JPH0542138B2 - - Google Patents
Info
- Publication number
- JPH0542138B2 JPH0542138B2 JP23875590A JP23875590A JPH0542138B2 JP H0542138 B2 JPH0542138 B2 JP H0542138B2 JP 23875590 A JP23875590 A JP 23875590A JP 23875590 A JP23875590 A JP 23875590A JP H0542138 B2 JPH0542138 B2 JP H0542138B2
- Authority
- JP
- Japan
- Prior art keywords
- dicing
- film
- pressure
- sensitive adhesive
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 51
- 230000001070 adhesive effect Effects 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 46
- 239000011347 resin Substances 0.000 claims description 46
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 45
- 239000000203 mixture Substances 0.000 claims description 40
- -1 methacryloyl groups Chemical group 0.000 claims description 38
- 235000012431 wafers Nutrition 0.000 claims description 28
- 239000004014 plasticizer Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 19
- 229920006395 saturated elastomer Polymers 0.000 claims description 18
- 229920001225 polyester resin Polymers 0.000 claims description 12
- 239000004645 polyester resin Substances 0.000 claims description 12
- 239000003505 polymerization initiator Substances 0.000 claims description 12
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 239000004800 polyvinyl chloride Substances 0.000 claims description 7
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 229920001283 Polyalkylene terephthalate Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920013639 polyalphaolefin Polymers 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical group C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 239000004711 α-olefin Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 238000006116 polymerization reaction Methods 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000003112 inhibitor Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 6
- 229920006026 co-polymeric resin Polymers 0.000 description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 2
- 229940081735 acetylcellulose Drugs 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229920002301 cellulose acetate Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- DHZSIQDUYCWNSB-UHFFFAOYSA-N chloroethene;1,1-dichloroethene Chemical compound ClC=C.ClC(Cl)=C DHZSIQDUYCWNSB-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- RLPSARLYTKXVSE-UHFFFAOYSA-N 1-(1,3-thiazol-5-yl)ethanamine Chemical compound CC(N)C1=CN=CS1 RLPSARLYTKXVSE-UHFFFAOYSA-N 0.000 description 1
- OGBWMWKMTUSNKE-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CCCCCC(OC(=O)C(C)=C)OC(=O)C(C)=C OGBWMWKMTUSNKE-UHFFFAOYSA-N 0.000 description 1
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- WWXUGNUFCNYMFK-UHFFFAOYSA-N Acetyl citrate Chemical compound CC(=O)OC(=O)CC(O)(C(O)=O)CC(O)=O WWXUGNUFCNYMFK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- SQNNHEYXAJPPKH-UHFFFAOYSA-N chloroethene;prop-2-enoic acid Chemical compound ClC=C.OC(=O)C=C SQNNHEYXAJPPKH-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
- XWVQUJDBOICHGH-UHFFFAOYSA-N dioctyl nonanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCC(=O)OCCCCCCCC XWVQUJDBOICHGH-UHFFFAOYSA-N 0.000 description 1
- YCZJVRCZIPDYHH-UHFFFAOYSA-N ditridecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCCCC YCZJVRCZIPDYHH-UHFFFAOYSA-N 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Description
産業上の利用分野
本発明は半導体ウエハーのダイシング方法に関
し、詳しくは、半導体ウエハーをダイシングフイ
ルムに比較的強い接着力にて接着固定して、ダイ
シングした後、ダイシングフイルムの接着力を低
減して、ダイスをピツクアツプする半導体ウエハ
ーのダイシング方法に関する。
従来の技術
集積回路の製作に際して、半導体ウエハー、例
えば、シリコンウエハーを所定の寸法に裁断す
る、即ち、ダイシングを行なつて、所定寸法のダ
イスを得るためには、所謂ダイシングフイルムと
呼ばれる感圧接着性シート上にシリコンウエハー
を載置し、ダイシングフイルム上に感圧接着によ
る固定下に裁断した後、これをフイルムからピツ
クアツプ、即ち、剥離して取り上げる。従つて、
シリコンウエハーを正確にダイシングするために
は、ダイシング時にはダイシングフイルムがシリ
コンウエハーに対して強い接着力を有し、一方、
得られたダイスをダイシングフイルムからピツク
アツプするに際しては、ダイシングフイルムはそ
の接着力が弱いことが必要である。何ら制限され
るものではないが、例えば、シリコンウエハーの
ダイシングに際しては、ダイシングフイルムは
100〜500g／25mm程度又はこれ以上の接着力を有
し、一方、ダイスのピツクアツプに際しては、ダ
イシングフイルムは約20〜50g／25mm程度又はこ
れ以下の接着力を有することが望ましいといわれ
ている。
しかし、このように、被着面に適用後に、必要
に応じて、その接着力を低減させ得る感圧接着剤
は、未だ知られておらず、従つて、前記したよう
な要求特性を満たすダイシングフイルムは、従
来、知られていない。
他方、一般に接着剤の分野において、光重合性
オリゴマー、光重合性モノマー、光重合開始剤及
びその他の添加剤からなる紫外線架橋性接着剤が
既に知られており、これは無溶剤型、一液型の接
着剤であり、速硬化性であつて、加熱を要しない
等の点ですぐれているが、この接着剤において
は、紫外線照射は、本来、接着剤に所要の接着力
を発現させるために行なわれる。
発明が解決しようとする課題
本発明者らは、当初は強い接着力を有し、必要
に応じてその接着力を低減し得る感圧接着剤を得
るために鋭意研究した結果、予期しないことに、
飽和共重合ポリエステル樹脂と紫外線架橋性アク
リル酸エステルと重合開始剤とを主成分にして含
有する感圧接着剤組成物が、これに紫外線を照射
するとき、その接着力が著しく低減することを見
出した。
従つて、紫外線を透過し得る基材樹脂シート上
にかかる感圧接着剤組成物の層を形成して、これ
をダイシングフイルムとすれば、かかるダイシン
グフイルムは、ダイシング時にはシリコンウエハ
ーに対して強い接着力を有し、一方、このダイシ
ング後にダイシングフイルムの裏面から紫外線を
照射すれば、感圧接着剤組成物はその接着力を著
しく低減するので、得られたダイスをダイシング
フイルムから容易にピツクアツプすることができ
ることを見出して、本発明に至つたものである。
従つて、本発明は、一般的には、半導体ウエハ
ーのダイシング方法に関し、特に、半導体ウエハ
ーのダイシングフイルムに比較的強い接着力にて
接着固定して、ダイシングした後、ダイシングフ
イルムの接着力を低減して、ダイスをピツクアツ
プすることができる半導体ウエハーのダイシング
方法を提供することを目的とする。
課題を解決するための手段
本発明による半導体ウエハーのダイシング方法
は、紫外線を透過し得る基材シート上に飽和共重
合ポリエステル樹脂100重量部に対して分子内に
少なくとも二つのアクリロイル基又はメタクリロ
イル基を有するモノマー又はオリゴマーからなる
紫外線架橋性アクリル酸エステル15〜200重量部
と粘着付与剤10〜200重量部と重合開始剤とを主
成分として含有する感圧接着剤組成物の層を形成
してなるダイシングフイルムであつて、且つ、上
記基材シートが可塑剤を含有するポリ塩化ビニル
又は塩化ビニルの共重合体からなる樹脂シートで
あり、この樹脂シート上に上記可塑剤及び紫外線
架橋性アクリル酸エステルを透過させないが、紫
外線を透過させるポリ−α−オレフインフイルム
又はポリアルキレンテレフタレートフイルムから
なる樹脂層を介して、感圧接着剤組成物の層が形
成されているダイシングフイルム上に半導体ウエ
ハーを載置し、接着固定して、ダイシングした
後、上記ダイシングフイルムの裏面から紫外線を
照射し、上記感圧接着剤の接着力を低減させた
後、ダイスを取り上げることを特徴とする。
本発明の方法において用いるダイシングフイル
ムは、紫外線を透過させ得る基材シート上に飽和
共重合ポリエステル樹脂と紫外線架橋性アクリル
酸エステルと重合開始剤とを主成分として含有す
る感圧接着剤組成物の層が形成されてなり、かか
るダイシングフイルムは、紫外線照射前は、精度
の高いダイシングを可能にする程度に強い接着力
を有し、この後にその裏面から紫外線を照射する
ことによつて、得られたダイスに対する接着力を
著しく低減させることができるので、ダイスを容
易にピツクアツプすることができる。
先ず、上記感圧接着剤組成物について説明す
る。
