JPH0343750U - - Google Patents
Info
- Publication number
- JPH0343750U JPH0343750U JP1989103839U JP10383989U JPH0343750U JP H0343750 U JPH0343750 U JP H0343750U JP 1989103839 U JP1989103839 U JP 1989103839U JP 10383989 U JP10383989 U JP 10383989U JP H0343750 U JPH0343750 U JP H0343750U
- Authority
- JP
- Japan
- Prior art keywords
- led
- wiring frame
- resin
- reflective
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000009429 electrical wiring Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案実施例の構造説明図、第2図は
本考案の他の実施例の構造を示す断面図、第3図
は本考案が適用される日字形セグメント数字表示
装置の説明図、第4図は従来のモールドタイプの
構造を示す断面図、第5図は従来の基板タイプを
示す断面図である。 1……反射ケース、2……リード用配線、3…
…LED、4……配線フレーム、5……透光性樹
脂。
本考案の他の実施例の構造を示す断面図、第3図
は本考案が適用される日字形セグメント数字表示
装置の説明図、第4図は従来のモールドタイプの
構造を示す断面図、第5図は従来の基板タイプを
示す断面図である。 1……反射ケース、2……リード用配線、3…
…LED、4……配線フレーム、5……透光性樹
脂。
Claims (1)
- 上面にLEDが装着され、かつ、そのLEDの
リード用電気配線が導電性の金属メツキにより形
成された樹脂製の配線フレームと、その配線フレ
ーム上のLEDを囲む所定の反射構造を持つ樹脂
製の反射ケースとが、相互に固着された状態で上
記反射ケース内のLEDが透光性樹脂によつてモ
ールドされてなるLED表示装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989103839U JPH0343750U (ja) | 1989-09-04 | 1989-09-04 | |
US07/576,653 US5177593A (en) | 1989-09-04 | 1990-09-04 | Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989103839U JPH0343750U (ja) | 1989-09-04 | 1989-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0343750U true JPH0343750U (ja) | 1991-04-24 |
Family
ID=14364596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989103839U Pending JPH0343750U (ja) | 1989-09-04 | 1989-09-04 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5177593A (ja) |
JP (1) | JPH0343750U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001337627A (ja) * | 2000-05-25 | 2001-12-07 | Rohm Co Ltd | 発光表示装置 |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5698866A (en) * | 1994-09-19 | 1997-12-16 | Pdt Systems, Inc. | Uniform illuminator for phototherapy |
US6274890B1 (en) * | 1997-01-15 | 2001-08-14 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and its manufacturing method |
JP3572924B2 (ja) * | 1997-03-06 | 2004-10-06 | 松下電器産業株式会社 | 発光装置及びそれを用いた記録装置 |
US5909037A (en) * | 1998-01-12 | 1999-06-01 | Hewlett-Packard Company | Bi-level injection molded leadframe |
DE19833039A1 (de) * | 1998-07-22 | 2000-01-27 | Elcos Gmbh Electronic Componen | Elektronisches Bauteil und Verfahren zu seiner Herstellung |
US6087195A (en) * | 1998-10-15 | 2000-07-11 | Handy & Harman | Method and system for manufacturing lamp tiles |
DE19940319B4 (de) * | 1999-08-25 | 2004-10-14 | Osram Opto Semiconductors Gmbh | Verfahren zum spannungsarmen Aufsetzen einer Linse auf ein oberflächenmontierbares optoelektronisches Bauelement |
DE10020465A1 (de) * | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement |
JP2001345485A (ja) * | 2000-06-02 | 2001-12-14 | Toyoda Gosei Co Ltd | 発光装置 |
CN1245586C (zh) * | 2000-07-07 | 2006-03-15 | 宇宙设备公司 | 一种发光屏 |
CN1259732C (zh) * | 2000-09-29 | 2006-06-14 | 欧姆龙株式会社 | 光学器件及其应用 |
WO2002059983A1 (en) * | 2000-11-17 | 2002-08-01 | Emcore Corporation | Led package having improved light extraction and methods therefor |
KR20020045694A (ko) * | 2000-12-09 | 2002-06-20 | 이택렬 | 광 반도체 소자 및 그 제조방법 |
US6627482B2 (en) * | 2001-02-09 | 2003-09-30 | Harvatek Corporation | Mass production technique for surface mount optical device with a focusing cup |
JP2003084066A (ja) * | 2001-04-11 | 2003-03-19 | Nippon Kessho Kogaku Kk | 放射線検出器用部品、放射線検出器および放射線検出装置 |
US6949771B2 (en) * | 2001-04-25 | 2005-09-27 | Agilent Technologies, Inc. | Light source |
JP2003046034A (ja) * | 2001-07-31 | 2003-02-14 | Nec Kagobutsu Device Kk | 樹脂封止型半導体装置 |
KR100439402B1 (ko) * | 2001-12-24 | 2004-07-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
JP5204947B2 (ja) * | 2002-11-27 | 2013-06-05 | ディーエムアイ バイオサイエンシズ インコーポレイテッド | リン酸受容体化合物の使用、ならびにリン酸受容体化合物を含んでいる、薬学的組成物、スキンケア用の組成物、およびキット |
US20040137656A1 (en) * | 2003-01-15 | 2004-07-15 | Gurbir Singh | Low thermal resistance light emitting diode package and a method of making the same |
JP3910171B2 (ja) * | 2003-02-18 | 2007-04-25 | シャープ株式会社 | 半導体発光装置、その製造方法および電子撮像装置 |
US7279355B2 (en) | 2003-06-27 | 2007-10-09 | Avago Technologies Ecbuip (Singapore) Pte Ltd | Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating same |
US7919787B2 (en) * | 2003-06-27 | 2011-04-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Semiconductor device with a light emitting semiconductor die |
