JPH0542138B2 - - Google Patents

Info

Publication number: JPH0542138B2
Authority: JP; Japan
Prior art keywords: dicing; film; pressure; sensitive adhesive; resin
Prior art date: 1990-09-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP23875590A

Other languages

English (en)

Japanese (ja)

Other versions

JPH03278444A (ja

Inventor

Hideo Kuroda

Masao Taniguchi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Bando Chemical Industries Ltd

Original Assignee

Bando Chemical Industries Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-09-07

Filing date

1990-09-07

Publication date

1993-06-25

1990-09-07 Application filed by Bando Chemical Industries Ltd filed Critical Bando Chemical Industries Ltd

1990-09-07 Priority to JP2238755A priority Critical patent/JPH03278444A/ja

1991-12-10 Publication of JPH03278444A publication Critical patent/JPH03278444A/ja

1993-06-25 Publication of JPH0542138B2 publication Critical patent/JPH0542138B2/ja

Status Granted legal-status Critical Current

Links

239000000853 adhesive Substances 0.000 claims description 51
230000001070 adhesive effect Effects 0.000 claims description 51
229920005989 resin Polymers 0.000 claims description 46
239000011347 resin Substances 0.000 claims description 46
239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 45
239000000203 mixture Substances 0.000 claims description 40
-1 methacryloyl groups Chemical group 0.000 claims description 38
235000012431 wafers Nutrition 0.000 claims description 28
239000004014 plasticizer Substances 0.000 claims description 22
238000000034 method Methods 0.000 claims description 20
239000004065 semiconductor Substances 0.000 claims description 19
229920006395 saturated elastomer Polymers 0.000 claims description 18
229920001225 polyester resin Polymers 0.000 claims description 12
239000004645 polyester resin Substances 0.000 claims description 12
239000003505 polymerization initiator Substances 0.000 claims description 12
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 8
230000001678 irradiating effect Effects 0.000 claims description 7
239000004800 polyvinyl chloride Substances 0.000 claims description 7
229920000915 polyvinyl chloride Polymers 0.000 claims description 7
150000002148 esters Chemical class 0.000 claims description 5
239000000178 monomer Substances 0.000 claims description 5
229920001283 Polyalkylene terephthalate Polymers 0.000 claims description 4
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 3
229920001577 copolymer Polymers 0.000 claims description 3
239000000463 material Substances 0.000 claims description 3
229920013639 polyalphaolefin Polymers 0.000 claims description 3
239000004698 Polyethylene Substances 0.000 claims description 2
239000004743 Polypropylene Substances 0.000 claims description 2
DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical group C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 2
MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 2
239000002253 acid Substances 0.000 claims description 2
229920000573 polyethylene Polymers 0.000 claims description 2
229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
239000005020 polyethylene terephthalate Substances 0.000 claims description 2
229920001155 polypropylene Polymers 0.000 claims description 2
239000004711 α-olefin Substances 0.000 claims 1
239000010410 layer Substances 0.000 description 24
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
238000006116 polymerization reaction Methods 0.000 description 12
230000004888 barrier function Effects 0.000 description 11
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
239000003112 inhibitor Substances 0.000 description 9
229910052710 silicon Inorganic materials 0.000 description 9
239000010703 silicon Substances 0.000 description 9
150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 6
KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 6
KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 6
229920006026 co-polymeric resin Polymers 0.000 description 5
238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
125000003118 aryl group Chemical group 0.000 description 4
230000000694 effects Effects 0.000 description 4
229920000642 polymer Polymers 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
125000001931 aliphatic group Chemical group 0.000 description 3
BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
238000004132 cross linking Methods 0.000 description 3
ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 3
230000009477 glass transition Effects 0.000 description 3
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
238000004519 manufacturing process Methods 0.000 description 3
229920000728 polyester Polymers 0.000 description 3
150000005846 sugar alcohols Polymers 0.000 description 3
150000003505 terpenes Chemical class 0.000 description 3
235000007586 terpenes Nutrition 0.000 description 3
SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
229920001328 Polyvinylidene chloride Polymers 0.000 description 2
244000028419 Styrax benzoin Species 0.000 description 2
235000000126 Styrax benzoin Nutrition 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
235000008411 Sumatra benzointree Nutrition 0.000 description 2
229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 2
229940081735 acetylcellulose Drugs 0.000 description 2
WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
125000002723 alicyclic group Chemical group 0.000 description 2
230000003712 anti-aging effect Effects 0.000 description 2
229960002130 benzoin Drugs 0.000 description 2
230000005540 biological transmission Effects 0.000 description 2
WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