上記飽和共重合ポリエステル樹脂は、例えば、
「工業材料」第25巻第11号第101〜106頁に記載さ
れているように、通常、異なる２種以上の飽和２
価カルボン酸と飽和２価アルコールとを重縮合さ
せて得られるガラス転移点の比較的低い飽和共重
合樹脂であり、通常、飽和２価カルボン酸とし
て、芳香族２価カルボン酸と脂肪族２価カルボン
酸とが併用され、飽和２価アルコールとして脂肪
族又は脂環式２価アルコール、即ち、グリコール
が用いられる。特に、本発明においては、芳香族
２価カルボン酸／脂肪族２価カルボン酸モル比が
80／20乃至20／80、好ましくは70／30乃至50／50
である飽和２価カルボン酸混合物とグリコールと
を等モルにて重縮合させて得られる飽和共重合ポ
リエステル樹脂が好ましく用いられる。本発明に
おいては、芳香族２価カルボン酸としてテレフタ
ル酸、脂肪族多価カルボン酸としてセバシン酸、
アジピン酸、グリコールとしてエチレングリコー
ル、１，４−ブタンジオール、プロピレングリコ
ール等を用いて得られる飽和共重合ポリエステル
樹脂が好ましく用いられる。尚、必要に応じて、
飽和共重合ポリエステル樹脂の製造においては、
カルボン酸成分として３価以上の飽和多価カルボ
ン酸や、３価以上の多価アルコールが一部併用さ
れてもよい。
本発明において用いる紫外線架橋性アクリル酸
エステルは、紫外線の照射によつて架橋するオリ
ゴマー又はモノマーとしてのアクリル酸エステル
又はメタクリル酸エステルをいい、分子内に少な
くとも２つのアクリロイル基又はメタクリロイル
基を有する。具体的には、かかるオリゴマーとし
ては、例えばオリゴエステルアクリレート等を、
また、モノマーとしては、例えば、１，６−ヘキ
サンジオールジアクリレート、トリメチロールプ
ロパントリアクリレート、テトラメチロールメタ
ンテトラアクリレート、ジペンタエリスリトール
ヘキサアクリレート等の多価アルコールとアクリ
ル酸のエステル、或いは１，６−ヘキサンジオー
ルジメタクリレート、トリメチロールプロパント
リメタクリレート、テトラメチロールメタンテト
ラメタクリレート、ジペンタエリスリトールペン
タメタクリレート等の多価アルコールとメタクリ
ル酸のエステル等を挙げることができる。
本発明において用いる感圧接着剤組成物は、前
記弾性重合体100重量部について、上記紫外線架
橋性アクリル酸エステルを15〜200重量部、好ま
しくは50〜150重量部の範囲にて含有する。弾性
重合体100重量部について、上記紫外線架橋性ア
クリル酸エステルが15重量部よりも少ないとき
は、得られる接着剤組成物に紫外線を照射して
も、その接着力は実質的に変化せず、一方、200
重量部を越えるときは、紫外線照射によつて、ダ
イシングフイルムの接着力を低減させることはで
きるが、しかし、シリコンウエハーのダイシング
後のダイスのピツクアツプ時に、ダイスに紫外線
架橋性アクリル酸エステルが残留することがあ
り、好ましくないからである。
本発明において用いる感圧接着剤組成物は、好
ましくは、更に粘着付与剤を含有する。用い得る
粘着付与剤に特に制限されず、従来より一般に粘
着剤と呼ばれている感圧接着剤組成物の製造にお
いて用いられているものが適宜に用いられる。こ
のように粘着付与剤として、例えば、キシレン樹
脂、ロジンや重合ロジン、水添ロジン、ロジンエ
ステル等の変性ロジン系樹脂、テルペン樹脂、テ
ルペンフエノール樹脂、ロジンフエノール樹脂等
のテルペン系樹脂、脂肪樹脂、芳香族系及び脂環
式系石油樹脂、クマロン樹脂、スチレン系樹脂、
アルキルフエノール樹脂等を挙げることができ
る。粘着付与剤は、飽和共重合ポリエステル樹脂
100重量部について、通常、10〜200重量部の範囲
で用いられる。粘着付与剤の配合量が余りに少な
いときは、接着力又は粘着力が不十分であり、他
方、多すぎるときは、得られる接着剤組成物に紫
外線を照射した後の接着力の低下幅が小さく、ま
た、かかる接着剤組成物をダイシングフイルムに
適用した場合、シリコンウエハーのダイシング後
のダイスのピツクアツプ時に、ダイスに粘着付与
剤が残留するとがあり、好ましくないからであ
る。
本発明において用いる感圧接着剤組成物は、更
に重合開始剤又は光増感剤を含有し、必要に応じ
て重合禁止剤を含有する。重合開始剤は、上記紫
外線架橋性アクリル酸エステルの紫外線照射によ
る架橋を促進するめに用いられる。このような重
合開始剤は、一般に、紫外線架橋重合の技術分野
においてよく知られており、本発明においては、
従来より一般に知られている重合開始剤を用いる
ことができる。かかる重合開始剤の具体例とし
て、例えば、ベンゾインメチルエーテル、ベンゾ
インイソプロピルエーテル等のベンゾインアルキ
ルエーテル類や、ベンゾイン、ベンジル、ベンゾ
フエノン等の芳香族オキシケトン類や芳香族ケト
ン類を挙げることができるが、これらに限定され
るものではない。
熱重合禁止剤は、上記紫外線架橋性アクリル酸
エステルが紫外線照射によらず、例えば、熱によ
つて重合することを防止するために、必要に応じ
て添加されるもので、かかる重合禁止剤として
も、従来より知られている通常の重合禁止剤を用
いることができる。このような重合禁止剤として
は、例えば、ピクリン酸、フエノール、ハイドロ
キノン、ハイドルキノンモノメチルエーテル等を
用いることができる。
上記重合開始剤及び重合禁止剤の配合量は、紫
外線架橋重合の技術分野において一般に使用され
ているところに従えばよく、例えば、重合開始剤
は、前記紫外線架橋性アクリル酸エステル100重
量部について１〜20重量部、重合禁止剤は必要に
応じて0.1〜１重量部の範囲で用いられる。
本発明において用いる感圧接着剤組成物は、上
記した配合量にて飽和共重合ポリエステル樹脂、
紫外線架橋性アクリル酸エステル及び重合開始剤
を、必要に応じて粘着付与剤、重合禁止剤、充填
剤、老化防止剤、着色剤等と共に、これらを溶解
する適宜の有機溶剤、例えば、芳香族炭化水素、
ケトン類、又はこれらの混合物に溶解することに
よつて得ることができる。溶剤としては、例え
ば、具体的にはトルエンとメチルエチルケトンと
の混合溶剤が好ましく用いられるが、しかし、こ
れに限定されるものではない。また、接着剤組成
物における弾性重合体の含有量は、用途等に応じ
て適宜に選ばれるが、通常、10〜50重量％の範囲
である。しかし、これに限定されるものではな
い。
上記のような感圧接着剤組成物の調製方法は、
何ら制限されるものではないが、通常、弾性重合
体及び粘着付与剤の溶液の形態にて市販されてお
り、これらを使用することが便利であるので、例
えば、これらの溶液を混合し、これに紫外線架橋
性アクリル酸エステルと重合開始剤、更に必要に
応じて重合禁止剤、充填剤、老化防止剤、着色剤
等を添加混合し、均一に溶解すればよい。
本発明の方法において用いるダイシングフイル
ムは、上記のような感圧接着剤組成物の層を紫外
線を透過し得る基材シート上に常法に従つて形成
することによつて得ることができる。
上記基材シートとしては、紫外線を透過し得る
限りは、特に制限されることなく、種々のシート
を用いることができるが、通常は、透明乃至半透
明の合成樹脂シートが用いられる。例えば、塩化
ビニル樹脂、塩化ビニル−塩化ビニリデン共重合
体樹脂、塩化ビニル−酢酸ビニル共重合体樹脂、
ポリ塩化ビニリデン、ポリオレフイン、ポリビニ
ルアルコール、ポリアミド、ポリエステル、ポリ
カーボネート、アセチルセルロース等からなる樹
脂シートが好適に用いられる。
上記した種々の基材樹脂シートのなかでも、可
塑剤を含有するポリ塩化ビニル又は塩化ビニルの
共重合体からなる樹脂シートは、柔軟であり、更
に、廉価でもあるので、本発明の方法において特
に好適に用いることができる。また、塩化ビニル
樹脂シート以外にも、可塑剤を含有する基材シー
トとして、好適に用いる得るものがある。例え
ば、塩化ビニル−塩化ビニリデン共重合体樹脂、
塩化ビニル−酢酸ビニル共重合体樹脂、塩化ビニ
ル−アクリル酸エステル共重合体樹脂、ポリ塩化
ビニリデン、アセチルセルロース等を挙げること
ができる。
ここに、上記可塑剤は、特に制限されるもので
はないが、例えば、ジブチルフタレート、ジオク
チルフタレート、ジデシルフタレート、ジトリデ
シルフタレート、ブチルベンジルフタレート等の
フタル酸ジエステル、トリクレジルホスフエー
ト、トリオクチルホスフエート、トリフエニルホ
スフエート、２−エチルヘキシルジフエニルホス
フエート、クレジルジフエニルホスフエート等の
リン酸エステル、ジオクチルアジペート、ジオク
チルセバケート、ジオクチルアゼレート、アセチ
ルクエン酸トリ−２−エチルヘキシル等の脂肪酸
ジエステル、ポリプロピレンアジペート、ポリプ
ロピレンセバケート等のポリエステル系可塑剤、
エポキシ化大豆脂等のエポキシ系可塑剤、塩素化
パラフイン、塩素化脂肪酸エステル等の塩素系可
塑剤等を挙げることができる。
しかしながら、このように、ダイシングフイル
ムの基材シートとして、可塑剤を含有する樹脂シ
ートを用いる場合には、この樹脂シートから可塑
剤が感圧接着剤組成物内に移行し、また、通常、
可塑剤と紫外線架橋性アクリル酸エステルとは相
溶性がよいために、感圧接着剤組成物に含まれる
紫外線架橋性アクリル酸エステルが樹脂シート中
に移行し、このような相互移行によつて、ダイシ
ングフイルムの紫外線照射後の接着力の低減効果
が著しく減少する。
従つて、本発明においては、ダイシングフイル
ムの基材シートとして、可塑剤を含有する樹脂シ
ートを用いる場合は、この基材シートと感圧接着
性シートとの間に可塑剤及び紫外線架橋性アクリ
ル酸エステルを透過させない樹脂層からなるバリ
ヤー層を介在させることが好ましい。但し、この
バリヤー層を、紫外線の透過を妨げるものであつ
てはならない。
即ち、このバリヤー層は、紫外線の透過は何ら
妨げないが、基材樹脂シートに含まれている可塑
剤が感圧接着剤組成物中に移行するのを阻止する
と共に、感圧接着剤組成物に含まれている紫外線
架橋性アクリル酸エステルが基材樹脂シートに移
行するのを阻止し、このようにして、基材樹脂シ
ートに含まれている可塑剤をこの基材中に保持
し、感圧接着剤組成物に含まれている紫外線架橋
性アクリル酸エステルを接着剤組成物中に保持し
て、感圧接着性シートの紫外線照射による接着力
の経時適な低下を防止する。
前記バリヤー層としては、ポリエチレン、ポリ
プロピレン等のポリ−α−オレフイン、ポリエチ
レンテレフタート等のポリアルキレンテレフタレ
ート等のフイルムが好適に用いられる。従つて、
バリヤー層は、基材樹脂シート上に前記例示した
樹脂からなるフイルムを圧着し、又はこの樹脂の
溶融液を塗布して冷却し、若しくは上記樹脂の溶
液を塗布し、乾燥することによつて、形成するこ
とができる。
従つて、本発明によるダイシングフイルムは、
例えば、基材樹脂シート上に上記バリヤー層を積
層し、この上に上述したような感圧接着剤組成物
の溶液を基材シート上に塗布し、乾燥することに
よつて得ることができる。
本発明の方法は、上記したようなダイシングフ
イルム上に半導体ウエハーを載置し、感圧接着し
て固定した後、ダイシングを行なつて所定の寸法
のダイスを得、この後、ダイシングフイルムの裏
面から紫外線を照射して、上記感圧接着剤組成物
の接着力を低減させ、次いで、ダイスをピツクア
ツプする。
ダイシングフイルムの裏面への紫外線の照射手
段及び照射方法は特に制限されず、紫外線硬化性
樹脂塗料や紫外線硬化性接着剤の技術分野におい
て、従来より通常に行なわれている手段及び方法
によることができる。例えば、照射手段として、
キセノンランプ、低圧、中圧、高圧或いは超高圧
水銀灯灯のような紫外線源を使用し、数秒乃至数
分、照射すればよい。
発明の効果
以上のように、飽和共重合ポリエステル樹脂と
紫外線架橋性アクリル酸エステルとを主成分とし
て含有してなる感圧接着剤組成物は、その理由は
必ずしも明らかではないが、紫外線を照射する前
は強い接着力を有し、一方、紫外線の照射によつ
てその接着力が著しく低減する。
従つて、かかる感圧接着剤組成物の層を有する
ダイシングフイルムは、当初は例えば数百ｇ／25
mmの接着力を有するが、紫外線照射によつて接着
力が著しく低減し、特に、紫外線架橋性アクリル
酸エステルの適正な配合によつて、接着力を数十
ｇ／25mm程度とすることができる。従つて、紫外
線照射前の強い接着力を利用して、半導体ウエハ
ーのダイシングを高精度で行なうことができ、こ
の後にダイシングフイルムの裏面から紫外線を照
射して、ダイシングフイルムの接着力を低減させ
ることにより、容易にダイスをダイシングフイル
ムからピツクアツプすることができる。このよう
にして、本発明の方法によれば、寸法精度にすぐ
れるダイスを生産性高く得ることができる。
