except that blackened copper was used as the conductive material was used as Example 9. Example 10 Instead of the lattice pattern formed in Example 1, a regular triangular repetition pattern was produced. (Example 11) Instead of the lattice pattern formed in Example 1, a regular hexagonal repeating pattern was produced. (Example 12) Instead of the lattice pattern formed in Example 1, a repetitive pattern consisting of regular octagons and squares was produced.
【００２２】（比較例１）アルミニウムの代わりにＩＴ
Ｏ膜を２，０００Å全面蒸着させたＩＴＯ蒸着ＰＥＴを
使い、パターンを形成しないで、直接接着剤を塗布し
た。その後、実施例１と同様にして得た接着フィルムを
比較例１とした。 （比較例２）透明プラスチック基材として厚さ２５μｍ
の透明ＰＥＴフィルムを用い、この上に導電性材料であ
るアルミニウムを、２０００Å蒸着させた。幾何学図形
を形成せず、直接接着剤２を塗布した。そして、実施例
２と同様にして得た接着フィルムを比較例２とした。 （比較例３）ライン幅を２５μｍから５０μｍにし、そ
れ以外の条件は全て実施例１と同様にして得たフィルム
を比較例３とした。 （比較例４）ライン間隔を２５０μｍから１５０μｍに
し、それ以外の条件は全て実施例２と同様にして得た接
着フィルムを比較例４とした。 （比較例５）ライン厚を２５μｍから７０μｍにし、そ
れ以外の条件は全て実施例２と同様にして得た接着フィ
ルムを比較例５とした。 （比較例６）接着剤としてフェノール-ホルムアルデヒ
ド樹脂（Ｍｗ=５万、ｎ=１．７３）を使い、その他の条
件は全て実施例１と同様にして得た接着フィルムを比較
例６とした。 （比較例７）接着剤としてポリジメチルシロキサン（Ｍ
ｗ=４．５万、ｎ=１．４３）を使い、その他の条件は全
て実施例３と同様にして得た接着フィルムを比較例７と
した。 （比較例８）接着剤としてポリビニリデンフルオライド
（Ｍｗ=１２万、ｎ=１．４２）を使い、その他の条件は
全て実施例３と同様にして得た接着フィルムを比較例８
とした。 （比較例９）透明プラスチック基材として厚み６０μｍ
の充填剤入りポリエチレンフィルム（可視光透過率２０
％以下）を使い、その他の条件は全て実施例１と同様に
して得たフィルムを比較例９とした。Comparative Example 1 Instead of aluminum, IT
An adhesive was directly applied without forming a pattern using ITO vapor-deposited PET in which an O film was entirely vapor-deposited at 2,000 °. Thereafter, an adhesive film obtained in the same manner as in Example 1 was used as Comparative Example 1. (Comparative Example 2) 25 μm thick transparent plastic substrate
Was used as a transparent PET film, and aluminum as a conductive material was vapor-deposited thereon at 2000 °. The adhesive 2 was applied directly without forming a geometric figure. Then, an adhesive film obtained in the same manner as in Example 2 was used as Comparative Example 2. Comparative Example 3 A film obtained in the same manner as in Example 1 except that the line width was changed from 25 μm to 50 μm was used as Comparative Example 3. Comparative Example 4 An adhesive film obtained in the same manner as in Example 2 except that the line interval was changed from 250 μm to 150 μm was used as Comparative Example 4. Comparative Example 5 An adhesive film obtained in the same manner as in Example 2 except that the line thickness was changed from 25 μm to 70 μm, and Comparative Example 5 was used. (Comparative Example 6) A phenol-formaldehyde resin (Mw = 50,000, n = 1.73) was used as an adhesive, and an adhesive film obtained in the same manner as in Example 1 under all other conditions was used as Comparative Example 6. (Comparative Example 7) Polydimethylsiloxane (M
(w = 45,000, n = 1.43), and the other conditions were the same as in Example 3 to obtain an adhesive film of Comparative Example 7. (Comparative Example 8) An adhesive film obtained by using polyvinylidene fluoride (Mw = 120,000, n = 1.42) as an adhesive in all other conditions as in Example 3 was used.
