JPS6045453U - 表示用発光ダイオ−ド - Google Patents

表示用発光ダイオ−ド

Info

Publication number
JPS6045453U
JPS6045453U JP1983137735U JP13773583U JPS6045453U JP S6045453 U JPS6045453 U JP S6045453U JP 1983137735 U JP1983137735 U JP 1983137735U JP 13773583 U JP13773583 U JP 13773583U JP S6045453 U JPS6045453 U JP S6045453U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
display
light
diffusion layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983137735U
Other languages
English (en)
Other versions
JPH0311895Y2 (ja
Inventor
英雄 近藤
酒井　弘生
Original Assignee
スタンレー電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スタンレー電気株式会社 filed Critical スタンレー電気株式会社
Priority to JP1983137735U priority Critical patent/JPS6045453U/ja
Publication of JPS6045453U publication Critical patent/JPS6045453U/ja
Application granted granted Critical
Publication of JPH0311895Y2 publication Critical patent/JPH0311895Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例に係る表示用発光ダイオードの縦断面図
、第２図は本考案に係る第１実施例の表示用発光ダイオ
ードの縦断面図、第３図は同第２実施例の表示用発光ダ
イオードの斜視図、第４図は同実施例の縦断面図である
。 １１・・・・・・リードフレーム、１２・・・・・・発
光ダイオード素子、１３・・・・・・ワイヤー、１４・
・・・・・反射枠、１５・・・・・・光透過性樹脂、１
６・・・・・・光拡散層、１７・・・・・・中間拡散層
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一方のリードフレーム上にマウントした発光ダイオード
    素子をワイヤーで他方のリードフレームと接続させ、こ
    れを反射枠内において樹脂モールドし、発光表示面に光
    拡散層を備えた表示用発光ダイオードにおいて、前記発
    光ダイオード素子と発光表示面と９間に中心部が厚く端
    部に行くに従って薄（なる中間拡散層を設けたことを特
    徴とする表示用発光ダイオード。
JP1983137735U 1983-09-05 1983-09-05 表示用発光ダイオ−ド Granted JPS6045453U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983137735U JPS6045453U (ja) 1983-09-05 1983-09-05 表示用発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983137735U JPS6045453U (ja) 1983-09-05 1983-09-05 表示用発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS6045453U true JPS6045453U (ja) 1985-03-30
JPH0311895Y2 JPH0311895Y2 (ja) 1991-03-20

Family

ID=30309271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983137735U Granted JPS6045453U (ja) 1983-09-05 1983-09-05 表示用発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS6045453U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223748A (ja) * 1999-01-27 2000-08-11 Stanley Electric Co Ltd Ｌｅｄランプおよびその製造方法
JP2010021497A (ja) * 2008-07-14 2010-01-28 Sanyo Electric Co Ltd 半導体発光装置
JP2011009480A (ja) * 2009-06-26 2011-01-13 Nichia Corp 発光装置
JP2011249852A (ja) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd 光源装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785273A (en) * 1980-11-17 1982-05-27 Toshiba Corp Photo-semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785273A (en) * 1980-11-17 1982-05-27 Toshiba Corp Photo-semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223748A (ja) * 1999-01-27 2000-08-11 Stanley Electric Co Ltd Ｌｅｄランプおよびその製造方法
JP2010021497A (ja) * 2008-07-14 2010-01-28 Sanyo Electric Co Ltd 半導体発光装置
JP2011009480A (ja) * 2009-06-26 2011-01-13 Nichia Corp 発光装置
JP2011249852A (ja) * 2011-09-02 2011-12-08 Mitsubishi Rayon Co Ltd 光源装置

Also Published As

Publication number Publication date
JPH0311895Y2 (ja) 1991-03-20

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