また、ダイシングフイルムの基材シートとし
て、可塑剤を含有するポリ塩化ビニル樹脂又は塩
化ビニル共重合体樹脂からなるシートを用いる場
合でも、前記したように、バリヤー層を基材樹脂
シートに感圧接着剤組成物の層との間に介在させ
ることによつて、基材樹脂シートに含まれる可塑
剤は感圧接着剤組成物に移行せず、また、上記紫
外線架橋性アクリル酸エステルも基材樹脂シート
側に移行しないので、長期間にわたつて、紫外線
照射による接着力の低減効果を保つことができ
る。
実施例
以下に、実施例を示すが、本発明はこの実施例
に限定されるものではない。また、実施例中、部
とあるのは重量部を示す。
実施例 １
離型紙上に第１表に示す配合の感圧接着剤組成
物を塗布し、120℃で１分間乾燥し、感圧接着剤
の層を固形分として10μmm厚みに形成した。ここ
に、飽和共重合ポリエステル樹脂としては、テレ
フタル酸／セバシン酸モル比70／30の飽和２価カ
ルボン酸混合物とエチレングリコールとを等モル
にて重縮合させて得られるガラス転移点約10℃の
樹脂を用いた。次に、平均重合度1300のポリ塩化
ビニル100部、ジオクチルフタレート35部及び適
宜量の安定剤からなる塩化ビニル樹脂組成物から
形成した厚み0.1mmのシートを上記感圧接着剤層
に重ねて貼り合わせて、ダイシングフイルムを得
た。
離型紙を剥離して、そのままいに接着力を測定
し、また、別に塩化ビニル樹脂シート側から主波
長365mμ、120W／cmにて紫外線を７秒間照射し
た後、接着力を測定した。結果を第１表に示す。
INDUSTRIAL APPLICATION FIELD The present invention relates to a method for dicing semiconductor wafers, and more specifically, a semiconductor wafer is adhesively fixed to a dicing film with a relatively strong adhesive force, and after dicing, the adhesive force of the dicing film is reduced. This invention relates to a method for dicing semiconductor wafers by picking up dice. BACKGROUND TECHNOLOGY When manufacturing integrated circuits, a pressure-sensitive adhesive called a dicing film is used to cut a semiconductor wafer, such as a silicon wafer, into predetermined dimensions, that is, to perform dicing to obtain dice of a predetermined size. A silicon wafer is placed on a dicing sheet, cut into pieces while being fixed on a dicing film by pressure-sensitive adhesive, and then picked up, that is, peeled off, from the dicing film. Therefore,
In order to accurately dice silicon wafers, the dicing film must have strong adhesion to the silicon wafer during dicing;
When picking up the obtained dice from a dicing film, the dicing film must have a weak adhesive strength. Although not limited in any way, for example, when dicing silicon wafers, the dicing film is
It is said that it is desirable that the dicing film has an adhesive force of about 100 to 500 g/25 mm or more, while when picking up dice, it is desirable that the dicing film has an adhesive force of about 20 to 50 g/25 mm or less. However, as described above, pressure-sensitive adhesives that can reduce their adhesive strength as needed after being applied to the surface to be adhered to are not yet known. Films are hitherto unknown. On the other hand, in general, in the field of adhesives, UV crosslinkable adhesives consisting of photopolymerizable oligomers, photopolymerizable monomers, photopolymerization initiators, and other additives are already known, and these are solvent-free, one-component adhesives. It is a mold adhesive and is excellent in that it cures quickly and does not require heating. It will be held in Problems to be Solved by the Invention As a result of intensive research to obtain a pressure-sensitive adhesive that originally had strong adhesive strength and could reduce the adhesive strength as needed, the inventors unexpectedly discovered that ,
It has been discovered that when a pressure-sensitive adhesive composition containing a saturated copolymerized polyester resin, an ultraviolet crosslinkable acrylic ester, and a polymerization initiator as main components is irradiated with ultraviolet light, its adhesive strength is significantly reduced. Ta. Therefore, if a layer of the pressure-sensitive adhesive composition is formed on a base resin sheet that can transmit ultraviolet rays and used as a dicing film, such a dicing film will have strong adhesion to silicon wafers during dicing. On the other hand, if ultraviolet rays are irradiated from the back side of the dicing film after dicing, the pressure-sensitive adhesive composition will significantly reduce its adhesive strength, making it easy to pick up the obtained dice from the dicing film. The present invention was achieved by discovering that this can be done. Therefore, the present invention generally relates to a method for dicing a semiconductor wafer, and in particular, the present invention relates to a method for dicing a semiconductor wafer, and in particular, to a method for dicing a semiconductor wafer by adhesively fixing the semiconductor wafer to a dicing film with relatively strong adhesive force and reducing the adhesive force of the dicing film after dicing. An object of the present invention is to provide a method for dicing a semiconductor wafer by which dice can be picked up. Means for Solving the Problems The method for dicing semiconductor wafers according to the present invention includes at least two acryloyl groups or methacryloyl groups in the molecule based on 100 parts by weight of a saturated copolyester resin on a base sheet that can transmit ultraviolet rays. A layer of a pressure-sensitive adhesive composition containing as main components 15 to 200 parts by weight of an ultraviolet crosslinkable acrylic ester consisting of a monomer or oligomer, 10 to 200 parts by weight of a tackifier, and a polymerization initiator is formed. The dicing film is a resin sheet in which the base sheet is made of polyvinyl chloride or a vinyl chloride copolymer containing a plasticizer, and the plasticizer and the ultraviolet crosslinkable acrylic ester are coated on the resin sheet. A semiconductor wafer is placed on a dicing film on which a layer of a pressure-sensitive adhesive composition is formed via a resin layer made of poly-α-olefin film or polyalkylene terephthalate film that does not transmit ultraviolet light but transmits ultraviolet light. After fixing with adhesive and dicing, ultraviolet rays are irradiated from the back side of the dicing film to reduce