JPH09510323A - 高密度格子配置の電気結線 - Google Patents

高密度格子配置の電気結線

Info

Publication number
JPH09510323A
JPH09510323A JP7523781A JP52378195A JPH09510323A JP H09510323 A JPH09510323 A JP H09510323A JP 7523781 A JP7523781 A JP 7523781A JP 52378195 A JP52378195 A JP 52378195A JP H09510323 A JPH09510323 A JP H09510323A
Authority
JP
Japan
Prior art keywords
substrate
film
conductive
core wire
connecting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7523781A
Other languages
English (en)
Japanese (ja)
Inventor
クラウス ブシック
Original Assignee
フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ． filed Critical フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー．ファオ．
Publication of JPH09510323A publication Critical patent/JPH09510323A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP7523781A 1994-03-16 1995-03-14 高密度格子配置の電気結線 Pending JPH09510323A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4408987 1994-03-16
DE4408987.2 1994-03-16
PCT/DE1995/000359 WO1995025346A1 (de) 1994-03-16 1995-03-14 Elektrische verbindungen in hochdichter rasteranordnung

Publications (1)

Publication Number Publication Date
JPH09510323A true JPH09510323A (ja) 1997-10-14

Family

ID=6512981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7523781A Pending JPH09510323A (ja) 1994-03-16 1995-03-14 高密度格子配置の電気結線

Country Status (4)

Country Link
EP (1) EP0750791A1 (de)
JP (1) JPH09510323A (de)
DE (1) DE19509202A1 (de)
WO (1) WO1995025346A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10249854B4 (de) * 2002-10-25 2005-06-16 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Leistungshalbleiter-Baugruppe
DE10332333B4 (de) * 2003-07-16 2006-08-03 Siemens Ag Detektormodul
DE102005047106B4 (de) 2005-09-30 2009-07-23 Infineon Technologies Ag Leistungshalbleitermodul und Verfahren zur Herstellung
FR2976720A1 (fr) * 2011-06-15 2012-12-21 St Microelectronics Sa Procede de connexion electrique entre des elements d'une structure integree tridimensionnelle, et dispositif correspondant

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3714706A (en) * 1970-08-21 1973-02-06 Perkin Elmer Corp Array of conductors fixed through dielectric plate
DE3709770A1 (de) * 1987-03-25 1988-10-13 Ant Nachrichtentech Leiterplatte, -folie, multilayerinnenlage oder leitersubstrat mit durchkontaktierungen und herstellungsverfahren
US5015207A (en) * 1989-12-28 1991-05-14 Isotronics, Inc. Multi-path feed-thru lead and method for formation thereof

Also Published As

Publication number Publication date
WO1995025346A1 (de) 1995-09-21
DE19509202A1 (de) 1995-09-21
EP0750791A1 (de) 1997-01-02

Similar Documents

Publication Publication Date Title
JP3544974B2 (ja) 一体化積層体
US5373627A (en) Method of forming multi-chip module with high density interconnections
US9378967B2 (en) Method of making a stacked microelectronic package
CN1964077B (zh) 电容器及其制造方法、以及包含该电容器的半导体器件
US6400573B1 (en) Multi-chip integrated circuit module
TW425647B (en) A mounting assembly for an integrated circuit and a method of routing signal paths on first and second insulative members
JP4140784B2 (ja) 電力分配構造を製造する方法および基板を製造する方法
US20020163072A1 (en) Method for bonding wafers to produce stacked integrated circuits
CN103178044B (zh) 具有一体化金属芯的多层电子支撑结构
JPH0689964A (ja) 集積回路を相互に接続するための多層ポリマー−金属装置を製造する方法およびハイブリッド構造
CN104332414A (zh) 嵌入式芯片的制造方法
JPH07101728B2 (ja) 多層配線構造体
KR20020024782A (ko) 반도체 디바이스 및 그 제조 방법
JP2009521116A (ja) ３ｄ電子モジュールを集積的に製造する方法
CN104183566B (zh) 具有突出的铜端子柱的基板
CN104269384A (zh) 嵌入式芯片
JPS58187B2 (ja) パツケ−ジ・モジユ−ル
US20020117753A1 (en) Three dimensional packaging
JPH022699A (ja) 高密度ハイブリッド集積回路
CN112117258A (zh) 一种芯片封装结构及其封装方法
CN114188300A (zh) 一种薄膜厚膜混合集成陶瓷基板及其制备方法
US20080217748A1 (en) Low cost and low coefficient of thermal expansion packaging structures and processes
EP1123565B1 (de) Mehrchipmodule mit eingebetteten kondensatoren
US5908304A (en) Mass memory and method for the manufacture of mass memories
JPH09510323A (ja) 高密度格子配置の電気結線