US7256486B2 (en) * | 2003-06-27 | 2007-08-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Packaging device for semiconductor die, semiconductor device incorporating same and method of making same |
AT501081B8 (de) * | 2003-07-11 | 2007-02-15 | Tridonic Optoelectronics Gmbh | Led sowie led-lichtquelle |
TWI220076B (en) * | 2003-08-27 | 2004-08-01 | Au Optronics Corp | Light-emitting device |
US7854535B2 (en) * | 2003-09-23 | 2010-12-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Ceramic packaging for high brightness LED devices |
US20080025030A9 (en) * | 2003-09-23 | 2008-01-31 | Lee Kong W | Ceramic packaging for high brightness LED devices |
JP3811160B2 (ja) * | 2004-03-09 | 2006-08-16 | 株式会社東芝 | 半導体装置 |
US20050251439A1 (en) * | 2004-05-06 | 2005-11-10 | Fenich George G | Apparatus and method for assessing progress toward product consumption goals and targeting potential customers |
US20060055320A1 (en) * | 2004-09-15 | 2006-03-16 | Taiwan Oasis Technology Co., Ltd. | LED panel LED display panel glue filling gateway |
JP4659421B2 (ja) * | 2004-09-30 | 2011-03-30 | 株式会社トクヤマ | 発光素子収納用パッケージの製造方法 |
US8076680B2 (en) * | 2005-03-11 | 2011-12-13 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
DE102006032428A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
JP4891626B2 (ja) * | 2006-02-15 | 2012-03-07 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
US20070269915A1 (en) * | 2006-05-16 | 2007-11-22 | Ak Wing Leong | LED devices incorporating moisture-resistant seals and having ceramic substrates |
TWI418054B (zh) * | 2006-08-08 | 2013-12-01 | Lg Electronics Inc | 發光裝置封裝與製造此封裝之方法 |
US7808013B2 (en) * | 2006-10-31 | 2010-10-05 | Cree, Inc. | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies |
JP4205135B2 (ja) | 2007-03-13 | 2009-01-07 | シャープ株式会社 | 半導体発光装置、半導体発光装置用多連リードフレーム |
KR100811723B1 (ko) * | 2007-03-30 | 2008-03-11 | 서울반도체 주식회사 | Led 패키지 |
US7967476B2 (en) * | 2007-07-04 | 2011-06-28 | Nichia Corporation | Light emitting device including protective glass film |
TWM353308U (en) * | 2008-06-09 | 2009-03-21 | qiu-shuang Ke | LED illumination device |
JP5127594B2 (ja) * | 2008-06-26 | 2013-01-23 | 三菱電機株式会社 | 半導体パッケージ |
US20100059783A1 (en) * | 2008-09-08 | 2010-03-11 | Harry Chandra | Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation |
US7871842B2 (en) * | 2008-10-03 | 2011-01-18 | E. I. Du Pont De Nemours And Company | Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package |
JP5566785B2 (ja) * | 2010-06-22 | 2014-08-06 | 日東電工株式会社 | 複合シート |
JP5488310B2 (ja) * | 2010-07-30 | 2014-05-14 | 市光工業株式会社 | 車両用灯具の半導体型光源の光源ユニット、車両用灯具 |
CN102738373B (zh) * | 2011-04-11 | 2014-11-05 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
DE102013213073A1 (de) * | 2013-07-04 | 2015-01-08 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelementes |
DE112015003293T5 (de) * | 2014-07-15 | 2017-06-29 | Citizen Electronics Co., Ltd. | Licht emittierende Vorrichtung |
US10410997B2 (en) * | 2017-05-11 | 2019-09-10 | Cree, Inc. | Tunable integrated optics LED components and methods |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5331974B1 (ja) * | 1969-02-05 | 1978-09-06 | ||
JPS551295B2 (ja) * | 1976-10-21 | 1980-01-12 | ||
JPS56135984A (en) * | 1980-03-27 | 1981-10-23 | Matsushita Electric Ind Co Ltd | Manufacture of leadless light emitting diode chip |
JPS6324857B2 (ja) * | 1987-07-18 | 1988-05-23 | Nissan Motor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583393B2 (ja) * | 1975-08-01 | 1983-01-21 | 株式会社東芝 | コタイハツコウヒヨウジソウチ |
JPS6317573A (ja) * | 1986-07-09 | 1988-01-25 | Mitsubishi Cable Ind Ltd | 可視発光ダイオ−ドランプ |
US4942454A (en) * | 1987-08-05 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Resin sealed semiconductor device |
-
1989
- 1989-09-04 JP JP1989103839U patent/JPH0343750U/ja active Pending
-
1990
- 1990-09-04 US US07/576,653 patent/US5177593A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5331974B1 (ja) * | 1969-02-05 | 1978-09-06 | ||
JPS551295B2 (ja) * | 1976-10-21 | 1980-01-12 | ||
JPS56135984A (en) * | 1980-03-27 | 1981-10-23 | Matsushita Electric Ind Co Ltd | Manufacture of leadless light emitting diode chip |
JPS6324857B2 (ja) * | 1987-07-18 | 1988-05-23 | Nissan Motor |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001337627A (ja) * | 2000-05-25 | 2001-12-07 | Rohm Co Ltd | 発光表示装置 |
JP4668390B2 (ja) * | 2000-05-25 | 2011-04-13 | ローム株式会社 | 発光表示装置 |
Also Published As
Publication number | Publication date |
---|---|
US5177593A (en) | 1993-01-05 |