the adhesive force of the pressure-sensitive adhesive, and then the dice are taken up. The dicing film used in the method of the present invention is made of a pressure-sensitive adhesive composition containing as main components a saturated copolymerized polyester resin, an ultraviolet crosslinkable acrylic ester, and a polymerization initiator on a base sheet that can transmit ultraviolet rays. This dicing film has a strong enough adhesive force to enable highly accurate dicing before irradiation with ultraviolet rays, and after that, it can be obtained by irradiating ultraviolet rays from the back side of the dicing film. Since the adhesion force to the dice can be significantly reduced, the dice can be easily picked up. First, the above pressure sensitive adhesive composition will be explained. The above saturated copolymerized polyester resin is, for example,
As described in "Industrial Materials" Vol. 25, No. 11, pp. 101-106, two or more different saturated
It is a saturated copolymer resin with a relatively low glass transition point obtained by polycondensing a dihydric carboxylic acid and a saturated dihydric alcohol. A carboxylic acid is used in combination, and an aliphatic or alicyclic dihydric alcohol, that is, a glycol, is used as the saturated dihydric alcohol. In particular, in the present invention, the molar ratio of aromatic divalent carboxylic acid/aliphatic divalent carboxylic acid to
80/20 to 20/80, preferably 70/30 to 50/50
A saturated copolymerized polyester resin obtained by polycondensing a saturated dicarboxylic acid mixture and glycol in equimolar amounts is preferably used. In the present invention, terephthalic acid is used as an aromatic divalent carboxylic acid, sebacic acid is used as an aliphatic polycarboxylic acid,
Saturated copolymerized polyester resins obtained using adipic acid and ethylene glycol, 1,4-butanediol, propylene glycol, etc. as the glycol are preferably used. In addition, if necessary,
In the production of saturated copolymerized polyester resin,
As the carboxylic acid component, a saturated polyhydric carboxylic acid having a valence of 3 or more or a polyhydric alcohol having a valence of 3 or more may be partially used in combination. The ultraviolet crosslinkable acrylic ester used in the present invention refers to an acrylic ester or methacrylic ester as an oligomer or monomer that crosslinks by irradiation with ultraviolet rays, and has at least two acryloyl or methacryloyl groups in the molecule. Specifically, such oligomers include, for example, oligoester acrylate, etc.
Examples of monomers include esters of polyhydric alcohol and acrylic acid such as 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, tetramethylolmethanetetraacrylate, dipentaerythritol hexaacrylate, or 1,6- Examples include esters of polyhydric alcohol and methacrylic acid such as hexanediol dimethacrylate, trimethylolpropane trimethacrylate, tetramethylolmethanetetramethacrylate, and dipentaerythritol pentamethacrylate. The pressure-sensitive adhesive composition used in the present invention contains the ultraviolet crosslinkable acrylic ester in an amount of 15 to 200 parts by weight, preferably 50 to 150 parts by weight, per 100 parts by weight of the elastic polymer. When the amount of the ultraviolet crosslinkable acrylic ester is less than 15 parts by weight with respect to 100 parts by weight of the elastic polymer, even if the resulting adhesive composition is irradiated with ultraviolet rays, its adhesive strength does not substantially change; On the other hand, 200
When the amount exceeds the weight part, the adhesive strength of the dicing film can be reduced by UV irradiation, but when picking up the dice after dicing the silicon wafer, UV crosslinkable acrylic ester remains on the dice. This is because it is not desirable. The pressure sensitive adhesive composition used in the present invention preferably further contains a tackifier. There are no particular restrictions on the tackifier that can be used, and those conventionally used in the production of pressure-sensitive adhesive compositions, generally called adhesives, can be used as appropriate. In this way, as a tackifier, for example, xylene resin, rosin, polymerized rosin, hydrogenated rosin, modified rosin resin such as rosin ester, terpene resin, terpene resin such as terpene phenol resin, rosin phenol resin, fatty resin, Aromatic and alicyclic petroleum resins, coumaron resins, styrene resins,
Examples include alkylphenol resins. Tackifier is saturated copolymerized polyester resin
For 100 parts by weight, it is usually used in a range of 10 to 200 parts by weight. When the amount of the tackifier is too small, the adhesive strength or adhesion is insufficient, and on the other hand, when it is too large, the amount of decrease in adhesive strength after irradiating the resulting adhesive composition with ultraviolet rays is small. Furthermore, when such an adhesive composition is applied to a dicing film, the tackifier may remain on the dice when the dice are picked up after dicing the silicon wafer, which is undesirable. The pressure-sensitive adhesive composition used in the present invention further contains a polymerization initiator or a photosensitizer, and if necessary, a polymerization inhibitor. The polymerization initiator is used to promote crosslinking of the ultraviolet crosslinkable acrylic ester by ultraviolet irradiation. Such polymerization initiators are generally well known in the technical field of ultraviolet crosslinking polymerization, and in the present invention,