229920002301 cellulose acetate Polymers 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
DHZSIQDUYCWNSB-UHFFFAOYSA-N chloroethene;1,1-dichloroethene Chemical compound ClC=C.ClC(Cl)=C DHZSIQDUYCWNSB-UHFFFAOYSA-N 0.000 description 2
239000003086 colorant Substances 0.000 description 2
DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
235000014113 dietary fatty acids Nutrition 0.000 description 2
238000001035 drying Methods 0.000 description 2
239000000194 fatty acid Substances 0.000 description 2
229930195729 fatty acid Natural products 0.000 description 2
239000000945 filler Substances 0.000 description 2
235000019382 gum benzoic Nutrition 0.000 description 2
238000002156 mixing Methods 0.000 description 2
239000005011 phenolic resin Substances 0.000 description 2
239000005033 polyvinylidene chloride Substances 0.000 description 2
239000011342 resin composition Substances 0.000 description 2
230000000717 retained effect Effects 0.000 description 2
239000007787 solid Substances 0.000 description 2
239000002904 solvent Substances 0.000 description 2
239000003381 stabilizer Substances 0.000 description 2
238000012360 testing method Methods 0.000 description 2
JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
RLPSARLYTKXVSE-UHFFFAOYSA-N 1-(1,3-thiazol-5-yl)ethanamine Chemical compound CC(N)C1=CN=CS1 RLPSARLYTKXVSE-UHFFFAOYSA-N 0.000 description 1
OGBWMWKMTUSNKE-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CCCCCC(OC(=O)C(C)=C)OC(=O)C(C)=C OGBWMWKMTUSNKE-UHFFFAOYSA-N 0.000 description 1
IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
WWXUGNUFCNYMFK-UHFFFAOYSA-N Acetyl citrate Chemical compound CC(=O)OC(=O)CC(O)(C(O)=O)CC(O)=O WWXUGNUFCNYMFK-UHFFFAOYSA-N 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
229920001634 Copolyester Polymers 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
244000068988 Glycine max Species 0.000 description 1
235000010469 Glycine max Nutrition 0.000 description 1
CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
229910019142 PO4 Inorganic materials 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
239000004372 Polyvinyl alcohol Substances 0.000 description 1
YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
125000005396 acrylic acid ester group Chemical group 0.000 description 1
239000000654 additive Substances 0.000 description 1
239000001361 adipic acid Substances 0.000 description 1
235000011037 adipic acid Nutrition 0.000 description 1
150000008365 aromatic ketones Chemical class 0.000 description 1
RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
239000012965 benzophenone Substances 0.000 description 1
125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
238000003763 carbonization Methods 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
SQNNHEYXAJPPKH-UHFFFAOYSA-N chloroethene;prop-2-enoic acid Chemical compound ClC=C.OC(=O)C=C SQNNHEYXAJPPKH-UHFFFAOYSA-N 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
238000001816 cooling Methods 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
150000005690 diesters Chemical class 0.000 description 1
MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
XWVQUJDBOICHGH-UHFFFAOYSA-N dioctyl nonanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCC(=O)OCCCCCCCC XWVQUJDBOICHGH-UHFFFAOYSA-N 0.000 description 1
YCZJVRCZIPDYHH-UHFFFAOYSA-N ditridecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCCC YCZJVRCZIPDYHH-UHFFFAOYSA-N 0.000 description 1
150000004665 fatty acids Chemical class 0.000 description 1
238000009472 formulation Methods 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
239000012770 industrial material Substances 0.000 description 1
239000003999 initiator Substances 0.000 description 1
150000002576 ketones Chemical class 0.000 description 1
238000010030 laminating Methods 0.000 description 1
239000000155 melt Substances 0.000 description 1
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
229910052753 mercury Inorganic materials 0.000 description 1
238000013508 migration Methods 0.000 description 1
230000005012 migration Effects 0.000 description 1
239000012046 mixed solvent Substances 0.000 description 1
XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
229920002601 oligoester Polymers 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
239000003973 paint Substances 0.000 description 1
239000012188 paraffin wax Substances 0.000 description 1
239000003208 petroleum Substances 0.000 description 1
NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
239000010452 phosphate Substances 0.000 description 1
150000003014 phosphoric acid esters Chemical class 0.000 description 1
239000003504 photosensitizing agent Substances 0.000 description 1
OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
230000000379 polymerizing effect Effects 0.000 description 1
229920000098 polyolefin Polymers 0.000 description 1
229920002451 polyvinyl alcohol Polymers 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000011160 research Methods 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
238000012719 thermal polymerization Methods 0.000 description 1
238000012546 transfer Methods 0.000 description 1
XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
229910052724 xenon Inorganic materials 0.000 description 1
FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
239000008096 xylene Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Adhesive Tapes (AREA)
Dicing (AREA)

JP2238755A 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法 Granted JPH03278444A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP2238755A JPH03278444A (ja)	1990-09-07	1990-09-07	半導体ウエハーのダイシング方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2238755A JPH03278444A (ja)	1990-09-07	1990-09-07	半導体ウエハーのダイシング方法