And (Comparative Example 9) 60 μm thick as a transparent plastic substrate
Filled polyethylene film (visible light transmittance 20
% Or less), and a film obtained in the same manner as in Example 1 under all other conditions was used as Comparative Example 9.
【００２３】以上のようにして得られた接着フィルム用
いた構成物のＥＭＩシールド性、可視光透過率、非視認
性、加熱処理前後の接着特性、退色特性を測定した。結
果を表１と表２に示す。The EMI shielding property, visible light transmittance, invisibility, adhesive properties before and after the heat treatment, and fading properties of the composition using the adhesive film obtained as described above were measured. The results are shown in Tables 1 and 2.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【表２】 [Table 2]
【００２６】なお、ＥＭＩシールド性は、同軸導波管変
換器（日本高周波（株）製、ＴＷＣ−Ｓ−０２４）のフ
ランジ間に試料を挿入し、スペクトロアナライザー（Ｙ
ＨＰ製、８５１０Ｂベクトルネットワークアナライザ
ー）を用い、周波数１ＧＨｚで測定した。可視光透過率
の測定は、ダブルビーム分光光度計（（株）日立製作所
製、２００−１０型）を用いて、４００〜８００ｎｍの
透過率の平均値を用いた。非視認性は、アクリル板に貼
付けた接着フィルムを０．５ｍ離れた場所から目視して
導電性材料で描かれた幾何学図形を認識できるかどうか
で評価し、認識できないものを非常に良、良好とし、認
識できるものをＮＧとした。接着力は、引張り試験器
（東洋ボールドウィン（株）製、テンシロンＵＴＭ−４
−１００）を使用し、幅１０ｍｍ、９０°方向、剥離速
度５０ｍｍ／分で測定した。屈折率は、屈折計（（株）
アタゴ光学機械製作所製、アッベ屈折計）を使用し、２
５℃で測定した。The EMI shielding property is determined by inserting a sample between flanges of a coaxial waveguide converter (TWC-S-024, manufactured by Japan High Frequency Co., Ltd.) and using a spectroanalyzer (Y
HP 8510B vector network analyzer) at a frequency of 1 GHz. The visible light transmittance was measured using a double beam spectrophotometer (manufactured by Hitachi, Ltd., Model 200-10), and the average value of the transmittance at 400 to 800 nm was used. The non-visibility is evaluated by visually checking the adhesive film attached to the acrylic plate from a distance of 0.5 m from the place where the geometric figure drawn by the conductive material can be recognized. Good and recognizable were NG. The adhesive force was measured using a tensile tester (Tensilon UTM-4 manufactured by Toyo Baldwin Co., Ltd.).
-100) using a width of 10 mm, a 90 ° direction, and a peeling speed of 50 mm / min. Refractive index, refractometer (Co., Ltd.)
Use Atago Optical Machine Works, Abbe refractometer)
It was measured at 5 ° C.