Conventionally known polymerization initiators can be used. Specific examples of such polymerization initiators include benzoin alkyl ethers such as benzoin methyl ether and benzoin isopropyl ether, and aromatic oxyketones and aromatic ketones such as benzoin, benzyl, and benzophenone. It is not limited to. Thermal polymerization inhibitor is added as necessary to prevent the above-mentioned ultraviolet crosslinkable acrylic ester from polymerizing due to heat rather than ultraviolet irradiation, and as such a polymerization inhibitor. Also, conventionally known polymerization inhibitors can be used. As such a polymerization inhibitor, for example, picric acid, phenol, hydroquinone, hydroquinone monomethyl ether, etc. can be used. The amount of the polymerization initiator and polymerization inhibitor may be in accordance with what is generally used in the technical field of ultraviolet crosslinking polymerization. ~20 parts by weight, and a polymerization inhibitor is used in a range of 0.1 to 1 part by weight, if necessary. The pressure-sensitive adhesive composition used in the present invention contains a saturated copolymerized polyester resin,
UV cross-linkable acrylic ester and polymerization initiator, if necessary, along with tackifier, polymerization inhibitor, filler, anti-aging agent, coloring agent, etc., are dissolved in an appropriate organic solvent, such as aromatic carbonization. hydrogen,
It can be obtained by dissolving in ketones or a mixture thereof. As the solvent, for example, specifically, a mixed solvent of toluene and methyl ethyl ketone is preferably used, but the solvent is not limited thereto. Further, the content of the elastic polymer in the adhesive composition is appropriately selected depending on the application and the like, but is usually in the range of 10 to 50% by weight. However, it is not limited to this. The method for preparing the pressure-sensitive adhesive composition as described above is as follows:
Although not limited in any way, elastic polymers and tackifiers are usually commercially available in the form of solutions, and it is convenient to use them. For example, by mixing these solutions, A UV crosslinkable acrylic ester, a polymerization initiator, and if necessary, a polymerization inhibitor, a filler, an antiaging agent, a coloring agent, etc. may be added and mixed to the mixture and uniformly dissolved. The dicing film used in the method of the present invention can be obtained by forming a layer of the pressure-sensitive adhesive composition as described above on a base sheet that can transmit ultraviolet rays in accordance with a conventional method. As the base sheet, various sheets can be used without particular limitation as long as they can transmit ultraviolet rays, but usually transparent or translucent synthetic resin sheets are used. For example, vinyl chloride resin, vinyl chloride-vinylidene chloride copolymer resin, vinyl chloride-vinyl acetate copolymer resin,
Resin sheets made of polyvinylidene chloride, polyolefin, polyvinyl alcohol, polyamide, polyester, polycarbonate, acetyl cellulose, etc. are preferably used. Among the various base resin sheets described above, resin sheets made of polyvinyl chloride or a copolymer of vinyl chloride containing a plasticizer are flexible and inexpensive, so they are particularly preferred in the method of the present invention. It can be suitably used. In addition to vinyl chloride resin sheets, there are also materials that can be suitably used as base sheets containing plasticizers. For example, vinyl chloride-vinylidene chloride copolymer resin,
Examples include vinyl chloride-vinyl acetate copolymer resin, vinyl chloride-acrylic acid ester copolymer resin, polyvinylidene chloride, acetyl cellulose, and the like. Here, the above-mentioned plasticizer is not particularly limited, but includes, for example, phthalic acid diesters such as dibutyl phthalate, dioctyl phthalate, didecyl phthalate, ditridecyl phthalate, and butylbenzyl phthalate, tricresyl phosphate, and trioctyl. Phosphate, triphenyl phosphate, 2-ethylhexyl diphenyl phosphate, phosphoric acid ester such as cresyl diphenyl phosphate, fatty acid such as dioctyl adipate, dioctyl sebacate, dioctyl azelate, tri-2-ethylhexyl acetyl citrate. Polyester plasticizers such as diester, polypropylene adipate, polypropylene sebacate,
Examples include epoxy plasticizers such as epoxidized soybean fat, chlorine plasticizers such as chlorinated paraffin, and chlorinated fatty acid esters. However, when a resin sheet containing a plasticizer is used as the base sheet of the dicing film, the plasticizer migrates from the resin sheet into the pressure-sensitive adhesive composition, and usually,
Since the plasticizer and the UV-crosslinkable acrylic ester have good compatibility, the UV-crosslinkable acrylic ester contained in the pressure-sensitive adhesive composition migrates into the resin sheet, and due to such mutual migration, The effect of reducing the adhesive strength of the dicing film after UV irradiation is significantly reduced. Therefore, in the present invention, when a resin sheet containing a plasticizer is used as the base sheet of the dicing film, the plasticizer and ultraviolet crosslinkable acrylic acid are added between the base sheet and the pressure-sensitive adhesive sheet. It is preferable to interpose a barrier layer made of a resin layer that does not allow ester to pass through. However, this barrier layer must not impede the transmission of ultraviolet light. That is, this barrier layer does not prevent the transmission of ultraviolet rays in any way, but it prevents the plasticizer contained in the base resin sheet from migrating into the pressure-sensitive adhesive composition. In this way, the plasticizer contained in the base resin sheet is retained in this base material, and the acrylic acid ester contained in The ultraviolet crosslinkable acrylic ester contained in the pressure adhesive composition is retained in the adhesive composition to prevent the adhesive strength of the pressure sensitive adhesive sheet from decreasing over time due to ultraviolet irradiation. As the barrier layer, a film made of poly-α-olefin such as polyethylene or polypropylene, or polyalkylene terephthalate such as polyethylene terephthalate is preferably used. Therefore,