Related Parent Applications (1)

Application Number	Title	Priority Date	Filing Date
JP60196542A Division JPS6254937A (ja)	1985-02-14	1985-09-04	半導体ウエハ−のダイシング方法

Publications (2)

Publication Number	Publication Date
JPH03278444A JPH03278444A (ja)	1991-12-10
JPH0542138B2 true JPH0542138B2 (fr)	1993-06-25

Family

ID=17034784

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2238755A Granted JPH03278444A (ja)	1990-09-07	1990-09-07	半導体ウエハーのダイシング方法

Country Status (1)

Country	Link
JP (1)	JPH03278444A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5977954B2 (ja) *	2012-02-09	2016-08-24	リンテック株式会社	半導体ウエハ加工用シート

Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5038524A (fr) *	1973-08-07	1975-04-10
JPS51117730A (en) *	1975-04-10	1976-10-16	Oosakafu	Pressure sensitive adhesives
JPS53121832A (en) *	1977-04-01	1978-10-24	Hitachi Chem Co Ltd	Method of protecting surface
JPS58173179A (ja) *	1982-04-06	1983-10-12	Nhk Spring Co Ltd	粘着剤付発泡シ−ト体
JPS5921038A (ja) *	1982-07-27	1984-02-02	Nec Home Electronics Ltd	ペレツト剥離方法
JPS60196956A (ja) *	1984-03-12	1985-10-05	Nitto Electric Ind Co Ltd	半導体ウエハ固定用接着薄板
JPS6128572A (ja) *	1984-07-19	1986-02-08	F S K Kk	半導体ウエハー用粘着シートの使用法

1990
- 1990-09-07 JP JP2238755A patent/JPH03278444A/ja active Granted

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5038524A (fr) *	1973-08-07	1975-04-10
JPS51117730A (en) *	1975-04-10	1976-10-16	Oosakafu	Pressure sensitive adhesives
JPS53121832A (en) *	1977-04-01	1978-10-24	Hitachi Chem Co Ltd	Method of protecting surface
JPS58173179A (ja) *	1982-04-06	1983-10-12	Nhk Spring Co Ltd	粘着剤付発泡シ−ト体
JPS5921038A (ja) *	1982-07-27	1984-02-02	Nec Home Electronics Ltd	ペレツト剥離方法
JPS60196956A (ja) *	1984-03-12	1985-10-05	Nitto Electric Ind Co Ltd	半導体ウエハ固定用接着薄板
JPS6128572A (ja) *	1984-07-19	1986-02-08	F S K Kk	半導体ウエハー用粘着シートの使用法

Also Published As

Publication number	Publication date
JPH03278444A (ja)	1991-12-10

Publication	Publication Date	Title
EP0194706B1 (fr)	1989-08-23	Adhésif sensible à la pression et film adhésif sensible à la pression revêtu d'une couche de cet adhésif
US4968559A (en)	1990-11-06	Pressure sensitive adhesive film with barrier layer
KR102344755B1 (ko)	2021-12-29	감온성 점착제
JPS5846235B2 (ja)	1983-10-14	電子線照射に曝露せしめることにより硬化し得る感圧熱熔融接着剤の製造法
EP0902071B1 (fr)	2007-07-11	Adhesif autocollant thermodurcissable, et feuilles adhesives l'utilisant
US4052527A (en)	1977-10-04	Radiation polymerized hot melt pressure sensitive adhesives
JPH068405B2 (ja)	1994-02-02	感圧接着性シ−ト
JP2510416B2 (ja)	1996-06-26	半導体ウエハ−のダイシング方法
JPH0542138B2 (fr)	1993-06-25
JPH0582059B2 (fr)	1993-11-17
JPH0613681B2 (ja)	1994-02-23	感圧接着性シ−ト
JP2005023114A (ja)	2005-01-27	感圧型両面接着テープ又はシート
JPH03205470A (ja)	1991-09-06	感圧接着性シート
JPH0156111B2 (fr)	1989-11-28
JP2618356B2 (ja)	1997-06-11	感圧接着性シート
JP2003089772A (ja)	2003-03-28	粘着剤組成物及び粘着シートの製造方法
JP2645975B2 (ja)	1997-08-25	感圧接着剤組成物
JPH0635569B2 (ja)	1994-05-11	感圧接着性シート
JPH0312777B2 (fr)	1991-02-21
JPH0655929B2 (ja)	1994-07-27	感圧接着性シート
JPH0739565B2 (ja)	1995-05-01	感圧接着性シート
JPH0739564B2 (ja)	1995-05-01	感圧接着剤組成物
JPH0751697B2 (ja)	1995-06-05	感圧接着性シート
JP2510416C (fr)	1997-12-10
JPS61187248A (ja)	1986-08-20	半導体ウエハ−のダイシング方法