【００２７】[0027]
【発明の効果】本発明により得られる電磁波シールドと
透明性を有する接着フィルムは実施例からも明らかなよ
うに、被着体に密着して使用できるので電磁波漏れがな
くＥＭＩシールド性が特に良好である。また、可視光透
過率、非視認性などの光学特性が良好で、しかも長時間
にわたって高温での接着特性の変化が少なく良好であ
り、それらに優れた接着フィルムを提供することができ
る。また、請求項２に記載の透明プラスチック基材をポ
リエチレンテレフタレートフィルムとすることにより、
透明性、耐熱性が良好なうえ、安価で取扱性に優れた電
磁波シールド性と透明性を有する接着フィルムを提供す
ることができる。請求項３に記載の導電性材料の厚み
が、３〜４０μｍの銅、アルミニウムまたはニッケルの
金属箔を使用し、透明プラスチック基材への接着面を粗
面とすることにより、加工性に優れ、安価でＥＭＩシー
ルド性に優れた電磁波シールド性と透明性を有する接着
フィルムを提供することができる。請求項４に記載の導
電性材料を銅として、少なくともその表面を黒化処理さ
れたものとすることにより、退色性が小さく、コントラ
ストの大きい電磁波シールド性と透明性を有する接着フ
ィルムを提供することができる。請求項５に記載の透明
プラスチック基材上の幾何学図形をケミカルエッチング
プロセスにより描画させることにより、加工性に優れた
電磁波シールド性と透明性を有する接着フィルムを提供
することができる。請求項６に記載の導電性材料を常磁
性金属とすることにより、磁場シールド性に優れた電磁
波シールド性と透明性を有する接着フィルムを提供する
ことができる。請求項７、８に記載の電磁波シ−ルド性
と透明性を有する接着フィルムをディスプレイや電磁波
遮蔽構成体に用いることによりＥＭＩシ−ルド性に優
れ、可視光透過率が大きいのでディスプレイの輝度を高
めることなく通常の状態とほぼ同様の条件下でディスプ
レイを見ることができ、しかも導電性材料で描かれた幾
何学図形が視認できないので違和感なく見ることができ
る。As is clear from the examples, the electromagnetic wave shield obtained by the present invention and the adhesive film having transparency can be used in close contact with the adherend, so that there is no electromagnetic wave leakage and the EMI shielding property is particularly good. is there. In addition, optical properties such as visible light transmittance and invisibility are good, and there is little change in adhesive properties at high temperature over a long period of time, and good adhesive films can be provided. Further, by making the transparent plastic substrate according to claim 2 a polyethylene terephthalate film,
It is possible to provide an adhesive film having excellent electromagnetic wave shielding properties and transparency that is excellent in transparency and heat resistance, inexpensive, and easy to handle. The thickness of the conductive material according to claim 3 is 3 to 40 μm, using a metal foil of copper, aluminum or nickel, and having a rough surface to adhere to the transparent plastic substrate, so that the workability is excellent, It is possible to provide an adhesive film that is inexpensive and has excellent electromagnetic shielding properties and transparency excellent in EMI shielding properties. By providing the conductive material according to claim 4 as copper and at least the surface thereof being subjected to blackening treatment, to provide an adhesive film having a small fading property, a high contrast, an electromagnetic wave shielding property and a transparency. Can be. By drawing the geometric figure on the transparent plastic substrate according to claim 5 by a chemical etching process, it is possible to provide an adhesive film having excellent electromagnetic wave shielding properties and transparency excellent in workability. By using a paramagnetic metal as the conductive material according to the sixth aspect, it is possible to provide an adhesive film having excellent electromagnetic shielding properties and transparency, which is excellent in magnetic field shielding properties. By using the adhesive film having electromagnetic wave shielding and transparency according to claim 7 for a display or an electromagnetic wave shielding structure, the EMI shielding is excellent and the visible light transmittance is large, so that the brightness of the display is reduced. The display can be viewed under almost the same conditions as in a normal state without raising the height, and since the geometrical figures drawn with the conductive material cannot be visually recognized, the display can be performed without discomfort.
フロントページの続き (72)発明者 高橋 敦之 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 (72)発明者 登坂 実 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 (72)発明者 津山 宏一 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内Continuing on the front page (72) Inventor Atsuyuki Takahashi 1500 Oji Ogawa, Shimodate City, Ibaraki Prefecture Inside Shimodate Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Koichi Tsuyama 1500 Ogawa, Shimodate-shi, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd.