The barrier layer is formed by pressing a film made of the above-mentioned resin onto a base resin sheet, or by applying a melt of this resin and cooling it, or by applying a solution of the above-mentioned resin and drying it. can be formed. Therefore, the dicing film according to the present invention has the following characteristics:
For example, it can be obtained by laminating the barrier layer on a base resin sheet, applying a solution of the pressure-sensitive adhesive composition as described above onto the base sheet, and drying. In the method of the present invention, a semiconductor wafer is placed on a dicing film as described above, fixed by pressure-sensitive adhesive, and then diced to obtain dice of predetermined dimensions. The adhesive force of the pressure-sensitive adhesive composition is reduced by irradiating with ultraviolet rays from a source, and then the dice are picked up. The means and method for irradiating the back side of the dicing film with ultraviolet rays are not particularly limited, and may be any means or method conventionally used in the technical fields of ultraviolet curable resin paints and ultraviolet curable adhesives. . For example, as an irradiation means,
An ultraviolet light source such as a xenon lamp, low pressure, medium pressure, high pressure, or ultra-high pressure mercury lamp may be used for irradiation for several seconds to several minutes. Effects of the Invention As described above, a pressure-sensitive adhesive composition containing a saturated copolymerized polyester resin and an ultraviolet crosslinkable acrylic ester as main components can be irradiated with ultraviolet rays, although the reason is not necessarily clear. On the other hand, irradiation with ultraviolet rays significantly reduces the adhesive strength. Therefore, a dicing film having a layer of such a pressure-sensitive adhesive composition initially has a weight of several hundred g/25
mm, but the adhesive strength is significantly reduced by UV irradiation, and in particular, by appropriately blending the UV crosslinkable acrylic ester, the adhesive strength can be reduced to about several tens of g/25 mm. . Therefore, semiconductor wafers can be diced with high precision by utilizing the strong adhesive force before irradiation with ultraviolet rays, and after this, ultraviolet rays can be irradiated from the back side of the dicing film to reduce the adhesive force of the dicing film. This allows the dice to be easily picked up from the dicing film. In this way, according to the method of the present invention, dies with excellent dimensional accuracy can be obtained with high productivity. Furthermore, even when using a sheet made of polyvinyl chloride resin or vinyl chloride copolymer resin containing a plasticizer as the base sheet of the dicing film, the barrier layer can be pressure-sensitively bonded to the base resin sheet as described above. By interposing the plasticizer between the pressure-sensitive adhesive composition layer and the pressure-sensitive adhesive composition layer, the plasticizer contained in the base resin sheet does not transfer to the pressure-sensitive adhesive composition, and the UV-crosslinkable acrylic ester is also interposed between the base resin sheet and the base resin sheet. Since it does not migrate to the sheet side, the effect of reducing adhesive strength caused by ultraviolet irradiation can be maintained for a long period of time. Examples Examples are shown below, but the present invention is not limited to these examples. Furthermore, in the examples, parts indicate parts by weight. Example 1 A pressure-sensitive adhesive composition having the formulation shown in Table 1 was applied onto a release paper and dried at 120° C. for 1 minute to form a pressure-sensitive adhesive layer with a solid content of 10 μm thick. Here, the saturated copolymerized polyester resin has a glass transition point of about 10°C and is obtained by polycondensing a saturated dicarboxylic acid mixture with a terephthalic acid/sebacic acid molar ratio of 70/30 and ethylene glycol in equimolar amounts. Using resin. Next, a sheet with a thickness of 0.1 mm made of a vinyl chloride resin composition consisting of 100 parts of polyvinyl chloride with an average degree of polymerization of 1300, 35 parts of dioctyl phthalate, and an appropriate amount of a stabilizer was laminated on the pressure-sensitive adhesive layer. In addition, a dicing film was obtained. The release paper was peeled off and the adhesive strength was measured as it was, and the adhesive strength was also measured after irradiating the vinyl chloride resin sheet side with ultraviolet rays at a dominant wavelength of 365 mμ and 120 W/cm for 7 seconds. The results are shown in Table 1.
