JP7438626B2 - 搬送機構及びシート拡張装置 - Google Patents
搬送機構及びシート拡張装置 Download PDFInfo
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- JP7438626B2 JP7438626B2 JP2020061923A JP2020061923A JP7438626B2 JP 7438626 B2 JP7438626 B2 JP 7438626B2 JP 2020061923 A JP2020061923 A JP 2020061923A JP 2020061923 A JP2020061923 A JP 2020061923A JP 7438626 B2 JP7438626 B2 JP 7438626B2
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- 230000007246 mechanism Effects 0.000 title claims description 62
- 239000002699 waste material Substances 0.000 claims description 16
- 230000007723 transport mechanism Effects 0.000 claims description 13
- 229920001971 elastomer Polymers 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 239000005060 rubber Substances 0.000 claims description 5
- 239000000806 elastomer Substances 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 13
- 239000010410 layer Substances 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Workpieces (AREA)
- Dicing (AREA)
Description
4:基台
8:シート供給ユニット
10:貼付ユニット
12:支持部
14:軸部
16:ベース部
18:エアシリンダ
20:チャックテーブル、20a:上面
22:矩形板、22a:貫通開口
24:切刃部
26:ヒーター
28:X軸移動機構
30:ガイドレール、32:移動板、34:ボールネジ、36:回転駆動源
40:受渡ユニット
42:移動板
44:回転駆動源
46:円盤
48:エアシリンダ、48a:シリンダチューブ、48b:ピストンロッド
50:チャックテーブル、50a:保持面
52:クランプ機構
54:支柱
56:ローラー部
58:カットユニット、58a:切刃
60:X軸移動機構
62:ガイドレール、64:ボールネジ
70:剥離機構
72:拡張ユニット
74A:第1挟持ユニット、74B:第2挟持ユニット
74C:第3挟持ユニット、74D:第4挟持ユニット
76a:下側挟持部、76a1:ローラー
76b:上側挟持部、76b1:ローラー
78:上アーム、80:上側可動板
82:ガイドレール、84:回転駆動源
86:X軸移動機構
88:ボールネジ、90:回転駆動源、92:軸受け
94:上側挟持部、96:上アーム、98:上側可動板
100:ガイドレール、102:回転駆動源
104:Y軸移動機構
106:ボールネジ、108:回転駆動源
110:フレーム配置ユニット
112:ベース部、112a:吸引パッド
114a:支持柱、114b:接続部、114c:移動板
116:Z軸方向移動機構
118:移動板、120:ガイドレール、122:ボールネジ、124:回転駆動源
126:移動ブロック、128:ガイドレール
130:ボールネジ、132:回転駆動源
134:Y軸移動機構、
136:移動ユニット
138:エアシリンダ、138a:シリンダチューブ、138b:ピストン
140:搬送機構
142:ブラケット、142a:直線部、142b:連結部、142c:円筒部
142d:柱、142e:水平板
144:弾性部材、144a:上端部、144b:下端部
146:吸引部、146a:流路、146b:吸引パッド
148:継手、148a:流路、148b:球状部、148c:円筒部
150:流路、152:吸引源、154:バルブ、156:負圧制御ユニット
158:廃棄箱
160:蛇腹状吸引パッド
11:被加工物、11a:表面、11b:裏面、13:分割予定ライン、15:デバイス
17:保護部材、19:シート、19a:一面、19b:穴、19c:外周部
21:被加工物ユニット、23:環状フレーム、23a:貫通開口
25:デバイスチップ、27:デバイスチップユニット
A1,A2:向き
Claims (4)
- 対象物としてのシートを吸引保持して搬送する搬送機構であって、
それぞれ吸引パッドを有し、該対象物を該吸引パッドで吸引保持する複数の吸引部と、
揺動可能な継手を介して該複数の吸引部に接続されたブラケットと、
一端部が該複数の吸引部の異なる吸引部にそれぞれ固定され、他端部が該ブラケットにそれぞれ固定された複数の弾性部材と、
複数の蛇腹状吸引パッドと、
該複数の吸引部に接続された所定の流路に配置されたバルブを有し、該複数の吸引部における負圧の発生を制御する負圧制御ユニットと、
該ブラケットを移動させる移動ユニットと、
を備え、
該ブラケットは、一対の直線部と、該一対の直線部の長手方向の中間部分において該一対の直線部を連結する連結部と、該一対の直線部の各々において両端部の下部に固定された水平板と、を含み、
