JP7427325B2 - テープ貼着方法 - Google Patents
テープ貼着方法 Download PDFInfo
- Publication number
- JP7427325B2 JP7427325B2 JP2019112537A JP2019112537A JP7427325B2 JP 7427325 B2 JP7427325 B2 JP 7427325B2 JP 2019112537 A JP2019112537 A JP 2019112537A JP 2019112537 A JP2019112537 A JP 2019112537A JP 7427325 B2 JP7427325 B2 JP 7427325B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- workpiece
- gas
- holding
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 26
- 239000007789 gas Substances 0.000 claims description 70
- 239000000463 material Substances 0.000 claims description 10
- 239000001307 helium Substances 0.000 claims description 8
- 229910052734 helium Inorganic materials 0.000 claims description 8
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 34
- 238000005520 cutting process Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000012466 permeate Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
- Y10T156/1057—Subsequent to assembly of laminae
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Textile Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
11a 表面
11b 裏面
13 分割予定ライン(ストリート)
15 デバイス
17 テープ
17a 基材
17b 粘着層(糊層)
19 環状フレーム
19a 開口
21 気泡
2 テープ貼着装置
4 チャンバー
4a テープ保持部
4b ワーク保持部
6 本体部
8 蓋部
10 フレーム支持部
10a 開口
12 保持テーブル
12a 保持面
14a,14b,14c,14d 流路
16a,16b,16c,16d バルブ
18 気体供給源
20 エアー供給源
30 ホットプレート
30a 保持面
40 保持テーブル
40a 保持面
40b 流路
42 ポーラス部材
44 バルブ
46 吸引源
48 クランプ
50 ヒーター
Claims (4)
- ワークにテープを貼着するテープ貼着方法であって、
テープ貼着装置を用いて大気の平均分子量より分子量の小さい気体中で該ワークに該テープを貼着する貼着ステップと、
該貼着ステップを実施した後、該ワークと該テープとの間に残存した該気体を、該テープを透過させて除去する透過ステップと、を備え、
該テープは、基材及び粘着層を備え、且つ、該気体及び空気が透過可能であり、
該テープ貼着装置は、該テープが保持されるテープ保持部と、該ワークが保持されるワーク保持部と、該ワーク保持部に設けられた保持テーブルと、を備え、
該貼着ステップでは、該テープ保持部が該気体で満たされた状態で、該保持テーブルによって保持された該ワークと該テープとを該気体中で接触させることを特徴とするテープ貼着方法。 - 該透過ステップでは、該テープを加熱することを特徴とする請求項1に記載のテープ貼着方法。
- 該透過ステップでは、該ワークと該テープの一方又は両方に対して、該ワークと該テープとが密着する方向に圧力を付与することを特徴とする請求項1に記載のテープ貼着方法。
- 該気体はヘリウムであることを特徴とする請求項1に記載のテープ貼着方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019112537A JP7427325B2 (ja) | 2019-06-18 | 2019-06-18 | テープ貼着方法 |
US16/898,553 US20200399089A1 (en) | 2019-06-18 | 2020-06-11 | Tape attaching method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019112537A JP7427325B2 (ja) | 2019-06-18 | 2019-06-18 | テープ貼着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020205356A JP2020205356A (ja) | 2020-12-24 |
JP7427325B2 true JP7427325B2 (ja) | 2024-02-05 |
Family
ID=73838040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019112537A Active JP7427325B2 (ja) | 2019-06-18 | 2019-06-18 | テープ貼着方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20200399089A1 (ja) |
JP (1) | JP7427325B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001210701A (ja) | 2000-01-24 | 2001-08-03 | Hitachi Ltd | 半導体ウエハ保護用フィルムの貼付方法及びその装置 |
JP2009194064A (ja) | 2008-02-13 | 2009-08-27 | Takatori Corp | 基板への接着フィルム貼付け装置及び貼付け方法 |
JP2015162652A (ja) | 2014-02-28 | 2015-09-07 | 株式会社ディスコ | 保護テープの貼着方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3444732A (en) * | 1967-06-06 | 1969-05-20 | Albert L Robbins | Method and apparatus for determining optimum bonding parameters for thermoplastic material |
US3826701A (en) * | 1972-10-31 | 1974-07-30 | Us Army | Controllable heat sealing process for optimum seal strength |
US3925139A (en) * | 1974-01-10 | 1975-12-09 | Package Machinery Co | Seal monitoring apparatus |
JPH0855824A (ja) * | 1994-08-10 | 1996-02-27 | Nikon Corp | 半導体ウエハのテープ貼付け方法 |
CN104471108B (zh) * | 2012-07-09 | 2020-05-05 | 四国化成工业株式会社 | 铜覆膜形成剂及铜覆膜的形成方法 |
JPWO2014038310A1 (ja) * | 2012-09-07 | 2016-08-08 | 富士電機株式会社 | 半導体素子の製造方法 |
JP7355618B2 (ja) * | 2018-12-04 | 2023-10-03 | 株式会社ディスコ | ウエーハ分割装置 |
-
2019
- 2019-06-18 JP JP2019112537A patent/JP7427325B2/ja active Active
-
2020
- 2020-06-11 US US16/898,553 patent/US20200399089A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001210701A (ja) | 2000-01-24 | 2001-08-03 | Hitachi Ltd | 半導体ウエハ保護用フィルムの貼付方法及びその装置 |
JP2009194064A (ja) | 2008-02-13 | 2009-08-27 | Takatori Corp | 基板への接着フィルム貼付け装置及び貼付け方法 |
JP2015162652A (ja) | 2014-02-28 | 2015-09-07 | 株式会社ディスコ | 保護テープの貼着方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2020205356A (ja) | 2020-12-24 |
US20200399089A1 (en) | 2020-12-24 |
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