【表】【table】
【表】
また、比較のために、紫外線架橋性アクリル酸
エステルを含有しない感圧接着剤を用いて、上記
と同様にダイシングフイルムを調製し、紫外線照
射前後の接着力を測定した。結果を第１表に示
す。紫外線架橋性アクリル酸エステルを含有しな
い感圧接着剤を用いて、ダイシングフイルムとす
るとき、これに紫外線を照射しても、接着力が実
質的に変化しない。
これに対して、本発明によれば、ダイシングフ
イルムの紫外線照射による接着力の低下が顕著で
あり、適当な配合設計によつて、当初数百ｇ／25
mmの接着力を有せしめ、紫外線照射後は数十ｇ／
25mm程度に低減させることができるので、シリコ
ンウエハーのダイシングを精度高く行なうことが
できる。
尚、接着力の測定方法は次のとおりである。即
ち、上記感圧接着性シートを幅25mm、長さ100mm
に裁断して試験片とし、これを被着体としてのス
テンレス板上に重ね、３Kgローラにて５回往復し
て押圧した後、シヨツパーにて引張速度300mm／
分にて180°剥離試験を行なつた。
実施例 ２
離型紙上に第２表に示す配合の感圧接着剤を塗
布し、120℃で１分間乾燥し、感圧接着剤の層を
固形分として10μm厚みに形成した。
ここに、飽和共重合ポリエステル樹脂として
は、テレフタル酸／セバシン酸モル比70／30の飽
和２価カルボン酸混合物とエチレングリコールと
を等モルにて重縮合させて得られるガラス転移点
約10℃の樹脂を用いた。
次に、平均重合度1300のポリ塩化ビニル100部、
可塑剤としてジオクチルフタレート又はポリエス
テル系可塑剤35部及び適宜量の安定剤からなる塩
化ビニル樹脂組成物から成形した厚み0.1mmのシ
ート上に表に示すバリヤー層を形成した。この基
材樹脂シートのバリヤー層側表面に上記感圧接着
剤層を重ねて貼り合わせて、ダイシングフイルム
を得た。[Table] For comparison, a dicing film was prepared in the same manner as above using a pressure-sensitive adhesive that does not contain an ultraviolet crosslinkable acrylic ester, and the adhesive strength before and after irradiation with ultraviolet rays was measured. The results are shown in Table 1. When a dicing film is made using a pressure-sensitive adhesive that does not contain an ultraviolet crosslinkable acrylic ester, the adhesive strength does not substantially change even if the film is irradiated with ultraviolet rays. On the other hand, according to the present invention, the adhesive strength of the dicing film is significantly reduced due to ultraviolet irradiation.
mm, and after UV irradiation, it has an adhesive force of several tens of grams/
Since it can be reduced to about 25 mm, silicon wafers can be diced with high precision. The method for measuring adhesive strength is as follows. That is, the above pressure-sensitive adhesive sheet is 25 mm wide and 100 mm long.
This was cut into a test piece, stacked on a stainless steel plate as an adherend, pressed back and forth 5 times with a 3 kg roller, and then pulled at a speed of 300 mm/3 with a shovel.
A 180° peel test was conducted at 10 minutes. Example 2 A pressure-sensitive adhesive having the composition shown in Table 2 was applied onto a release paper and dried at 120° C. for 1 minute to form a pressure-sensitive adhesive layer with a solid content of 10 μm thick. Here, the saturated copolymerized polyester resin has a glass transition point of about 10°C and is obtained by polycondensing a saturated dicarboxylic acid mixture with a terephthalic acid/sebacic acid molar ratio of 70/30 and ethylene glycol in equimolar amounts. Using resin. Next, 100 parts of polyvinyl chloride with an average degree of polymerization of 1300,
The barrier layer shown in the table was formed on a 0.1 mm thick sheet formed from a vinyl chloride resin composition containing 35 parts of a dioctyl phthalate or polyester plasticizer as a plasticizer and an appropriate amount of a stabilizer. The pressure-sensitive adhesive layer was laminated and bonded to the barrier layer side surface of this base resin sheet to obtain a dicing film.
【表】
また、比較のために、上記したダイシングフイ
ルムの調製において、バリヤー層を設けない以外
は、全く同様にして、ダイシングフイルムを得
た。
このようにして得たそれぞれのダイシングフイ
ルムを所定の温度で所定の時間放置した後、離型
紙を剥離して、そのままにて接着力を測定し、ま
た、別に塩化ビニル樹脂シート側から主波長
365mμ、120W／cmにて紫外線を７秒間照射した
後、接着力を測定した。結果を第２表に示す。
バリヤー層を有するダイシングフイルムを用い
るとき、感圧接着剤の紫外線照射による接着力の
低減効果は、長期間にわたつて保持されることが
明らかである。[Table] For comparison, a dicing film was prepared in exactly the same manner as described above, except that no barrier layer was provided. After leaving each dicing film obtained in this way at a predetermined temperature for a predetermined time, the release paper was peeled off and the adhesive strength was measured as it was.