それぞれの該水平板には、1つの吸引部と、2つの蛇腹状吸引パッドと、が直角三角形状に配置されており、該1つの吸引部は直角状部分に位置し、該2つの蛇腹状吸引パッドはそれぞれ鋭角状部分に位置しており、該1つの吸引部は、該一対の直線部の長手方向において該2つの蛇腹状吸引パッドのうち1つの蛇腹状吸引パッドよりも端部側に位置し、且つ、該連結部の長手方向において該2つの蛇腹状吸引パッドのうちもう1つの蛇腹状吸引パッドよりも端部側に位置しており、
該複数の弾性部材は、吸引保持された該対象物の傾き又は変形に応じて該複数の吸引部の揺動を許容し、且つ、該対象物の吸引保持が解除されると、該吸引パッドが該対象物を吸引保持していないときの所定の向きに該吸引パッドの向きを戻すことを特徴とする搬送機構。 - 該複数の弾性部材のそれぞれは、ゴムシート、樹脂シート、エラストマーシート又はバネであることを特徴とする請求項1に記載の搬送機構。
- 板状物に貼り付けられたシートを拡張するシート拡張装置であって、
該板状物に貼り付けられた矩形状の該シートを、所定の平面方向に拡張する拡張ユニットと、
該板状物の一面の大きさよりも大きな直径を有する開口が形成されている環状フレームを吸引するための第1の吸引パッドを有し、該環状フレームが該板状物の周囲を囲む様に、該拡張ユニットで拡張された該シートの一面側に該環状フレームを配置するフレーム配置ユニットと、
切刃を有し、該板状物と該環状フレームとが貼り付けられた該シートのうち該開口の外側を該切刃でカットするためのカットユニットと、
該シートのうち、該切刃でカットされて形成された穴の外周部を吸引保持して、該シートを廃棄箱へ搬送する搬送機構と、を備え、
該搬送機構は、
第2の吸引パッドを有し、該シートを該第2の吸引パッドで吸引保持する吸引部と、
揺動可能な継手を介して該吸引部に接続されたブラケットと、
一端部が該吸引部に固定され、他端部が該ブラケットに固定された弾性部材と、
該吸引部に接続された所定の流路に配置されたバルブを有し、該吸引部における負圧の発生を制御する負圧制御ユニットと、
該ブラケットを移動させる移動ユニットと、を備え、
該弾性部材は、吸引保持された該シートの傾き又は変形に応じて該吸引部の揺動を許容し、且つ、該シートの吸引保持が解除されると、該第2の吸引パッドが該シートを吸引保持していないときの所定の向きに該第2の吸引パッドの向きを戻すことを特徴とするシート拡張装置。 - 該搬送機構は、該廃棄箱に先に収容されている該シートの該一面に、該吸引部で吸引保持された該シートを押圧して接着させた後に、該シートの吸引を解除することにより、該廃棄箱に先に収容されている該シート上に、押圧して接着させた該シートを積み重ねることを特徴とする請求項3に記載のシート拡張装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020061923A JP7438626B2 (ja) | 2020-03-31 | 2020-03-31 | 搬送機構及びシート拡張装置 |
US17/195,995 US11289354B2 (en) | 2020-03-31 | 2021-03-09 | Conveying mechanism |
TW110110761A TW202139339A (zh) | 2020-03-31 | 2021-03-25 | 搬運機構及薄片擴張裝置 |
CN202110324088.2A CN113471118A (zh) | 2020-03-31 | 2021-03-26 | 搬送机构和片材扩展装置 |
DE102021203017.3A DE102021203017A1 (de) | 2020-03-31 | 2021-03-26 | Beförderungsmechanismus |
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JP2020061923A JP7438626B2 (ja) | 2020-03-31 | 2020-03-31 | 搬送機構及びシート拡張装置 |
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JP7438626B2 true JP7438626B2 (ja) | 2024-02-27 |
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US (1) | US11289354B2 (ja) |
JP (1) | JP7438626B2 (ja) |
CN (1) | CN113471118A (ja) |
DE (1) | DE102021203017A1 (ja) |
TW (1) | TW202139339A (ja) |
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2020
- 2020-03-31 JP JP2020061923A patent/JP7438626B2/ja active Active
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2021
- 2021-03-09 US US17/195,995 patent/US11289354B2/en active Active
- 2021-03-25 TW TW110110761A patent/TW202139339A/zh unknown
- 2021-03-26 DE DE102021203017.3A patent/DE102021203017A1/de active Pending
- 2021-03-26 CN CN202110324088.2A patent/CN113471118A/zh active Pending
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