Claims (8)
性材料で描かれた幾何学図形を設けた構成材料におい
て、幾何学図形を構成するライン幅が４０μｍ以下、ラ
イン間隔が２００μｍ以上、ライン厚みが４０μｍ以下
であり、その幾何学図形を含む基材の一部または全面を
接着剤で被覆し、（２）幾何学図形を被覆する接着剤と
透明プラスチック基材、または透明プラスチック基材が
接着層を介して導電性材料と積層されている場合におい
ては接着層と幾何学図形を被覆する接着剤との屈折率の
差が０．１４以下であることを特徴とする電磁波シール
ド性と透明性を有する接着フィルム。(1) In a constituent material in which a geometrical figure drawn with a conductive material is provided on the surface of a transparent plastic base material, a line width constituting the geometrical figure is 40 μm or less, a line interval is 200 μm or more, The line thickness is 40 μm or less, and a part or the whole of the substrate including the geometrical figure is coated with an adhesive, and (2) the adhesive covering the geometrical figure and the transparent plastic substrate or the transparent plastic substrate Is laminated with a conductive material via an adhesive layer, the difference between the refractive index of the adhesive layer and the adhesive covering the geometric figure is 0.14 or less, Adhesive film with transparency.
フタレートフィルムである請求項１に記載の電磁波シー
ルド性と透明性を有する接着フィルム。2. The adhesive film according to claim 1, wherein the transparent plastic substrate is a polyethylene terephthalate film.
ミニウムまたはニッケルの金属箔で、透明プラスチック
基材への接着面が粗面である請求項１又は請求項２に記
載の電磁波シールド性と透明性を有する接着フィルム。3. The electromagnetic wave shielding property according to claim 1, wherein the conductive material is a metal foil of copper, aluminum or nickel having a thickness of 3 to 40 μm, and a surface adhered to the transparent plastic substrate is rough. And transparent adhesive film.
面が黒化処理されていることを特徴とする請求項３に記
載の電磁波シールド性と透明性を有する接着フィルム。4. The adhesive film according to claim 3, wherein the conductive material is copper, and at least the surface thereof is blackened.
ミカルエッチングプロセスにより描画されたものである
ことを特徴とする請求項１ないし請求項４のいずれかに
記載の電磁波シールド性と透明性を有する接着フィル
ム。5. The electromagnetic wave shielding property and transparency according to claim 1, wherein the geometric figure on the transparent plastic substrate is drawn by a chemical etching process. Having an adhesive film.
請求項２又は請求項５に記載の電磁波シールド性と透明
性を有する接着フィルム。6. The method according to claim 1, wherein the conductive material is a paramagnetic metal.
The adhesive film having electromagnetic wave shielding properties and transparency according to claim 2 or 5.
−ルド性と透明性を有する接着フィルムを用いたディス
プレイ。7. A display using the adhesive film having electromagnetic shielding and transparency according to claim 1.
−ルド性と透明性を有する接着フィルムを設けた電磁波
遮蔽構成体。8. An electromagnetic wave shielding structure provided with the adhesive film having electromagnetic wave shielding and transparency according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02457597A JP3388682B2 (en) | 1996-05-23 | 1997-02-07 | Method for producing display film having electromagnetic wave shielding and transparency |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12877096 | 1996-05-23 | ||
| JP8-128770 | 1996-05-23 | ||
| JP02457597A JP3388682B2 (en) | 1996-05-23 | 1997-02-07 | Method for producing display film having electromagnetic wave shielding and transparency |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002333041A Division JP3570420B2 (en) | 1996-05-23 | 2002-11-18 | Display film having electromagnetic wave shielding property and transparency, display using the film, and electromagnetic wave shielding structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1041682A true JPH1041682A (en) | 1998-02-13 |
| JP3388682B2 JP3388682B2 (en) | 2003-03-24 |
Family
ID=26362121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02457597A Expired - Fee Related JP3388682B2 (en) | 1996-05-23 | 1997-02-07 | Method for producing display film having electromagnetic wave shielding and transparency |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3388682B2 (en) |
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