After irradiating with ultraviolet rays at 365 mμ and 120 W/cm for 7 seconds, the adhesive strength was measured. The results are shown in Table 2. It is clear that when a dicing film having a barrier layer is used, the effect of reducing the adhesive strength of the pressure-sensitive adhesive by UV irradiation is maintained over a long period of time.
Claims (1)
合ポリエステル樹脂100重量部に対して分子内に
少なくとも二つのアクリロイル基又はメタクリロ
イル基を有するモノマー又はオリゴマーからなる
紫外線架橋性アクリル酸エステル15〜200重量部
と粘着付与剤10〜200重量部と重合開始剤とを主
成分として含有する感圧接着剤組成物の層を形成
してなるダイシングフイルムであつて、且つ、上
記基材シートが可塑剤を含有するポリ塩化ビニル
又は塩化ビニルの共重合体からなる樹脂シートで
あり、この樹脂シート上に上記可塑剤及び紫外線
架橋性アクリル酸エステルを透過させないが、紫
外線を透過させるポリ−α−オレフインフイルム
又はポリアルキレンテレフタレートフイルムから
なる樹脂層を介して、感圧接着剤組成物の層が形
成されているダイシングフイルム上に半導体ウエ
ハーを載置し、接着固定して、ダイシングした
後、上記ダイシングフイルムの裏面から紫外線を
照射し、上記感圧接着剤の接着力を低減させた
後、ダイスを取り上げることを特徴とする半導体
ウエハーのダイシング方法。 ２ 紫外線架橋性アクリル酸エステルがトリメチ
ロールプロパントリアクリレート、ジペンタエリ
スリトールヘキサアクリレート又はトリメチロー
ルプロパントリメタクリレートであることを特徴
とする特許請求の範囲第１項記載の半導体ウエハ
ーのダイシング方法。 ３ ポリ−α−オレフインフイルムがポリエチレ
ンフイルム又はポリプロピレンフイルムであるこ
とを特徴とする特許請求の範囲第１項記載の半導
体ウエハーのダイシング方法。 ４ ポリアルキレンテレフタレートフイルムがポ
リエチレンテレフタレートフイルムであることを
特徴とする特許請求の範囲第１項記載の半導体ウ
エハーのダイシング方法。[Scope of Claims] 1 UV-crosslinkable acrylic comprising a monomer or oligomer having at least two acryloyl groups or methacryloyl groups in the molecule based on 100 parts by weight of a saturated copolymerized polyester resin on a base sheet capable of transmitting ultraviolet rays. A dicing film formed by forming a layer of a pressure-sensitive adhesive composition containing as main components 15 to 200 parts by weight of an acid ester, 10 to 200 parts by weight of a tackifier, and a polymerization initiator, and The material sheet is a resin sheet made of polyvinyl chloride or a copolymer of vinyl chloride containing a plasticizer, and on this resin sheet is a polyvinyl chloride that does not transmit the plasticizer and the UV crosslinkable acrylic ester, but transmits UV rays. - A semiconductor wafer is placed on a dicing film on which a layer of a pressure-sensitive adhesive composition is formed via a resin layer made of an α-olefin film or a polyalkylene terephthalate film, and the semiconductor wafer is adhesively fixed and diced. A method for dicing semiconductor wafers, comprising: irradiating ultraviolet rays from the back side of the dicing film to reduce the adhesive force of the pressure-sensitive adhesive, and then picking up the dice. 2. The method for dicing a semiconductor wafer according to claim 1, wherein the ultraviolet crosslinkable acrylic ester is trimethylolpropane triacrylate, dipentaerythritol hexaacrylate, or trimethylolpropane trimethacrylate. 3. The method for dicing a semiconductor wafer according to claim 1, wherein the poly-α-olefin film is a polyethylene film or a polypropylene film. 4. The method for dicing a semiconductor wafer according to claim 1, wherein the polyalkylene terephthalate film is a polyethylene terephthalate film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2238755A JPH03278444A (en) | 1990-09-07 | 1990-09-07 | Dicing of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2238755A JPH03278444A (en) | 1990-09-07 | 1990-09-07 | Dicing of semiconductor wafer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60196542A Division JPS6254937A (en) | 1985-02-14 | 1985-09-04 | Dicing method of semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03278444A JPH03278444A (en) | 1991-12-10 |
| JPH0542138B2 true JPH0542138B2 (en) | 1993-06-25 |
Family
ID=17034784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2238755A Granted JPH03278444A (en) | 1990-09-07 | 1990-09-07 | Dicing of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03278444A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5977954B2 (en) * | 2012-02-09 | 2016-08-24 | リンテック株式会社 | Semiconductor wafer processing sheet |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5038524A (en) * | 1973-08-07 | 1975-04-10 | ||
| JPS51117730A (en) * | 1975-04-10 | 1976-10-16 | Oosakafu | Pressure sensitive adhesives |
| JPS53121832A (en) * | 1977-04-01 | 1978-10-24 | Hitachi Chem Co Ltd | Method of protecting surface |
| JPS58173179A (en) * | 1982-04-06 | 1983-10-12 | Nhk Spring Co Ltd | Foamed sheet material with adhesive |
| JPS5921038A (en) * | 1982-07-27 | 1984-02-02 | Nec Home Electronics Ltd | Releasing method for pellet |
| JPS60196956A (en) * | 1984-03-12 | 1985-10-05 | Nitto Electric Ind Co Ltd | Adhesive metal sheet for fixing semiconductor wafer |
| JPS6128572A (en) * | 1984-07-19 | 1986-02-08 | F S K Kk | Pressure-sensitive adhesive sheet and method for using the same |
-
1990
- 1990-09-07 JP JP2238755A patent/JPH03278444A/en active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5038524A (en) * | 1973-08-07 | 1975-04-10 | ||
| JPS51117730A (en) * | 1975-04-10 | 1976-10-16 | Oosakafu | Pressure sensitive adhesives |
| JPS53121832A (en) * | 1977-04-01 | 1978-10-24 | Hitachi Chem Co Ltd | Method of protecting surface |
| JPS58173179A (en) * | 1982-04-06 | 1983-10-12 | Nhk Spring Co Ltd | Foamed sheet material with adhesive |
| JPS5921038A (en) * | 1982-07-27 | 1984-02-02 | Nec Home Electronics Ltd | Releasing method for pellet |
| JPS60196956A (en) * | 1984-03-12 | 1985-10-05 | Nitto Electric Ind Co Ltd | Adhesive metal sheet for fixing semiconductor wafer |
| JPS6128572A (en) * | 1984-07-19 | 1986-02-08 | F S K Kk | Pressure-sensitive adhesive sheet and method for using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03278444A (en) | 1991-12-10 |
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